CN205342221U

CN205342221U - Laser cutting machine with low ablation degree on side wall of LED (Light emitting diode) chip

Info

Publication number: CN205342221U
Application number: CN201520953616.0U
Authority: CN
Inventors: 方方
Original assignee: Guangdong Gold Mirror Detects Science And Technology Ltd
Current assignee: Guangdong Gold Mirror Detects Science And Technology Ltd
Priority date: 2015-11-25
Filing date: 2015-11-25
Publication date: 2016-06-29
Anticipated expiration: 2025-11-25

Abstract

The utility model discloses a laser cutting machine with low ablation degree on side wall of LED (Light emitting diode) chip, include: laser head, 12 ripples boards, rotary mechanism, speculum, focusing mirror, the mechanism that adjusts luminance, objective table, 1 2 ripples board fixed connection holds in rotary mechanism's power take off, speculum, focusing mirror are connected with the mechanism that adjusts luminance through anchor clamps, anchor clamps are located the mechanism's end of adjusting luminance, and the LED chip is placed on the objective table. 12 ripples boards of rotary mechanism drive are rotatory along the radial direction of this 12 ripples board, and this cutting machine changes the the polarization direction of laser under the rotation effect of 12 ripples boards, act on the LED chip through speculum, focusing mirror for the cutting depth of LED chip produces the periodic depth to be changed, makes the ablation area of LED chip lateral wall reduce, thereby has simple structure, advantage with low costs, low to sapphire substrate lateral wall ablation degree.

Description

A kind of laser cutting machine that LED chip sidewall ablation degree is low

Technical field

This utility model relates to a kind of laser cutting machine, particularly relates to a kind of laser cutting machine that LED chip sidewall ablation degree is low.

Background technology

The technique carrying out machinery sliver after laser scribing is a kind of conventional process in LED chip cutting process, especially it is applied in sapphire for the blue-ray LED of substrate, at present, the blue-light LED chip being substrate with sapphire, doping fluorescent powder and white light can be produced, this LED is the main flow leading lighting field future, meanwhile, how to further provide for brightness and reduce cost, being always up the problem that industry is made great efforts.The existing patent No. is CN201320865570.8, patent name provides a kind of laser cutting machine that LED chip sidewall ablation degree is low for " a kind of laser cutting machine that LED chip sidewall ablation degree is low ", rotation by 1/2 ripple plate, change the polarization direction of laser, the depth of cut making LED chip produces the change of the periodic depth, the ablated area making LED chip sidewall reduces, thus there is simple in construction, advantage that cost is low, Sapphire Substrate sidewall ablation degree is low, but this patent also exists the deficiency that cannot adjust laser path.

Utility model content

The technical problems to be solved in the utility model is, for the deficiencies in the prior art, solves to adjust the problem of laser path, and then realizes the cut that LED chip sidewall ablation degree is low more accurately.

The purpose of this utility model is achieved through the following technical solutions:

This utility model provides a kind of laser cutting machine that LED chip sidewall ablation degree is low, including: laser head, 1/2 ripple plate, rotating mechanism, reflecting mirror, focus lamp, dimming mechanism, object stage, described 1/2 ripple plate is fixedly connected on the clutch end of rotating mechanism, described reflecting mirror, focus lamp are connected with dimming mechanism by fixture, described fixture is positioned at dimming mechanism end, and LED chip is positioned on object stage.

Further, the clutch end of described rotating mechanism is provided with a drive rod, and the end of described drive rod is provided with hollow bearing, and described 1/2 ripple plate is fixed in described hollow bearing.

Further, described rotating mechanism includes motor and gear, and described gear is any one or a few the combination in gear train, belt pulley set, chain group and friction wheels.

Further, described dimming mechanism includes control chamber, upper mechanical arm and lower mechanical arm.

Further, described upper mechanical arm includes forearm, postbrachium, support arm, it is provided with panel in described forearm, postbrachium, described support arm is fixed in control chamber, it is provided with driver in described control chamber, control chamber is outside equipped with control lever, and described driver electrically connects with panel, and described control lever electrically connects with driver.

Further, it is provided with mobile device bottom described object stage.

Compared with prior art, the laser cutting machine a kind of that LED chip sidewall ablation degree is low in this utility model, by the control lever on control chamber, the position of mechanical arm in adjustment, and then regulate the height of illuminator, angle of inclination；By regulating the position of lower mechanical arm, and then regulate the height of focus lamp, position, angle of inclination, to select suitable laser path to carry out LED chip cutting.

Accompanying drawing explanation

In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.

Fig. 1 is the structural representation of the laser cutting machine of this utility model embodiment.

Detailed description of the invention

Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is clearly and completely described, it is clear that described embodiment is only a part of embodiment of this utility model, rather than whole embodiments.Based on the embodiment in this utility model, all other embodiments that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of this utility model protection.

Accordingly, Fig. 1 illustrates a kind of laser cutting machine that LED chip sidewall ablation degree is low in this utility model embodiment, including: laser head 1,1/2 ripple plate 2, rotating mechanism 3, reflecting mirror 4, focus lamp 5, dimming mechanism 6, object stage 7, described 1/2 ripple plate 2 is fixedly connected on rotating mechanism 3, described rotating mechanism 3 includes motor and gear, and described gear is any one or a few the combination in gear train, belt pulley set, chain group and friction wheels.Described reflecting mirror 4, focus lamp 5 are connected with dimming mechanism 6 by fixture, and LED chip is positioned on object stage 7.The clutch end of rotating mechanism 3 is located at by described 1/2 ripple plate 2, as a kind of optimal way, the clutch end of described rotating mechanism 7 is provided with a drive rod 8, the end of described drive rod 8 is provided with hollow bearing 9, described 1/2 ripple plate 2 is fixed in described hollow bearing 9, and described rotating mechanism 3 drives 1/2 ripple plate 2 to rotate along the radial direction of this 1/2 ripple plate 2.The postbrachium 621 being controlled upper mechanical arm 62 by the action bars 611 on the control chamber 61 of described dimming mechanism 6 is rotated, to adjust the position before and after upper mechanical arm 62, the forearm 622 being operated by the upper mechanical arm 62 of bar 612 control rotates, to adjust upper illuminator 4 angle of inclination, and then control laser downwardly direction.The postbrachium 631 being controlled lower mechanical arm 63 by described control lever 613 is stretched, and to adjust the front and back position of lower mechanical arm 63, is controlled the forearm 632 of lower mechanical arm 63 by described control lever 614, to adjust the angle of inclination of focus lamp 5, and then controls the drop point site of laser.

In practical application, laser head 1 launches laser, rotation by rotating mechanism 3, 1/2 ripple plate 2 is driven to rotate along the radial direction of this 1/2 ripple plate 2, laser traverse 1/2 ripple plate 2, it is incident upon illuminator 4, by control lever 611, control lever 612 adjusts forearm 621 and the postbrachium 622 of upper mechanical arm 62, and then regulate height and the angle of illuminator 4, make laser traverse illuminator 4, it is incident upon focus lamp 5, by control lever 613, control lever 614 adjusts forearm 631 and the postbrachium 632 of lower mechanical arm 63, and then regulate position and the angle of focus lamp 5, make pass through focus lamp 5 laser fall on object stage 7 LED chip 10 on, coordinate the movement of object stage 7, realize the cutting to LED, rotation along with 1/2 ripple plate 23, realize the change of the tangent line degree of depth, and then reduce the ablated area of the sidewall of LED.

What above this utility model embodiment is provided is described in detail the laser cutting machine that LED chip sidewall ablation degree is low, principle of the present utility model and embodiment are set forth by specific case used herein, and the explanation of above example is only intended to help to understand method of the present utility model and core concept thereof；Simultaneously for one of ordinary skill in the art, according to thought of the present utility model, all will change in specific embodiments and applications, in sum, this specification content should not be construed as restriction of the present utility model.

Claims

1. the laser cutting machine of a kind LED chip sidewall ablation degree is low, including: laser head, 1/2 ripple plate, rotating mechanism, reflecting mirror, focus lamp, dimming mechanism, object stage, described 1/2 ripple plate is fixedly connected on the clutch end of rotating mechanism, described reflecting mirror, focus lamp are connected with dimming mechanism by fixture, described fixture is positioned at dimming mechanism end, and LED chip is positioned on object stage.

2. as claimed in claim 1 that LED chip sidewall ablation degree is low laser cutting machine, it is characterized in that, the clutch end of described rotating mechanism is provided with a drive rod, and the end of described drive rod is provided with hollow bearing, and described 1/2 ripple plate is fixed in described hollow bearing.

3. as claimed in claim 1 that LED chip sidewall ablation degree is low laser cutting machine, it is characterized in that, described rotating mechanism includes motor and gear, and described gear is any one or a few the combination in gear train, belt pulley set, chain group and friction wheels.

4. as claimed in claim 1 that LED chip sidewall ablation degree is low laser cutting machine, it is characterised in that described dimming mechanism includes control chamber, upper mechanical arm and lower mechanical arm.

5. as claimed in claim 4 that LED chip sidewall ablation degree is low laser cutting machine, it is characterized in that, described upper mechanical arm includes forearm, postbrachium, support arm, it is provided with panel in described forearm, postbrachium, described support arm is fixed in control chamber, is provided with driver in described control chamber, and control chamber is outside equipped with control lever, described driver electrically connects with panel, and described control lever electrically connects with driver.

6. as claimed in claim 1 that LED chip sidewall ablation degree is low laser cutting machine, it is characterised in that be provided with mobile device bottom described object stage.