CN205353689U

CN205353689U - Data acquisition and recording chip of thick film encapsulation

Info

Publication number: CN205353689U
Application number: CN201620108577.9U
Authority: CN
Inventors: 夏博
Original assignee: XI'AN KEYWAY TECHNOLOGY CO LTD
Current assignee: Xi'an Qiwei Technology Co. Ltd.
Priority date: 2016-02-03
Filing date: 2016-02-03
Publication date: 2016-06-29
Anticipated expiration: 2026-02-03

Abstract

The utility model provides a data acquisition and recording chip of thick film encapsulation, belongs to data acquisition device field, its characterized in that: including data processing module, power module and storage module, data processing module includes singlechip and simulation manipulation front end module, the electricity is connected between singlechip and the simulation manipulation front end module, data processing module is provided with communication interface, power module and data processing module electricity mutually are connected, data processing module and storage module electricity mutually are connected. Based on data processing module, storage module and power module constitution, low -power consumption, little volume, the data acquisition and recording system of gathering passageway, large capacity have been realized more. Simultaneously, configuration parameter flexible and diverse can realize user's secondary development to its is reliable and stable, application in the adaptable adverse circumstances, but fields such as data record are carried in missile -borne data record, machine to the wide application. The utility model discloses simple structure, use safe and reliable are suitable for popularization and application.

Description

A kind of data acquiring and recording chip of thick film encapsulation

Technical field

This utility model belongs to data acquisition unit field, particularly relates to the data acquiring and recording chip of a kind of thick film encapsulation.

Background technology

Carry out in experimentation at missile borne system, in order to verify the correctness of design, generally require and record a lot of analogue signal and digital signal, after experiment completes, by analyzing the correctness of the data verification design of record.Simultaneously airborne, carrier-borne waiting in log equipment, acquisition and recording module is its core component, generally requires a large amount of input of cost and goes exploitation acquisition and recording module.

Traditional a kind of scheme is to gather external input signal by the A/D module of single-chip microcomputer and store it in the NANDFLASH chip extended out.When needs record data, first by user's triggering system, single-chip microcomputer reads the data of conversion from AD and it is processed, and then the data after process is stored in the NANDFLASH extended out.Although the program can realize the acquisition and recording of data, but owing to system structure is complicated, volume is bigger, it is impossible to meet the application of ultra-small volume occasion, also cannot meet the demand of the onboard use of user and secondary development.Also have a kind of common scheme for adopting various PC104 modules to be combined, reach the purpose of above-mentioned application, though the program possesses the possibility of user's secondary development.But the operating power consumption of PC104 module is big, use complexity high.And system dependability that modules assembles is low, system bulk is big, it is impossible to meet the use environment of missile-borne.

Summary of the invention

This utility model aims to solve the problem that the problems referred to above, it is provided that a kind of volume is little, capacity is big, can the data acquiring and recording chip of thick film encapsulation of secondary development.

The data acquiring and recording chip of a kind of thick film described in the utility model encapsulation, including data processing module, power module and memory module；Described data processing module includes single-chip microcomputer and simulation process front-end module；Electrically connect between described single-chip microcomputer with simulation process front-end module；Described data processing module is provided with communication interface；Described power module and data processing module are electrically connected；Described data processing module and memory module are electrically connected.By the programming to data processing module, complete the function such as reading management and user's configuration management of the collection of data, the storage of data, data.When system works, first it is acquired arranging (such as triggering mode, acquisition channel, sample rate, serial ports parameter etc.) by USB interface by host computer, after parameter configures into, preserves the configuration parameter of system.

After system electrification, arrive etc. triggering thing to be configured, when the event of triggering occurs, data processing module startup internal simulation process front-end module AD and serial ports carry out the collection of data, and it is stored in its internal buffer after reading the data process of collection, when relief area reaches to be sized, the data of relief area are write in storage chip by data processing module.After when recording stop condition and arriving or when record space is full, stop data record.User to PC by the USB interface of connection system, can be inquired about the data of collection and download, and resolves for follow-up.

The data acquiring and recording chip of thick film described in the utility model encapsulation, described memory module adopts EMMC chip.

The data acquiring and recording chip of thick film described in the utility model encapsulation, described communication interface includes USB interface and serial ports；Carried out the collection of data by serial ports, realize the connection with host computer by USB interface, it is achieved transferring of data.

The data acquiring and recording chip of thick film described in the utility model encapsulation, described chip adopts metal thick film encapsulation, and specification is 29mm × 20mm × 10mm, can bear the overload impact being not less than 20000g.

The data acquiring and recording chip of thick film described in the utility model encapsulation, described singlechip chip adopts STM32F411 chip.

The data acquiring and recording chip of thick film described in the utility model encapsulation, described power module adopts REF3030 power supply chip.

The data acquiring and recording chip of thick film described in the utility model encapsulation, the capacity of described memory module is 64GB.

The data acquiring and recording chip of thick film described in the utility model encapsulation, form based on data processing module, memory module and power module, with STM32F411 be data acquisition process chip, with EMMC be data storage medium, with USB for load shedding interface, it is achieved that low-power consumption, small size, many acquisition channels, jumbo data acquisition logging system.Meanwhile, configuration parameter is versatile and flexible, it may be achieved the secondary development of user, and it is reliable and stable, is suitable for the application in adverse circumstances, can be widely applied to the fields such as missile-borne data record, on-board data record.This utility model simple in construction, safe and reliable, be suitable to popularization and application.

Accompanying drawing explanation

Fig. 1 is the structural schematic block diagram of the data acquiring and recording chip of thick film described in the utility model encapsulation；

Fig. 2 is the circuit diagram of the data acquiring and recording chip of thick film described in the utility model encapsulation；

Fig. 3 is the pin assignment schematic diagram of the data acquiring and recording chip of thick film described in the utility model encapsulation；

Fig. 4 is the workflow diagram of the data acquiring and recording chip of thick film described in the utility model encapsulation.

Detailed description of the invention

The data acquiring and recording chip of a kind of thick film encapsulation, as shown in Figure 1 and Figure 2, including data processing module, power module and memory module；Described data processing module includes single-chip microcomputer and simulation process front-end module；Electrically connect between described single-chip microcomputer with simulation process front-end module；Described data processing module is provided with communication interface；Described power module and data processing module are electrically connected；Described data processing module and memory module are electrically connected.Described memory module adopts EMMC chip.Described communication interface includes USB interface and serial ports.Described singlechip chip adopts STM32F411 chip.Described power module adopts REF3030 power supply chip.The capacity of described memory module is 64GB.The stand-by power consumption of the data acquiring and recording chip of thick film described in the utility model encapsulation is low, representative value is less than 300mw, data acquisition and the storage of 8 tunnels analogy amounts and 2 passage digital quantities can be supported, employing metal thick film encapsulates, volume is only 29mm × 20mm × 10mm, anti-overload ability is high, can bear the overload impact being not less than 20000g.

Below in conjunction with accompanying drawing 3, Fig. 4 and embodiment, the present invention is described in further detail.

Data acquiring and recording chip described in the utility model be configured with two ways, a kind of mode is upper PC to be written and read the internal configuration registers arranged in data processing module by USB interface, and then the information of amendment internal configuration registers.Another way is that the internal configuration registers arranged in data processing module is written and read by user by serial ports, and then amendment internal configuration registers information.Configuration parameter can carry out flexible configuration by upper PC, and curable, and user can pass through change configuration parameter and solidify, and is made for one piece of custom chip.

When data acquiring and recording chip described in the utility model works on power, it is first determined whether need its configuration parameter is modified, if it is required, then carry out parameter setting (such as triggering mode, acquisition channel, sample rate, serial ports parameter etc.) by upper PC or serial ports and preserve.

If not needing parameter modification after powering on, then from memory module EMMC, first read the configuration register data of front 256 bytes.Then according to the configuration information of configuration register, the duty of data memorization COMS clip is set.After the triggering event set arrives, data processing module judges whether to need record analog data and bus data respectively.If analog data need to be recorded, then start internal simulation process front-end module AD and the analog quantity AIN1 ~ AIN7 of input is carried out the collection of data, and it is stored in internal buffer after reading the data process of collection, when relief area reaches to be sized, the data of relief area are write in memory module EMMC chip by data processing module.If needing record trunk data, then serial ports (UART0, UART1) is carried out the collection of data by data processing module according to configuration information, and it is stored in internal buffer after reading the data process of collection, when relief area reaches to be sized, the data of relief area are write in EMMC chip by data processing module.Processing module circulation carries out data acquisition and storage, when arriving until acquisition and recording stop condition or after when record space is full.The internal simulation that power module is data processing module processes front-end module AD and provides the reference of 2.5V.

After collection completes, user can connect PC by USB interface, inquires about the data file gathered and downloads, and resolves for follow-up, gathers one data file of generation every time.

Claims

1. the data acquiring and recording chip of a thick film encapsulation, it is characterised in that: include data processing module, power module and memory module；Described data processing module includes single-chip microcomputer and simulation process front-end module；Electrically connect between described single-chip microcomputer with simulation process front-end module；Described data processing module is provided with communication interface；Described power module and data processing module are electrically connected；Described data processing module and memory module are electrically connected.

2. the data acquiring and recording chip of thick film according to claim 1 encapsulation, it is characterised in that: described memory module adopts EMMC chip.

3. the data acquiring and recording chip of thick film according to claim 2 encapsulation, it is characterised in that: described communication interface includes USB interface and serial ports.

4. the data acquiring and recording chip of the thick film encapsulation according to claim 1 or 3, it is characterised in that: described chip adopts metal thick film encapsulation, and specification is 29mm × 20mm × 10mm.

5. the data acquiring and recording chip of thick film according to claim 4 encapsulation, it is characterised in that: described singlechip chip adopts STM32F411 chip.

6. the data acquiring and recording chip of thick film according to claim 5 encapsulation, it is characterised in that: described power module adopts REF3030 power supply chip.

7. the data acquiring and recording chip of the thick film encapsulation according to claim 1 or 3 or 6, it is characterised in that: the capacity of described memory module is 64GB.