CN205376530U - Thin film encapsulation's OLED screen body - Google Patents
Thin film encapsulation's OLED screen body Download PDFInfo
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- CN205376530U CN205376530U CN201521135518.2U CN201521135518U CN205376530U CN 205376530 U CN205376530 U CN 205376530U CN 201521135518 U CN201521135518 U CN 201521135518U CN 205376530 U CN205376530 U CN 205376530U
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Abstract
The utility model relates to a thin film encapsulation's OLED screen body belongs to organic electroluminescence device technical field, and thin film encapsulation's OLED screen body includes electrically -conductive backing plate and thin film encapsulation layer, the electrically -conductive backing plate with set up organic functional layer in the airtight space of the laminiform one -tenth of thin film encapsulation, the top of organic functional layer be provided with the second electrode lay, adjacent the second electrode lay is insulating each other, the thin film encapsulation layer with be provided with planarization layer between the second electrode lay, planarization layer keeps away from one side of the second electrode lay forms continuous planar structure, the thin film encapsulation laminating closes the setting and is in in succession on the planar structure. Because the thin film encapsulation layer forms consequently one side continuous planar relatively of planarization layer can closely laminate with planarization layer, and the thickness homogeneity is good. Not only packaging effects is good, can be difficult to damagedly in the thin film encapsulation layer moreover.
Description
Technical field
This utility model includes organic electroluminescence devices technical field, OLED screen body being specifically related to a kind of thin-film package and preparation method thereof.
Background technology
Through the development of nearly 30 years, (English full name is OrganicLightEmittingDevice to the OLED screen body of thin-film package, referred to as OLED) as illumination of future generation and Display Technique, have that colour gamut width, response be fast, wide viewing angle, pollution-free, high-contrast, the advantage such as planarization, in illumination and display, obtain a degree of application.The OLED screen body of typical thin-film package generally comprises transparency carrier, transparent anode, reflecting electrode and arranges organic function layer between two electrodes.The negative electrode of illuminating OLED of the usual end is planar metal, has good reflecting effect.
The OLED screen body (OLED) of thin-film package includes active electroluminescent device (AMOLED) and passive electroluminescent device (PMOLED), and wherein passive electroluminescent device (PMOLED) has Ka band, organic layer functional layer and anode strap.PMOLED is most effective for showing when text and icon, is suitable to make the small screen (diagonal 2-3 inch), often applies and mobile phone, palm PC and MP3 player.Along with intelligence dresses the universal of product, PMOLED display screen is proposed demand ultra-thin, flexible by market.Generally for bending screen body, it is necessary to adopt thin-film package could realize its bending.
There is insulated column (Separatororrib) structure in the OLED screen body PMOLED yet with passive film encapsulation, its upper end is uneven, when therefore adopting thin film encapsulation technology, easily there is the discontinuous problem causing sealing effectiveness difference of thicknesses of layers in thin-film encapsulation layer.
Utility model content
Technical problem to be solved in the utility model is that existing passive electroluminescent device (PMOLED) adopts thin-film package to be easily occur that breakage causes encapsulating not tight problem, thus providing the OLED screen body of a kind of thin-film package, the OLED screen body of this thin-film package can make thin-film encapsulation layer fit tightly with it by arranging the planarization layer with continuous level structure such that it is able to prevents the damaging problem of thin-film encapsulation layer.
For solving above-mentioned technical problem, this utility model is achieved through the following technical solutions:
A kind of OLED screen body of thin-film package, including electrically-conductive backing plate and thin-film encapsulation layer, in the confined space that described electrically-conductive backing plate and described thin-film encapsulation layer are formed, organic function layer is set, described organic function layer be provided above the second electrode lay, adjacent the second electrode lay is insulated from each other, it is provided with planarization layer between described thin-film encapsulation layer and described the second electrode lay, described planarization layer forms continuous level structure away from the side of described the second electrode lay, and the laminating of described thin-film encapsulation layer is arranged in described continuous level structure.
Realized insulated from each other between adjacent described the second electrode lay by insulated column, the top of the upper end of described planarization layer and described insulated column is collectively forming continuous level structure, and the laminating of described thin-film encapsulation layer is arranged in described continuous level structure.
Realized insulated from each other between adjacent described the second electrode lay by insulated column, after described planarization layer is filled between insulated column and covers described insulated column, its upper end forms continuous level structure, and the laminating of described thin-film encapsulation layer is arranged in described continuous level structure.
Described electrically-conductive backing plate includes substrate and arranges the first electrode layer on the substrate, described first electrode layer is provided with the pixel confining layers of some formation continuous grids structures, described network is filled organic function layer, described pixel confining layers is provided above insulated column, and the second electrode lay on adjacent organic function layer is isolated from each other insulation by described insulated column.
The light transmittance of described planarization layer > 70%, refractive index is 1.4-2.3, and described planarization layer is organic material layer or inorganic material layer.
Described planarization layer is NPB, ALq3, one in TBD, PBD, CBP；Or it is the one in such as acrylic, Tai Fulong, polyimides.
Described planarization layer and encapsulated layer are the integrative-structures being prepared from by poly-hydrogen silazane class material, its derivant or poly-hydrogen silazane class material compositions.
Poly-hydrogen silazane class material compositions includes poly-hydrogen silazane class material, light curing agent and light trigger.
The preparation method of the OLED screen body of a kind of thin-film package, comprises the steps:
S1, on electrically-conductive backing plate make be coated with organic photoresist layer, exposure imaging forms it into the pixel confining layers with hatch frame；
S2, pixel confining layers above through gluing, exposure, development, etching technique prepare insulated column, evaporation mask plate is adopted to deposit organic function layer in the pixel confining layers have hatch frame, at the disposed thereon the second electrode lay of organic function layer, described insulated column makes adjacent described the second electrode lay insulated from each other；
S3, at the planarization layer of described the second electrode lay organic material fabricated above or inorganic material, described planarization layer is filled between described insulated column, and its upper end and insulated column upper end form continuous level structure, or,
After described planarization layer is filled between insulated column and covers described insulated column, its upper end forms continuous level structure；
S4, described continuous level superstructure evaporation formed thin-film encapsulation layer.
The preparation method of the OLED screen body of another kind of thin-film package, comprises the steps:
S1, on electrically-conductive backing plate make be coated with organic photoresist layer, exposure imaging forms it into the pixel confining layers with hatch frame；
S2, pixel confining layers above through gluing, exposure, development, etching technique prepare insulated column, evaporation mask plate is adopted to deposit organic function layer in the pixel confining layers have hatch frame, at the disposed thereon the second electrode lay of organic function layer, described insulated column makes adjacent described the second electrode lay insulated from each other；
S3, above described the second electrode lay the poly-hydrogen silazane class material or derivatives thereof of wet coating or silk screen printing or poly-hydrogen silazane class material compositions, after being filled between insulated column and covering described insulated column, solidify planarization layer and the thin-film encapsulation layer that can form integrative-structure.
Poly-hydrogen silazane class material compositions in described step S3 includes poly-hydrogen silazane class material, light curing agent and light trigger.
Technique scheme of the present utility model has the advantage that compared to existing technology
The OLED screen body of a kind of thin-film package of the present utility model, including electrically-conductive backing plate and thin-film encapsulation layer, in the confined space that described electrically-conductive backing plate and described thin-film encapsulation layer are formed, organic function layer is set, described organic function layer be provided above the second electrode lay, adjacent the second electrode lay is insulated from each other, it is provided with planarization layer between described thin-film encapsulation layer and described the second electrode lay, described planarization layer forms continuous level structure away from the side of described the second electrode lay, and the laminating of described thin-film encapsulation layer is arranged in described continuous level structure.Be formed in the side of the continuous level of described planarization layer due to thin-film encapsulation layer, therefore, it is possible to fit tightly with planarization layer, and film forming seriality is good, and packaging effect is good, and thin-film encapsulation layer is not easy breakage.Additionally, the described planarization layer that this utility model adopts adopts organic material and/or inorganic material to be prepared from, it is preferable that light transmittance > 70%, refractive index is the transparent material of 1.4-2.3, is applicable to transparent screen body or back side illuminated layer.
As another embodiment, described planarization layer and encapsulated layer are the integrative-structures being prepared from by poly-hydrogen silazane class material, its derivant or poly-hydrogen silazane class material compositions.This integrative-structure has excellent sealing effectiveness, extends the life-span of device.
Accompanying drawing explanation
In order to make content of the present utility model be more likely to be clearly understood, below in conjunction with accompanying drawing, this utility model is described in further detail, wherein,
Fig. 1 is the OLED screen body structural representation of this utility model thin-film package；
Fig. 2 is the structural representation of OLED screen another embodiment of body of this utility model thin-film package；
In figure, accompanying drawing labelling is expressed as:
101-substrate, 102-the first electrode layer, 103-organic function layer, 104-the second electrode lay, 105-insulated column, 106-planarization layer, 107-thin-film encapsulation layer.
Detailed description of the invention
For making the purpose of this utility model, technical scheme and advantage clearly, below in conjunction with accompanying drawing, this utility model embodiment is described in further detail.
This utility model can be embodied in many different forms, and should not be construed as limited to embodiment set forth herein.On the contrary, it is provided that these embodiments so that the disclosure will be thorough and complete, and design of the present utility model being fully conveyed to those skilled in the art, this utility model will only be defined by the appended claims.In the accompanying drawings, for clarity, the size in layer and region and relative size can be exaggerated.It should be appreciated that when element such as layer, region or substrate be referred to as " formed exist " or " being arranged on " another element " on " time, this element can be arranged directly on another element described, or can also there is intermediary element.On the contrary, when element is referred to as on " being formed directly into " or " being set directly at " another element, it is absent from intermediary element.
As shown in Figure 1, the OLED screen body of a kind of thin-film package of the present utility model, including electrically-conductive backing plate and thin-film encapsulation layer 107, in the confined space that described electrically-conductive backing plate and described thin-film encapsulation layer 107 are formed, organic function layer 103 is set, described organic function layer 103 be provided above the second electrode lay 104, adjacent the second electrode lay 104 is insulated from each other, it is provided with planarization layer 106 between described thin-film encapsulation layer 107 and described the second electrode lay 104, described planarization layer 106 forms continuous level structure away from the side of described the second electrode lay 104, the laminating of described thin-film encapsulation layer 107 is arranged in described continuous level structure.
Specifically, as shown in Figure 2, realizing insulated from each other by insulated column 105 between adjacent described the second electrode lay 104, the top of the upper end of described planarization layer 106 and described insulated column 105 is collectively forming continuous level structure, and the laminating of described thin-film encapsulation layer 107 is arranged in described continuous level structure.
As another embodiment, realize insulated from each other by insulated column 105 between adjacent described the second electrode lay 104, after described planarization layer 106 is filled between insulated column 105 and covers described insulated column 105, its upper end forms continuous level structure, and the laminating of described thin-film encapsulation layer 107 is arranged in described continuous level structure.
Described electrically-conductive backing plate includes substrate 101 and the first electrode layer 102 being arranged on described substrate 101, described first electrode layer 102 is provided with the pixel confining layers 108 of some formation continuous grids structures, described network is filled organic function layer 103, described pixel confining layers 108 is provided above insulated column 105, and the second electrode lay 104 on adjacent organic function layer 103 is isolated from each other insulation by described insulated column 105.
The light transmittance of described planarization layer 106 > 70%, refractive index is 1.4-2.3, and described planarization layer 106 is organic material layer or inorganic material layer.
Described planarization layer can be Small molecule organic materials: preferred molecular weight is between 500-1000, and material energy gap is between 2.0-3.0eV.Such as NPB, ALq3, TBD, PBD, CBP etc., such material can be prepared by the mode of vacuum thermal evaporation.
Described planarization layer can be polymeric material: such as acrylic, Tai Fulong, polyimides etc..Such material can be prepared by modes such as printing, silk-screen, heat deposition.
Described planarization layer can be inorganic material: such as ZnSe, MoO3、WO3In one or more be prepared from.Such material can be prepared by the mode such as vacuum thermal evaporation, sputtering.
The integrative-structure that described planarization layer can be prepared from by poly-hydrogen silazane class material, its derivant or poly-hydrogen silazane class material compositions.Poly-hydrogen silazane molecular formula is: [SiH2NH]n；Described poly-hydrogen silazane class material compositions includes poly-hydrogen silazane class material, light curing agent and light trigger.
Thickness according to planarization layer 106 and the difference of the material of use, have following embodiment.
Embodiment 1
As shown in Figure 1, the OLED screen body of the thin-film package of the present embodiment, including substrate 101 and the first electrode layer 102 (anode) being arranged on described substrate 101, described first electrode layer 102 is provided with the pixel confining layers 108 of some formation continuous grids structures, described network is filled organic function layer 103, described pixel confining layers 108 is provided above insulated column 105, and the second electrode lay 104 (negative electrode) on adjacent organic function layer 103 is isolated from each other insulation by described insulated column 105.Shown organic function layer 103 includes the hole injection layer of stacking setting, hole transmission layer, luminescent layer, electron transfer layer and electron injecting layer, and wherein hole injection layer, hole transmission layer, electron transfer layer and electron injecting layer can omit one or more layers.
Described the second electrode lay 104 be provided above planarization layer 106, after described planarization layer 106 is filled between described insulated column 105 and covers described insulated column 105, its upper end forms continuous level structure, and the laminating of described thin-film encapsulation layer 107 is arranged in described continuous level structure.Described planarization layer is by molecular weight between 500-1000, and material energy gap is between 2.0-3.0eV, for instance NPB, ALq3, TBD, PBD, CBP etc., such material can be prepared by the mode of vacuum thermal evaporation；Can being polymeric material: such as acrylic, Tai Fulong, polyimides etc., such material can be prepared by modes such as printing, silk-screen, heat deposition.
The preparation method of the OLED screen body of the thin-film package of the present embodiment, comprises the steps:
S1, making the first electrode layer 102 on the substrate 101, be coated with organic photoresist layer, exposure imaging forms it into the pixel confining layers 108 with hatch frame；
S2, pixel confining layers above through gluing, exposure, development, etching technique prepare insulated column 105, evaporation mask plate is adopted to deposit organic function layer 103 in the pixel confining layers have hatch frame, at the disposed thereon the second electrode lay 104 of organic function layer 103, described insulated column 105 makes adjacent described the second electrode lay 104 insulated from each other；
S3, above described the second electrode lay 104 be deposited with inorganic material formed planarization layer 106, after described planarization layer 106 is filled between described insulated column and covers described insulated column 105, its upper end formed continuous level structure；Or the planarization layer 106 of the materials such as acrylic, Tai Fulong, polyimides is prepared by modes such as printing, silk-screen, heat deposition；
S4, form thin-film encapsulation layer 107 at described continuous level superstructure by the SiN of CVD silence 1um thickness.
The thin-film encapsulation layer of the present embodiment is formed in the side of the continuous level of described planarization layer, therefore, it is possible to fit tightly with planarization layer, and film forming seriality is good, and packaging effect is good, and thin-film encapsulation layer is not easy breakage.Additionally, the described planarization layer that this utility model adopts adopts organic material and/or inorganic material to be prepared from, it is preferable that light transmittance > 70%, refractive index is the transparent material of 1.4-2.3, is applicable to transparent screen body or back side illuminated layer.
Embodiment 2
As shown in Figure 2, the OLED screen body structure of the thin-film package of the present embodiment is with embodiment 1, wherein planarization layer 106 is filled between insulated column 105, the top of its upper end and described insulated column 105 is collectively forming continuous level structure, and the laminating of described thin-film encapsulation layer 107 is arranged in described continuous level structure.
Its preparation method is with the OLED screen body of the thin-film package of embodiment 1, and wherein step S3 is:
Forming planarization layer 106 in evaporation inorganic material above described the second electrode lay 104, described planarization layer 106 is filled between described insulated column, and its upper end and insulated column upper end are collectively forming continuous level structure；Or prepared the planarization layer 106 of organic material material by modes such as printing, silk-screen, heat deposition, its upper end and insulated column upper end are collectively forming continuous level structure；
In this embodiment, selected inorganic material is NPB, ALq3, one or more in TBD, PBD, CBP, organic material is acrylic, Tai Fulong, polyimides.Described encapsulating film 107 adopts Sputter alumina layer to prepare.
The thin-film encapsulation layer of the present embodiment is formed in the side of the continuous level of described planarization layer, therefore, it is possible to fit tightly with planarization layer, and film forming seriality is good, and packaging effect is good, and thin-film encapsulation layer is not easy breakage.Additionally, the described planarization layer that this utility model adopts adopts organic material and/or inorganic material to be prepared from, it is preferable that light transmittance > 70%, refractive index is the transparent material of 1.4-2.3, is applicable to transparent screen body or back side illuminated layer.
Embodiment 3
As it is shown in figure 1, the OLED screen body structure of the thin-film package of the present embodiment is with embodiment 1, wherein planarization layer 106 and thin-film encapsulation layer 107 are the integrative-structures being prepared from by poly-hydrogen silazane class material.Silazane class material molecule formula such as [SiH2NH], such material is prepared on the second electrode lay by the mode of wet coating or silk screen printing, and moisture and the oxygen of described poly-hydrogen silazane class material and air react and becomes cured film, forms the planarization layer 106 of integrative-structure.Afterwards by the mode silence SiN or SiO of CVD as thin-film encapsulation layer 107.
Wherein to run into water, oxygen reaction mechanism as follows for silazane, and final padded coaming is silicon dioxide layer.
-[SiH2NH]n-+O2→SiO2+NH3
and
-[SiH2NH]n-+H2O→SiO2+NH3+H2
The preparation method of the OLED screen body of the thin-film package of the present embodiment, comprises the steps:
S1, on electrically-conductive backing plate make be coated with organic photoresist layer, exposure imaging forms it into the pixel confining layers 108 with hatch frame；
S2, pixel confining layers above through gluing, exposure, development, etching technique prepare insulated column 105, evaporation mask plate is adopted to deposit organic function layer 103 in the pixel confining layers have hatch frame, at the disposed thereon the second electrode lay 104 of organic function layer 103, described insulated column 105 makes adjacent described the second electrode lay 104 insulated from each other；
S3, above described the second electrode lay 104 the poly-hydrogen silazane class material or derivatives thereof of wet coating or silk screen printing, after being filled between insulated column 105 and cover described insulated column 105, solidify the planarization layer 106 that can form integrative-structure.Depositing inorganic films encapsulated layer 107 afterwards.
The planarization layer 106 of the present embodiment is reacted with water in air, oxygen by poly-hydrogen silazane class material and forms, and end product is Si oxide.This integrative-structure has excellent sealing effectiveness, extends the life-span of device.
Embodiment 4
As it is shown in figure 1, the OLED screen body structure of the thin-film package of the present embodiment is with embodiment 2, wherein planarization layer 106 and thin-film encapsulation layer 107 are the integrative-structures being prepared from by poly-hydrogen silazane class material compositions.Described poly-hydrogen silazane class material compositions includes following component:
Dimerization hydrogen silazane derivative material 100 parts is radix:
Cross-linking agent is the 5wt%-50wt% of dimerization hydrogen silazane derivative material, light trigger is the 5wt%-50wt% mass parts of cross-linking agent；
Levelling agent is the 0wt%-10wt% of resin；
Described cross-linking agent preferably is three acrylic acid trihydroxy methyl propyl ester, three acrylic acid trihydroxy methyl propyl ester of oxirane upgrading or three acrylic acid trihydroxy methyl propyl ester of expoxy propane upgrading, be specially pentaerythritol triacrylate, tetramethylol methane tetraacrylate, dipentaerythritol acrylate, Dipentaerythritol Pentaacrylate, dipentaerythritol tetraacrylate, the dipentaerythritol acrylate of caprolactone upgrading, tetrapropylene acid two trihydroxy methyl propyl ester.
Described light trigger is 1-Phenylethanone. based compound or diimidazole based compound.
nullDescribed 1-Phenylethanone. based compound is to dimethylamine 1-Phenylethanone. (p-dimethylamino-acetophen-one)、a,A' dimethoxy azoxy 1-Phenylethanone. (a,a’-dimethoxyazoxyacetophen-one)、2,2'-dimethyl-2-phenyl acetophenone (2,2'-dimethyl-2-phenylaceto–phen-one)、Acetanisole (p-methoxyacetophenone)、2-methyl isophthalic acid-(4-methylthiophenyi)-2-morpholino-1-acetone (2-methyl-l-(4-methylthiophenyl)-2-morp-holino-propane-l-one)、2-benzyl-2-N,N dimethylamine-1-(4-morphlinophenyl)-l-butanone (2-benzyl-2-N,N-dimethylamino-1-(4-morpholinophenyl)-1-butanone).
Diimidazole based compound (biimidazole) is double; two (o-the chlorphenyl)-4,4' of 2,2'-, 5,5' tetraphenyl diimidazole [2,2'-bis (o-chlorophenyl)-4,4', 5,5'-tetraphenyl-biimida-zole], 2, double; two (the o-methyl-phenyl-)-4,4' of 2'-, 5,5'-tetraphenyl diimidazole [2,2'-bis (o-fluoro-phenyl)-4,4', 5,5'tetraphenylbiimidazole].
Preferred 2-benzyl-2-N, N dimethylamine-1-(4-the morphlinophenyl)-1-butanone of light trigger and 2,2'-double; two (2-chlorphenyls)-4,4', 5, the mixture of 5'-tetraphenyl diimidazole, the two mass ratio is 30-50%:50-70%.
Levelling agent is acrylic acid modified fluorine carbon levelling agent (manufacturer is EFKA, and model is EFKA3600).Solvent is propylene glycol methyl ether acetate or 3-ethoxyl ethyl propionate.
The preparation method of the present embodiment is with embodiment 3, and the wherein said solidification in step S3 is to adopt irradiation under ultraviolet ray to cause the cross-linking polymerization of poly-hydrogen silazane class material compositions to form planarization layer (106) and the thin-film encapsulation layer (107) of integrative-structure.
The planarization layer 106 of the present embodiment and encapsulated layer 107 are the integrative-structures being prepared from by poly-hydrogen silazane class material, its derivant or poly-hydrogen silazane class material compositions.This integrative-structure has excellent sealing effectiveness, extends the life-span of device.
Obviously, above-described embodiment is only for clearly demonstrating example, and is not the restriction to embodiment.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here without also cannot all of embodiment be given exhaustive.And the apparent change thus extended out or variation still in this utility model create protection domain among.
Claims (6)
1. the OLED screen body of a thin-film package, including electrically-conductive backing plate and thin-film encapsulation layer (107), in the confined space that described electrically-conductive backing plate and described thin-film encapsulation layer (107) are formed, organic function layer (103) is set, described organic function layer (103) be provided above the second electrode lay (104), adjacent the second electrode lay (104) is insulated from each other, it is characterized in that
Planarization layer (106) it is provided with between described thin-film encapsulation layer (107) and described the second electrode lay (104), described planarization layer (106) forms continuous level structure away from the side of described the second electrode lay (104), and described thin-film encapsulation layer (107) laminating is arranged in described continuous level structure.
2. the OLED screen body of thin-film package according to claim 1, it is characterized in that, realize insulated from each other by insulated column (105) between adjacent described the second electrode lay (104), the top of the upper end of described planarization layer (106) and described insulated column (105) is collectively forming continuous level structure, and described thin-film encapsulation layer (107) laminating is arranged in described continuous level structure.
3. the OLED screen body of thin-film package according to claim 1, it is characterized in that, realize insulated from each other by insulated column (105) between adjacent described the second electrode lay (104), after described planarization layer (106) is filled between insulated column (105) and covers described insulated column (105), its upper end forms continuous level structure, and described thin-film encapsulation layer (107) laminating is arranged in described continuous level structure.
4. the OLED screen body of the thin-film package according to any one of claim 1-3, it is characterized in that, described electrically-conductive backing plate includes substrate (101) and the first electrode layer (102) being arranged on described substrate (101), described first electrode layer (102) is provided with the pixel confining layers (108) of some formation continuous grids structures, described network is filled organic function layer (103), described pixel confining layers (108) is provided above insulated column (105), the second electrode lay (104) on adjacent organic function layer (103) is isolated from each other insulation by described insulated column (105).
5. the OLED screen body of thin-film package according to claim 1, it is characterised in that the light transmittance of described planarization layer (106) > 70%, refractive index is 1.4-2.3, and described planarization layer (106) is organic material layer or inorganic material layer.
6. the OLED screen body of thin-film package according to claim 5, it is characterised in that described planarization layer is NPB, ALq3, one in TBD, PBD, CBP；Or it is the one in acrylic, Tai Fulong, polyimides.
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