CN205272779U - Waterproof board on circuit edition of books body - Google Patents
Waterproof board on circuit edition of books body Download PDFInfo
- Publication number
- CN205272779U CN205272779U CN201521086947.5U CN201521086947U CN205272779U CN 205272779 U CN205272779 U CN 205272779U CN 201521086947 U CN201521086947 U CN 201521086947U CN 205272779 U CN205272779 U CN 205272779U
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- plate body
- edition
- groove structure
- high temperature
- books body
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Abstract
The utility model discloses a waterproof board on circuit edition of books body, package rubbing board body and setting are at the high temperature resistant polyester film of edition of books body one side, high temperature resistant polyester film keep away from an edition of books body side end face on be provided with the net face, the edition of books body for the graphite cake, the edition of books body for 2 layers of stromatolite setting, 2 layers the edition of books body between be provided with the heater strip the edition of books body keep away from a high temperature resistant polyester film side end face on be provided with the groove structure who arranges at the interval, adjacent groove structure communicate each other edition of books body surface covering have ethylene - vinyl acetate membrane. The utility model discloses an adopting graphite cake and heater strip matched with mode, can improving water removal efficiency, through heating methods, groove structure is adopted simultaneously in evaporation of water with higher speed, plays the water guide effect, makes things convenient for ponding to discharge.
Description
Technical field
This utility model relates to the splash guard in a kind of circuit board body.
Background technology
When there is hydrops in circuit board surface, it is easy to make circuit board that corrosion to occur, even there will be short circuit, affect it properly functioning. The existing mode that circuit is anhydrated, mainly adopts the mode of pad pasting, and when circuit board surface exists hydrops, pad pasting does not have the effect removing hydrops.
Utility model content
The purpose of this utility model is in that to provide the splash guard in a kind of circuit board body, prior art Problems existing can be improved, by the mode adopting graphite cake and heater strip to match, water removal efficiency can be improved, by mode of heating, accelerate moisture evaporation, adopt groove structure simultaneously, play water guide effect, facilitate hydrops to discharge.
This utility model is achieved through the following technical solutions:
A kind of splash guard in circuit board body, including plate body and the high temperature resistance polyester thin film being arranged on plate body side, described high temperature resistance polyester thin film is provided with grid surface away from described plate body one side end face, described plate body is graphite cake, described plate body is 2 layers that lamination is arranged, it is provided with heater strip between plate body 2 layers described, it is provided with, away from described high temperature resistance polyester film side end face, the groove structure being intervally arranged at described plate body, adjacent described groove structure is interconnected, it is coated with ethylene-vinyl acetate film at described plate body surface.
Further, for realizing this utility model better, described groove structure is be obliquely installed along described plate body surface.
Further, for realizing this utility model better, the incline direction of adjacent described groove structure is identical, and adjacent described groove structure is parallel to each other.
Further, for realizing this utility model better, being respectively arranged with, on plate body 2 layers described end face in opposite directions, the fixing groove that position is corresponding, described heater strip is positioned at described fixing groove.
Further, for realizing this utility model better, plate body 2 layers described end face in opposite directions is bondd mutually by high temperature resistant binder.
This utility model compared with prior art, has the advantages that
(1) this utility model arranges heater strip by adopting between plate body, plate body surface can be heated, it is thus possible to remove plate body surface moisture, when there is hydrops in plate body surface, the effect anhydrated can be played, by arranging ethylene-vinyl acetate film, the insulating properties of plate body can be improved, utilize high temperature resistant, the corrosion resistance of ethylene-vinyl acetate, the effect that plate body is insulated can be played, be favorably improved integrally-built insulative water-proof effect;
(2) this utility model is by adopting graphite cake manufactured Board body, it is possible to playing heat-conducting effect so that when heater strip is heated, heat can better be delivered to surface, is favorably improved the efficiency anhydrated, and reduces the loss of the electric energy of heater strip;
(3) this utility model is by adopting high temperature resistance polyester film side end face to arrange grid surface, it is possible to when making that this utility model is bonded in PCB surface, more firm with PCB surface bonding, it is not easy to damage;
(4) this utility model arranges groove structure by adopting at plate body surface, it is possible to facilitating moisture to discharge along groove structure, is favorably improved water removal efficiency, simultaneously when there is hydrops, facilitating hydrops to discharge, improves waterproof effect.
Accompanying drawing explanation
In order to be illustrated more clearly that the technical scheme of this utility model embodiment, the accompanying drawing used required in embodiment will be briefly described below, it is to be understood that, the following drawings illustrate only some embodiment of the present utility model, therefore the restriction to scope it is not construed as, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other relevant accompanying drawings according to these accompanying drawings.
Fig. 1 is this utility model overall structure schematic diagram.
Wherein: 101. plate bodies, 102. high temperature resistance polyester thin film, 103. grid surfaces, 104. heater strips, 105. groove structures, 106. fixing grooves, 107. ethylene-vinyl acetate films.
Detailed description of the invention
Below in conjunction with specific embodiment, this utility model is described in further detail, but embodiment of the present utility model is not limited to this.
Embodiment 1:
As shown in Figure 1, a kind of splash guard in circuit board body, including plate body 101 and the high temperature resistance polyester thin film 102 being arranged on plate body 101 side, described high temperature resistance polyester thin film 102 is provided with grid surface 103 away from described plate body 101 1 side end face, described plate body 101 is graphite cake, arrange for lamination 2 layers of described plate body 101, it is provided with heater strip 104 between plate body 101 2 layers described, it is provided with, away from described high temperature resistance polyester thin film 102 1 side end face, the groove structure 105 being intervally arranged at described plate body 101, adjacent described groove structure 105 is interconnected, it is coated with ethylene-vinyl acetate film 107 on described plate body 101 surface.
This utility model arranges heater strip by adopting between plate body, plate body surface can be heated, it is thus possible to remove plate body surface moisture, when there is hydrops in plate body surface, the effect anhydrated can be played, by arranging ethylene-vinyl acetate film, make its fully wrapped around plate body superficies, the insulating properties of plate body can be improved, utilize high temperature resistant, the corrosion resistance of ethylene-vinyl acetate, the effect that plate body is insulated can be played, be favorably improved integrally-built insulative water-proof effect; This utility model is by adopting graphite cake manufactured Board body, it is possible to playing heat-conducting effect so that when heater strip is heated, heat can better be delivered to surface, is favorably improved the efficiency anhydrated, and reduces the loss of the electric energy of heater strip; This utility model arranges grid surface by adopting high temperature resistance polyester film side end face, it is possible to when making that this utility model is bonded in PCB surface, more firm with PCB surface bonding, it is not easy to damage; This utility model arranges groove structure by adopting at plate body surface, it is possible to facilitating moisture to discharge along groove structure, is favorably improved water removal efficiency, simultaneously when there is hydrops, facilitating hydrops to discharge, improves waterproof effect.
Embodiment 2:
The present embodiment is on the basis of embodiment 1, in order to improve drainage efficiency, in the present embodiment, it is preferable that described groove structure 105 is be obliquely installed along described plate body 101 surface. By arranging incline structure, it is possible to facilitate hydrops to discharge along groove structure.
In order to enable hydrops to discharge along fixation locus, in the present embodiment, it is preferable that the incline direction of adjacent described groove structure 105 is identical, adjacent described groove structure 105 is parallel to each other.
In order to facilitate the fixing of heater strip, in the present embodiment, it is preferable that being respectively arranged with, on plate body 101 2 layers described end face in opposite directions, the fixing groove 106 that position is corresponding, described heater strip 104 is positioned at described fixing groove 106. By heater strip is arranged in fixing groove, it is possible to make heater strip be positioned at fixed space, meanwhile, convenient by bonded to each other for 2 laminate bodies end face in opposite directions, make overall structure compacter.
In order to avoid 2 laminate bodies are mutually disengaged, in the present embodiment, it is preferable that plate body 101 2 layers described end face in opposite directions is bondd mutually by high temperature resistant binder.
The foregoing is only preferred embodiment of the present utility model, be not limited to this utility model, for a person skilled in the art, this utility model can have various modifications and variations. All within spirit of the present utility model and principle, any amendment of making, equivalent replacement, improvement etc., should be included within protection domain of the present utility model.
Claims (5)
1. the splash guard in a circuit board body, it is characterized in that: include plate body (101) and be arranged on the high temperature resistance polyester thin film (102) of plate body (101) side, described high temperature resistance polyester thin film (102) is provided with grid surface (103) away from described plate body (101) side end face, described plate body (101) is graphite cake, arrange for lamination 2 layers of described plate body (101), it is provided with heater strip (104) between plate body (101) 2 layers described, it is provided with, away from described high temperature resistance polyester thin film (102) side end face, the groove structure (105) being intervally arranged at described plate body (101), adjacent described groove structure (105) is interconnected, it is coated with ethylene-vinyl acetate film (107) on described plate body (101) surface.
2. the splash guard in a kind of circuit board body according to claim 1, it is characterised in that: described groove structure (105) is for be obliquely installed along described plate body (101) surface.
3. the splash guard in a kind of circuit board body according to claim 2, it is characterised in that: the incline direction of adjacent described groove structure (105) is identical, and adjacent described groove structure (105) is parallel to each other.
4. the splash guard in a kind of circuit board body according to claim 1, it is characterized in that: being respectively arranged with, on plate body (101) 2 layers described end face in opposite directions, the fixing groove (106) that position is corresponding, described heater strip (104) is positioned at described fixing groove (106).
5. the splash guard in a kind of circuit board body according to claim 4, it is characterised in that: plate body (101) 2 layers described end face in opposite directions is bondd mutually by high temperature resistant binder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521086947.5U CN205272779U (en) | 2015-12-22 | 2015-12-22 | Waterproof board on circuit edition of books body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521086947.5U CN205272779U (en) | 2015-12-22 | 2015-12-22 | Waterproof board on circuit edition of books body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205272779U true CN205272779U (en) | 2016-06-01 |
Family
ID=56057389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521086947.5U Active CN205272779U (en) | 2015-12-22 | 2015-12-22 | Waterproof board on circuit edition of books body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205272779U (en) |
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2015
- 2015-12-22 CN CN201521086947.5U patent/CN205272779U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Waterproof board on circuit edition of books body Effective date of registration: 20180905 Granted publication date: 20160601 Pledgee: Zhejiang Tonglu Hengfeng village bank Limited by Share Ltd Pledgor: HANGZHOU TIANFENG ELECTRONICS CO., LTD. Registration number: 2018330000260 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20210122 Granted publication date: 20160601 Pledgee: Zhejiang Tonglu Hengfeng village bank Limited by Share Ltd. Pledgor: HANGZHOU TIANFENG ELECTRONICS Co.,Ltd. Registration number: 2018330000260 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |