CN205377716U - Accept semiconductor power device of waste heat - Google Patents
Accept semiconductor power device of waste heat Download PDFInfo
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- CN205377716U CN205377716U CN201620063764.XU CN201620063764U CN205377716U CN 205377716 U CN205377716 U CN 205377716U CN 201620063764 U CN201620063764 U CN 201620063764U CN 205377716 U CN205377716 U CN 205377716U
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- semiconductor
- semiconductor power
- power generation
- generation device
- coil pipe
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Abstract
The utility model relates to a semiconductor power device, name are accept semiconductor power device of waste heat, and it includes semiconductor assemble, semiconductor assemble two blocks of side boards have, be semiconductor grain two sides between the board, semiconductor assemble has two power lead -out wires, characterized by: wherein thermal collection portion spare is installed in the outside of a side board, thermal collection portion spare be a metal block, the metal block below have upwards a slot shape structure that the vault rises, the metal block above also have a plurality of apertures about running through, there is the guiding tube aperture outside, installs the valve on the guiding tube, and it still includes a baffle that coordinates slot shape structure, has fixed stop's fastener in slot shape structure, the inside coil pipe in addition of tubular metal resonator, the coil pipe has import and export, such semiconductor power device has the advantage that the generating efficiency is high.
Description
Technical field
This utility model relates to semiconductor power generation device.
Background technology
Partly leading device in the environment having the temperature difference, it can have electric current to produce, and utilizes such character can make semiconductor power generation device;In prior art, semiconductor power generation device is relatively simple for structure, and its ability accepting waste heat is restricted, and have impact on the generating efficiency of semiconductor power generation device.
Summary of the invention
The purpose of this utility model is aiming at disadvantages mentioned above, it is provided that a kind of semiconductor power generation device accepting waste heat of semiconductor power generation device that a kind of generating efficiency is high.
The technical solution of the utility model is achieved in that a kind of semiconductor power generation device accepting waste heat, it includes semiconductor subassembly, described semiconductor subassembly has two pieces of side panels, it is semiconductor grain between two pieces of side panels, semiconductor subassembly has two power outlets, it is characterized in that: the outside of one of side panel is provided with the undertaking parts of heat, the undertaking parts of described heat are metal derbies.
Say that there is below described metal derby the pit-shaped structure upwards arched further.
Say above described metal derby, also have multiple upper and lower aperture of running through further.
Saying there is guiding tube outside described aperture further, install valve on guiding tube, it also includes one piece of baffle plate coordinating pit-shaped structure, has the fastener of fixed dam in pit-shaped structure.
Saying further, described metal tube is internal also has coil pipe, and coil pipe has inlet and outlet.
The beneficial effects of the utility model are: such semiconductor power generation device has the advantage that generating efficiency is high.There is below described metal derby the pit-shaped structure upwards arched, also have multiple upper and lower aperture of running through above described metal derby, there is advantage in hgher efficiency;Described metal tube is internal also has coil pipe, and coil pipe has inlet and outlet, it is also possible to utilize hot water etc., better effects if.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Wherein: 1, semiconductor subassembly 2, side panel 3, semiconductor grain 4, lead-out wire 5, accept parts 6, pit-shaped structure 7, aperture 8, guiding tube 9, valve 10, baffle plate 11, fastener 12, coil pipe.
Detailed description of the invention
Below in conjunction with accompanying drawing, the utility model is described in further detail.
As shown in Figure 1, a kind of semiconductor power generation device accepting waste heat, it includes semiconductor subassembly 1, described semiconductor subassembly has two pieces of side panels 2, it it is semiconductor grain 3 between two pieces of side panels, semiconductor subassembly has two power outlets 4, it is characterized in that: the outside of one of side panel is provided with the undertaking parts 5 of heat, and the undertaking parts of described heat are metal derbies.
So, this utility model can accept waste heat, for instance the waste heat of the tail gas of vehicle, the waste heat etc. of boiler, and arranging of metal derby can absorb more heat, it is achieved the purpose of this utility model.
Say that there is below described metal derby the pit-shaped structure 6 upwards arched further.Such heat rising pit-shaped structure can keep off heat, reduces scattering and disappearing of heat, and result of use is better.,
Say above described metal derby, also have multiple upper and lower aperture 7 of running through further.So the air of heat is through small holes, and metal derby absorbs heat better effects if.
Say further, guiding tube 8 is had outside described aperture, guiding tube is installed valve 9, it also includes one piece of baffle plate 10 coordinating pit-shaped structure, the fastener 11 of fixed dam is had in pit-shaped structure, so when absorbing heat without aperture, it is possible to keep off aperture with baffle plate, it is prevented that some air accumulations affect the absorption of heat in aperture.
Saying further, described metal tube is internal also has coil pipe 12, and coil pipe has inlet and outlet.Such metal tube can connect hot water, steam etc., makes hot water steam at coil pipe internal recycle.
The foregoing is only specific embodiment of the utility model, but architectural feature of the present utility model is not limited to this, any those skilled in the art is in field of the present utility model, and change or the modification made all are encompassed in the scope of the claims of the present invention.
Claims (6)
1. the semiconductor power generation device accepting waste heat, it includes semiconductor subassembly, described semiconductor subassembly has two pieces of side panels, it is semiconductor grain between two pieces of side panels, semiconductor subassembly has two power outlets, it is characterized in that: the outside of one of side panel is provided with the undertaking parts of heat, the undertaking parts of described heat are metal derbies.
2. semiconductor power generation device according to claim 1, is characterized in that: have the pit-shaped structure upwards arched below described metal derby.
3. semiconductor power generation device according to claim 1 and 2, is characterized in that: also have multiple upper and lower aperture of running through above described metal derby.
4. semiconductor power generation device according to claim 3, is characterized in that: have guiding tube outside described aperture, installs valve on guiding tube, and it also includes one piece of baffle plate coordinating pit-shaped structure, has the fastener of fixed dam in pit-shaped structure.
5. the semiconductor power generation device according to claim 1,2 or 4, is characterized in that: described metal tube is internal also has coil pipe, and coil pipe has inlet and outlet.
6. semiconductor power generation device according to claim 4, is characterized in that: described metal tube is internal also has coil pipe, and coil pipe has inlet and outlet.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201620063764.XU CN205377716U (en) | 2016-01-24 | 2016-01-24 | Accept semiconductor power device of waste heat |
Applications Claiming Priority (1)
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CN201620063764.XU CN205377716U (en) | 2016-01-24 | 2016-01-24 | Accept semiconductor power device of waste heat |
Publications (1)
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CN205377716U true CN205377716U (en) | 2016-07-06 |
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CN201620063764.XU Active CN205377716U (en) | 2016-01-24 | 2016-01-24 | Accept semiconductor power device of waste heat |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105515449A (en) * | 2016-01-24 | 2016-04-20 | 河南鸿昌电子有限公司 | Semiconductor power device for taking over waste heat |
-
2016
- 2016-01-24 CN CN201620063764.XU patent/CN205377716U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105515449A (en) * | 2016-01-24 | 2016-04-20 | 河南鸿昌电子有限公司 | Semiconductor power device for taking over waste heat |
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