CN205378404U - QSFP module shell structure and QSFP module - Google Patents
QSFP module shell structure and QSFP module Download PDFInfo
- Publication number
- CN205378404U CN205378404U CN201521142675.6U CN201521142675U CN205378404U CN 205378404 U CN205378404 U CN 205378404U CN 201521142675 U CN201521142675 U CN 201521142675U CN 205378404 U CN205378404 U CN 205378404U
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- China
- Prior art keywords
- qsfp module
- upper cover
- drain pan
- qsfp
- module housing
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Abstract
The utility model relates to a QSFP module shell structure and QSFP module, QSFP module shell structure, including drain pan and upper cover, the upper cover with the drain pan can be dismantled to connect and form accommodation space jointly, the upper cover and/or the drain pan is equipped with sunken heat radiation structure, heat radiation structure includes the diapire and encircles the lateral wall of diapire. Above -mentioned QSFP module shell structure, upper cover and/or drain pan are equipped with the surface area of sunken heat radiation structure in order to increase upper cover and/or drain pan to increase the heat radiating area of upper cover and/or drain pan, improved this QSFP module shell structure's radiating effect.
Description
Technical field
This utility model relates to fiber-optic transfer field, particularly relates to a kind of QSFP module housing structure and QSFP module.
Background technology
Along with the development of science and technology, the capacity of communication network primary transmission constantly expands, and transfer rate also improves constantly, and the fiber optic communication being becomes the prevailing transmission means of present information network.Existing optical communication network, for instance wide area network (WAN), Metropolitan Area Network (MAN) (MAN), LAN (LAN) etc. is also more and more higher to the wherein required requirement as the optical transceiver module of one of core light electronic device.Namely the demand of the pluggable solution of more highdensity high speed is born to meet market by QSFP (QuadSmallForm-factorPluggable, four-way SFP interface).The pluggable interface transfer rate of this four-way can reach 40Gbps.
And owing to QSFP module is the shell structure closed, therefore radiating effect is poor, thus affecting the performance of QSFP module.
Utility model content
Based on this, it is necessary to for the problem that QSFP module heat dissipating effect is poor, it is provided that a kind of good QSFP module housing structure of radiating effect and QSFP module.
A kind of QSFP module housing structure, including drain pan and upper cover, described upper cover and described drain pan removably connect and are collectively forming accommodation space, and described upper cover and/or described drain pan are provided with the radiator structure of depression, and described radiator structure includes diapire and the sidewall around described diapire.
Above-mentioned QSFP module housing structure, upper cover and/or drain pan are provided with the radiator structure of depression to increase the surface area of upper cover and/or drain pan, thus adding the area of dissipation of upper cover and/or drain pan, improve the radiating effect of this QSFP module housing structure.
Wherein in an embodiment, described upper cover includes top board and the upper side edge extended from the bending of described ceiling edge, and described radiator structure is located at the inwall of described top board.
Wherein in an embodiment, described drain pan includes base plate and the lower side extended from the bending of described bottom edge, and described radiator structure is located at the inwall of described base plate.
Wherein in an embodiment, described radiator structure includes multiple heat-sink unit, and multiple spaced settings of described heat-sink unit are cellular.
Wherein in an embodiment, the arrangement of described heat-sink unit array is rectangular.
Wherein in an embodiment, described heat-sink unit is polygon.
Wherein in an embodiment, described drain pan offers corresponding installing hole with described upper cover, to be removably connected by securing member.
A kind of QSFP module, including above-mentioned QSFP module housing structure.
Wherein in an embodiment, described QSFP module is provided with circuit board, and described circuit board is contained in described accommodation space.
Wherein in an embodiment, described radiator structure is positioned at described circuit board one or both sides.
Above-mentioned QSFP module, circuit board is positioned at the accommodation space that upper cover is formed with drain pan, therefore can be dispelled the heat by upper cover and drain pan.Owing to QSFP module housing structure is provided with radiator structure and has bigger area of dissipation, therefore can strengthen the radiating effect of this QSFP module, to increase the stability of this QSFP module, increase the service life.
Accompanying drawing explanation
Fig. 1 is the structural representation of the QSFP module of an embodiment.
Detailed description of the invention
For the ease of understanding this utility model, below with reference to relevant drawings, this utility model is described more fully.Accompanying drawing gives preferred embodiment of the present utility model.But, this utility model can realize in many different forms, however it is not limited to embodiment described herein.On the contrary, the purpose providing these embodiments is to make the understanding to disclosure of the present utility model more thorough comprehensively.
It should be noted that be referred to as " being fixed on " another element when element, it can directly on another element or can also there is element placed in the middle.When an element is considered as " connection " another element, it can be directly to another element or may be simultaneously present centering elements.Term as used herein " vertical ", " level ", "left", "right" and similar statement are for illustrative purposes only.
Unless otherwise defined, all of technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present utility model are generally understood that.The purpose describing specific embodiment it is intended merely to herein, it is not intended that in restriction this utility model at term used in the description of the present utility model.Term as used herein " and/or " include the arbitrary and all of combination of one or more relevant Listed Items.
As shown in Figure 1, a kind of QSFP module housing structure 20 of this preferred embodiment, including drain pan 22 and upper cover 24, upper cover 24 and drain pan 22 removably connect and are collectively forming accommodation space, upper cover 24 and/or drain pan 22 are provided with the radiator structure 26 of depression, described radiator structure 26 includes diapire and the sidewall around diapire, thus increasing upper cover 24 and/or the surface area of drain pan 22.
Above-mentioned QSFP module housing structure 20, upper cover 24 and/or drain pan 22 are provided with the radiator structure 26 of depression to increase upper cover 24 and/or the surface area of drain pan 22, thus adding upper cover 24 and/or the area of dissipation of drain pan 22, improve the radiating effect of this QSFP module housing structure 20.
Please continue to refer to Fig. 1, in the present embodiment, upper cover 24 includes top board 242 and the upper side edge 244 extended from the bending of top board 242 edge, and radiator structure 26 is located at the inwall of top board 242.Drain pan 22 includes base plate 222 and the lower side 224 extended from the bending of base plate 222 edge, and radiator structure 26 is located at the inwall of base plate 222.So, the heat holding space distributes mainly through top board 242 and base plate 222.
Radiator structure 26 includes multiple heat-sink unit 262, and multiple spaced settings of heat-sink unit 262 are cellular.All include diapire and the sidewall around diapire due to each heat-sink unit 262, therefore can increase area of dissipation further, and make heat radiation comparatively uniform.
Further, the arrangement of heat-sink unit 262 array is rectangular with the form fit with drain pan 22 and upper cover 24, and heat-sink unit 262 is all in polygon.In the present embodiment, heat-sink unit 262 is hexagonal, thus increasing quantity and the area of sidewall, to increase area of dissipation further.It is appreciated that the shape of heat-sink unit 262 is not limited to this, can be tetragon, pentagon etc..
Further, drain pan 22 offers corresponding installing hole with upper cover 24, to be removably connected by securing member 28.In the present embodiment, securing member 28 is screw.
Above-mentioned QSFP module housing structure 20, drain pan 22 and/or upper cover 24 are provided with the cooling mechanism of depression to expand drain pan 22 and/or the surface area of upper cover 24, thus increasing area of dissipation, improve radiating effect.
As it is shown in figure 1, a kind of QSFP module 100, including above-mentioned QSFP module housing structure 20.This QSFP module 100 is provided with circuit board 40, and circuit board 40 holds in space to be contained between upper cover 24 and drain pan 22.
Radiator structure 26 is positioned at circuit board 40 one or both sides, and so, the heat that circuit board 40 surface distributes can be transferred to upper cover 24 and drain pan 22, and then distributes to external environment.
Above-mentioned QSFP module 100, circuit board 40 is positioned at the accommodation space that upper cover 24 is formed with drain pan 22, therefore can pass through upper cover 24 and dispel the heat with drain pan 22.Owing to QSFP module housing structure 20 is provided with radiator structure 26 and has bigger area of dissipation, therefore can strengthen the radiating effect of this QSFP module 100, to increase the stability of this QSFP module 100, increase the service life.
Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics is absent from contradiction, all it is considered to be the scope that this specification is recorded.
Embodiment described above only have expressed several embodiments of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to utility model patent scope.It should be pointed out that, for the person of ordinary skill of the art, without departing from the concept of the premise utility, it is also possible to make some deformation and improvement, these broadly fall into protection domain of the present utility model.Therefore, the protection domain of this utility model patent should be as the criterion with claims.
Claims (10)
1. a QSFP module housing structure, it is characterized in that, including drain pan and upper cover, described upper cover and described drain pan removably connect and are collectively forming accommodation space, described upper cover and/or described drain pan are provided with the radiator structure of depression, and described radiator structure includes diapire and the sidewall around described diapire.
2. QSFP module housing structure according to claim 1, it is characterised in that described upper cover includes top board and the upper side edge extended from the bending of described ceiling edge, and described radiator structure is located at the inwall of described top board.
3. QSFP module housing structure according to claim 1, it is characterised in that described drain pan includes base plate and the lower side extended from the bending of described bottom edge, and described radiator structure is located at the inwall of described base plate.
4. the QSFP module housing structure according to Claims 2 or 3, it is characterised in that described radiator structure includes multiple heat-sink unit, and multiple spaced settings of described heat-sink unit are cellular.
5. QSFP module housing structure according to claim 4, it is characterised in that the arrangement of described heat-sink unit array is rectangular.
6. QSFP module housing structure according to claim 4, it is characterised in that described heat-sink unit is polygon.
7. QSFP module housing structure according to claim 1, it is characterised in that described drain pan offers corresponding installing hole with described upper cover, to be removably connected by securing member.
8. a QSFP module, it is characterised in that include the QSFP module housing structure as described in claim 1～7 any one.
9. QSFP module according to claim 8, it is characterised in that described QSFP module is provided with circuit board, described circuit board is contained in described accommodation space.
10. QSFP module according to claim 9, it is characterised in that described radiator structure is positioned at described circuit board one or both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521142675.6U CN205378404U (en) | 2015-12-31 | 2015-12-31 | QSFP module shell structure and QSFP module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521142675.6U CN205378404U (en) | 2015-12-31 | 2015-12-31 | QSFP module shell structure and QSFP module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205378404U true CN205378404U (en) | 2016-07-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521142675.6U Expired - Fee Related CN205378404U (en) | 2015-12-31 | 2015-12-31 | QSFP module shell structure and QSFP module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205378404U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108987966A (en) * | 2017-05-21 | 2018-12-11 | 富士康(昆山)电脑接插件有限公司 | Electric coupler component and its adapter |
| CN110687640A (en) * | 2018-07-05 | 2020-01-14 | 上海瑞波电子科技有限公司 | High-rate QSFP optical module for optical fiber communication |
-
2015
- 2015-12-31 CN CN201521142675.6U patent/CN205378404U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108987966A (en) * | 2017-05-21 | 2018-12-11 | 富士康(昆山)电脑接插件有限公司 | Electric coupler component and its adapter |
| CN108987966B (en) * | 2017-05-21 | 2021-03-23 | 富士康(昆山)电脑接插件有限公司 | Electric connector assembly and adaptor thereof |
| CN110687640A (en) * | 2018-07-05 | 2020-01-14 | 上海瑞波电子科技有限公司 | High-rate QSFP optical module for optical fiber communication |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160706 Termination date: 20191231 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |