CN205378364U - A heat -resisting pressure baffle for pressfitting circuit board - Google Patents
A heat -resisting pressure baffle for pressfitting circuit board Download PDFInfo
- Publication number
- CN205378364U CN205378364U CN201620105600.9U CN201620105600U CN205378364U CN 205378364 U CN205378364 U CN 205378364U CN 201620105600 U CN201620105600 U CN 201620105600U CN 205378364 U CN205378364 U CN 205378364U
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- CN
- China
- Prior art keywords
- dividing plate
- pressing
- resistance
- wiring board
- baffle
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- Expired - Fee Related
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Abstract
The utility model relates to a heat -resisting pressure baffle for pressfitting circuit board, including the substrate layer substrate layer surface cladding has the insulating layer, wherein at least one exposed end portion has on two relative sides on the baffle respectively, so that the insulating layer can't wrap up completely the substrate layer, and, every the surface of exposed end portion still is equipped with the protective layer, the end angle department of baffle is equipped with end angle transition portion. The present case is through the improvement to the diaphragm structure for the baffle has obtained higher structural strength and hardness, and it can and prevent swell -shrinking property to have excellent heat -resisting piezotropy, and life is high, come to realize the restoration to the insulating layer as electrically conductive point through the exposed end portion that sets up, and can not influence baffle surface insulating layer's heat -resisting piezotropy ability, through holding angle department to set up transition portion, realize the slick and sly lead angle of end angle department to the edge fish tail that can effectively prevent the baffle is used for the copper foil or the aluminium foil of pressfitting circuit board.
Description
Technical field
This utility model relates to a kind of insulating barrier, particularly to a kind of dividing plate of resistance to hot pressing for pressing wiring board.
Background technology
When the main body base material on manufacturing line road plate (PCB), need to use electric press that materials different for multilamellar is carried out pressing, the operation principle of this electric press is the tacky resin material processed by Copper Foil (or aluminium foil) conductive heater, and by applying certain pressure, multilayer material is pressure bonded to not a half hour, thus preparing board substrate, and in using electric press bonding processes, for cost consideration, single stitching operation generally requires pressing multi-disc board substrate simultaneously, and in order to make multi-disc board substrate when pressing, it is not affected each other, need to overlap them, and insert a kind of special insulating barrier between which, it has insulation, heat transfer, the effect supported and separate.
In the prior art due to the restriction of production technology and sheet material self structure so that this dividing plate is relatively low for the service life when hot pressing, there is higher breathing phenomenon at high temperature under high pressure, and this breathing can cause that the PCB surface prepared produces flaw.Additionally, after insulating barrier sustains damage, it is impossible to insulating barrier being carried out secondary reparation, thus result in the relatively low by rate again of dividing plate, causing the waste of resource and the increase of production cost；Further, owing to the corner of dividing plate is more crude, in time putting Copper Foil or aluminium foil, fragile Copper Foil or aluminium foil, thus have impact on production efficiency.
Utility model content
For the deficiency that prior art exists, the purpose of this utility model is in that, by the improvement to diaphragm structure, to obtain the insulating barrier of a kind of high life, resistance to hot pressing, low breathing.
For achieving the above object, this utility model is achieved through the following technical solutions:
A kind of dividing plate of resistance to hot pressing for pressing wiring board; include substrate layer; insulating barrier is had at described substrate layer Surface coating; wherein; two relative sides of described dividing plate are respectively provided with at least one uncoated end portion; so that described insulating barrier cannot state substrate layer in fully wrapped around residence, and, the surface of each described uncoated end portion is additionally provided with protective layer；The end angle place of described dividing plate is provided with end angle transition part.
Preferably, the described dividing plate of resistance to hot pressing for pressing wiring board, wherein, described end angle transition part is curved surface or dull face or curved surface and any form of combination of dull face.
Preferably, the described dividing plate of resistance to hot pressing for pressing wiring board, wherein, described substrate layer is aluminium alloy.
Preferably, the described dividing plate of resistance to hot pressing for pressing wiring board, wherein, described insulating barrier is the oxide of aluminum.
Preferably, the described dividing plate of resistance to hot pressing for pressing wiring board, wherein, the hardness of described substrate layer is HV60～HV170.
Preferably, the described dividing plate of resistance to hot pressing for pressing wiring board, wherein, every seamed edge of described dividing plate all has seamed edge transition part.
Preferably, the described dividing plate of resistance to hot pressing for pressing wiring board, wherein, described seamed edge transition part is curved surface or dull face or curved surface and any form of combination of dull face.
Preferably, the described dividing plate of resistance to hot pressing for pressing wiring board, wherein, the thickness of described dividing plate is 0.4～2mm.
Preferably, the described dividing plate of resistance to hot pressing for pressing wiring board, wherein, the thickness of described insulating barrier is 15～90 μm.
The beneficial effects of the utility model are: this case is by the improvement to diaphragm structure so that dividing plate obtains higher structural strength and hardness, have resistance to hot press performance and anti expanding and shrinking performance, the high life of excellence；It is used as conductiving point, it may be achieved the reparation to insulating barrier by the uncoated end portion arranged, and without influence on the resistance to hot press performance of baffle surface insulating barrier；By arranging transition part at end angle place, realize the round and smooth lead angle at end angle place such that it is able to effectively prevent the edge of dividing plate from scratching the Copper Foil for pressing wiring board or aluminium foil.
Accompanying drawing explanation
Fig. 1 is the structural representation of the dividing plate of resistance to hot pressing for pressing wiring board.
Fig. 2 is the profile of Fig. 1.
Fig. 3 is the enlarged drawing of B in Fig. 2.
Detailed description of the invention
Below in conjunction with accompanying drawing, this utility model is described in further detail, to make those skilled in the art can implement according to this with reference to description word.
As Figure 1-3; the dividing plate of resistance to hot pressing for pressing wiring board of an embodiment is listed in this case; include substrate layer 01; insulating barrier 02 is had at substrate layer 01 Surface coating; wherein, two relative sides of dividing plate are respectively provided with at least one uncoated end portion 03 so that insulating barrier 02 cannot fully wrapped around live substrate layer 01; further, the surface of each uncoated end portion 03 is additionally provided with protective layer 07；The end angle place of dividing plate is provided with end angle transition part 04.By arranging transition part at end angle place, realize the round and smooth lead angle at end angle place such that it is able to effectively prevent the end angle place of dividing plate from scratching the Copper Foil for pressing wiring board or aluminium foil, simultaneously by the design of this structure, the structural strength at end angle place can be increased, to improve the service life of dividing plate.The dividing plate of this case has length and width and high (i.e. thickness), and end angle place here refers to the intersection of length × high place plane and width × high place plane.What the side of this case indication represented is the plane at high place.Substrate layer 01 is carried out electrochemicial oxidation by the conductiving point that functions as of uncoated end portion 03, so that insulating barrier 02 can be coated with on substrate layer 01 surface, in addition, another benefit of uncoated end portion 03 is able to when insulating barrier 02 sustains damage, secondary reparation is carried out as conductiving point, the breakage of insulating barrier is carried out oxidation processes once again, with improve to dividing plate again by rate, save cost.The concrete material of protective layer 07 can without circumscribed; it can be a kind of insullac; can also be that other are different from the covering material of insulating barrier 02 material; the effect of protective layer 07 is that protection uncoated end portion 03 is from clashing into, wear and tear or corrosion; to protect uncoated end portion 03 as the applications well of conductiving point, when uncoated end portion 03 is used by needs as conductiving point, only protective layer 07 need to be struck off; after use terminates, only need to again be covered with protective layer 07.
In the above-described embodiments, end angle transition part 04 is preferably curved surface or dull face or curved surface and any form of combination of dull face.Dull face in this case refers to the face of all no longer sharp non-curved forms by being obtained by sharp corner with means such as polishings.
In the above-described embodiments, substrate layer 01 is preferably aluminium alloy.
In the above-described embodiments, insulating barrier 02 is preferably the oxide of aluminum.
In the above-described embodiments, the hardness of substrate layer 01 is preferably HV60～HV170.
As another embodiment of this case, wherein, every seamed edge of dividing plate all preferably has seamed edge transition part 05.
In the above-described embodiments, seamed edge transition part 05 is preferably curved surface or dull face or curved surface and any form of combination of dull face.The effect of seamed edge transition part 05 is identical with the effect of end angle transition part 04.
In the above-described embodiments, the thickness of dividing plate is preferably 0.4～2mm.
In the above-described embodiments, the thickness of insulating barrier 02 is preferably 15～90 μm.
As the another embodiment of this case, wherein, the surface of dividing plate also can be preferably provided with labelling end 06, and labelling end 06 has recognizable, mark and can tracing function, it may be achieved dynamic tracing and the supervision to dividing plate.
Although embodiment of the present utility model is disclosed as above, but listed utilization that it is not restricted in description and embodiment, it can be applied to various applicable field of the present utility model completely, for those skilled in the art, it is easily achieved other amendment, therefore, under the general concept limited without departing substantially from claim and equivalency range, this utility model is not limited to specific details and shown here as the legend with description.
Claims (9)
1. the dividing plate of resistance to hot pressing for pressing wiring board; it is characterized in that; include substrate layer; insulating barrier is had at described substrate layer Surface coating; described insulating barrier wherein, two relative sides of described dividing plate is respectively provided with at least one uncoated end portion, so that cannot state substrate layer in fully wrapped around residence; further, the surface of each described uncoated end portion is additionally provided with protective layer；The end angle place of described dividing plate is provided with end angle transition part.
2. the dividing plate of resistance to hot pressing for pressing wiring board as claimed in claim 1, it is characterised in that described end angle transition part is curved surface or dull face or curved surface and any form of combination of dull face.
3. the dividing plate of resistance to hot pressing for pressing wiring board as claimed in claim 1, it is characterised in that described substrate layer is aluminium alloy.
4. the dividing plate of resistance to hot pressing for pressing wiring board as claimed in claim 1, it is characterised in that described insulating barrier is the oxide of aluminum.
5. the dividing plate of resistance to hot pressing for pressing wiring board as claimed in claim 1, it is characterised in that the hardness of described substrate layer is HV60～HV170.
6. the dividing plate of resistance to hot pressing for pressing wiring board as claimed in claim 1, it is characterised in that every seamed edge of described dividing plate all has seamed edge transition part.
7. the dividing plate of resistance to hot pressing for pressing wiring board as claimed in claim 6, it is characterised in that described seamed edge transition part is curved surface or dull face or curved surface and any form of combination of dull face.
8. the dividing plate of resistance to hot pressing for pressing wiring board as claimed in claim 1, it is characterised in that the thickness of described dividing plate is 0.4～2mm.
9. the dividing plate of resistance to hot pressing for pressing wiring board as claimed in claim 1, it is characterised in that the thickness of described insulating barrier is 15～90 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620105600.9U CN205378364U (en) | 2016-02-03 | 2016-02-03 | A heat -resisting pressure baffle for pressfitting circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620105600.9U CN205378364U (en) | 2016-02-03 | 2016-02-03 | A heat -resisting pressure baffle for pressfitting circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205378364U true CN205378364U (en) | 2016-07-06 |
Family
ID=56262869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620105600.9U Expired - Fee Related CN205378364U (en) | 2016-02-03 | 2016-02-03 | A heat -resisting pressure baffle for pressfitting circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205378364U (en) |
-
2016
- 2016-02-03 CN CN201620105600.9U patent/CN205378364U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160706 Termination date: 20200203 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |