CN205385011U - Silicon chip crack detection device - Google Patents
Silicon chip crack detection device Download PDFInfo
- Publication number
- CN205385011U CN205385011U CN201620211662.8U CN201620211662U CN205385011U CN 205385011 U CN205385011 U CN 205385011U CN 201620211662 U CN201620211662 U CN 201620211662U CN 205385011 U CN205385011 U CN 205385011U
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- silicon chip
- blowing nozzle
- image
- image component
- detection
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Abstract
The utility model relates to a silicon chip crack detection device, including image subassembly and the blowing nozzle that shines the silicon chip surface, its characterized in that, an image subassembly and the detecting element of blowing nozzle constitution who sets up in this image subassembly front side, detecting element sets up the upper and lower both sides at the silicon chip, the image subassembly comprises the transmitting illuminant of one side and the image sensor of opposite side, just the tail end line connection formation of image processing unit of image subassembly, formation of image processing unit connects display element. The utility model discloses the detection erroneous judgement that the reduction caused because of surface pollutant in the surperficial testing process of silicon chip has improved the detection accuracy, and the silicon chip detects and to form images fast simultaneously, is convenient for survey.
Description
Technical field
This utility model relates to silicon chip optical detection apparatus technical field, particularly relates to a kind of silicon chip slight crack detecting device.
Background technology
In solaode manufacture process, it is both needed to silicon chip is detected, and eliminates silicon chip inferior by the parameter detected, or silicon chip is carried out grade separation.Silicon chip after after testing after further treatment, as formed conduction grid line on surface, ultimately forms the cell piece that can be used to generate electricity.The detection of silicon chip is included the size detection of silicon chip, angularity detection, slight crack detection and electric property detection etc..It is typically now all adopt optical imaging apparatus that silicon chip surface is detected, but existing detecting device is frequently present of detection erroneous judgement, mainly in the production process of silicon chip, it is also easy to form viscose glue, fingerprint etc. in its surface stain, often the dirt of silicon chip surface is damaged as silicon chip surface during detection, there is observation inconvenience in existing detection equipment simultaneously, easily causes erroneous judgement too.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, provide a kind of silicon chip slight crack detecting device, reduce the detection erroneous judgement caused because of surface contaminant in silicon chip surface detection process, improve detection accuracy, simultaneously silicon chip detection can fast imaging, it is simple to observation.
This utility model is achieved through the following technical solutions: a kind of silicon chip slight crack detecting device, including the image component and the blowing nozzle that irradiate silicon chip surface, it is characterized in that, one image component forms a detection unit with the blowing nozzle being arranged on front side of this image component, described detection unit is arranged on the both sides up and down of silicon chip, described image component is made up of the transmitting illuminant of side and the image sensor of opposite side, and the tail end connection image forming process unit of described image component, described image forming process unit connects display unit.
Further, what described image component and blowing nozzle formed detects unit near the upper and lower end face of silicon chip respectively at least provided with two groups.
Further, the mouthpiece of described blowing nozzle is perpendicular to silicon chip.
Further, described silicon chip is run to side by tape transport.
nullCompared with prior art,The beneficial effects of the utility model are: this utility model arranges blowing nozzle by the front side of the image component at detecting device,When silicon chip is detected surface by tape transport to image component,First adopt blowing nozzle that silicon chip surface is blown,Blow the foreign material of silicon chip surface off,Silicon chip surface pollutant are avoided to cause detection erroneous judgement,And image component and blowing nozzle composition detection unit near the upper and lower end face of silicon chip respectively at least provided with two groups,Guarantee that silicon chip surface is blown off by blowing nozzle,Ensure the accuracy of detection,And arrange in the upper and lower end face of silicon chip,Realize the complete detection to silicon chip surface,Silicon chip is launched incident illumination by the transmitting illuminant of image component,And the reflection light after silicon chip reflects is received by image sensor,Luminance signal is passed to image forming process unit by image sensor simultaneously,At display unit, silicon chip surface imaging is shown after the whole process of imaged processing unit,It is easy to observation.
Accompanying drawing explanation
Fig. 1 is the attachment structure schematic diagram of a kind of silicon chip slight crack detecting device of this utility model.
Wherein: 1, conveyer belt;2, silicon chip;3, image component;4, image forming process unit;5, display unit;6, transmitting illuminant;7, image sensor;8, blowing nozzle.
Detailed description of the invention
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, this utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain this utility model, be not used to limit this utility model.
As shown in Figure 1, this utility model relates to a kind of silicon chip slight crack detecting device, including the image component 3 and the blowing nozzle 8 that irradiate silicon chip surface, one image component 3 forms a detection unit with being arranged on the blowing nozzle 8 on front side of this image component 3, described detection unit is arranged on the both sides up and down of silicon chip 2, described image component 3 is made up of the transmitting illuminant 6 of side and the image sensor 7 of opposite side, and the tail end connection image forming process unit 4 of described image component 3, described image forming process unit 4 connects display unit 5, what described image component 3 and blowing nozzle 8 formed detects unit near the upper and lower end face of silicon chip 2 respectively at least provided with two groups, the mouthpiece of described blowing nozzle 8 is perpendicular to silicon chip 2, described silicon chip 2 is carried by conveyer belt 1 and is run to side.
nullIn sum,This utility model is by arranging blowing nozzle 8 in the front side of the image component 3 of detecting device,Silicon chip 2 by conveyer belt defeated 1 deliver to image component 3 detect surface time,Blowing nozzle 8 is first adopted to be blown in silicon chip 2 surface,Blow the foreign material on silicon chip 2 surface off,Silicon chip 2 surface contaminant is avoided to cause detection erroneous judgement,And image component 3 and blowing nozzle 8 composition detection unit near the upper and lower end face of silicon chip 2 respectively at least provided with two groups,Guarantee that silicon chip 2 surface is blown off by blowing nozzle 8,Ensure the accuracy of detection,And arrange in the upper and lower end face of silicon chip 2,Realize the complete detection to silicon chip 2 surface,Silicon chip 2 is launched incident illumination by the transmitting illuminant 6 of image component 3,And the reflection light after silicon chip 2 reflects is received by image sensor 7,Luminance signal is passed to image forming process unit 4 by image sensor 7 simultaneously,At display unit 5, silicon chip 2 surface imaging is shown after the imaged whole process of processing unit 4,It is easy to observation.
The foregoing is only preferred embodiment of the present utility model, not in order to limit this utility model, all any amendment, equivalent replacement and improvement etc. made within spirit of the present utility model and principle, should be included within protection domain of the present utility model.
Claims (4)
1. a silicon chip slight crack detecting device, including the image component (3) and the blowing nozzle (8) that irradiate silicon chip surface, it is characterized in that, one image component (3) and be arranged on this image component (3) front side blowing nozzle (8) form one detection unit, described detection unit is arranged on the both sides up and down of silicon chip (2), described image component (3) is made up of the transmitting illuminant (6) of side and the image sensor (7) of opposite side, and tail end connection image forming process unit (4) of described image component (3), described image forming process unit (4) connects display unit (5).
2. a kind of silicon chip slight crack detecting device according to claim 1, it is characterised in that the detection unit that described image component (3) and blowing nozzle (8) form near the upper and lower end face of silicon chip (2) respectively at least provided with two groups.
3. a kind of silicon chip slight crack detecting device according to claim 1, it is characterised in that the mouthpiece of described blowing nozzle (8) is perpendicular to silicon chip (2).
4. a kind of silicon chip slight crack detecting device according to claim 1, it is characterised in that described silicon chip (2) is run to side by conveyer belt (1) conveying.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620211662.8U CN205385011U (en) | 2016-03-18 | 2016-03-18 | Silicon chip crack detection device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620211662.8U CN205385011U (en) | 2016-03-18 | 2016-03-18 | Silicon chip crack detection device |
Publications (1)
Publication Number | Publication Date |
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CN205385011U true CN205385011U (en) | 2016-07-13 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201620211662.8U Expired - Fee Related CN205385011U (en) | 2016-03-18 | 2016-03-18 | Silicon chip crack detection device |
Country Status (1)
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CN (1) | CN205385011U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018188654A1 (en) * | 2017-04-14 | 2018-10-18 | 常州亿晶光电科技有限公司 | Device and method for detecting bending and warping of silicon wafer of solar cell |
-
2016
- 2016-03-18 CN CN201620211662.8U patent/CN205385011U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018188654A1 (en) * | 2017-04-14 | 2018-10-18 | 常州亿晶光电科技有限公司 | Device and method for detecting bending and warping of silicon wafer of solar cell |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160713 |