CN205335402U - Single chamber three die cavitys body duplexer based on grounded probe feed of buckling - Google Patents
Single chamber three die cavitys body duplexer based on grounded probe feed of buckling Download PDFInfo
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- CN205335402U CN205335402U CN201521140664.4U CN201521140664U CN205335402U CN 205335402 U CN205335402 U CN 205335402U CN 201521140664 U CN201521140664 U CN 201521140664U CN 205335402 U CN205335402 U CN 205335402U
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Abstract
The utility model discloses a single chamber three die cavitys body duplexer based on grounded probe feed of buckling, cavity, setting cavity and setting dielectric plate bottom the cavity outside the rectangle in rectangle exocoel two internal rectangles outside the rectangle, the cavity is interior cavity of first rectangle and the interior cavity of second rectangle respectively in two rectangles, the bottom of cavity is equipped with first buckle conductor subassembly and the second conductor subassembly of buckling in the first rectangle, the bottom of cavity is equipped with third conductor subassembly and the fourth conductor subassembly of buckling of buckling in the second rectangle, be equipped with first microstrip line, second microstrip line, third microstrip line and fourth microstrip line on the dielectric plate. The utility model discloses a duplexer has simple structure, handling ease, advantage that the performance is good, can satisfy miniaturized required by communication.
Description
Technical field
This utility model relates to a kind of duplexer, especially a kind of single chamber three die cavity body duplexer based on bending grounded probe feed, belongs to wireless communication field。
Background technology
The effect of microwave diplexer is by transmitting and to receive signal isolated, it is ensured that receiving and launch can simultaneously normal operation。It is made up of the band elimination filter of two groups of different frequencies, it is to avoid the machine is launched signal and is transferred to receiver。Along with the development of wireless communication technology, the frequency band between signal is more and more narrow, this just specification and reliability to duplexer have higher requirement。Cavity body filter has high q-factor, power capacity is big, be easily achieved, steady performance and there is significantly high using value。Cavity body filter is by perforate between the resonator of each chamber or adds probe, it is achieved inductance or Capacitance Coupled, controls the power of coupling inductance or coupling electric capacity to realize various wave filter by changing the thickness length etc. of the position in hole, size or probe；And it is easily achieved the cross-couplings between resonator, by controlling cross-linked quantity and strong and weak position and the number being achieved transmission zero。Due to above feature, research cavity body filter multi-mode structure, cavity body filter miniaturization obtain the extensive concern of scholars。
According to investigations with understanding, disclosed prior art is as follows:
1) the separation degenerate mode of resonator generally has four kinds of methods: 1.1) as seen in figure la and lb, when realizing degenerate mode coupling by coupling screws, in order to avoid interacting, its position should be positioned near the electric field intensity maximum of two resonance (coupling), and all the other degenerate mode electric fields are the region of zero, the electric field of usual coupling screws and two polarization becomes 45o, but this coupled modes tunable range is smaller；1.2) as shown in figures 2 a and 2b, above resonator 45° angle, coupling screws, equally possible separation degenerate mode are put in；1.3) as best shown in figures 3 a and 3b, cut a rectangle corner cut, but this coupled modes are not easily processed；1.4) as shown in Figs. 4a and 4b, to slot at resonator central, same this coupled modes are not easily processed。
2) nineteen fifty-one woods is that dry academician also exists multiple degenerate mode based in the resonant frequency fundamental formular proposition cylindrical cavity of wave-guide cavity wave internal schema, and devising chamber five mode filter being substantially reduced waveguide filter volume, the research for multimode cavity wave filter lays the foundation。
3) in October, 1998, G.Lastoria et al. delivers at IEEEMICROWAVEANDGUIDEDWAVELETTERS in the article being entitled as " CADofTriple-ModeCavitiesinRectangularWaveguide "。Author proposes a kind of three mode structures adopting metallic cavity corner cut, and several modes of resonance as shown in Figure 5 a, are moved in the passband that we are required by controlling the size of corner cut by structure, and its simulation result is as shown in Figure 5 b；The structure of this coupled modes is not easily processed。
4) in January, 2004, L.H.Chua et al. delivers and is entitled as in " Analysisofdielectricloadedcubicalcavityfortriplemodefilt erdesign " article, propose to utilize coaxial line as feed, as shown in Figure 6 a, adopting the dielectric cavity fluid filter structure of tuning screw, simulation result is as shown in Figure 6 b；The tunable scope of structure of this employing coupling screws is fewer, there is certain deficiency。
Utility model content
The purpose of this utility model is the defect in order to solve above-mentioned prior art, it is provided that a kind of have simple in construction, handling ease, advantage that performance is good, it is possible to meet the single chamber three die cavity body duplexer based on bending grounded probe feed of miniaturization communicating requirement。
The purpose of this utility model can be passed through to adopt the following technical scheme that and reach:
Single chamber three die cavity body duplexer based on bending grounded probe feed, including rectangle outer chamber, two the rectangular inner cavity bodies being arranged in rectangle outer chamber and be arranged on the dielectric-slab bottom rectangle outer chamber, said two rectangular inner cavity body respectively the first rectangular inner cavity body and the second rectangular inner cavity body；The bottom of described first rectangular inner cavity body is provided with the first bending conductor assembly and the second bending conductor assembly, and the bottom of described second rectangular inner cavity body is provided with the 3rd bending conductor assembly and the 4th bending conductor assembly；Described dielectric-slab is provided with the first microstrip line, the second microstrip line, the 3rd microstrip line and the 4th microstrip line；
One end of described first microstrip line, the second microstrip line and the 3rd microstrip line is as port, and is positioned at the edge of dielectric-slab, and described first microstrip line and the 4th microstrip line are connected；The bottom of the first rectangular inner cavity body is stretched out in one end of described first bending conductor assembly, and the other end injecting dielectric-slab and the second microstrip line is connected, the bottom of the first rectangular inner cavity body is stretched out in one end of described second bending conductor assembly, and the one end injecting dielectric-slab and the 4th microstrip line is connected, the bottom of the second rectangular inner cavity body is stretched out in one end of described 3rd bending conductor assembly, and the other end injecting dielectric-slab and the 4th microstrip line is connected, the bottom of the second rectangular inner cavity body is stretched out in one end of described 4th bending conductor assembly, and the other end injecting dielectric-slab and the 3rd microstrip line is connected。
As a kind of preferred version, the other end of described first bending conductor assembly stretches out the left side of the first rectangular inner cavity body, and be connected with the inner left wall of rectangle outer chamber, the described other end of the second bending conductor assembly and the right side inwall of the first rectangular inner cavity body are connected, the described other end of the 3rd bending conductor assembly and the inner left wall of the second rectangular inner cavity body are connected, the other end of described 4th bending conductor assembly stretches out the right side of the second rectangular inner cavity body, and is connected with the right side inwall of rectangle outer chamber。
As a kind of preferred version, described first bending conductor assembly includes the first x-axis conductor 801, the first y-axis conductor 801 and the first z-axis conductor 801, the bottom of the first rectangular inner cavity body is stretched out in one end of described first z-axis conductor 801, and the other end injecting dielectric-slab and the second microstrip line is connected, the other end of the first z-axis conductor 801 is connected by one end of the first y-axis conductor 801 and the first x-axis conductor 801, the other end of described first x-axis conductor 801 stretches out the left side of the first rectangular inner cavity body, and is connected with the inner left wall of rectangle outer chamber；
Described second bending conductor assembly includes the second x-axis conductor 801, the second y-axis conductor 801 and the second z-axis conductor 801, the bottom of the first rectangular inner cavity body is stretched out in one end of described second z-axis conductor 801, and the one end injecting dielectric-slab and the 4th microstrip line is connected, the other end of the second z-axis conductor 801 is connected by one end of the second y-axis conductor 801 and the second x-axis conductor 801, and the other end of described second x-axis conductor 801 and the right side inwall of the first rectangular inner cavity body are connected；
Described 3rd bending conductor assembly includes the 3rd x-axis conductor 801, the 3rd y-axis conductor 801 and the 3rd z-axis conductor 801, the bottom of the second rectangular inner cavity body is stretched out in one end of described 3rd z-axis conductor 801, and the other end injecting dielectric-slab and the 4th microstrip line is connected, the other end of the 3rd z-axis conductor 801 is connected by one end of the 3rd y-axis conductor 801 and the 3rd x-axis conductor 801, and the other end of described 3rd x-axis conductor 801 and the inner left wall of the second rectangular inner cavity body are connected；
Described 4th bending conductor assembly includes the 4th x-axis conductor 801, the 4th y-axis conductor 801 and the 4th z-axis conductor 801, the bottom of the second rectangular inner cavity body is stretched out in one end of described 4th z-axis conductor 801, and the other end injecting dielectric-slab and the 3rd microstrip line is connected, the other end of the 4th z-axis conductor 801 is connected by one end of the 4th y-axis conductor 801 and the 4th x-axis conductor 801, the other end of described 4th x-axis conductor 801 stretches out the right side of the second rectangular inner cavity body, and is connected with the right side inwall of rectangle outer chamber。
As a kind of preferred version, the position that the bottom outer wall of described first rectangular inner cavity body is stretched out at the first z-axis conductor 801 is provided with the first outer conductor, and the position stretched out at the second z-axis conductor 801 is provided with the second outer conductor；
The position that the bottom outer wall of described second rectangular inner cavity body is stretched out at the 3rd z-axis conductor 801 is provided with the 3rd outer conductor, and the position stretched out at the 4th z-axis conductor 801 is provided with the 4th outer conductor。
As a kind of preferred version, described first microstrip line stretches out a part on the position being connected with the 4th microstrip line, forms open circuit minor matters。
Symmetrical as a kind of preferred version, described first bending conductor assembly and the second bending conductor assembly；Described 3rd bending conductor assembly and the 4th bending conductor assembly are symmetrical。
As a kind of preferred version, described first microstrip line, the second microstrip line, the 3rd microstrip line and the 4th microstrip line all adopt copper sheet。
As a kind of preferred version, described dielectric-slab adopts pcb board。
This utility model has following beneficial effect relative to prior art:
1, duplexer of the present utility model by arranging two rectangular inner cavity bodies in a rectangle outer chamber, and a dielectric-slab is set in bottom, two bending conductor assemblies are set in the bottom of each rectangular inner cavity body, the two bending conductor assembly is connected with the microstrip line on dielectric-slab, form bending grounded probe feed structure, a wherein microstrip line is utilized to be assigned to by energy in two rectangular inner cavity bodies, and exported by the port of two microstrip lines, it is achieved thereby that a port input, two port outputs, there is high selectivity, high q-factor, design and process simple feature, disclosure satisfy that the requirement that miniaturization communicates。
2, duplexer of the present utility model shows through emulation, one passband of each generation in the band limits of 2.52-2.57G and 2.64-2.69G, each passband has three patterns, therefore constitutes single chamber three die cavity body duplexer, overcomes the zero point existing for the single mode of existing single chamber and produces difficult problem。
3, duplexer handling ease of the present utility model, the problem solving prior art processed complex, and simple in construction, applied range。
Accompanying drawing explanation
Fig. 1 a is resonator (resonator the is cuboid) structure chart adopting the first separation degenerate mode method of prior art。
Fig. 1 b is resonator (resonator the is cylinder) structure chart adopting the first separation degenerate mode method of prior art。
Fig. 2 a is the resonator axonometric chart adopting prior art the second separation degenerate mode method。
Fig. 2 b is the resonator top view adopting prior art the second separation degenerate mode method。
Fig. 3 a is the resonator axonometric chart adopting the third separation degenerate mode method of prior art。
Fig. 3 b is the resonator top view adopting the third separation degenerate mode method of prior art。
Fig. 4 a is the resonator axonometric chart adopting prior art the 4th kind to separate degenerate mode method。
Fig. 4 b is the resonator top view adopting prior art the 4th kind to separate degenerate mode method。
Fig. 5 a is the three mode filter structure charts adopting metallic cavity corner cut in prior art。
Fig. 5 b is the three mode filter simulation result figure adopting metallic cavity corner cut in prior art。
Fig. 6 a is the dielectric cavity fluid filter structure chart adopting tuning screw in prior art。
Fig. 6 b is the dielectric cavity fluid filter simulation result figure adopting tuning screw in prior art。
Fig. 7 is the duplexer axonometric chart of this utility model embodiment 1。
Fig. 8 is the duplexer front view of this utility model embodiment 1。
Fig. 9 is the duplexer left side view of this utility model embodiment 1。
Figure 10 is the duplexer top view of this utility model embodiment 1。
Figure 11 is the Electromagnetic Simulation curve chart of the duplexer frequency response of this utility model embodiment 1。
Figure 12 is the closed top board schematic diagram during duplexer of processing this utility model embodiment 1。
Figure 13 is the lower chamber schematic diagram during duplexer of processing this utility model embodiment 1。
Figure 14 is the dielectric-slab schematic diagram during duplexer of processing this utility model embodiment 1。
Wherein, 1-rectangle outer chamber, 2-dielectric-slab, 3-the first rectangular inner cavity body, 4-the second rectangular inner cavity body, 5-the first microstrip line, 6-the second microstrip line, 7-the 3rd microstrip line, 8-the 4th microstrip line, 9-the first x-axis conductor 801, 10-the first y-axis conductor 801, 11-the first z-axis conductor 801, 12-the second x-axis conductor 801, 13-the second y-axis conductor 801, 14-the second z-axis conductor 801, 15-the 3rd x-axis conductor 801, 16-the 3rd y-axis conductor 801, 17-the 3rd z-axis conductor 801, 18-the 4th x-axis conductor 801, 19-the 4th y-axis conductor 801, 20-the 4th z-axis conductor 801, 21-the first outer conductor, 22-the second outer conductor, 23-the 3rd outer conductor, 24-the 4th outer conductor, 25-positions hole。
Detailed description of the invention
Embodiment 1:
As shown in Fig. 7～Figure 10, the duplexer of the present embodiment includes rectangle outer chamber 1, be arranged in rectangle outer chamber 1 two rectangular inner cavity bodies and be arranged on the dielectric-slab 2 bottom rectangle outer chamber 1, said two rectangular inner cavity body is the first rectangular inner cavity body 3 and the second rectangular inner cavity body 4 respectively；
The bottom of described first rectangular inner cavity body 3 is provided with the first bending conductor assembly and the second bending conductor assembly, the bottom of described second rectangular inner cavity body 4 is provided with the 3rd bending conductor assembly and the 4th bending conductor assembly, described first bending conductor assembly and the second bending conductor assembly are symmetrical, and described 3rd bending conductor assembly and the 4th bending conductor assembly are symmetrical；Described dielectric-slab 2 adopts pcb board, and it is provided with the first microstrip line the 5, second microstrip line the 6, the 3rd microstrip line 7 and the 4th microstrip line 8, and described first microstrip line the 5, second microstrip line the 6, the 3rd microstrip line 7 and the 4th microstrip line 8 all adopt copper sheet；
One end of described first microstrip line the 5, second microstrip line 6 and the 3rd microstrip line 7 is respectively as port Port1, port Port2 and port Port3, and is positioned at the edge of dielectric-slab 2, and described first microstrip line 5 is connected with the 4th microstrip line 8；
Described first bending conductor assembly includes the first x-axis conductor 801 the 9, first y-axis conductor 801 10 and the first z-axis conductor 801 11, the bottom of the first rectangular inner cavity body 3 is stretched out in one end of described first z-axis conductor 801 11, and inject dielectric-slab 2 and be connected with the other end of the second microstrip line 6, the other end of the first z-axis conductor 801 11 is connected with one end of the first x-axis conductor 801 9 by the first y-axis conductor 801 10, the other end of described first x-axis conductor 801 9 stretches out the left side of the first rectangular inner cavity body 3, and be connected with the inner left wall of rectangle outer chamber 1, form bending grounded probe feed structure；
Described second bending conductor assembly includes the second x-axis conductor 801 the 12, second y-axis conductor 801 13 and the second z-axis conductor 801 14, the bottom of the first rectangular inner cavity body 3 is stretched out in one end of described second z-axis conductor 801 14, and inject dielectric-slab 2 and be connected with one end of the 4th microstrip line 8, the other end of the second z-axis conductor 801 14 is connected with one end of the second x-axis conductor 801 12 by the second y-axis conductor 801 13, the other end of described second x-axis conductor 801 12 and the right side inwall of the first rectangular inner cavity body 3 are connected, and form bending grounded probe feed structure；
Described 3rd bending conductor assembly includes the 3rd x-axis conductor 801 the 15, the 3rd y-axis conductor 801 16 and the 3rd z-axis conductor 801 17, the bottom of the second rectangular inner cavity body 4 is stretched out in one end of described 3rd z-axis conductor 801 17, and inject dielectric-slab 2 and be connected with the other end of the 4th microstrip line 8, the other end of the 3rd z-axis conductor 801 17 is connected with one end of the 3rd x-axis conductor 801 15 by the 3rd y-axis conductor 801 16, the other end of described 3rd x-axis conductor 801 15 and the inner left wall of the second rectangular inner cavity body 4 are connected, and form bending grounded probe feed structure；
Described 4th bending conductor assembly includes the 4th x-axis conductor 801 the 18, the 4th y-axis conductor 801 19 and the 4th z-axis conductor 801 20, the bottom of the second rectangular inner cavity body 4 is stretched out in one end of described 4th z-axis conductor 801 20, and inject dielectric-slab 2 and be connected with the other end of the 3rd microstrip line 7, the other end of the 4th z-axis conductor 801 20 is connected with one end of the 4th x-axis conductor 801 18 by the 4th y-axis conductor 801 19, the other end of described 4th x-axis conductor 801 18 stretches out the right side of the second rectangular inner cavity body 4, and be connected with the right side inwall of rectangle outer chamber 1, form bending grounded probe feed structure；
The bottom outer wall of described first rectangular inner cavity body 3 is provided with the first outer conductor 21 in the position that the first z-axis conductor 801 11 stretches out, and is provided with the second outer conductor 22 in the position that the second z-axis conductor 801 14 stretches out；The position that the bottom outer wall of described second rectangular inner cavity body 4 is stretched out at the 3rd z-axis conductor 801 17 is provided with the 3rd outer conductor 23, the 4th outer conductor 24, described first outer conductor the 21, second outer conductor the 22, the 3rd outer conductor 23 and the 4th outer conductor 24 namely cavity wall it is provided with in the position that the 4th z-axis conductor 801 20 stretches out。
Described first microstrip line 5 stretches out a part on the position being connected with the 4th microstrip line 8, forms open circuit minor matters, and these open circuit minor matters are used for regulating the performance of impedance matching。
The duplexer operation principle of the present embodiment is: port Port1, port Port2 and port Port3 and three SMA head connect, energy inputs from port Port1, the energy of input is assigned in the first rectangular inner cavity body 3 and the second rectangular inner cavity body 4 by the 4th microstrip line 8 by the first microstrip line 5, energy is exported at port Port2 by the second microstrip line 6, and energy is exported at port Port3 by the 3rd microstrip line 7, it is achieved thereby that a port input, the duplexer of two port outputs。
The Electromagnetic Simulation curve of the duplexer frequency response of the present embodiment as shown in figure 11, S in figure1,1Expression is the return loss of port Port1；S2,1Represent the forward transmission coefficient of port Port1 to port Port2, S3,1Represent the forward transmission coefficient of port Port1 to port Port3, S2,3Represent the reverse transfer coefficient of port Port3 to port Port2, it can be seen that S1,1Parameter is each in the band limits of 2.52-2.57G and 2.64-2.69G produces a passband, and each passband has three patterns, therefore constitutes single chamber three die cavity body duplexer。
The wave filter course of processing of the present embodiment is as follows:
Take a cuboid, top is cut, the top cut is closed top board, two rectangular inner cavity are dug out in the remaining part do not cut, make this part that lower chamber is integrally formed, closed top board and lower chamber are respectively as shown in Figures 12 and 13, it is processed in conjunction with Fig. 7～Figure 10, by two x-axis conductor 801 (first x-axis conductor 801 9 and the second x-axis conductor 801 12), two y-axis conductor 801 (first y-axis conductor 801 10 and the second y-axis conductor 801 13) and two z-axis conductor 801 (first z-axis conductor 801 11 and the second z-axis conductor 801 14) are fixed on the bottom of left side rectangular inner cavity, two openings are outputed in the bottom of left side rectangular inner cavity, corresponding with two z-axis conductor 801 (first z-axis conductor 801 11 and the second z-axis conductor 801 14) respectively；In like manner, the bottom of rectangular inner cavity on the right of two x-axis conductor 801 (the 3rd x-axis conductor 801 15 and the 4th x-axis conductor 801 18), two y-axis conductor 801 (the 3rd y-axis conductor 801 16 and the 4th y-axis conductor 801 19) and two z-axis conductor 801 (the 3rd z-axis conductor 801 17 and the 4th z-axis conductor 801 20) are fixed on, two openings are outputed in the bottom of rectangular inner cavity on the right, corresponding with two z-axis conductor 801 (the 3rd z-axis conductor 801 17 and the 4th z-axis conductor 801 20) respectively；The position that lower chamber top is not dug is outputed eight location holes 25 corresponding with pin, closed top board is outputed hole 25, eight location, again through pin, lower chamber and closed top board is fixed；Finally the dielectric-slab 2 (as shown in figure 14) posting first microstrip line the 5, second microstrip line the 6, the 3rd microstrip line 7 and the 4th microstrip line 8 is fixed on the bottom of lower chamber, make first z-axis conductor 801 the 11, second z-axis conductor 801 the 14, the 3rd z-axis conductor 801 17 and the 4th z-axis conductor 801 20 insert dielectric-slab 2, and the first z-axis conductor 801 11 is welded with the 3rd microstrip line 7 with the second microstrip line the 6, the 4th z-axis conductor 801 20 with first microstrip line the 5, second z-axis conductor 801 14 and the 3rd z-axis conductor 801 17。
In above-described embodiment, the metal material that described rectangle outer chamber, the first rectangle outer chamber, the second rectangle outer chamber, the first bending conductor assembly and the second bending conductor assembly adopt can be any one of aluminum, ferrum, stannum, copper, silver, gold and platinum, can be maybe any one alloy of aluminum, ferrum, stannum, copper, silver, gold and platinum。
In sum, duplexer of the present utility model by arranging two rectangular inner cavity bodies in a rectangle outer chamber, and a dielectric-slab is set in bottom, two bending conductor assemblies are set in the bottom of each rectangular inner cavity body, the two bending conductor assembly is connected with the microstrip line on dielectric-slab, form bending grounded probe feed structure, a wherein microstrip line is utilized to be assigned to by energy in two rectangular inner cavity bodies, and export at the port of two microstrip lines, it is achieved thereby that a port input, two port outputs, there is high selectivity, high q-factor, design and process simple feature, disclosure satisfy that the requirement that miniaturization communicates。
The above; it is only this utility model patent preferred embodiment; but the protection domain of this utility model patent is not limited thereto; any those familiar with the art is in the scope disclosed in this utility model patent; technical scheme and utility model design thereof according to this utility model patent are equal to replacement or are changed, and broadly fall into the protection domain of this utility model patent。
Claims (8)
1. based on single chamber three die cavity body duplexer of bending grounded probe feed, it is characterized in that: two rectangular inner cavity bodies include rectangle outer chamber, being arranged in rectangle outer chamber and be arranged on the dielectric-slab bottom rectangle outer chamber, said two rectangular inner cavity body respectively the first rectangular inner cavity body and the second rectangular inner cavity body；The bottom of described first rectangular inner cavity body is provided with the first bending conductor assembly and the second bending conductor assembly, and the bottom of described second rectangular inner cavity body is provided with the 3rd bending conductor assembly and the 4th bending conductor assembly；Described dielectric-slab is provided with the first microstrip line, the second microstrip line, the 3rd microstrip line and the 4th microstrip line；
One end of described first microstrip line, the second microstrip line and the 3rd microstrip line is as port, and is positioned at the edge of dielectric-slab, and described first microstrip line and the 4th microstrip line are connected；The bottom of the first rectangular inner cavity body is stretched out in one end of described first bending conductor assembly, and the other end injecting dielectric-slab and the second microstrip line is connected, the bottom of the first rectangular inner cavity body is stretched out in one end of described second bending conductor assembly, and the one end injecting dielectric-slab and the 4th microstrip line is connected, the bottom of the second rectangular inner cavity body is stretched out in one end of described 3rd bending conductor assembly, and the other end injecting dielectric-slab and the 4th microstrip line is connected, the bottom of the second rectangular inner cavity body is stretched out in one end of described 4th bending conductor assembly, and the other end injecting dielectric-slab and the 3rd microstrip line is connected。
2. the single chamber three die cavity body duplexer based on bending grounded probe feed according to claim 1, it is characterized in that: the other end of described first bending conductor assembly stretches out the left side of the first rectangular inner cavity body, and be connected with the inner left wall of rectangle outer chamber, the described other end of the second bending conductor assembly and the right side inwall of the first rectangular inner cavity body are connected, the described other end of the 3rd bending conductor assembly and the inner left wall of the second rectangular inner cavity body are connected, the other end of described 4th bending conductor assembly stretches out the right side of the second rectangular inner cavity body, and be connected with the right side inwall of rectangle outer chamber。
3. the single chamber three die cavity body duplexer based on bending grounded probe feed according to claim 2, it is characterized in that: described first bending conductor assembly includes the first x-axis conductor 801, first y-axis conductor 801 and the first z-axis conductor 801, the bottom of the first rectangular inner cavity body is stretched out in one end of described first z-axis conductor 801, and the other end injecting dielectric-slab and the second microstrip line is connected, the other end of the first z-axis conductor 801 is connected by one end of the first y-axis conductor 801 and the first x-axis conductor 801, the other end of described first x-axis conductor 801 stretches out the left side of the first rectangular inner cavity body, and be connected with the inner left wall of rectangle outer chamber；
Described second bending conductor assembly includes the second x-axis conductor 801, the second y-axis conductor 801 and the second z-axis conductor 801, the bottom of the first rectangular inner cavity body is stretched out in one end of described second z-axis conductor 801, and the one end injecting dielectric-slab and the 4th microstrip line is connected, the other end of the second z-axis conductor 801 is connected by one end of the second y-axis conductor 801 and the second x-axis conductor 801, and the other end of described second x-axis conductor 801 and the right side inwall of the first rectangular inner cavity body are connected；
Described 3rd bending conductor assembly includes the 3rd x-axis conductor 801, the 3rd y-axis conductor 801 and the 3rd z-axis conductor 801, the bottom of the second rectangular inner cavity body is stretched out in one end of described 3rd z-axis conductor 801, and the other end injecting dielectric-slab and the 4th microstrip line is connected, the other end of the 3rd z-axis conductor 801 is connected by one end of the 3rd y-axis conductor 801 and the 3rd x-axis conductor 801, and the other end of described 3rd x-axis conductor 801 and the inner left wall of the second rectangular inner cavity body are connected；
Described 4th bending conductor assembly includes the 4th x-axis conductor 801, the 4th y-axis conductor 801 and the 4th z-axis conductor 801, the bottom of the second rectangular inner cavity body is stretched out in one end of described 4th z-axis conductor 801, and the other end injecting dielectric-slab and the 3rd microstrip line is connected, the other end of the 4th z-axis conductor 801 is connected by one end of the 4th y-axis conductor 801 and the 4th x-axis conductor 801, the other end of described 4th x-axis conductor 801 stretches out the right side of the second rectangular inner cavity body, and is connected with the right side inwall of rectangle outer chamber。
4. the single chamber three die cavity body duplexer based on bending grounded probe feed according to claim 3, it is characterized in that: the position that the bottom outer wall of described first rectangular inner cavity body is stretched out at the first z-axis conductor 801 is provided with the first outer conductor, and the position stretched out at the second z-axis conductor 801 is provided with the second outer conductor；
The position that the bottom outer wall of described second rectangular inner cavity body is stretched out at the 3rd z-axis conductor 801 is provided with the 3rd outer conductor, and the position stretched out at the 4th z-axis conductor 801 is provided with the 4th outer conductor。
5. the single chamber three die cavity body duplexer based on bending grounded probe feed according to any one of claim 1-4, it is characterised in that: described first microstrip line stretches out a part on the position being connected with the 4th microstrip line, forms open circuit minor matters。
6. the single chamber three die cavity body duplexer based on bending grounded probe feed according to any one of claim 1-4, it is characterised in that: described first bending conductor assembly and the second bending conductor assembly are symmetrical；Described 3rd bending conductor assembly and the 4th bending conductor assembly are symmetrical。
7. the single chamber three die cavity body duplexer based on bending grounded probe feed according to any one of claim 1-4, it is characterised in that: described first microstrip line, the second microstrip line, the 3rd microstrip line and the 4th microstrip line all adopt copper sheet。
8. the single chamber three die cavity body duplexer based on bending grounded probe feed according to any one of claim 1-4, it is characterised in that: described dielectric-slab adopts pcb board。
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| CN201521140664.4U CN205335402U (en) | 2015-12-30 | 2015-12-30 | Single chamber three die cavitys body duplexer based on grounded probe feed of buckling |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105470607A (en) * | 2015-12-30 | 2016-04-06 | 华南理工大学 | Single-cavity triple-mode cavity duplexer based on bending grounded probe feed |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105470607A (en) * | 2015-12-30 | 2016-04-06 | 华南理工大学 | Single-cavity triple-mode cavity duplexer based on bending grounded probe feed |
| CN105470607B (en) * | 2015-12-30 | 2018-05-15 | 华南理工大学 | Three die cavity body duplexer of single-chamber based on bending grounded probe feed |
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