CN205282462U - Quad flat no -load (QFN) packaging structure - Google Patents
Quad flat no -load (QFN) packaging structure Download PDFInfo
- Publication number
- CN205282462U CN205282462U CN201521134763.1U CN201521134763U CN205282462U CN 205282462 U CN205282462 U CN 205282462U CN 201521134763 U CN201521134763 U CN 201521134763U CN 205282462 U CN205282462 U CN 205282462U
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- CN
- China
- Prior art keywords
- qfn
- base material
- substrate
- chip
- utility
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model relates to a quad flat no -load (QFN) packaging structure, include the substrate that becomes by silvery, the thickness of substrate is 40 -60um, be fixed with the chip through the bond line on the substrate, the chip through the lead wire with the substrate links to each other, be provided with the cover on the substrate the substrate the plastic -sealed body of chip and lead wire, quad flat no -load (QFN) packaging structure's encapsulation thickness is 0.25 -0.75mm. The utility model discloses a silver does not have the crosstalk (XTALK) and the transmission of multiple metal as the substrate, has guaranteed the electrical property and the thermal behavior of QFN product to the thickness of substrate is 40 -60um, can realize the miniaturization of QFN product.
Description
Technical field
The utility model relates to unicircuit encapsulation technology, and specifically a kind of QFN encapsulates structure.
Background technology
QFN (QuadFlatNo-leadPackage, quad flat non-pin package) is one of surface attaching type encapsulation. QFN is a kind of without pin package, and in square or rectangle, package bottom central authorities position has a big area exposed pads to be used for heat conduction, and the encapsulation periphery around large bonding pad has the conduction pad realizing electrically link.
Traditional QFN encapsulates structure as shown in Figure 1, and it is a kind of encapsulation structure mode based on copper material, and product base material is generally be made up of copper material 12 and coating 11 two portions, and the profile of base material forms in muscle, prop carrier and welding zone by connecting. Copper material 12 is generally the alloys such as A194, C7025, and on copper material 12 electroplating surface, metal plating 11 is to realize welding function, and coating 11 generally adopts tin or nickel palladium gold.
There is following shortcoming in the QFN of this kind of traditional type: (1) connects muscle owing to base material exists, and the signal between pin can be interfered when transmission; (2) base material thickness is at least 0.1mm, cannot realize the thinner less QFN product of below 0.35mm thickness; (3) due to the restriction of complete processing (corrosion) and structure, analogous products can only realize the encapsulation of 2 row's pins, and package dimension size also can be restricted; (4) coating structure of existing QFN product determines processing link must plating link, and plating generally can produce a large amount of waste water and dregs, causes environmental pressure.
Summary of the invention
The utility model encapsulates structure Problems existing for above-mentioned traditional Q FN, it is provided that a kind of novel QFN encapsulates structure, and this structure can ensure the electrical property of QFN product, and realizes the miniaturization of QFN product.
According to the technical solution of the utility model: a kind of QFN encapsulates structure, comprise the base material being made from silver, the thickness of described base material is 40-60um, described base material is fixed with chip by bonding coat, described chip is connected with described base material by lead-in wire, and described base material is provided with the plastic packaging body covering described base material, described chip and lead-in wire.
It is 0.25-0.75mm that described QFN encapsulates the package thickness of structure.
The center arrangement of described base material has prop carrier, and the surrounding of described prop carrier is furnished with multiple welding zone, and the spacing between described welding zone is more than or equal to 0.3mm.
Technique effect of the present utility model is: the utility model adopts silver as base material, it does not have the interactive interference of various metals and transmission, ensure that the electrical property of QFN product and thermal characteristics, and the thickness of base material is 40-60um, it may be achieved the miniaturization of QFN product.
Accompanying drawing explanation
The QFN that Fig. 1 is traditional encapsulates the sectional view of structure.
Fig. 2 is section of structure of the present utility model.
Fig. 3 is the upward view of Fig. 2.
In Fig. 1��Fig. 3, Reference numeral refers to that the technology in generation is characterized as respectively: base material 1, bonding coat 2, chip 3, lead-in wire 4, plastic packaging body 5, prop carrier 6, welding zone 7, coating 11, copper material 12.
Embodiment
For enabling above-mentioned purpose of the present utility model, feature and advantage more become apparent, below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
As shown in Figure 2, the utility model is that a kind of QFN encapsulates structure, comprise the base material 1 being made from silver, the thickness of base material 1 is 40-60um, base material 1 is fixed with chip 3 by bonding coat 2, chip 3 is connected with base material 1 by lead-in wire 4, and base material 1 is provided with the plastic packaging body 5 of covering substrates 1, chip 3 and lead-in wire 4.
It is 0.25-0.75mm that QFN encapsulates the package thickness of structure.
As shown in Figure 3, it is a kind of embodiment of base material 1. The center arrangement of base material 1 has prop carrier 6, and the surrounding of prop carrier 6 is furnished with multiple welding zone 7, and welding zone 7 arranges regularly, and the spacing between welding zone 7 is more than or equal to 0.3mm.
The utility model uses argent as base material, it does not have the interactive interference of various metals and transmission, can ensure electrical property and the thermal characteristics of QFN product, and money base material can also ensure that product encapsulates good workability simultaneously; Money base material does not need plating, cost-saved, decreasing pollution. In addition, the utility model can realize arranging the pin of any row, and the shape of pin can also be ever-changing.
Above the utility model has been carried out the enough detailed description with certain singularity. Those of ordinary skill in art is it is to be understood that the description in embodiment is only exemplary, and making under the prerequisite not deviateing true spirit of the present utility model and scope is changed all should belong to protection domain of the present utility model. The claimed scope of the utility model is undertaken limiting by described claim book, instead of limit by the foregoing description in embodiment.
Claims (3)
1. a QFN encapsulates structure, it is characterized in that: comprise the base material (1) being made from silver, the thickness of described base material (1) is 40-60um, described base material (1) is fixed with chip (3) by bonding coat (2), described chip (3) is connected with described base material (1) by lead-in wire (4), and described base material (1) is provided with the plastic packaging body (5) covering described base material (1), described chip (3) and lead-in wire (4).
2. encapsulate structure according to QFN according to claim 1, it is characterized in that: it is 0.25-0.75mm that described QFN encapsulates the package thickness of structure.
3. encapsulate structure according to the QFN described in claim 1 or 2, it is characterized in that: the center arrangement of described base material (1) has prop carrier (6), the surrounding of described prop carrier (6) is furnished with multiple welding zone (7), and the spacing between described welding zone (7) is more than or equal to 0.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521134763.1U CN205282462U (en) | 2015-12-31 | 2015-12-31 | Quad flat no -load (QFN) packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521134763.1U CN205282462U (en) | 2015-12-31 | 2015-12-31 | Quad flat no -load (QFN) packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205282462U true CN205282462U (en) | 2016-06-01 |
Family
ID=56067007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521134763.1U Active CN205282462U (en) | 2015-12-31 | 2015-12-31 | Quad flat no -load (QFN) packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205282462U (en) |
-
2015
- 2015-12-31 CN CN201521134763.1U patent/CN205282462U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |