CN205302316U - Fingerprint identification module and electronic equipment - Google Patents

Fingerprint identification module and electronic equipment Download PDF

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Publication number
CN205302316U
CN205302316U CN201520938372.9U CN201520938372U CN205302316U CN 205302316 U CN205302316 U CN 205302316U CN 201520938372 U CN201520938372 U CN 201520938372U CN 205302316 U CN205302316 U CN 205302316U
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CN
China
Prior art keywords
fingerprint recognition
recognition module
utility
model
cover layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520938372.9U
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Chinese (zh)
Inventor
刘永明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ofilm Microelectronics Technology Co ltd
Nanchang OFilm Tech Co Ltd
Suzhou OFilm Tech Co Ltd
OFilm Group Co Ltd
Jiangxi OMS Microelectronics Co Ltd
Original Assignee
Nanchang OFilm Tech Co Ltd
Suzhou OFilm Tech Co Ltd
Nanchang OFilm Biometric Identification Technology Co Ltd
Shenzhen OFilm Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanchang OFilm Tech Co Ltd, Suzhou OFilm Tech Co Ltd, Nanchang OFilm Biometric Identification Technology Co Ltd, Shenzhen OFilm Tech Co Ltd filed Critical Nanchang OFilm Tech Co Ltd
Priority to CN201520938372.9U priority Critical patent/CN205302316U/en
Application granted granted Critical
Publication of CN205302316U publication Critical patent/CN205302316U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model provides a fingerprint identification module and electronic equipment, this fingerprint identification module includes: the flexble printed circuit board, the chip package structure sets up the upper surface at the flexble printed circuit board to be connected with flexble printed circuit board electricity, the frame sets up the upper surface at the flexble printed circuit board, and the outer peripheral edges of frame upper end have round angle structure, and the overburden of setting at the upper surface of chip package structure. The utility model provides a fingerprint identification module, simple structure, the price / performance ratio is higher, and the outer peripheral edges round angle structure of frame upper end can effectively prevent scratch user finger, and the fingerprint identification effect is excellent.

Description

Fingerprint recognition module and electronic equipment
Technical field
This utility model relates to fingerprint identification technology field, in particular it relates to fingerprint recognition module and electronic equipment.
Background technology
In recent years; fingerprint recognition is as popular, convenient and reliable identity identification method; oneself starts to widely use through all many-sides in social life; the electronic equipments such as mobile phone, computer, gate inhibition such as, it is widely used fingerprint recognition to carry out authentication, protects system and information security. During swiping, finger and jamb surface CONTACT WITH FRICTION typically require finger with certain dynamics and fingerprint recognition module contact due to fingerprint identification process, if the structure of fingerprint recognition module has the corner angle that some are sharp-pointed, then very easily give the bigger stress of finger, cause finger sense of discomfort, affect Consumer's Experience.
Thus, the structure of current fingerprint recognition module still haves much room for improvement.
Utility model content
This utility model is intended to the technical problem solving in correlation technique at least to a certain extent. For this, inventor furthers investigate, and the contact surface of fingerprint recognition module Yu finger is carried out round and smooth design, reduces the friction stree of finger and fingerprint recognition module contact face, alleviate finger sense of discomfort.
In one of the present utility model, this utility model provides a kind of fingerprint recognition module. According to embodiment of the present utility model, this fingerprint recognition module includes: flexible printed circuit board; Chip-packaging structure, is arranged on the upper surface of flexible printed circuit board, and electrically connects with flexible printed circuit board; Frame, is arranged on the upper surface of flexible printed circuit board, and the outer peripheral edge of frame upper end has fillet structure; And it is arranged on the cover layer of the upper surface of chip-packaging structure.
Inventor have found that, the outer peripheral edge of the frame upper end of the fingerprint recognition module according to this utility model embodiment has fillet structure, thus outer peripheral edge, frame upper end arc transition, there is no sharp-pointed corner angle, can effectively prevent user's scratch or scratching fingers, be greatly improved the security performance that fingerprint recognition module uses.
According to embodiment of the present utility model, the radius of the fillet structure of the outer peripheral edge of the frame upper end of fingerprint recognition module is 0.15mm��0.3mm.
According to embodiment of the present utility model, the pattern that cover layer is arranged is CD stricture of vagina or waffle-like pattern.
According to embodiment of the present utility model, containing fingerprint Identification sensor in chip-packaging structure.
According to embodiment of the present utility model, chip-packaging structure realizes encapsulation by spherical grid array type encapsulation technology or grid array encapsulation technology.
According to embodiment of the present utility model, frame surrounds chip-packaging structure and cover layer.
According to embodiment of the present utility model, cover layer is formed by sapphire, pottery, glass or printing-ink.
According to embodiment of the present utility model, the pattern that cover layer is arranged is by spraying or silk screen printing formation.
In another aspect of the present utility model, this utility model provides a kind of electronic equipment. According to embodiment of the present utility model, this electronic equipment includes: housing, and foregoing fingerprint recognition module, and wherein, foregoing fingerprint recognition module is arranged in housing. This electronic equipment according to this utility model embodiment, has whole feature and advantage of foregoing fingerprint recognition module, and this is no longer going to repeat them.
According to embodiment of the present utility model, electronic equipment includes mobile phone, panel computer, game machine, Fingerprint Lock or portable computer.
Accompanying drawing explanation
Fig. 1 shows the profile of the fingerprint recognition module according to this utility model embodiment;
Fig. 2 shows the profile of the fingerprint recognition module according to this utility model embodiment;
Fig. 3 shows the top view of the fingerprint recognition module according to this utility model embodiment;
Fig. 4 shows the profile of the fingerprint recognition module according to this utility model embodiment;
Fig. 5 shows the profile of the fingerprint recognition module according to this utility model embodiment;
Fig. 6 shows the profile of the fingerprint recognition module according to this utility model embodiment;
Fig. 7 shows the structural representation of the electronic equipment according to this utility model embodiment;
Fig. 8 shows the structural representation of the electronic equipment according to this utility model embodiment.
Detailed description of the invention
Embodiment of the present utility model is described below in detail. The embodiments described below is illustrative of, and is only used for explaining this utility model, and it is not intended that to restriction of the present utility model. Unreceipted concrete technology or condition in embodiment, technology or condition described by the document in this area or carry out according to product description. Agents useful for same or the unreceipted production firm person of instrument, be can pass through city available from conventional products.
In one of the present utility model, this utility model provides a kind of fingerprint recognition module 1000. According to embodiment of the present utility model, with reference to Fig. 1, this fingerprint recognition module includes: flexible printed circuit board 100; Chip-packaging structure 200, is arranged on the upper surface of flexible printed circuit board 100, and electrically connects with flexible printed circuit board 100; Frame 300, is arranged on the upper surface of flexible printed circuit board 100, and the outer peripheral edge of frame 300 upper end has fillet structure 310; And it is arranged on the cover layer 400 of the upper surface of chip-packaging structure 200. Inventor have found that, the outer peripheral edge of frame 300 upper end of the fingerprint recognition module 1000 according to this utility model embodiment has fillet structure 310, thus outer peripheral edge, frame 300 upper end arc transition, there is no sharp-pointed corner angle, can effectively prevent user's scratch or scratching fingers, be greatly improved the security performance that fingerprint recognition module 1000 uses.
According to embodiment of the present utility model, the radius of fillet structure 310 is not particularly limited, and those skilled in the art can select according to actual needs flexibly. In embodiments more of the present utility model, the radius of fillet structure 310 can be 0.15mm��0.30mm. Thus, fillet structure 310 has suitable radius, it is possible to effectively plays while preventing from scraping hands effect, also makes fingerprint recognition module appearance looks elegant.
According to embodiment of the present utility model, with reference to Fig. 2, containing fingerprint Identification sensor 500 in chip-packaging structure 200, in order to complete fingerprint recognition and signal conversion. Wherein, it will be understood by those skilled in the art that the particular type of fingerprint Identification sensor 500 is not particularly limited. Those skilled in the art according to the actual requirements and the concrete structure of flexible PCB 100, can select suitable sensor as fingerprint Identification sensor 500. Such as, according to embodiment of the present utility model, fingerprint Identification sensor 500 is preferably pressing type capacitance sensor, such that it is able to improve precision and the recognition speed of fingerprint recognition. Thus, it is possible to improve the result of use of the fingerprint recognition module according to this utility model embodiment further.
According to embodiment of the present utility model, the concrete kind of chip-packaging structure 200 is not particularly limited, and those skilled in the art can select flexibly according to practical situation. In embodiments more of the present utility model, chip-packaging structure 200 can be realize encapsulation by spherical grid array type encapsulation technology or grid array encapsulation technology. Under preferable case, chip-packaging structure 200 realizes encapsulation by grid array encapsulation technology. Thus, chip-packaging structure 200 has contact encapsulating structure, can reduce the signal noise that needle-like pin brings, and the sensor contact point of more crypto set is provided for the fingerprint recognition module according to this utility model embodiment, such that it is able to improve precision and the recognition speed of fingerprint recognition.
According to embodiment of the present utility model, the connected mode of chip-packaging structure 200 and flexible printed circuit board 100 is not particularly limited, if the connection effect that can effectively ensure that between chip-packaging structure 200 and flexible printed circuit board 100. In embodiments more of the present utility model, it is possible to by tin cream, said chip encapsulating structure 200 is fixed on the upper surface of flexible printed circuit board 100.
According to embodiment of the present utility model, with reference to Fig. 3, frame 300 is around chip-packaging structure 200 (not shown go out) and cover layer 400. Thus; frame 300 can be passed through and provide extra protection for chip-packaging structure 200 and cover layer 400; and then improve the result of use of the fingerprint recognition module according to this utility model embodiment; meanwhile, chip-packaging structure 200 outer ring increases frame 300 and modifies and make the outward appearance of fingerprint recognition module more good-looking. According to embodiment of the present utility model, with reference to Fig. 4, frame 300 while chip-packaging structure 200 and cover layer 400, can also exceed the upper surface of cover layer 400. Thus, the difference in height between frame 300 and cover layer 400 can be passed through, better finger is guided in the region of chip-packaging structure 200, make finger be accurately positioned, and then the fingerprint recognition speed of fingerprint recognition module according to this utility model embodiment can be accelerated. Under preferable case, according to another embodiment of the present utility model, with reference to Fig. 5, frame 300 can also cover a part for cover layer 400 upper surface.According to another embodiment of the present utility model, with reference to Fig. 6, frame 300 can also be higher than cover layer 400 and around chip-packaging structure 200 and cover layer 400, chamfering structure 320 in simultaneously being formed to cover layer 400. Thus; the interior chamfering structure 320 of frame 300 can be passed through; marginal portion for cover layer 400 provides Additional Protection; chamfering structure 320 arc transition outward appearance more natural beauty in simultaneously; more easily user's finger can be guided to the region that can carry out fingerprint recognition; the sense of touch making user is better, and then improves the result of use of the fingerprint recognition module according to this utility model embodiment further.
According to embodiment of the present utility model, the material of cover layer 400 is not particularly limited, and those skilled in the art can select according to actual needs flexibly. In embodiments more of the present utility model, cover layer 400 can be formed by sapphire, pottery, glass or printing-ink. Thus, cover layer 400 has higher intensity such that it is able to realize the functions such as good anti-scratch, shatter-resistant, simultaneously, Material Strength owing to forming cover layer 400 is better, and cover layer 400 can have less thickness such that it is able to ensure that fingerprint recognition signal conducts smoothly.
According to embodiment of the present utility model, in order to improve the appearance power of fingerprint recognition module 1000, the surface configuration of the cover layer 400 of the fingerprint recognition module according to this utility model embodiment has pattern, wherein, the concrete kind of pattern is not particularly limited, it is possible to select flexibly according to practical situation. In embodiments more of the present utility model, the pattern that cover layer 400 is arranged can be waffle-like pattern or CD stricture of vagina (CodeDivision, CD stricture of vagina). Wherein, waffle-like pattern can also be able to be random grid for gauge mesh lattice, and regular grid shape includes but not limited to square, rectangle, pentagon, hexagon etc., and random grid shape can be any irregular polygon. Thus, the appearance power of fingerprint recognition module 1000 according to this utility model embodiment can be improved so that it is there is appearance attractive in appearance, improve the appearance power of fingerprint recognition module, meet the demand that user is aesthetic and personalized to the outer light of product, promote the sensory experience of user.
According to embodiment of the present utility model, the pattern that cover layer 400 is arranged can pass through to spray or silk screen printing is formed. Thereby, it is possible to form various pattern conveniently and efficiently on cover layer 400, simple to operate, be easily achieved, less costly, and facilitate industrialized production.
In another aspect of the present utility model, this utility model provides a kind of electronic equipment. According to embodiment of the present utility model, with reference to Fig. 7 and Fig. 8, this electronic equipment includes: housing 2000, and foregoing fingerprint recognition module 1000, and wherein, foregoing fingerprint recognition module 1000 is arranged in housing 2000. Wherein, Fig. 7 is that fingerprint recognition module is arranged at the just basifacial structural representation of electronic equipment, Fig. 8 is the structural representation that fingerprint recognition module is arranged at middle and upper part, the electronic equipment back side, the profile of a-a line in Fig. 7 and Fig. 8, is the profile shown in Fig. 1, Fig. 2 and Fig. 4 any one of-Fig. 6. This electronic equipment according to this utility model embodiment, has whole feature and advantage of foregoing fingerprint recognition module, and this is no longer going to repeat them.
According to embodiment of the present utility model, the concrete kind of electronic equipment is not particularly limited. In embodiments more of the present utility model, include but not limited to mobile phone, panel computer, game machine, Fingerprint Lock or portable computer according to the electronic equipment of this utility model embodiment. As long as it will be understood by those skilled in the art that the electronic equipment adopting the foregoing fingerprint recognition module 1000 of this utility model is all within the protection domain of the application.
In the description of this specification, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means in conjunction with this embodiment or example describe are contained at least one embodiment of the present utility model or example. In this manual, the schematic representation of above-mentioned term is necessarily directed to identical embodiment or example. And, the specific features of description, structure, material or feature can combine in one or more embodiments in office or example in an appropriate manner. Additionally, when not conflicting, the feature of the different embodiments described in this specification or example and different embodiment or example can be carried out combining and combining by those skilled in the art.
Although above it has been shown and described that embodiment of the present utility model, it is understandable that, above-described embodiment is illustrative of, it is not intended that to restriction of the present utility model, above-described embodiment can be changed in scope of the present utility model, revises, replace and modification by those of ordinary skill in the art.

Claims (10)

1. a fingerprint recognition module, it is characterised in that including:
Flexible printed circuit board;
Chip-packaging structure, is arranged on the upper surface of described flexible printed circuit board, and electrically connects with described flexible printed circuit board;
Frame, is arranged on the upper surface of described flexible printed circuit board, and the outer peripheral edge of described frame upper end has fillet structure; And
Cover layer, is arranged on the upper surface of described chip-packaging structure.
2. fingerprint recognition module according to claim 1, it is characterised in that the radius of described fillet structure is 0.15mm��0.3mm.
3. fingerprint recognition module according to claim 1, it is characterised in that containing fingerprint Identification sensor in described chip-packaging structure.
4. fingerprint recognition module according to claim 1, it is characterised in that described chip-packaging structure realizes encapsulation by spherical grid array type encapsulation technology or grid array encapsulation technology.
5. fingerprint recognition module according to claim 1, it is characterised in that described frame surrounds described chip-packaging structure and described cover layer.
6. fingerprint recognition module according to claim 1, it is characterised in that described cover layer is formed by sapphire, pottery, glass or printing-ink.
7. fingerprint recognition module according to claim 1, it is characterised in that be provided with pattern on described cover layer, described pattern is CD stricture of vagina or waffle-like pattern.
8. fingerprint recognition module according to claim 7, it is characterised in that the pattern arranged on described cover layer is by spraying or silk screen printing formation.
9. an electronic equipment, it is characterised in that including:
Housing; And
Fingerprint recognition module described in any one of claim 1��8, described fingerprint recognition module is arranged in described housing.
10. electronic equipment according to claim 9, it is characterised in that described electronic equipment includes mobile phone, panel computer, game machine, Fingerprint Lock or portable computer.
CN201520938372.9U 2015-11-23 2015-11-23 Fingerprint identification module and electronic equipment Expired - Fee Related CN205302316U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520938372.9U CN205302316U (en) 2015-11-23 2015-11-23 Fingerprint identification module and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520938372.9U CN205302316U (en) 2015-11-23 2015-11-23 Fingerprint identification module and electronic equipment

Publications (1)

Publication Number Publication Date
CN205302316U true CN205302316U (en) 2016-06-08

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520938372.9U Expired - Fee Related CN205302316U (en) 2015-11-23 2015-11-23 Fingerprint identification module and electronic equipment

Country Status (1)

Country Link
CN (1) CN205302316U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106384104A (en) * 2016-10-21 2017-02-08 南昌欧菲生物识别技术有限公司 Fingerprint identification module and electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106384104A (en) * 2016-10-21 2017-02-08 南昌欧菲生物识别技术有限公司 Fingerprint identification module and electronic device

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: 330013 no.1189 Jingdong Avenue, high tech Zone, Nanchang City, Jiangxi Province

Patentee after: OFilm Microelectronics Technology Co.,Ltd.

Patentee after: Nanchang OFilm Tech. Co.,Ltd.

Patentee after: OFilm Tech Co.,Ltd.

Patentee after: SUZHOU OFILM TECH Co.,Ltd.

Address before: 330013 no.1189 Jingdong Avenue, high tech Zone, Nanchang City, Jiangxi Province

Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd.

Patentee before: Nanchang OFilm Tech. Co.,Ltd.

Patentee before: Shenzhen OFilm Tech Co.,Ltd.

Patentee before: SUZHOU OFILM TECH Co.,Ltd.

CP01 Change in the name or title of a patent holder
CP03 Change of name, title or address

Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province

Patentee after: Jiangxi OMS Microelectronics Co.,Ltd.

Patentee after: Nanchang OFilm Tech. Co.,Ltd.

Patentee after: Ophiguang Group Co.,Ltd.

Patentee after: SUZHOU OFILM TECH Co.,Ltd.

Address before: 330013 no.1189 Jingdong Avenue, high tech Zone, Nanchang City, Jiangxi Province

Patentee before: OFilm Microelectronics Technology Co.,Ltd.

Patentee before: Nanchang OFilm Tech. Co.,Ltd.

Patentee before: OFilm Tech Co.,Ltd.

Patentee before: SUZHOU OFILM TECH Co.,Ltd.

CP03 Change of name, title or address
TR01 Transfer of patent right

Effective date of registration: 20210611

Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province

Patentee after: Jiangxi OMS Microelectronics Co.,Ltd.

Address before: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province

Patentee before: Jiangxi OMS Microelectronics Co.,Ltd.

Patentee before: Nanchang OFilm Tech. Co.,Ltd.

Patentee before: Ophiguang Group Co.,Ltd.

Patentee before: SUZHOU OFILM TECH Co.,Ltd.

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160608

Termination date: 20211123

CF01 Termination of patent right due to non-payment of annual fee