CN205384546U - Embedded computer support plate - Google Patents
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- CN205384546U CN205384546U CN201620140638.XU CN201620140638U CN205384546U CN 205384546 U CN205384546 U CN 205384546U CN 201620140638 U CN201620140638 U CN 201620140638U CN 205384546 U CN205384546 U CN 205384546U
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Abstract
The utility model provides an embedded computer support plate. This embedded computer support plate includes: the treater passes through HT bus connection's north bridge chip with the treater, pass through A with the north bridge chip link bus connection's south bridge chip to and power module, the treater passes through memory bus connection memory module, and power module includes an electrical unit, the 2nd electrical unit and the 3rd electrical unit, the low dropout regulator that an electrical unit includes a switching power supply stabiliser, is connected with switching power supply stabiliser electricity, the 2nd electrical unit include the 2nd switching power supply stabiliser, the 3rd electrical unit include the 3rd switching power supply stabiliser, with electric the 2nd low dropout regulator who is connected of the 3rd switching power supply stabiliser. The embedded computer support plate that this embodiment provided can provide stable power for the modular computer for the modular computer can the reliability service.
Description
Technical Field
The embodiment of the utility model provides a relate to the computer technology, especially relate to an embedded computer support plate.
Background
COM-Express is an embedded Industrial computer modularization standard developed by the computer industry association (PCI Industrial computers Group, PICMG for short) standardization organization in recent years, and is suitable for being used when a standard single board computer is structurally or has no expansibility, so as to shorten the development period of the computer, increase the flexibility and unify the standard.
The existing COM-Express standard is a high-speed computer-interface-based standard that allows the use of USB2.0 and PCIE xpress applications, serial ATA, gigabit ports, etc. All electronic signals are connected to the interface through the connectors of the two 220-pin AB and CD. However, the current modular computer based on the COM-Express standard has limited board card area, complex power domain and unstable performance of the power supply, which affects the reliable operation of the modular computer.
SUMMERY OF THE UTILITY MODEL
An embodiment of the utility model provides an embedded computer support plate for the module computer can the reliable operation.
The utility model provides an embedded computer support plate, include: the processor is connected with the memory module through a memory bus, and the power module comprises a first power supply unit, a second power supply unit and a third power supply unit; wherein,
the first power supply unit comprises a first switching power supply voltage stabilizer and a first low dropout linear voltage stabilizer electrically connected with the first switching power supply voltage stabilizer, the first switching power supply voltage stabilizer is also electrically connected with the processor and the memory module respectively, the first low dropout linear voltage stabilizer is electrically connected with the memory module, the first switching power supply voltage stabilizer is used for converting an input first voltage into a second voltage and outputting the second voltage to the processor, the memory module and the first low dropout linear voltage stabilizer, and the first low dropout linear voltage stabilizer is used for converting the second voltage into a third voltage and outputting the third voltage to the memory module;
the second power supply unit comprises a second switching power supply voltage stabilizer which is respectively and electrically connected with the processor and the north bridge chip, and the second switching power supply voltage stabilizer is used for converting the input first voltage into a fourth voltage and outputting the fourth voltage to the processor and the north bridge chip;
The third power supply unit comprises a third switching power supply voltage stabilizer and a second low dropout regulator electrically connected with the third switching power supply voltage stabilizer, the third switching power supply voltage stabilizer is respectively and electrically connected with the processor, the north bridge chip and the south bridge chip through a first branch circuit, the third switching power supply voltage stabilizer is respectively and electrically connected with the second low dropout regulator, the processor, the north bridge chip and the south bridge chip through a second branch circuit, the second low dropout regulator is electrically connected with the processor, a double-circuit Metal Oxide Semiconductor Field Effect Transistor (MOSFET) is integrated in the third switching power supply regulator, the third switching power supply regulator is used for converting the input first voltage into a fifth voltage and a sixth voltage, the fifth voltage is output to the processor, the north bridge chip and the south bridge chip through a first branch circuit; the sixth voltage is output to the processor, the north bridge chip, the south bridge chip and the second low dropout regulator through a second branch, and the second low dropout regulator is used for converting the sixth voltage into a seventh voltage and outputting the seventh voltage to the processor.
Optionally, the power module further comprises: a fourth power supply unit, the fourth power supply unit include third low-dropout linear regulator, with the fourth low-dropout linear regulator that third low-dropout linear regulator electricity is connected, third low-dropout linear regulator still with south bridge chip electricity is connected, fourth low-dropout linear regulator still with south bridge chip electricity is connected, third low-dropout linear regulator is used for converting the eighth voltage of input into ninth voltage input extremely south bridge chip with fourth low-dropout linear regulator, fourth low-dropout linear regulator is used for converting the ninth voltage of input into tenth voltage input extremely south bridge chip.
Optionally, the size of the first switching power supply regulator is 2.6 mm × 1.8 mm, the size of the second switching power supply regulator is 2.6 mm × 1.8 mm, and the size of the third switching power supply regulator is 4 mm × 5 mm.
Optionally, the first voltage is 12V, the second voltage is 1.8V, the third voltage is 0.9V, the fourth voltage is 1.1V, the fifth voltage is 1.2V, the sixth voltage is 3.3V, the seventh voltage is 2.5V, the eighth voltage is 5VSB, the ninth voltage is 3.3VSB, and the tenth voltage is 1.2 VSB.
Optionally, the processor is a Loongson 3A processor, the north bridge chip is AMD780E, and the south bridge chip is SB 710E.
Optionally, the processor is further connected to the BIOS chip through an LPC bus; the processor is integrated with a memory controller, and the memory controller is connected with the memory module through a memory bus interface.
Optionally, the number of the memory controllers is two, and each memory controller is connected to one small dual in-line memory module.
Optionally, the north bridge chip supports a VGA interface, a LVDS interface, a PCI-E interface, and a video memory, and the south bridge chip supports a USB interface, a PCI, a SATA interface, a PATA interface, and an HD audio interface.
Optionally, the north bridge chip supports 6 PCI-E × 1, one PCI-E × 16, where one PCI-E × 1 is connected to the ethernet controller.
Optionally, the south bridge chip supports 8 USB interfaces and supports 4 SATA interfaces.
The utility model discloses a processor, the north bridge chip that passes through HT bus connection with the processor, the south bridge chip that passes through A-Link bus connection with the north bridge chip, and power module, the processor passes through memory bus connection memory module, power module includes first power supply unit, second power supply unit and third power supply unit, first power supply unit includes first switching power regulator, the first low dropout linear voltage regulator that is connected with first switching power regulator electricity, second power supply unit includes second switching power regulator, the third power supply unit includes third switching power regulator, the second low dropout linear voltage regulator that is connected with third switching power regulator electricity, this embodiment chooses the first switching power regulator, the second switching power regulator and the third switching power regulator that conversion efficiency is high, the integration level that calorific capacity is low is higher to the power domain of heavy current demand, the first switching power supply voltage stabilizer is electrically connected with the processor and the memory module, so that the voltage required by normal operation can be provided for the processor and the memory module, and the second switching power supply voltage stabilizer is electrically connected with the processor and the north bridge chip, so that the nuclear voltage of the processor and the north bridge chip can be provided; the third switching power supply voltage stabilizer is respectively and electrically connected with the processor, the north bridge chip and the south bridge chip through the first branch circuit and can provide core voltage for the processor, the north bridge chip, the south bridge chip and the processor, the third switching power supply voltage stabilizer is respectively and electrically connected with the second low-dropout linear voltage stabilizer, the processor, the north bridge chip and the south bridge chip through the second branch circuit and can provide voltage for each interface on the processor, the north bridge chip and the south bridge chip, thereby realizing the requirement of pointedly realizing the multi-path power supply conversion on the carrier plate according to the actual requirements of the processor, the memory module, the south bridge chip and the north bridge chip, improving the reliability of the computer system, selecting the first low-dropout linear voltage stabilizer and the second low-dropout linear stabilizer with smaller occupied area for the power domain with small current requirement, and the first low-dropout linear voltage stabilizer is electrically connected with the memory module, the reference input voltage can be provided for the memory module, the second low dropout regulator is electrically connected with the processor, and can provide voltage for a clock system of the processor, so that the requirements of the memory module and the processor are met, the running reliability of the memory module and the processor is ensured, and the area of a circuit board can be saved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 is a schematic view of an overall structure of an embedded computer carrier according to a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of a power module according to a second embodiment of the embedded computer carrier of the present invention;
fig. 3 is a schematic structural diagram of a power module according to a third embodiment of the embedded computer carrier of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Fig. 1 is a schematic view of an overall structure of an embedded computer carrier according to the present invention. The computer carrier board of the present invention will be described in detail with reference to fig. 1.
As shown in fig. 1, the embedded computer board provided in this embodiment includes: the processor 10 and the processor 10 are connected through a Hyper Transport (HT) bus, a north bridge chip connected with the north bridge chip through an a-Link bus, and a power module.
Optionally, in this embodiment, the processor 10 is a Loongson 3A processor, the Northbridge chip 20 is AMD780E, and the southbridge chip 30 is SB 710E. The following description is directed to the processor 10, the north bridge 20, and the south bridge 30.
For the processor 10, the processor 10 is connected to a Basic Input Output System (BIOS chip for short) through a Low Pin Count (LPC) bus, and the BIOS chip 102 may adopt an 8Mbit Flash chip SST49LF 008A; the processor also has a memory controller (not shown) integrated therein, which may be coupled to the memory modules via a memory bus. Optionally, there are two Memory controllers, each of which is connected to a Small Dual In-line Memory Module (sodim), and the Memory Module is a second generation Double Data rate Synchronous Dynamic random Access Memory (DDR 2). Such as DDR2 SODIMM 101A and DDR2 SODIMM 101B shown in fig. 1. The memory capacity can be configured according to the user requirement.
For the north bridge chip 20, the north bridge chip 20 integrates two independent display controllers, and the north bridge chip 20 supports 1 Video Graphics Array (VGA) interface 206 and 1 Low-Voltage Differential Signaling (LVDS) interface 205 of 24bit Dual-Link. The north bridge chip 20 further supports a PCIE interface, and optionally, the north bridge chip 20 supports 6 PCI-E × 1 and one PCI-E × 16204, where one PCI-E × 1201 is connected to the ethernet controller 202, and the other 5 PCI-E × 1203 may be directly connected to the connector. The PCI-E16 interface can support an external expansion display card or be configured as a general PCI-E interface, and the north bridge chip also supports a display memory 207.
For the south bridge chip 30, the south bridge chip 30 supports a USB interface 301, a PCI304, a Serial Advanced Technology Attachment (SATA) interface 302, a Parallel Advanced Technology Attachment (PATA) interface 305, and a High Definition (HD) audio interface 303. Optionally, the south bridge chip 30 supports 8 USB interfaces and supports 4 SATA interfaces.
Those skilled in the art will understand that all the interfaces described above are directly connected to the AB CD interface, the AB interface (220 pin) and the CD interface (220 pin) of the connector of the embedded computer carrier board, and the embodiment is not limited herein for the specific connection manner.
The embodiment schematically shows implementation manners of the processor, the south bridge chip, and the north bridge chip, and interfaces supported by the processor, the south bridge chip, and the north bridge chip, and the above embodiment is only an example, and other implementation manners may also be specifically provided, which is not described herein again.
In the specific implementation process, a modular computer based on the Loongson 3A has a complex power domain and a limited board card area, the power design is the key of the whole embedded computer carrier board, the power design quality directly influences the reliable operation of the system, and practical experience shows that most of faults caused by external interference of an industrial control computer are caused by the power. Therefore, in the embodiment, the embedded computer carrier board is improved, so that the board card area is saved, and the stability of a power supply is improved, so that the module computer can run reliably.
Specifically, taking the Loongson 3A processor as an example, the input power supplies are +12V, +5VSB and 3.3VRTC, and the ATX power on-off is supported. The power domain on the carrier plate includes: in the S5 domain and the S0 domain, except for the input power, the carrier board still needs to convert itself to generate 2 kinds of power in the S5 domain and 6 kinds of power in the S0 domain. The power domain of the present invention will be described in detail with reference to fig. 2 and 3.
Fig. 2 is a schematic structural diagram of a power module according to a second embodiment of the embedded computer carrier of the present invention, wherein the power module includes a first power unit, a second power unit and a third power unit when implementing power supply of S0 domain. Each power supply unit will be described in detail below using specific examples.
As shown in fig. 2, the first power supply unit includes a first switching power supply regulator 41, and a first low dropout regulator 42 electrically connected to the first switching power supply regulator 41, the first switching power supply regulator 41 is further electrically connected to the processor 10 and the memory module 101, respectively, the first switching power supply regulator 41 is configured to convert an input first voltage into a second voltage and output the second voltage to the processor 10 and the memory module 101, and the first low dropout regulator 42 is configured to convert the second voltage into a third voltage and output the third voltage to the memory module 101.
Specifically, the first switching power supply regulator 41 may be implemented by using a switching power supply regulator ISL8105, and the size of the first switching power supply regulator 41 is 2.6 mm × 1.8 mm. First low dropout regulator 42 may be implemented using low dropout regulator ISL 80103. The first switching power supply regulator 41 is configured to convert an input first voltage 12V into a second voltage 1.8V and output the second voltage to the processor 10, the memory module 101 and the first low dropout regulator 42. The first low dropout regulator 42 is configured to convert the second voltage 1.8V into a third voltage 0.9V and output the third voltage to the memory module 101. The voltage of 1.8V is a working voltage required by the memory controller and the memory module in the processor to work normally, and the corresponding required current is about 5A, and the voltage of 0.9V is a reference input Voltage (VTT) of the memory module, and a smaller current is correspondingly required.
As shown in fig. 2, the second power supply unit includes a second switching power supply voltage regulator 51, the second switching power supply voltage regulator 51 is electrically connected to the processor 10 and the north bridge chip 20, respectively, and the second switching power supply voltage regulator 51 is configured to convert the input first voltage into a fourth voltage and output the fourth voltage to the processor 10 and the north bridge chip 20.
Specifically, the second switching power supply regulator 51 may be implemented by using a switching power supply regulator ISL8105, and the size of the second switching power supply regulator 51 is 2.6 mm × 1.8 mm. The second switching power supply 51 is used for converting the input first voltage 12V into a fourth voltage 1.1V and outputting the fourth voltage to the processor 10 and the north bridge chip 20. Wherein, the voltage of 1.1V is the core voltage of the processor and the north bridge chip.
As shown in fig. 2, the third power supply unit includes a third switching power supply regulator 61, and a second low dropout regulator 62 electrically connected to the third switching power supply regulator 61, the third switching power supply regulator 61 is electrically connected to the processor 10, the north bridge chip 20, and the south bridge chip 30 through a first branch, the third switching power supply regulator 61 is electrically connected to the second low dropout regulator 62, the processor 10, the north bridge chip 20, and the south bridge chip 30 through a second branch, the second low dropout regulator 62 is electrically connected to the processor 10, a double-channel Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) is integrated in the third switching power supply regulator 61, the third switching power supply regulator 61 is configured to convert the input first voltage into a fifth voltage and a sixth voltage, and the fifth voltage is output to the processor 10 through the first branch, A north bridge chip 20 and a south bridge chip 30; the sixth voltage is output to the processor 10, the north bridge chip 20, the south bridge chip 30, and the second low dropout regulator 62 through the second branch, and the second low dropout regulator 62 is configured to convert the sixth voltage into a seventh voltage and output the seventh voltage to the processor 10.
Specifically, the third switching power supply regulator 61 may be implemented by a switching power supply regulator LTC3633EUFD # PBF, and a double-channel MOSFET is integrated in the third switching power supply regulator 61, so that the third switching power supply regulator may output a first branch voltage 1.2V and a second branch voltage 3.3V. The size of the third switching power regulator 61 is 4 mm × 5 mm. Second low dropout linear regulator 62 may be implemented using low dropout linear regulator ISL 80103. The third switching power supply regulator 61 is configured to convert the input first voltage 12V into a fifth voltage 1.2V and a sixth voltage 3.3V, where the fifth voltage 1.2V is output to the processor 10, the north bridge chip 20, and the south bridge chip 30 through the first branch; the sixth voltage 3.3V is output to the processor 10, the north bridge chip 20, the south bridge chip 30 and the second low dropout regulator 62 through the second branch, and the second low dropout regulator 62 is configured to convert the sixth voltage 3.3V into a seventh voltage 2.2V and output to the processor 10. The voltage of 1.2V is the core voltage of the processor 10, the north bridge chip 20, and the south bridge chip 30, and the current required is about 2A. The 3.3V voltage is a voltage required by each interface of the processor 10, the north bridge chip 20, and the south bridge chip 30, and corresponds to a required current of about 2A. The 2.5V voltage is the voltage required by the clock system of the processor 10, corresponding to a required current of about 100 mA.
In the aspect of type selection, the power supply chip of the embodiment selects the switching power supply voltage regulator with high conversion efficiency and low heat productivity for the power supply domain with large current demand, so that the requirement of targeted multi-path power supply conversion on the carrier plate is realized according to the actual requirements of the processor, the memory module, the south bridge chip and the north bridge chip, the reliability of a computer system is improved, and a low dropout regulator (LDO) is selected for the power supply domain with small current demand.
Fig. 3 is a schematic structural diagram of a power module according to a third embodiment of the embedded computer carrier of the present invention, in order to implement S5 domain power, the power module further includes a fourth power unit according to the present embodiment on the basis of the embodiment of fig. 2.
Specifically, the fourth power supply unit includes a third low dropout regulator 71 and a fourth low dropout regulator 73 electrically connected to the third low dropout regulator 71, the third low dropout regulator 71 is further electrically connected to the south bridge chip 30, and the fourth low dropout regulator 73 is further electrically connected to the south bridge chip 30.
The S5 domain power supply mainly makes the south bridge chip 30 perform power management, and the required voltage of the south bridge chip 30 is 3.3VSB and 1.2VSB when performing power management. Therefore, the third low dropout regulator 71 is configured to convert the inputted eighth voltage 5VSB into the ninth voltage 3.3VSB to be inputted to the south bridge chip 30 and the fourth low dropout regulator 73, and the fourth low dropout regulator 73 is configured to convert the inputted ninth voltage 3.3VSB into the tenth voltage 1.2VSB to be inputted to the south bridge chip 30. Both the third low dropout regulator 71 and the fourth low dropout regulator 73 can be implemented by using the low dropout regulator ISL 80103.
In summary, in the embodiment, the switching power supply voltage regulator with high conversion efficiency and low heat productivity and high integration level is selected for the power domain requiring large current; the requirement of multi-path power supply conversion on the carrier plate is realized, the reliability of a computer system is improved, and the low-dropout linear voltage regulator is selected for a power supply domain with a small current requirement so as to save the area of a circuit board.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (10)
1. An embedded computer carrier, comprising: the processor is connected with the memory module through a memory bus, and the power module comprises a first power supply unit, a second power supply unit and a third power supply unit; wherein,
the first power supply unit comprises a first switching power supply voltage stabilizer and a first low dropout linear voltage stabilizer electrically connected with the first switching power supply voltage stabilizer, the first switching power supply voltage stabilizer is also electrically connected with the processor and the memory module respectively, the first low dropout linear voltage stabilizer is electrically connected with the memory module, the first switching power supply voltage stabilizer is used for converting an input first voltage into a second voltage and outputting the second voltage to the processor, the memory module and the first low dropout linear voltage stabilizer, and the first low dropout linear voltage stabilizer is used for converting the second voltage into a third voltage and outputting the third voltage to the memory module;
the second power supply unit comprises a second switching power supply voltage stabilizer which is respectively and electrically connected with the processor and the north bridge chip, and the second switching power supply voltage stabilizer is used for converting the input first voltage into a fourth voltage and outputting the fourth voltage to the processor and the north bridge chip;
The third power supply unit comprises a third switching power supply voltage stabilizer and a second low dropout regulator electrically connected with the third switching power supply voltage stabilizer, the third switching power supply voltage stabilizer is respectively and electrically connected with the processor, the north bridge chip and the south bridge chip through a first branch circuit, the third switching power supply voltage stabilizer is respectively and electrically connected with the second low dropout regulator, the processor, the north bridge chip and the south bridge chip through a second branch circuit, the second low dropout regulator is electrically connected with the processor, a double-circuit Metal Oxide Semiconductor Field Effect Transistor (MOSFET) is integrated in the third switching power supply regulator, the third switching power supply regulator is used for converting the input first voltage into a fifth voltage and a sixth voltage, the fifth voltage is output to the processor, the north bridge chip and the south bridge chip through a first branch circuit; the sixth voltage is output to the processor, the north bridge chip, the south bridge chip and the second low dropout regulator through a second branch, and the second low dropout regulator is used for converting the sixth voltage into a seventh voltage and outputting the seventh voltage to the processor.
2. The embedded computer carrier of claim 1, wherein the power module further comprises: a fourth power supply unit, the fourth power supply unit include third low-dropout linear regulator, with the fourth low-dropout linear regulator that third low-dropout linear regulator electricity is connected, third low-dropout linear regulator still with south bridge chip electricity is connected, fourth low-dropout linear regulator still with south bridge chip electricity is connected, third low-dropout linear regulator is used for converting the eighth voltage of input into ninth voltage input extremely south bridge chip with fourth low-dropout linear regulator, fourth low-dropout linear regulator is used for converting the ninth voltage of input into tenth voltage input extremely south bridge chip.
3. The embedded computer carrier board of claim 1, wherein the first switching power regulator has a size of 2.6 mm x 1.8 mm, the second switching power regulator has a size of 2.6 mm x 1.8 mm, and the third switching power regulator has a size of 4 mm x 5 mm.
4. The embedded computer carrier board of claim 2, wherein the first voltage is 12V, the second voltage is 1.8V, the third voltage is 0.9V, the fourth voltage is 1.1V, the fifth voltage is 1.2V, the sixth voltage is 3.3V, the seventh voltage is 2.5V, the eighth voltage is 5VSB, the ninth voltage is 3.3VSB, and the tenth voltage is 1.2 VSB.
5. The embedded computer carrier of claim 1, wherein the processor is a Loongson 3A processor, the Northbridge chip is AMD780E, and the southbridge chip is SB 710E.
6. The embedded computer carrier board of claim 1, wherein the processor is further connected to the BIOS chip via an LPC bus; the processor is integrated with a memory controller, and the memory controller is connected with the memory module through a memory bus interface.
7. The embedded computer carrier according to claim 1, wherein there are two memory controllers, and each memory controller is connected to a small dual in-line memory module.
8. The embedded computer carrier board according to any one of claims 1 to 7, wherein the north bridge chip supports VGA interface, LVDS interface, PCI-E and video memory, and the south bridge chip supports USB interface, PCI, SATA interface, PATA interface and HD audio interface.
9. The embedded computer carrier board of claim 8, wherein the northbridge chip supports 6 PCI-E x 1, one PCI-E x 16, wherein one PCI-E x 1 is connected to an ethernet controller.
10. The embedded computer carrier board of claim 8, wherein the south bridge chip supports 8 USB interfaces and 4 SATA interfaces.
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| CN201620140638.XU CN205384546U (en) | 2016-02-24 | 2016-02-24 | Embedded computer support plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107831884A (en) * | 2017-10-24 | 2018-03-23 | 曙光信息产业(北京)有限公司 | The electric power system of computer motherboard |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107831884A (en) * | 2017-10-24 | 2018-03-23 | 曙光信息产业(北京)有限公司 | The electric power system of computer motherboard |
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Address after: 100095 Building 2, Longxin Industrial Park, Zhongguancun environmental protection technology demonstration park, Haidian District, Beijing Patentee after: Loongson Zhongke Technology Co.,Ltd. Address before: 100095 Building 2, Longxin Industrial Park, Zhongguancun environmental protection technology demonstration park, Haidian District, Beijing Patentee before: LOONGSON TECHNOLOGY Corp.,Ltd. |