CN205385604U - Microphone array module - Google Patents
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- CN205385604U CN205385604U CN201620115530.5U CN201620115530U CN205385604U CN 205385604 U CN205385604 U CN 205385604U CN 201620115530 U CN201620115530 U CN 201620115530U CN 205385604 U CN205385604 U CN 205385604U
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Abstract
The utility model discloses a microphone array module, the main difficulty of current microphone array in system design and use of solving. This microphone array module includes: be a plurality of microphone units that the array mode was arranged, signal processing unit, respectively with a plurality of microphone unit connections, be used for with the signal combination of a plurality of microphone units is an output signal. The utility model provides an it is integrated inside it that microphone array module will be used for making up the signal processing unit of microphone unit signal, regards as a whole to the monophonic audio signal of system output the array, need not to occupy the computational resource of system, had both made things convenient for microphone array's application, is favorable to reducing system power dissipation again, and in addition, microphone array module is as a whole part, and the line is simple, has made things convenient for the space design and the equipment of system.
Description
Technical field
This utility model relates to mike field, is specifically related to a kind of microphone array module.
Background technology
Common mike is all isotropic, and the sound from all directions is received comparably.But wish in many situations only to retain the sound on specific direction, the voice of such as speaker；Some occasions also are intended to suppress the sound on specific direction, the such as interference of known fixed sound source.The most general and effective way is to use many mike composition microphone arrays, utilizes the sound wave from different directions to arrive the time difference of each mike in array, it is achieved to have the reception of set direction.
Microphone array algorithm is different according to the structure difference of microphone array, and basic signal operation includes delay, gain, summation, and senior signal processing is likely to comprise filtering, Fourier transform, adaptive iteration etc..Simple process can be directly realized by with circuit, and complicated process needs CPU to participate in, or uses independent digital signal processor (digitalsignalprocessor, DSP).
Fig. 1 illustrates that in existing four road microphone array systems, signal is from microphone unit 1 ' to the necessary links of application end process.If A/D converter 4 ' is integrated in inside mike, then mike is digital microphone；If mike does not comprise A/D converter 4 ', it it is then simulation mike, need to coordinate analog/digital converter (Analog-to-DigitalConverter, ADC), codec (Codec) or the digital signal processor with A/D conversion to use.No matter it is with numeral or simulation mike, it is required for Digital Signal Processing link 2 ' and carries out array operation, CPU is relied on to participate in or use other digital signal processor to complete, therefore existing microphone array not only needs the process resource of the system that takies to carry out the computing that array is relevant, and connected by multi-path digital or analog audio interface between mike and the processing apparatus of core, cause the problems such as connection line complexity.
Utility model content
In view of this, this utility model provides a kind of microphone array module, and external audio interface is equivalent to a mike, plays the effect of simplied system structure.
For reaching this purpose, this utility model by the following technical solutions:
A kind of microphone array module, including:
Multiple microphone units of arrangement in array way；
Signal processing unit, is connected with the plurality of microphone unit respectively, for the signal of the plurality of microphone unit is combined as an output signal.
Preferably, also including pcb board, described microphone unit and described signal processing unit and may be contained within described pcb board, the described output signal combined through described signal processing unit is exported by described pcb board.
Preferably, described signal processing unit includes multiple computing module, each described computing module is respectively provided with multiple input, the plurality of input is connected with the plurality of microphone unit respectively, and described computing module is weighted summation operation to produce composite signal for the signal that the plurality of microphone unit inputs described signal processing unit；
Described signal processing unit also includes laminating module, and the outfan of each described computing module is all connected with described laminating module, and the composite signal that multiple described computing modules produce forms described output signal through described laminating module superposition.
Preferably, the quantity of described computing module is 2 to 4.
Preferably, it is provided with wave filter between each described computing module and described laminating module.
Preferably, described signal processing unit also includes a plurality of signal processing path being correspondingly arranged respectively with the plurality of microphone unit, described signal processing path includes the adaptive noise conceller module that is sequentially connected with and down-sampled module, and the signal of described microphone unit input inputs described computing module after described signal processing path processes.
Preferably, described signal processing path also includes the fifo module that is arranged between described adaptive noise conceller module and described microphone unit.
Preferably, described signal processing unit includes configuration module, for configuring the running parameter of each module of described signal processing unit.
Preferably, described signal processing unit being provided with audio interface, described audio interface includes digital audio interface and/or analog audio interface；
The signal of described laminating module output exports through described digital audio interface, or is exported by described analog audio interface after digital/analog converter is changed.
Preferably, described signal processing unit also includes oscillator module, for producing the clock signal of preset frequency when not having efficient clock signal to input.
This utility model additionally provides the mobile terminal adopting above-mentioned microphone array module, reaches the effect that packaging efficiency is high, low in energy consumption.
For reaching this purpose, this utility model by the following technical solutions:
Mobile terminal, including microphone array module as above.
The beneficial effects of the utility model are:
The signal processing unit being used for combining microphone unit signal is integrated in inside it by the microphone array module that this utility model provides,
Array is made the as a whole audio signal exporting single channel to system, it is not necessary to take the calculating resource of system, facilitate the application of microphone array, be also beneficial to reduce system power dissipation.
It addition, microphone array module is as a global facility, line is simple, facilitates spatial design and the assembling of system.
Accompanying drawing explanation
By referring to the accompanying drawing description to this utility model embodiment, of the present utility model above-mentioned and other objects, features and advantages will be apparent from, in the accompanying drawings:
Fig. 1 is the structural representation that existing microphone array is connected to application end；
Fig. 2 is the structural representation of the microphone array module that this utility model detailed description of the invention provides；
Fig. 3 is the structural representation of the signal processing unit that this utility model detailed description of the invention provides.
In figure, 1 ', microphone unit；2 ', Digital Signal Processing link；4 ', A/D converter；
1, microphone unit；2, signal processing unit；201, microphone interface；202, MCU controls interface；203, digital audio interface；204, analog audio interface；205, computing module；206, laminating module；207, wave filter；208, fifo module；209, adaptive noise conceller module；210, down-sampled module；211, up-sampling module；212, digital/analog converter；213, configuration module；214, oscillator module；3, pcb board.
Detailed description of the invention
Below based on embodiment, this utility model is described, but this utility model is not restricted to these embodiments.In below details of the present utility model being described, detailed describe some specific detail sections.The description not having these detail sections for a person skilled in the art can also understand this utility model completely.In order to avoid obscuring essence of the present utility model, known method, process, flow process, element be narration in detail not.
The embodiment of microphone array module of the present utility model is described referring to Fig. 2 and Fig. 3.
The microphone array module that this utility model provides includes multiple microphone units 1 of arrangement in array way, also including the signal processing unit 2 being connected respectively with multiple microphone units 1, signal processing unit 2 for being combined as an output signal by the signal of multiple microphone units 1.
The signal processing unit 2 being used for combining microphone unit signal is integrated in inside it by the microphone array module that this utility model provides, array is made the as a whole audio signal exporting single channel to system, without taking the calculating resource of system, facilitate the application of microphone array, be also beneficial to reduce system power dissipation.It addition, microphone array module is as a global facility, line is simple, facilitates spatial design and the assembling of system.
Further, as in figure 2 it is shown, microphone unit 1 and signal processing unit 2 may be contained within, on pcb board 3, realizing connection by pcb board 3, the output signal combined through signal processing unit 2 is exported by pcb board 3.
The array way of multiple microphone units 1 is not limit, for instance, it is possible to it is end-fire as shown in Figure 2 (endfire) array, or (broadside) array etc. is penetrated in side.
The structure of microphone array module is specifically introduced below for four microphone units 1 in end-fire array.
As shown in Figure 2, pcb board 3 is elongated, four microphone units 1 are arranged in order and are arranged on pcb board 3, and signal processing unit 2 is positioned at the middle part of pcb board 3, and signal processing unit 2 is a piece of ASIC (ApplicationSpecificIntegratedCircuit) chip.Inside signal processing unit 2, the signal of multiple microphone units 1 synthesizes the road audio signal with directivity through necessary computing, is connected to the pad output on pcb board 3.For microphone applications circuit, using this module is the same with the mode of operation using a mike, enormously simplify system design.Further, since in module Integrated Algorithm, it is no longer necessary to controller, processor participation, the power consumption of system can be saved.
Fig. 3 illustrates the structural representation of signal processing unit.As shown in the figure, signal processing unit 2 has multiple interface, including power interface (not shown), for the audio interface being connected with audio system, for the microphone interface 201 being connected with microphone unit 1 and the MCU control interface 202 for being connected with controller.
For microphone unit 1 for digital microphone, digital dock can be provided to microphone unit 1 by microphone interface 201, and the signal that microphone unit 1 produces can be received.
Audio interface includes digital audio interface 203 and/or analog audio interface 204, analog audio interface 204 is to arrange for the audio system not having digital audio interface 203, analog audio interface 204 place need to arrange digital/analog converter 212 (DAC) signal is carried out conversion rear exportable.The clock signal from audio system can be received by digital audio interface 203, and can to the audio system output output signal through combination.As a preferred embodiment, digital audio interface 203 is I2S interface, clock signal includes bit clock (BCLK) signal and frame clock (LRCK) signal, frame clock (LRCK) signal is the clock signal determining sample frequency, such as, during the clock signal that bit clock signal is 64 times of PCM sample frequencys that digital audio interface 203 inputs, clock signal in microphone interface 201 is derived by bit clock signal, therefore, microphone unit 1 is also operated under 64 times of PCM sample frequencys, concrete, such as, when PCM sample frequency is 48kHz, bit clock signal is 3.072MHz, microphone unit 1 clock frequency is also 3.072MHz.
MCU controls the SPI three-wire interface that interface 202 can be standard, it is also possible to be the I of two lines2C interface, controller can pass through MCU control interface 202 and be written and read operation.
Signal processing unit 2 includes four computing modules 205, and computing module 205 has four inputs, is connected with four microphone units 1 respectively.Four computing modules 205 are respectively used to the signal of four microphone units 1 generations is weighted summation operation, produce four tunnel composite signals, namely, the pcm word of each road composite signal is that pcm word corresponding to signal that four road microphone units 1 produce is multiplied by a weight coefficient respectively and is added and obtains, and weight coefficient can be arranged according to real needs.
The outfan of four computing modules 205 is all connected with laminating module 206.The four tunnel composite signals produced by four computing module 205 computings pass into laminating module 206, by laminating module 206, four tunnel composite signal superpositions are formed output signal and export.
Further, being provided with wave filter 207 between each computing module 205 and laminating module 206, the four tunnel composite signals that weighted sum obtains are respectively through passing into laminating module 206 superposition after wave filter 207 again.Wave filter 207 concrete structure is not limit, for instance can be FIR (FiniteImpulseResponse) wave filter, IIR (InfiniteImpulseResponse) wave filter etc., and the coefficient of wave filter 207 can be arranged according to real needs.
It is, of course, understood that the quantity of computing module 205 is not limited to four, it is preferable that range for 2 to 4.
Further, four bars that signal processing unit 2 includes being correspondingly arranged with four microphone units 1 respectively process path, are respectively used to process the signal of four microphone unit 1 inputs.Signal processing path includes the fifo module 208, adaptive noise conceller module 209 (ADM) and the down-sampled module 210 that are sequentially connected with.
Wherein, FIFO (FirstInputFirstOutput) module can play the effect of signal delay, can set the time delay of each road microphone unit signal by arranging the effective length of fifo module 208.
Microphone unit 1 exports the 1 of 1bit, 0 signal, i.e. ADM code stream, and ADM code stream is input to adaptive noise conceller module 209 by fifo module 208 after being postponed, i.e. ADM decoder, the pcm encoder of over-sampling is exported after ADM decoder processes, for instance, the pcm encoder of 64 times of over-samplings of output.
Obtain, after the down-sampled module of pcm stream 210 of over-sampling of ADM decoder output is down-sampled, the pcm audio signal that sample frequency is identical with the frame clock signal frequency of digital audio interface 203.Four road pcm audio signals are carrying out follow-up weighted sum process and superposition, and, follow-up computing is also carry out under identical sample frequency.Output signal after superposition is exported by digital audio interface 203.
Further, also include configuration module 213, by configuring the running parameter of each module of module 213 configuration signal processing unit 2, including parameter register, described parameter includes each computing module 205 weight coefficient when being weighted summation operation, the coefficient of each wave filter 207, effective length of fifo module 208 etc..Parameter register can control interface 202 by MCU and carry out data read-write operation for controller.
In a preferred embodiment, the outfan of laminating module 206 also can be connected with analog audio interface 204 through up-sampling module 211 and digital/analog converter 212 successively, signal after superimposed processes through up-sampling module 211 and is converted to analog signal output through digital/analog converter 212, it is applicable to there is no digital audio interface 203, the only audio system of analog audio interface 204.Wherein, the up-sampling multiple of up-sampling module 211 can but be not limited to be 4 times, 8 times, 16 times, 32 times or 64 times.
In a preferred embodiment, signal processing unit 2 also includes oscillator module 214, when outside does not have effective clock signal to input, oscillator module 214 enables, the clock signal providing preset frequency for digital display circuit is replaced by clock signal, it is ensured that analog audio interface 204 place can export audio signal normally.Such as, the frequency of clock signal is 2.4MHz.
Certainly, the microphone array module that this utility model provides be also applied for simulation mike, i.e. microphone unit 1 can be simulation mike, only need to increase corresponding A/D modular converter in signal processing unit 2.
Additionally, it should be understood by one skilled in the art that the accompanying drawing in this offer is provided to descriptive purpose, and what accompanying drawing was not necessarily drawn to scale.
It will also be appreciated that example embodiment is provided, so that the disclosure is comprehensive, and its scope is fully conveyed to those skilled in the art.A lot of specific detail (such as the example of particular elements, equipment and method) are presented to provide thorough understanding of the disclosure.It will be apparent to one skilled in the art that and need not adopt specific detail, example embodiment can be implemented with much different forms, and example embodiment is understood not to restriction the scope of the present disclosure.In some example embodiments, it is thus well known that device structure and widely-known technique are not described in.
When an element or layer be mentioned as another element or layer " on ", " being engaged to ", " being connected to " or " being coupled to " another element or during layer, its can directly on another element or layer, directly engaged, be connected or coupled to another element or layer, or can there is intermediary element or layer.By contrast, when an element be mentioned as " directly " another element or layer " on ", " being bonded directly to ", " being directly coupled to " or " being directly coupled to " another element or during layer, intermediary element or layer can be absent from.For describing other word of relation between element and should be explained in a similar manner (such as, " between " and " directly between ", " vicinity " and " being directly adjacent to " etc.).As used herein, term "and/or" includes arbitrary in the Listed Items of one or more association or all combines.
Although term first, second, third, etc. can be used for describing each element, parts, region, layer and/or section at this, but these elements, parts, region, layer and/or section should not be limited by these terms.These terms can only be used for distinguishing an element, parts, region, layer or section and another element, region, layer or section.The such as term of " first ", " second " and other numerical value term do not mean that order or order at this when using, unless clearly indicated by the context.Thus, the first element discussed below, parts, region, layer or section are referred to alternatively as the second element, parts, region, layer or section, without departing from the instruction of example embodiment.Additionally, in description of the present utility model, except as otherwise noted, " multiple " are meant that two or more.
The foregoing is only preferred embodiment of the present utility model, be not limited to this utility model, to those skilled in the art, this utility model can have various change and change.All make within spirit of the present utility model and principle any amendment, equivalent replacement, improvement etc., should be included within protection domain of the present utility model.
Claims (10)
1. a microphone array module, it is characterised in that including:
Multiple microphone units of arrangement in array way；
Signal processing unit, is connected with the plurality of microphone unit respectively, for the signal of the plurality of microphone unit is combined as an output signal.
2. microphone array module according to claim 1, it is characterized in that, also including pcb board, described microphone unit and described signal processing unit and may be contained within described pcb board, the described output signal combined through described signal processing unit is exported by described pcb board.
3. microphone array module according to claim 1 and 2, it is characterized in that, described signal processing unit includes multiple computing module, each described computing module is respectively provided with multiple input, the plurality of input is connected with the plurality of microphone unit respectively, and described computing module is weighted summation operation to produce composite signal for the signal that the plurality of microphone unit inputs described signal processing unit；
Described signal processing unit also includes laminating module, and the outfan of each described computing module is all connected with described laminating module, and the composite signal that multiple described computing modules produce forms described output signal through described laminating module superposition.
4. microphone array module according to claim 3, it is characterised in that the quantity of described computing module is 2 to 4.
5. microphone array module according to claim 3, it is characterised in that be provided with wave filter between each described computing module and described laminating module.
6. microphone array module according to claim 3, it is characterized in that, described signal processing unit also includes a plurality of signal processing path being correspondingly arranged respectively with the plurality of microphone unit, described signal processing path includes the adaptive noise conceller module that is sequentially connected with and down-sampled module, and the signal of described microphone unit input inputs described computing module after described signal processing path processes.
7. microphone array module according to claim 6, it is characterised in that described signal processing path also includes the fifo module being arranged between described adaptive noise conceller module and described microphone unit.
8. the microphone array module according to claim 5 or 7, it is characterised in that described signal processing unit includes configuration module, for configuring the running parameter of each module of described signal processing unit.
9. microphone array module according to claim 3, it is characterised in that being provided with audio interface on described signal processing unit, described audio interface includes digital audio interface and/or analog audio interface；
The signal of described laminating module output exports through described digital audio interface, or is exported by described analog audio interface after digital/analog converter is changed.
10. microphone array module according to claim 9, it is characterised in that described signal processing unit also includes oscillator module, for producing the clock signal of preset frequency when not having efficient clock signal to input.
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| CN201620115530.5U CN205385604U (en) | 2016-02-04 | 2016-02-04 | Microphone array module |
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| CN201620115530.5U CN205385604U (en) | 2016-02-04 | 2016-02-04 | Microphone array module |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107040856A (en) * | 2016-02-04 | 2017-08-11 | 北京卓锐微技术有限公司 | A kind of microphone array module |
| TWI786083B (en) * | 2017-01-27 | 2022-12-11 | 美商舒爾獲得控股公司 | Array microphone module and system |
-
2016
- 2016-02-04 CN CN201620115530.5U patent/CN205385604U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107040856A (en) * | 2016-02-04 | 2017-08-11 | 北京卓锐微技术有限公司 | A kind of microphone array module |
| CN107040856B (en) * | 2016-02-04 | 2023-12-08 | 共达电声股份有限公司 | Microphone array module |
| TWI786083B (en) * | 2017-01-27 | 2022-12-11 | 美商舒爾獲得控股公司 | Array microphone module and system |
| US11647328B2 (en) | 2017-01-27 | 2023-05-09 | Shure Acquisition Holdings, Inc. | Array microphone module and system |
| US12063473B2 (en) | 2017-01-27 | 2024-08-13 | Shure Acquisition Holdings, Inc. | Array microphone module and system |
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Effective date of registration: 20180724 Address after: 261000 Fengshan Road, Fangzi District, Weifang, Shandong Province, No. 68 Patentee after: Shandong Gettop Acoustic Co.,Ltd. Address before: 100191 Beijing Haidian District Zhichun Road 23 quantum Ginza 1002 room Patentee before: Beijing Acuti Microsystems Co., Ltd. |
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