CN205325937U - Membrane module and stamping forming mould are down used to semicircular tile stamping forming mould - Google Patents
Membrane module and stamping forming mould are down used to semicircular tile stamping forming mould Download PDFInfo
- Publication number
- CN205325937U CN205325937U CN201620109870.7U CN201620109870U CN205325937U CN 205325937 U CN205325937 U CN 205325937U CN 201620109870 U CN201620109870 U CN 201620109870U CN 205325937 U CN205325937 U CN 205325937U
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- lower mold
- semicircular tile
- mold core
- forming
- forming cavity
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Abstract
The utility model provides a membrane module and stamping forming mould are down used to semicircular tile stamping forming mould belongs to die making machine technical field, framed and lower mold core under lower membrane module includes, the semicircular tile is the arch, the mold core has the shaping of being used for down the one -tenth die cavity of semicircular tile, the mold core inlays and locates down it is framed down, down the mold core the upper surface with framed upper surface lies in the coplanar down. The stamping forming mould includes this time membrane module. When this time membrane module carried out stamping forming, the structural strength of lower mold core was high, can match the punching press with last mold core and make the semicircular tile, and the structure of semicircular tile is pleasing to the eye, satisfies user's user demand, and the phenomenon of card mould can not appear, process safe and reliable, the manufacturing of work piece is efficient, has saved the cost.
Description
Technical field
This utility model relates to equipments machining die technical field, in particular to a kind of semicircular tile punch-forming mold lower mold assemblies and punch-forming mold。
Background technology
At present, the semicircular tile that market is sold is divided into ancient architecture green grass or young crops semicircular tile and Western-style semicircular tile two kinds, ancient architecture semicircular tile surface not glazing, and glazing is wanted on Western-style semicircular tile surface。Ancient architecture semicircular tile has two kinds at present, and a kind of is be squeezed into, by vacuum machine, the slice that moisture content is significantly high, then by the semi-circular tile of the tiling of mould pressed sizing。The shortcoming of this tile has following three points: one is that adobe need to be dried time-consuming for a long time, and production efficiency is very low；Two is fire rear tile to deform very serious；Three is that tile intensity is not high。Another kind is that the advantage of this tile is to realize the production line balance of track kiln furnace, and efficiency is significantly high, and the intensity of tile is higher by dry powder punch forming, the tile of tiling small semicircle and two sideband platforms。
Inventor finds under study for action, and semicircular tile of the prior art processing at least has a disadvantage in that
When adopting dry powder punch forming, tile shape is unsightly, it is impossible to meet the user demand of user；And tile is when punch forming, upper mold core coordinates when carrying out press work with lower mold core, lower mold core extruding liner plate, causes the punching press insufficient strength of two long sides of lower mold core, so tile can not molding, add manufacturing cost；And easily occur that lower mold core expands and the phenomenon of snap gauge, processing inconvenience。
Utility model content
The purpose of this utility model is in that to provide a kind of semicircular tile punch forming lower mould assembly, the problem that during to improve the dry powder punch forming of prior art, low and tile the structure sight difference of ratio of briquetting of tile causes manufacturing cost to increase。
The purpose of this utility model also resides in a kind of punch-forming mold of offer, the problem that during to improve the dry powder punch forming of prior art, low and tile the structure sight difference of ratio of briquetting of tile causes manufacturing cost to increase。
This utility model is achieved in that
Based on above-mentioned first purpose, this utility model provides a kind of semicircular tile punch-forming mold lower mold assemblies, including low mold frame and lower mold core, described semicircular tile is domed, described lower mold core has the forming cavity of semicircular tile described in molding, described lower mold core is embedded at described low mold frame, in the upper surface of the upper surface of described lower mold core and described low mold frame is generally aligned in the same plane。
Preferably, the upper surface along described lower mold core of described forming cavity is perpendicular to the height radius more than described semicircular tile of the lower surface of described lower mold core。
Preferably, described forming cavity includes curved portions and is positioned at two straight plate parts of both sides of width of curved portions, said two straight plate part be arranged in parallel, said two straight plate part is respectively fixedly connected with in the upper surface of described curved portions, the upper surface of said two straight plate part and described low mold frame is generally aligned in the same plane。
Preferably, said two straight plate part is respectively arranged with pattern draft。
Preferably, described forming cavity includes the first forming cavity and the second forming cavity that are connected, described second forming cavity is positioned at described second forming cavity, the axial line of described first forming cavity is paralleled with the axial line of described second forming cavity, and the axial line of described first forming cavity is lower than the axial line of described second forming cavity。
Preferably, the radius of described first forming cavity is more than the radius of described second forming cavity。
Preferably, being provided with mounting groove in described low mold frame, described lower mold core is installed in described mounting groove。
Preferably, described mounting groove is provided with multiple, corresponding, described lower mold core is provided with multiple, and multiple described lower mold core one_to_one corresponding are positioned at multiple described mounting groove。
Preferably, the angle of the central angle of the cross section of described semicircular tile is between 170 °-180 °。
Based on above-mentioned second purpose, this utility model additionally provides a kind of punch-forming mold, including described semicircular tile punch-forming mold lower mold assemblies。
The beneficial effects of the utility model are:
In sum, this utility model provides a kind of semicircular tile punch-forming mold lower mold assemblies, and this lower mold assemblies is simple and reasonable, easily manufactured, low cost of manufacture, and easy to use；When this lower mold assemblies carries out punch forming, the structural strength of lower mold core is high, it is possible to semicircular tile is made in the punching press that matches with upper mold core, and the structure of semicircular tile is attractive in appearance, meets the user demand of user；And not havinging the phenomenon of snap gauge, process safety is reliable, and the manufacture efficiency of workpiece is high, provides cost savings。Specific as follows:
The semicircular tile punch-forming mold lower mold assemblies that this utility model embodiment provides, including lower mold core and the low mold frame installing lower mold core, lower mold core is directly mounted in low mold frame, and the upper surface of lower mold core is equal with the upper surface of low mold frame, during punch forming, forming cavity is in lower mold core, and semicircular tile directly punch forming in lower mold core, during semicircular tile molding, the platform that two length sides of semicircular tile outwards do not turn down, the structure of semicircular tile is attractive in appearance, meets the user demand of user, convenient during installation。Meanwhile, lower mold core is directly installed together with low mold frame, and the structural strength of lower mold core is high, and two length sides of lower mold core can bear stamping press during punching press, safe and reliable, do not have the phenomenon of snap gauge, semicircular tile qualification rate is high, meanwhile, meet and produce in enormous quantities, reduce production cost。
The punch-forming mold that this utility model embodiment provides has all advantages of above-mentioned lower mold assemblies, meanwhile, this punch-forming mold safe to use, long service life, save manufacturing cost。
Accompanying drawing explanation
In order to be illustrated more clearly that the technical scheme of this utility model embodiment, the accompanying drawing used required in embodiment will be briefly described below, it is to be understood that, the following drawings illustrate only some embodiment of the present utility model, therefore the restriction to scope it is not construed as, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other relevant accompanying drawings according to these accompanying drawings。
The structure chart of the semicircular tile mould lower mold assemblies that Fig. 1 provides for this utility model；
The top view of the lower mold core of the semicircular tile mould lower mold assemblies that Fig. 2 provides for this utility model。
Accompanying drawing labelling collects:
Semicircular tile 100, lower mold core 200, low mold frame 300,
First forming cavity 101, the second forming cavity 102, curved portions 103, straight plate part 104, watt tongue 105, tile 106。
Detailed description of the invention
At present, on market, semicircular tile adopts dry powder punch forming to make, and during dry powder punch forming, lower mold core is separated mutually with liner plate, lower mold core is connected with low mold frame by liner plate, during punching press, the insufficient strength of two length sides of lower mold core, cause that lower mold core expands phenomenon snap gauge occur, cause that the mold use life-span is short, and the stamping quality of semicircular tile is poor, two length sides of semicircular tile easily occur can not stamping forming phenomenon, add manufacturing cost。
Given this, designer of the present utility model devises a kind of semicircular tile punch-forming mold lower mold assemblies and punch-forming mold, this lower mold assemblies simple and reasonable, is directly installed in low mold frame by lower mold core, during lower mold core work, the intensity of its length side is high, during punching press safe and reliable, it is simple to the punch forming of semicircular tile, whole mold use is safe and reliable, long service life, saves maintenance and the cost changed。
For making the purpose of this utility model embodiment, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in this utility model embodiment, technical scheme in this utility model embodiment is clearly and completely described, obviously, described embodiment is a part of embodiment of this utility model, rather than whole embodiments。Generally can with various different configurations arrange and design with the assembly of this utility model embodiment that illustrate described in accompanying drawing herein。Therefore, below the detailed description of the embodiment of the present utility model provided in the accompanying drawings is not intended to limit claimed scope of the present utility model, but is merely representative of selected embodiment of the present utility model。Based on the embodiment in this utility model, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of this utility model protection。
It should also be noted that similar label and letter below figure represent similar terms, therefore, once a certain Xiang Yi accompanying drawing is defined, then it need not be carried out definition further and explain in accompanying drawing subsequently。
In this utility model, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, for instance, it is possible to it is fixing connection, it is also possible to be removably connect, or integral；Can be mechanically connected, it is also possible to be electrical connection；Can be joined directly together, it is also possible to be indirectly connected to by intermediary, it is possible to be connection or the interaction relationship of two elements of two element internals。For the ordinary skill in the art, it is possible to understand above-mentioned term concrete meaning in this utility model as the case may be。
In this utility model, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score can include the first and second features and directly contact, it is also possible to include the first and second features and be not directly contact but by the other characterisation contact between them。And, fisrt feature second feature " on ", " top " and " above " include fisrt feature directly over second feature and oblique upper, or be merely representative of fisrt feature level height higher than second feature。Fisrt feature second feature " under ", " lower section " and " below " include fisrt feature immediately below second feature and obliquely downward, or be merely representative of fisrt feature level height less than second feature。
Semicircular tile punched core mold lower mold assemblies embodiment one
Refer to Fig. 1-2, this utility model embodiment provides a kind of semicircular tile 100 punch-forming mold lower mold assemblies, including low mold frame 300 and lower mold core 200, described semicircular tile 100 is domed, described lower mold core 200 has the forming cavity of semicircular tile 100 described in molding, described lower mold core 200 is embedded at described low mold frame 300, in the upper surface of the upper surface of described lower mold core 200 and described low mold frame 300 is generally aligned in the same plane。Lower mold core 200 has the forming cavity for molding semicircular tile 100, in punch forming process, is placed in by dry powder in the forming cavity of lower mold core 200, then, mould is controlled so that the upper mold core of mould carries out punching press action, upper mold core matches with lower mold core 200, and then punch forming obtains semicircular tile 100。Semicircular tile 100 is domed, and namely semicircular tile 100 has two relative arc surfaces, and the simple in construction of semicircular tile 100 is attractive in appearance, builds conveniently during use。In use procedure, it is simple to current flow, and are not easily accumulated in semicircular tile 100 surface, it is ensured that building antileaking。Lower mold core 200 is embedded in low mold frame 300, and lower mold core 200 is varied with the mounting structure of low mold frame 300, it is possible to adopting bolt to be spirally connected, screw connection manner is simple and reliable, easy to process, and is easy to maintenance and adjusts。
Obviously, the on-demand setting of angle of bend of semicircular tile 100, in the preferred version of this embodiment, the angle of the central angle of the cross section of described semicircular tile 100 is between 170 °-180 °。
Semicircular tile 100 is similar to the semi-cylindrical of hollow, and the structure of semicircular tile 100 is attractive in appearance, and sight is good, meets the user demand of user。Meanwhile, when punch forming, 100 two length sides of semicircular tile can punch forming, and after punch forming, it does not have the outwards platform of turnover, more attractive in appearance。Match with upper mold core for lower mold core 200 and carry out punching press action, in the upper surface of the upper surface of lower mold core 200 and low mold frame 300 is generally aligned in the same plane, namely the opening of the forming cavity of lower mold core 200 is concordant with the upper surface of described low mold frame 300, the shaping position making semicircular tile 100 is positioned at lower mold core 200, whole forming cavity is a cavity sealed, in punching course, upper mold core acts on the power on powder and passes to lower mold core 200, this power is directly passed to low mold frame 300 by lower mold core 200, the chamber of molding is not had between lower mold core 200 and low mold frame 300, powder is not easily accessible in the installation gap between lower mold core 200 and low mold frame 300, it is easy to molding。Meanwhile, the stress balance of lower mold core 200, use safety, lower mold core 200。The central angle being preferably arranged to the cross section of described semicircular tile 100 is 180 degree, and the structure of semicircular tile 100 is attractive in appearance, and sight is high。Obviously, for the error of equipment error or assembling, the central angle of the cross section of semicircular tile 100 is difficult to meet at 180 degree, therefore, the central angle of the cross section of semicircular tile 100 can be 170 degree, 175 degree angularly。
Actual add man-hour, the thickness of semicircular tile 100 and all on-demand setting of its radian, it is necessary to meet the user demand of user, simultaneously, it is necessary to meet the requirement of minimum thickness during punch forming。When actual punch forming, semicircular tile 100 adopts powder punch forming, scraping mechanism before the conveying of powder, punching press and after punch forming, the discharging of semicircular tile 100 is prior art, lower mold assemblies has only been improved by the present embodiment, in order to avoid narration repeats burden, the present embodiment is not described in detail。
In description of the present utility model, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " clockwise ", orientation or the position relationship of the instruction such as " counterclockwise " are based on orientation shown in the drawings or position relationship, it is for only for ease of description this utility model and simplifies description, rather than the equipment of instruction or hint indication or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to restriction of the present utility model。
In the preferred version of this embodiment, the upper surface along described lower mold core 200 of described forming cavity is perpendicular to the height radius more than described semicircular tile 100 of the lower surface of described lower mold core 200, during semicircular tile 100 molding, the on-demand setting of angle of the arch of semicircular tile 100, when the angle of the arch of semicircular tile 100 is bigger, the semicircular tile 100 area in lower mold core 200 increases, in order to ensure the smooth punch forming of semicircular tile 100, the semicircular tile 100 not moulding section outside the forming cavity of lower mold core 200, when lower mold core 200 is with upper mold core combined effect, semicircular tile 100 is positioned at lower mold core 200 and is shaped, after semicircular tile 100 molding, the length side of semicircular tile 100 do not have unnecessary flanging, the structure of semicircular tile 100 is attractive in appearance。
In the preferred version of this embodiment, described forming cavity includes curved portions 103 and is positioned at two straight plate parts 104 of both sides of width of curved portions 103, said two straight plate part 104 be arranged in parallel, said two straight plate part 104 is respectively fixedly connected with in the upper surface of described curved portions 103, the upper surface of said two straight plate part 104 and described low mold frame 300 is generally aligned in the same plane。Semicircular tile 100 is shaped in curved portions 103, during upper mold core punching press, the forming cavity surrounded of upper mold core and lower mold core 200 is positioned at lower mold core 200, straight plate part 104 has location and the effect of guiding, and block effect due to straight plate part 104, powder not easily spills from the gap between upper mold core and lower mold core 200, it is simple to molding。In order to increase the scope of molding, in the preferred version of this embodiment, the cross section of described curved portions 103 be shaped as semicircle, it is possible to processing central angle be the semicircular tile 100 less than or equal to 180 degree, and semicircular tile 100 adds the forming cavity in man-hour and is positioned at lower mold core 200, the convenient formation of semicircular tile 100。
In the preferred version of this embodiment, said two straight plate part 104 is respectively arranged with pattern draft, for the ease of die sinking, the medial wall of two straight plate parts 104 is processed as inclined-plane, convenient during die sinking, the phenomenon of snap gauge not easily occurs。The on-demand setting of drafting angle, it is possible to be easy to die sinking and the matched moulds of mould。
Term " first ", " second " only for descriptive purposes, and it is not intended that instruction or hint relative importance or the implicit quantity indicating indicated technical characteristic。Thus, define " first ", the feature of " second " can express or implicitly include one or more these features。In description of the present utility model, " multiple " are meant that two or more, unless otherwise expressly limited specifically。
In the preferred version of this embodiment, described forming cavity includes the first forming cavity 101 and the second forming cavity 102 being connected, described second forming cavity 102 is positioned at described second forming cavity 102, the axial line of described first forming cavity 101 is paralleled with the axial line of described second forming cavity 102, and the axial line of described first forming cavity 101 is lower than the axial line of described second forming cavity 102。The semicircular tile 100 that processing obtains has tile 106 and 105 two parts of watt tongue, and the structure of semicircular tile 100 is more attractive in appearance, has sight。
In the preferred version of this enforcement, the radius of described first forming cavity 101 is more than the radius of described second forming cavity 102, and the radius of watt tongue 105 of the semicircular tile 100 that processing obtains is less than the radius of tile 106, and the structure of whole semicircular tile 100 is more firm, and is easily installed。
In the preferred version of this embodiment, it is provided with mounting groove in described low mold frame 300, described lower mold core 200 is installed in described mounting groove, being easy to the installation of lower mold core 200, the mating shapes of the shape of mounting groove and lower mold core 200, after lower mold core 200 is installed on mounting groove, not easily slide relative to mounting groove, during punching press, lower mold core 200 is higher with the quality of fit of upper mold core, and the structure of the semicircular tile 100 obtained is more solid and reliable。
Semicircular tile 100 punch-forming mold lower mold assemblies embodiment two
Refer to Fig. 1-2, this enforcement also provides a kind of semicircular tile 100 punch-forming mold lower mold assemblies, this embodiment is the further improvement on the basis of the technical scheme of embodiment one, embodiment one disclosed technical scheme is equally applicable to the present embodiment, the technical scheme that embodiment one has been described above is not repeated to describe, specific as follows:
Described mounting groove is provided with multiple, corresponding, described lower mold core 200 is provided with multiple, multiple described lower mold core 200 one_to_one corresponding are positioned at multiple described mounting groove, can the multiple semicircular tile 100 of disposal molding, substantially increase the shaping efficiency of semicircular tile 100, save manufacturing cost。
Punch-forming mold embodiment
Present embodiments provide a kind of punch-forming mold, including described semicircular tile 100 punch-forming mold lower mold assemblies。The punch-forming mold that the present embodiment provides, it is simple and reasonable, convenient processing and manufacture, and the structure of semicircular tile 100 that processing obtains is attractive in appearance, sight is strong, in punch forming process, not easily there is the phenomenon of snap gauge in mould, punch forming is safe and reliable, it is possible to large-scale production semicircular tile 100, substantially increases production efficiency。
The foregoing is only preferred embodiment of the present utility model, be not limited to this utility model, for a person skilled in the art, this utility model can have various modifications and variations。All within spirit of the present utility model and principle, any amendment of making, equivalent replacement, improvement etc., should be included within protection domain of the present utility model。
Claims (10)
1. a semicircular tile punch-forming mold lower mold assemblies, it is characterized in that, including low mold frame and lower mold core, described semicircular tile is domed, described lower mold core has the forming cavity of semicircular tile described in molding, described lower mold core is embedded at described low mold frame, in the upper surface of the upper surface of described lower mold core and described low mold frame is generally aligned in the same plane。
2. semicircular tile punch-forming mold lower mold assemblies according to claim 1, it is characterised in that the upper surface along described lower mold core of described forming cavity is perpendicular to the height radius more than described semicircular tile of the lower surface of described lower mold core。
3. semicircular tile punch-forming mold lower mold assemblies according to claim 2, it is characterized in that, described forming cavity includes curved portions and is positioned at two straight plate parts of both sides of width of curved portions, said two straight plate part be arranged in parallel, said two straight plate part is respectively fixedly connected with in the upper surface of described curved portions, the upper surface of said two straight plate part and described low mold frame is generally aligned in the same plane。
4. semicircular tile punch-forming mold lower mold assemblies according to claim 3, it is characterised in that said two straight plate part is respectively arranged with pattern draft。
5. semicircular tile punch-forming mold lower mold assemblies according to claim 2, it is characterized in that, described forming cavity includes the first forming cavity and the second forming cavity that are connected, described second forming cavity is positioned at described second forming cavity, the axial line of described first forming cavity is paralleled with the axial line of described second forming cavity, and the axial line of described first forming cavity is lower than the axial line of described second forming cavity。
6. semicircular tile punch-forming mold lower mold assemblies according to claim 5, it is characterised in that the radius of described first forming cavity is more than the radius of described second forming cavity。
7. semicircular tile punch-forming mold lower mold assemblies according to claim 1, it is characterised in that being provided with mounting groove in described low mold frame, described lower mold core is installed in described mounting groove。
8. semicircular tile punch-forming mold lower mold assemblies according to claim 7, it is characterised in that described mounting groove is provided with multiple, corresponding, described lower mold core is provided with multiple, and multiple described lower mold core one_to_one corresponding are positioned at multiple described mounting groove。
9. the semicircular tile punch-forming mold lower mold assemblies according to any one of claim 1-8, it is characterised in that the angle of the central angle of the cross section of described semicircular tile is between 170 °-180 °。
10. a punch-forming mold, it is characterised in that include the semicircular tile punch-forming mold lower mold assemblies described in any one of claim 1-9。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620109870.7U CN205325937U (en) | 2016-02-02 | 2016-02-02 | Membrane module and stamping forming mould are down used to semicircular tile stamping forming mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620109870.7U CN205325937U (en) | 2016-02-02 | 2016-02-02 | Membrane module and stamping forming mould are down used to semicircular tile stamping forming mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205325937U true CN205325937U (en) | 2016-06-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620109870.7U Withdrawn - After Issue CN205325937U (en) | 2016-02-02 | 2016-02-02 | Membrane module and stamping forming mould are down used to semicircular tile stamping forming mould |
Country Status (1)
| Country | Link |
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| CN (1) | CN205325937U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105563622A (en) * | 2016-02-02 | 2016-05-11 | 夹江县巨浪机械有限责任公司 | Lower die assembly for cylindrical tile punch forming die and punch forming die |
-
2016
- 2016-02-02 CN CN201620109870.7U patent/CN205325937U/en not_active Withdrawn - After Issue
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105563622A (en) * | 2016-02-02 | 2016-05-11 | 夹江县巨浪机械有限责任公司 | Lower die assembly for cylindrical tile punch forming die and punch forming die |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20160622 Effective date of abandoning: 20171027 |
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| AV01 | Patent right actively abandoned |