CN205305214U - Multilayer circuit board - Google Patents
Multilayer circuit board Download PDFInfo
- Publication number
- CN205305214U CN205305214U CN201520895085.4U CN201520895085U CN205305214U CN 205305214 U CN205305214 U CN 205305214U CN 201520895085 U CN201520895085 U CN 201520895085U CN 205305214 U CN205305214 U CN 205305214U
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- China
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- block
- contiguous block
- substrate
- heat abstractor
- circuit board
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Abstract
The utility model relates to an electronic apparatus technical field, in particular to multilayer circuit board. Including the base plate and locate the heat abstractor of base plate below, the base plate including cow hide ply, thermosetting type glue film and epoxy layer, the epoxy layer is the weld layer, the cow hide ply locate on the heat abstractor, thermosetting type glue film and epoxy layer locate the cow hide ply in proper order on the other end of heat abstractor one end, heat abstractor be the radiating block, the both ends of this radiating block are equipped with the connecting block respectively and make connecting block and radiating block formation recess form, the base plate arrange in the recess, connecting block and radiating block be connected to be equipped with on the other end of one end and can dismantle the locating part of being connected with the connecting block, the locating part top of arranging the base plate both ends respectively in prevent outside the base plate roll -off recess. The utility model provides a with low costs and have heat abstractor's a low -cost circuit board.
Description
Technical field
This utility model relates to electronic apparatus technical field, particularly to a kind of multilayer circuit board.
Background technology
Wiring board is important electronic unit, is the supporter of electronic devices and components, is the supplier of electronic devices and components electrical connection. Wiring board is in energising use procedure, and electronic devices and components there will be the situation of heating, after reaching certain temperature, wiring board can be made to burn out, and therefore, existing wiring board bottom is both provided with heat abstractor, to reach the purpose of cooling.
The current this wiring board with heat abstractor is generally all be fixed on a radiating block by wiring board, but, owing to wiring board uses for a long time, components and parts on wiring board there will be phenomenon that is malfunctioning or that damage, so needing wiring board is repaired or replaced, so the mode of this fixing connection is very inconvenient when dismounting, causing the damage of wiring board, this brings certain difficulty to user in use.
And traditional wiring board is generally all include a substrate, arranges components and parts on substrate, traditional substrate is typically all epoxy resin material or ceramic substrate, and production cost is high.
Summary of the invention
For the deficiency that prior art exists, it is low and have a kind of multilayer circuit board of heat abstractor that this utility model provides cost.
For achieving the above object, this utility model provides following technical scheme: a kind of multilayer circuit board, include substrate and be located at the heat abstractor below substrate, described substrate includes layers of kraft paper, heat curing-type glue-line and epoxy resin layer, epoxy resin layer is weld layer, described layers of kraft paper is located on heat abstractor, and described heat curing-type glue-line and epoxy resin layer are sequentially arranged in layers of kraft paper on the other end of heat abstractor one end; Described heat abstractor is radiating block, being respectively arranged at two ends with contiguous block and promote contiguous block and radiating block to form groove-like of this radiating block, described substrate is placed in groove, described contiguous block is connected the other end of one end and is provided with the locating part removably connected with contiguous block with radiating block, and described locating part is respectively placed in the top at substrate two ends and prevents substrate from skidding off outside groove.
Adopt technique scheme, substrate includes layers of kraft paper, heat curing-type glue-line and epoxy resin layer, after so arranging, epoxy resin layer and layers of kraft paper are bonded together by heat curing-type glue-line, are a kind of material entirely with previous piece of wiring board, after having added layers of kraft paper, be equivalent to epoxy resin layer and have only to the material with the first half or 1/3rd, decreasing the consumption of epoxy resin layer, the cost of layers of kraft paper, well below epoxy resin or ceramic substrate, has reached cost-effective effect. and in this utility model, the two ends of radiating block are respectively provided with contiguous block, contiguous block forms groove-like with radiating block, after so arranging, substrate is actually and is in groove, then on the other end that contiguous block is connected with radiating block, it is provided with locating part, and this locating part and contiguous block removably connect, it is disposed on radiating block so being equivalent to substrate, then pass through locating part to fix, and locating part is to removably connect, so when wanting dismounting substrate, have only to take off locating part, just directly substrate can be taken out and be replaced or keep in repair, installing/dismounting is very convenient, nor meeting damaged line plate, first-selection for consumer instantly.
This utility model is further set to: described locating part includes mounting blocks and limited block, described mounting blocks fits on contiguous block and is connected by screw with contiguous block, the other end that mounting blocks is connected with contiguous block is fixing with limited block to be connected, described limited block is connected the other end of one end and can fit on the epoxy resin layer of substrate with mounting blocks, and described mounting blocks and limited block are in " Z " type.
Adopting technique scheme, mounting blocks is used for the installation with contiguous block, and limited block has been to prevent wiring board from skidding off the effect outside groove, the locating part of " Z " font is more convenient, but do not make specific demand here, as long as can prevent wiring board from skidding off outside groove, be all feasible.
This utility model is further set to: described contiguous block and the perpendicular shape of radiating block.
Adopting technique scheme, this simple in construction is convenient, and contiguous block can be made to form an intact placement space with radiating block.
This utility model is further set to: described mounting blocks is provided with projection towards the other end of contiguous block one end.
Adopting technique scheme, arrange projection here and be because wiring board when being arranged in other electrical equipment, the mounting blocks on wiring board can produce friction with other part, so being provided with projection here, reduces the friction of mounting blocks and other part.
This utility model is further set to: described projection is circular arc type.
Adopt technique scheme, the projection better effects if of circular arc type.
Below in conjunction with accompanying drawing, this utility model is further described.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of this utility model embodiment.
Detailed description of the invention
A kind of multilayer circuit board as shown in Figure 1, include substrate 1 and be located at the heat abstractor 2 below substrate 1, described substrate 1 includes layers of kraft paper 11, heat curing-type glue-line 12 and epoxy resin layer 13, epoxy resin layer 13 is weld layer, described layers of kraft paper 11 is located on heat abstractor 2, and described heat curing-type glue-line 12 and epoxy resin layer 13 are sequentially arranged in layers of kraft paper 11 on the other end of heat abstractor 2 one end, described heat abstractor 2 is radiating block 21, being respectively arranged at two ends with contiguous block 3 and promote contiguous block 3 and radiating block 21 to form groove 4 shape of this radiating block 21, described substrate 1 is placed in groove 4, described contiguous block 3 is connected the other end of one end and is provided with the locating part 5 removably connected with contiguous block 3 with radiating block 21, described locating part 5 is respectively placed in the top at substrate 1 two ends and prevents substrate 1 from skidding off outside groove 4, in such scheme, substrate 1 includes layers of kraft paper 11, heat curing-type glue-line 12 and epoxy resin layer 13, after so arranging, epoxy resin layer 13 and layers of kraft paper 11 are bonded together by heat curing-type glue-line 12, it is a kind of material entirely with previous piece of wiring board, after having added layers of kraft paper 11, be equivalent to epoxy resin layer 13 and have only to the material with the first half or 1/3rd, decrease the consumption of epoxy resin layer 13, the cost of layers of kraft paper 11 is well below epoxy resin or ceramic substrate, reach cost-effective effect.And in this utility model, the two ends of radiating block 21 are respectively provided with contiguous block 3, contiguous block 3 and radiating block 21 form groove 4 shape, after so arranging, substrate 1 is actually and is in groove 4, then on the other end that contiguous block 3 is connected with radiating block 21, it is provided with locating part 5, and this locating part 5 and contiguous block 3 removably connect, it is disposed on radiating block 21 so being equivalent to substrate 1, then pass through locating part 5 to fix, and locating part 5 is to removably connect, so when wanting dismounting substrate 1, have only to take off locating part 5, just directly substrate 1 can be taken out and be replaced or keep in repair, installing/dismounting is very convenient, nor meeting damaged line plate, first-selection for consumer instantly.
In this utility model embodiment, described locating part 5 includes mounting blocks 51 and limited block 52, described mounting blocks 51 fits on contiguous block 3 and is connected by screw with contiguous block 3, the other end that mounting blocks 51 is connected with contiguous block 3 is fixing with limited block 52 to be connected, described limited block 52 is connected the other end of one end and can fit on the epoxy resin layer 13 of substrate 1 with mounting blocks 51, described mounting blocks 51 and limited block 52 are in " Z " type, in such scheme, mounting blocks 51 is used for the installation with contiguous block 3, limited block 52 has been the effect preventing wiring board from skidding off outside groove 4, the locating part of " Z " font is more convenient, but do not make specific demand here, as long as can prevent wiring board from skidding off outside groove, it is all feasible.
In this utility model embodiment, described contiguous block 3 and the perpendicular shape of radiating block 21, in such scheme, this simple in construction is convenient, and contiguous block 3 and radiating block 21 can be made to form an intact placement space.
In this utility model embodiment, described mounting blocks 51 is provided with projection 6 towards the other end of contiguous block 3 one end, in such scheme, projection 6 is set here and is because wiring board when being arranged in other electrical equipment, mounting blocks on wiring board can produce friction with other part, so being provided with projection here, reduce the friction of mounting blocks and other part.
In this utility model embodiment, described projection 6 is circular arc type, in such scheme, and the projection better effects if of circular arc type.
The foregoing is only preferred embodiment of the present utility model; not in order to limit this utility model; all any amendment, equivalent replacement and improvement etc. made within spirit of the present utility model and principle, should be included within protection domain of the present utility model.
Claims (5)
1. a multilayer circuit board, include substrate and be located at the heat abstractor below substrate, it is characterized in that: described substrate includes layers of kraft paper, heat curing-type glue-line and epoxy resin layer, epoxy resin layer is weld layer, described layers of kraft paper is located on heat abstractor, and described heat curing-type glue-line and epoxy resin layer are sequentially arranged in layers of kraft paper on the other end of heat abstractor one end; Described heat abstractor is radiating block, being respectively arranged at two ends with contiguous block and promote contiguous block and radiating block to form groove-like of this radiating block, described substrate is placed in groove, described contiguous block is connected the other end of one end and is provided with the locating part removably connected with contiguous block with radiating block, and described locating part is respectively placed in the top at substrate two ends and prevents substrate from skidding off outside groove.
2. a kind of multilayer circuit board according to claim 1, it is characterized in that: described locating part includes mounting blocks and limited block, described mounting blocks fits on contiguous block and is connected by screw with contiguous block, the other end that mounting blocks is connected with contiguous block is fixing with limited block to be connected, described limited block is connected the other end of one end and can fit on the epoxy resin layer of substrate with mounting blocks, and described mounting blocks and limited block are in " Z " type.
3. a kind of multilayer circuit board according to claim 1 and 2, it is characterised in that: described contiguous block and the perpendicular shape of radiating block.
4. a kind of multilayer circuit board according to claim 2, it is characterised in that: described mounting blocks is provided with projection towards the other end of contiguous block one end.
5. a kind of multilayer circuit board according to claim 4, it is characterised in that: described projection is circular arc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520895085.4U CN205305214U (en) | 2015-11-05 | 2015-11-05 | Multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520895085.4U CN205305214U (en) | 2015-11-05 | 2015-11-05 | Multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205305214U true CN205305214U (en) | 2016-06-08 |
Family
ID=56438389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520895085.4U Active CN205305214U (en) | 2015-11-05 | 2015-11-05 | Multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205305214U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107364409A (en) * | 2017-08-14 | 2017-11-21 | 瑞安市纳德睿电子科技有限公司 | A kind of connection sheet of gasbag coil |
| CN112312645A (en) * | 2020-10-28 | 2021-02-02 | 江苏贺鸿智能科技有限公司 | Ceramic heat dissipation circuit board and manufacturing method thereof |
-
2015
- 2015-11-05 CN CN201520895085.4U patent/CN205305214U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107364409A (en) * | 2017-08-14 | 2017-11-21 | 瑞安市纳德睿电子科技有限公司 | A kind of connection sheet of gasbag coil |
| CN112312645A (en) * | 2020-10-28 | 2021-02-02 | 江苏贺鸿智能科技有限公司 | Ceramic heat dissipation circuit board and manufacturing method thereof |
| CN112312645B (en) * | 2020-10-28 | 2023-06-02 | 江苏贺鸿智能科技有限公司 | Ceramic heat dissipation circuit board and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 325000 No. 2788, Ouhai Avenue, Guoxi street, Ouhai District, Wenzhou City, Zhejiang Province Patentee after: Zhejiang Huabang Electronic Co., Ltd Address before: 325000 A-1 block, Central Road, three industrial park, Ouhai Economic Development Zone, Wenzhou, Zhejiang Patentee before: WENZHOU WALBOND ELECTRONIC CO., LTD. |
|
| CP03 | Change of name, title or address |