CN2053831U - Speed remover for ic chip - Google Patents
Speed remover for ic chip Download PDFInfo
- Publication number
- CN2053831U CN2053831U CN 89200135 CN89200135U CN2053831U CN 2053831 U CN2053831 U CN 2053831U CN 89200135 CN89200135 CN 89200135 CN 89200135 U CN89200135 U CN 89200135U CN 2053831 U CN2053831 U CN 2053831U
- Authority
- CN
- China
- Prior art keywords
- chip
- tin
- heater
- utility
- integrated chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Abstract
The utility model discloses a device which can rapidly and safely remove an integrated chip without damaging a circuit plate. The utility model comprises a heating device which is composed of contact legs, a welding head, a heating electric heating wire and a handle and the device of a blow tin tube which is used for clearing the residual tin in a welding hole. When a chip and other elements need to be removed, the suitable contact leg is arranged on the welding head according to the requirement. After the contact leg is heated, a heater aims at the base pin of the chip. After tin is melted, the chip can be drawn off. The heater is not removed, the blow tin tube aims at welding hole and presses a rubber gas holder, and the residual tin is blown off. The heater is taken away, and the operation is completed. When the chip is taken out by the utility model, the welding hole of the circuit plate is clean. The chip can be conveniently replaced.
Description
The present invention relates to a kind of new integrated chip relieving attachment, particularly a kind of energy is dismantled the chip on the vlsi circuitry plate fast, safely.Be suitable for the following integrated chip of 20 legs.
Existing integrated chip extracting tool is mainly solder sucker.It mainly is made up of tin sucting head, electric heater, spring, press rods and gas dome.The solder sucker of selling on the market is exactly this form.After the solder sucker heating, depress press rods,, to treat to press button after the tinization by on the chip leg that will dismantle with tin sucting head, the tin on the solder joint just is sucked out, and with scolding tin exhaustion on each pin of chip, pulls up chip with driver-extractor then so again and again.Because operation needs next pin to inhale tin, thereby speed is slow, and easy damaged line plate.Make troubles to work.
Task of the present invention provides a kind of novel stripping attachment, and it can dismantle general middle and small scale integrated chip quickly and safely.
Describe in further detail for invention below in conjunction with accompanying drawing.
Fig. 1 is a kind of concrete longitudinal sectional drawing of heater section of the present invention.
Fig. 2 is that the present invention blows the tinware profile.
With reference to Fig. 1, have heat conduction, heat-resisting and the contact leg of certain degree of hardness is arranged, according to dismounting device difference the multiple specification that adapts (1) can be arranged. Soldering copper head (2) with good heat accumulation heat conductivility. Insulation, heat-resistant sheet (3). Heat-resisting porcelain dish (4). Heating wire (5) with certain power. Iron head cover (6). Porcelain dish pallet (7). Metal frame (8). Handle (9). Insulation heat-resistant rings (10). Pallet is gong silk (11) fixedly. Handle is gong nail (12) fixedly.
With reference to Fig. 2, rubber gas dome (1). Steel pipe (2).
During operation, load onto and will dismantle the heat conduction head that chip matches, plug in, heating back solder horn arrives molten some temperature of scolding tin, and this flatiron heat conduction head is aimed at chip pin, treats with the integrated chip driver-extractor chip to be taken out after the tinization, blow residual tin with blowing tinware off by the hole then, the operation of this stripping attachment is finished.
The utility model is a kind of device of dismantling integrated chip fast, safely.Be applicable to that electronic equipment maintenance uses.Not only detachable integrated chip also can be used for the fast quick-detach of transistor, resistance, electric capacity.
Claims (2)
1, a kind of integrated chip quick detacher, special use contact leg with a double dentation, can make different size [1] according to die size, it is characterized in that on the rectangular slab two toothrow shape legs side by side, solder horn [2] with good heat conductive and thermal storage performance, certain power heating wire [3], the heater that pallet and handle are formed.
2, according to the described stripping attachment of claim 1, it is characterized in that having removable dentation leg, be applied to the plurality of specifications integrated chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 89200135 CN2053831U (en) | 1988-12-30 | 1988-12-30 | Speed remover for ic chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 89200135 CN2053831U (en) | 1988-12-30 | 1988-12-30 | Speed remover for ic chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2053831U true CN2053831U (en) | 1990-02-28 |
Family
ID=4858280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 89200135 Withdrawn CN2053831U (en) | 1988-12-30 | 1988-12-30 | Speed remover for ic chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2053831U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104269352A (en) * | 2014-09-30 | 2015-01-07 | 京东方科技集团股份有限公司 | Chip removal device |
-
1988
- 1988-12-30 CN CN 89200135 patent/CN2053831U/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104269352A (en) * | 2014-09-30 | 2015-01-07 | 京东方科技集团股份有限公司 | Chip removal device |
| CN104269352B (en) * | 2014-09-30 | 2017-02-15 | 京东方科技集团股份有限公司 | Chip removal device |
| US9629293B2 (en) | 2014-09-30 | 2017-04-18 | Boe Technology Group Co., Ltd. | Chip removing device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |