CN205356885U - Insulating housing and wiring board assembly device - Google Patents
Insulating housing and wiring board assembly device Download PDFInfo
- Publication number
- CN205356885U CN205356885U CN201620070927.7U CN201620070927U CN205356885U CN 205356885 U CN205356885 U CN 205356885U CN 201620070927 U CN201620070927 U CN 201620070927U CN 205356885 U CN205356885 U CN 205356885U
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- insulation shell
- circuit board
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- insulating housing
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Abstract
The utility model discloses an insulating housing, including the insulating housing body, be provided with on the insulating housing body and supply the liquid through -hole that passes through of gluing. The liquid solation of this through -hole guide is gone into between metal casing and the insulating housing, makes the liquid state glue and be full of whole metal casing inner chamber before solidification, avoids the production of cavity, improves the heat dispersion and the waterproof performance of wiring board assembly device, and the stable of guarantee electric elements is worked. The utility model also discloses a wiring board assembly device of having above -mentioned insulating housing.
Description
Technical field
This utility model relates to circuit board module insulation technology field, more particularly, it relates to a kind of insulating trip housing and a kind of circuit board module device.
Background technology
More existing circuit board module devices include circuit board module body and metal shell, and circuit board module body is installed in metal shell.In order to make circuit board module device have waterproof and dampproof, dust-proof, insulation, heat radiation, anticorrosion, the performance such as shockproof, it is possible to the internal encapsulating of circuit board module device.But, in safety, glue can not ensure effective insulation of circuit board module body and metal shell.Effective insulation in order to ensure circuit board module body and metal shell, it is possible to setting up insulation shell, the shape of insulation shell and the shape of metal shell are substantially the same.First this is external to make insulation shell be coated on circuit board module, loads in metal shell by insulation shell afterwards together with circuit board module body, afterwards the internal encapsulating from the port of metal shell to circuit board module device, and encapsulating seals after completing, and installs end cap 21.
But, the existence of insulation shell can stop that liquid glue flows between insulation shell and metal shell, and liquid glue can flow and solidify, and so, there will be cavity between insulation shell and metal shell.Cavity can hinder heat transmission, affects the heat radiation of circuit board assembly apparatus.It addition, cavity also can affect the water resistance of circuit board assembly apparatus.Producing heat when this body running of circuit board module, in cavity, when gases are heated, they expand overflows, and after circuit component body quits work, temperature reduces, and gas shrinkage forms negative pressure, and water around can be inhaled in metal shell, damages electrical equipment.
Therefore, how to break through the restriction of insulation shell, liquid glue is guided to flow between metal shell and insulation shell, glue is made to be full of the whole cavity of metal shell, evade the generation of cavity, improve the heat dispersion of circuit board module device and water resistance, ensure the steady operation of electrical equipment, be those skilled in the art's critical problems urgently to be resolved hurrily.
Utility model content
The purpose of this utility model is to provide a kind of insulation shell, the unique texture of this insulation shell can guide liquid glue to flow between metal shell and insulation shell, liquid glue is made to be full of whole cavity before curing, evade the generation of cavity, improve heat dispersion and the water resistance of circuit board module device, ensure the steady operation of electrical equipment.
For reaching above-mentioned purpose, this utility model provides following technical scheme:
A kind of insulation shell, including insulation shell body, described insulation shell body is provided for the through hole that liquid glue passes through.
Preferably, described through hole is opened on the seamed edge of described insulation shell body.
Preferably, described through hole is opened on the face of described insulation shell body.
Preferably, the edges and corners of the port of described insulation shell body are provided for liquid glue and overflow, and make the port of described insulation shell body be full of the excessive glue breach of glue.
Preferably, one end of described insulation shell body is provided with anti-reverse mounting mark.
Preferably, described anti-reverse mounting is designated the groove on the flanging of the one end being arranged at described insulation shell body.
Preferably, described anti-reverse mounting is designated the projection on the flanging of the one end being arranged at described insulation shell body.
This utility model additionally provides a kind of circuit board module device, including metal shell, is positioned at insulation shell and the circuit board module body of described metal shell, and described insulation shell is any one insulation shell above-mentioned.
Can be seen that from technique scheme, insulation shell body in this utility model is provided with through hole, this through hole passes through for liquid glue, liquid glue is guided to flow between metal shell and insulation shell, liquid glue is made to be full of whole metal shell inner chamber before curing, evade the generation of cavity, improve heat dispersion and the water resistance of circuit board module device, ensure the steady operation of electrical equipment.
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is only embodiment of the present utility model, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to the accompanying drawing provided.
The exploded view of the circuit board module device that Fig. 1 provides for this utility model one specific embodiment；
The structural representation of the insulation shell that Fig. 2 provides for this utility model one specific embodiment；
The expansion schematic diagram of the insulation shell that Fig. 3 provides for this utility model one specific embodiment.
Wherein, 1 be insulation shell body, 10 in order to seamed edge, 11 be through hole, 12 be the glue breach that overflows, 13 be flanging, 14 be groove, 2 be metal shell, 21 be end cap, 3 for circuit board module body.
Detailed description of the invention
This utility model provides a kind of insulation shell, the unique texture of this insulation shell can guide liquid glue to flow between metal shell and insulation shell, liquid glue is made to be full of whole cavity before curing, evade the generation of cavity, improve heat dispersion and the water resistance of circuit board module device, ensure the steady operation of electrical equipment.
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is clearly and completely described, it is clear that described embodiment is only a part of embodiment of the present utility model, rather than whole embodiments.Based on embodiment of the present utility model, all other embodiments that those of ordinary skill in the art obtain under the premise not making creative work, broadly fall into the scope of this utility model protection.
Refer to Fig. 1-Fig. 3, this utility model one specific embodiment is provided with through hole 11 on insulation shell body 1, this through hole 11 passes through for liquid glue, liquid glue is guided to flow between metal shell 2 and insulation shell body 1, liquid glue is made to be full of the inner chamber of whole metal shell 2 before curing, evade the generation of cavity, improve heat dispersion and the water resistance of circuit board module device, ensure the steady operation of electrical equipment.
In this utility model one specific embodiment, through hole 11 prioritizing selection in above-mentioned is opened on the seamed edge 10 of insulation shell body 1.Seamed edge 10 is adjacent with two faces, and such liquid glue just can spread to the direction in two faces simultaneously, thus further increasing the diffusion velocity of liquid glue, it is ensured that liquid glue can be full of the inner chamber of whole metal shell 2 in the short period of time.It will be understood by those skilled in the art that, insulation shell body 1 has multiple seamed edge under normal circumstances, specifically on which seamed edge, offer through hole, and on same seamed edge, offer several through hole, it is intended to the structure according to concrete circuit board module body 3 determine, electric elements higher in circuit board module body 3 to be avoided in the position of through hole 11, in order to avoid higher electric elements are contacted with metal shell 2 by through hole 11.So that the design of insulation shell meets safety requirement.
Certainly, through hole 11 can also be opened on the face of insulation shell 1.Position and number to through hole 11 are not especially limited herein, as long as this through hole can guide liquid glue to flow between metal shell 2 and insulation shell 1, each fall within protection domain herein.
The position of the port of insulation shell body 1 is also the port position of metal shell 2.After encapsulating completes, it is necessary to the port of metal shell 2 is sealed up.In order to improve the sealing of the port of metal shell 2, in this utility model one specific embodiment, it is provided with excessive glue breach 12 in the edges and corners of the port of insulation shell body 1.Liquid glue can overflow from excessive glue breach 12 to the port of insulation shell body 1, so that the port of insulation shell body 1 is full of glue, makes the port of metal shell 2 be full of glue in other words, which improves the sealing of the port of metal shell 2.Certainly, excessive glue breach 12 is specifically set on the corner angle of the port of which end of insulation shell body 1, and on which corner angle of same port, offer excessive glue breach 12, or to determine according to the structure of concrete circuit board module body 3, the sealing of port and the insulating properties of circuit board module body 3 will be taken into account.
It should be noted that the position that the through hole 11 described in this utility model and excessive glue breach 12 are arranged, it is necessary to meet the requirement of safety, that is to say on insulation shell, meet the position that safety requires.
In this utility model one specific embodiment, one end of the insulation shell body 1 in above-mentioned is provided with anti-reverse mounting mark.Such as, if requiring that one end that insulation shell body 1 has anti-reverse mounting mark to be positioned at the first end of metal shell 2, to be positioned at the second end of metal shell 2 without one end of anti-reverse mounting mark.When mounted, just guaranteeing that insulation shell body 1 has one end of anti-reverse mounting mark and is positioned at the first end of metal shell 2 easily by observing the position of anti-reverse mounting mark, the one end identified without anti-reverse mounting is positioned at the second end of metal shell 2.Anti-reverse mounting mark can be a pattern, it is also possible to be an eye-catching structure, as long as being prone to observe, each falls within protection domain herein.
In this utility model one specific embodiment, anti-reverse mounting is designated the groove 14 on the flanging 13 being arranged on insulation shell body 1 one end.
In another specific embodiment of this utility model, anti-reverse mounting is designated the projection on the flanging 13 being arranged on insulation shell body 1 one end.
This utility model additionally provides a kind of circuit board module device, including metal shell, insulation shell and circuit board module body, insulation shell and circuit board module body are positioned at metal shell, i.e. insulation shell parcel wiring board body, especially, this insulation shell is any one insulation shell above-mentioned, and above-mentioned insulation shell has the effect above, the circuit board module device with above-mentioned insulation shell has the effect above equally, therefore repeats no more herein.
The insulation shell mentioned in this utility model, it is possible to be integrated insulating part, it is also possible to being that first stamping-out becomes a piece of, at corresponding position impression, refolding is a hull shape.
During enforcement, conventional insulation shell is mylar film (mylar), for plastic raw materialss such as PP, PC, PET, under polycondensation or copolyreaction, by the biaxial stretch-formed diaphragm obtained, has good damage resistibility, moisture resistance and high-insulativity.
Described above to the disclosed embodiments, makes professional and technical personnel in the field be capable of or uses this utility model.The multiple amendment of these embodiments be will be apparent from for those skilled in the art, and generic principles defined herein when without departing from spirit or scope of the present utility model, can realize in other embodiments.Therefore, this utility model is not intended to be limited to the embodiments shown herein, and is to fit to the widest scope consistent with principles disclosed herein and features of novelty.
Claims (8)
1. an insulation shell, including insulation shell body (1), it is characterised in that be provided for the through hole (11) that liquid glue passes through on described insulation shell body.
2. insulation shell according to claim 1, it is characterised in that described through hole (11) is opened on the seamed edge (10) of described insulation shell body (1).
3. insulation shell according to claim 1, it is characterised in that described through hole (11) is opened on the face of described insulation shell body (1).
4. insulation shell according to claim 1, it is characterized in that, the edges and corners of the port of described insulation shell body (1) are provided for liquid glue and overflow, and make the port of described insulation shell body (1) be full of the excessive glue breach (12) of glue.
5. the insulation shell according to claim 1-4 any one, it is characterised in that one end of described insulation shell body (1) is provided with anti-reverse mounting mark.
6. insulation shell according to claim 5, it is characterised in that described anti-reverse mounting is designated the groove (14) on the flanging (13) of the one end being arranged at described insulation shell body (1).
7. insulation shell according to claim 5, it is characterised in that described anti-reverse mounting is designated the projection on the flanging (13) of the one end being arranged at described insulation shell body (1).
8. a circuit board module device, including metal shell, it is positioned at insulation shell and the circuit board module body of described metal shell, it is characterised in that, described insulation shell wraps up described wiring board body, and described insulation shell is the insulation shell as described in claim 1-7 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620070927.7U CN205356885U (en) | 2016-01-22 | 2016-01-22 | Insulating housing and wiring board assembly device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620070927.7U CN205356885U (en) | 2016-01-22 | 2016-01-22 | Insulating housing and wiring board assembly device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205356885U true CN205356885U (en) | 2016-06-29 |
Family
ID=56180667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620070927.7U Active CN205356885U (en) | 2016-01-22 | 2016-01-22 | Insulating housing and wiring board assembly device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205356885U (en) |
-
2016
- 2016-01-22 CN CN201620070927.7U patent/CN205356885U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170908 Address after: Ring road 311500 Hangzhou city in Zhejiang province Tonglu Tonglu County Economic Development Zone No. 88, building 1, building 101 Patentee after: Tonglu Heng Ying Electronics Co., Ltd. Address before: 310053, Hangzhou, Zhejiang, Binjiang District, six and 368 Road, 1 (North) third floor, room A4117 Patentee before: Zhejiang Yingfeite Energy-saving Technology Co., Ltd. |
|
| TR01 | Transfer of patent right |