CN205249523U - Metal substrate module and have LED lamps and lanterns of this metal substrate module - Google Patents
Metal substrate module and have LED lamps and lanterns of this metal substrate module Download PDFInfo
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- CN205249523U CN205249523U CN201520951132.2U CN201520951132U CN205249523U CN 205249523 U CN205249523 U CN 205249523U CN 201520951132 U CN201520951132 U CN 201520951132U CN 205249523 U CN205249523 U CN 205249523U
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- metal substrate
- substrate module
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Abstract
The utility model provides a metal substrate module, metal substrate and controlling means including electricity connection mutually, be formed with parasitic capacitance in the metal substrate, parasitic capacitance with controlling means connects, the metal substrate module still includes at least one conductor, each the one end of conductor with metal substrate connection, the other end with controlling means's earthing terminal is connected, makes the conductor with parasitic capacitance is parallelly connected. The utility model also provides a LED lamps and lanterns that have this metal substrate module. Test value after adopting above -mentioned technical scheme, in the time of can effectively reducing the metal substrate and carry out the EMC test.
Description
Technical field
The utility model relates to LED accessory field, relates in particular to a kind of metal substrate module and has the LED light fixture of this metal substrate module.
Background technology
In order to comply with the trend of LED illuminating product miniaturization, increasing LED product adopts whole all components and parts pasters to the structure on metal substrate, to realize higher integrated level, reduces product size, and has solved the heat dissipation problem of electronic device simultaneously. But for this kind of product, its electromagnetic compatibility characteristic (EMC) can non-constant. Particularly, metal substrate is formed by Copper Foil routing layer, insulating barrier, metal substrate layer pressing successively, but have parasitic capacitance between the metal of metal substrate layer and Copper Foil routing layer and electrical network, although the capacity of these electric capacity is small, but for high-frequency signal as short circuit, so in the time carrying out EMC test to LED product, the non-constant of EMC characteristic of LED product expression.
Therefore, need a kind of novel metal substrate structure, there is the LED product of this metal substrate in the time carrying out ECM test, can show well, weaken the harassing and wrecking of the high-frequency signal itself being subject to.
Utility model content
In order to overcome above-mentioned technological deficiency, the purpose of this utility model is to provide a kind of metal substrate, can have good EMC characteristic.
The utility model discloses a kind of metal substrate module, comprise metal substrate and the control device of mutual electrical connection, in described metal substrate, be formed with parasitic capacitance, described parasitic capacitance is connected with described control device, described metal substrate module also comprises at least one conductor, described in each, one end of conductor is connected with described metal substrate, and the other end is connected with the earth terminal of described control device, makes described conductor in parallel with described parasitic capacitance.
Preferably, described control device comprises: EMC filter unit and rectification unit; Described EMC filter unit is connected in the output of described rectification unit, and is connected with described metal substrate; Described EMC filter unit can an external high-frequency signal emission source; Described rectification unit is connected with described earth terminal, and can an external EMC test lead; Described EMC filter unit is connected between described rectification unit and described high-frequency signal emission source.
Preferably, described EMC filter unit comprises the first electric capacity, the second electric capacity and the first inductance; Described the first electric capacity is in parallel with described rectification unit; Described the second electric capacity is in parallel with described high-frequency signal emission source; Described the first inductance is connected between described the first electric capacity and the second electric capacity.
Preferably, described rectification unit comprises full bridge rectifier; The output of described full bridge rectifier is connected with described EMC test lead; The input of described full bridge rectifier is connected with described EMC filter unit.
Preferably, described EMC test lead comprises live wire and zero line, is connected respectively with described metal substrate.
Preferably, described metal substrate comprises: metal substrate layer, Copper Foil routing layer and be located at described metal substrate layer and Copper Foil routing layer between insulating barrier; Described parasitic capacitance is formed between described metal substrate layer and described Copper Foil routing layer.
Preferably, described conductor is wire or metal base.
The invention also discloses a kind of LED light fixture, comprise electronic device and said metal substrates module, described electric device is arranged on described metal substrate.
Preferably, described electronic device comprises LED light source and drives module.
Adopt after technique scheme, compared with prior art, there is following beneficial effect:
1. can solve the poor problem of LED EMC.
Brief description of the drawings
Fig. 1 is the electrical connection schematic diagram that meets the metal substrate of the utility model one preferred embodiment.
Reference numeral:
1-metal substrate layer, 2-parasitic capacitance, 3-high-frequency signal emission source, 4-EMC filter unit, 5-conductor, 6-rectification unit.
Detailed description of the invention
Further set forth advantage of the present utility model below in conjunction with accompanying drawing and specific embodiment.
Consult Fig. 1, metal substrate module of the present utility model comprises metal substrate and control device, metal substrate is made up of metal substrate layer 1, Copper Foil routing layer and insulating barrier conventionally, insulating barrier is folded between metal substrate layer 1 and Copper Foil routing layer, thereby has caused parasitic capacitance 2 to be formed between metal substrate layer 1 and Copper Foil routing layer. Control device is connected with metal substrate, for improving the Electro Magnetic Compatibility of the lighting with this metal substrate. Particularly, in control device, comprise an EMC filter unit 4 and rectification unit 6, EMC filter unit 4 is connected to the output of rectification unit 6, and is connected with metal substrate layer 1, while test for make EMC at metal substrate, to signal filtering processing, rectification unit 6 is connected with the earth terminal of control device. For metal substrate being done to EMC test, EMC filter unit 4 is circumscribed with a high-frequency signal emission source 3, and the external EMC test lead of rectification unit 6, wherein high-frequency signal emission source 3 is generally DC-DC converter, the actual emission source for high frequency harassing and wrecking of this DC-DC converter, send the EMC characteristic of high-frequency signal with test metal substrate to metal substrate, and EMC filter unit 4 is in parallel with high-frequency signal emission source 3, the high-frequency signal that high-frequency signal emission source 3 is sent carries out EMC filtering.
But just because of the existence of parasitic capacitance 2, control device is isolated in the time of test, parasitic capacitance 2 is directly connected with EMC test lead, therefore, in order to overcome this problem, metal substrate also comprises at least one conductor 5, one end of conductor 5 is connected with metal substrate, link position can be any position on the metal covering of metal substrate, the other end of conductor 5 is connected with the earth terminal of control device, make metal substrate pass through this conductor 5 and be connected with the earth terminal of control device, thereby metal substrate layer 1 is in 0 potential state. In the time that metal substrate receives a high-frequency signal, because metal substrate layer 1 is in 0 potential state, even if high-frequency signal enters into metal substrate by parasitic capacitance 2, then must get back to the earth terminal of control device, in this process, cannot walk around undoubtedly EMC filter unit 4, thereby high-frequency signal passes through 4 filtering of EMC filter unit, the impact on high-frequency signal in the EMC test of the LED light fixture of further having decayed.
Further, the EMC test lead that control device comprises is in parallel with metal substrate layer 1, for testing the Electro Magnetic Compatibility EMC of metal substrate. The whole area of considering metal substrate layer 1 covers by metal, between EMC test lead or EMC filter unit 4 and metal substrate layer 1, is all likely connected with interlayer parasitic capacitance 2. Therefore, conductor 5 can be set to multiple (in embodiment illustrated in fig. 1, being 1), no matter where parasitic capacitance 2 appears at, and conductor 5 all can be recycled to the high-frequency signal that flows through this parasitic capacitance 2 earth terminal of EMC filter unit 4, remains 0 current potential of metal substrate layer 1.
In one preferred embodiment, EMC filter unit 4 comprises: the first electric capacity, the second electric capacity and the first inductance, wherein, the first electric capacity is in parallel with rectification unit 6, the second electric capacity is in parallel with high-frequency signal emission source 3, and the first inductance is connected between the first electric capacity and the second electric capacity, forms a pi type filter, its input and output are all Low ESR, and insertion loss characteristic is also better.
And rectification unit 6 can adopt the configuration of full bridge rectifier, its input is connected with EMC test lead, and output is connected with EMC filter unit 4, after EMC filter unit 4 is processed high-frequency signal filtering, further to its rectification, to reduce the noise signal in circuit.
EMC test lead often adopts the configuration of live wire and zero line, is connected respectively, and is connected with the output of rectification unit 6 with metal substrate, and high-frequency signal exports EMC test lead to and carries out EMC test after over commutation.
Choosing of conductor 5 can adopt common wire or metal metal base, ensures that metal substrate layer 1 and the electric connection of EMC filter unit 4 continue uninterrupted.
Have after the metal substrate module in above-mentioned arbitrary embodiment, electronic device in LED light fixture is as LED light source and drive module etc. to adopt to be arranged on metal substrate as the mode of paster, the EMC of the LED light fixture obtaining is strong, significantly reduced by high-frequency signal interference effect.
Should be noted that, embodiment of the present utility model has preferably implementation, and not the utility model is done to any type of restriction, any person skilled in art of being familiar with may utilize the technology contents of above-mentioned announcement to change or be modified to the effective embodiment being equal to, in every case do not depart from the content of technical solutions of the utility model, any amendment or equivalent variations and the modification above embodiment done according to technical spirit of the present utility model, all still belong in the scope of technical solutions of the utility model.
Claims (9)
1. a metal substrate module, comprise metal substrate and the control device of mutual electrical connection, in described metal substrate, be formed with parasitic capacitance, described parasitic capacitance is connected with described control device, it is characterized in that, described metal substrate module also comprises at least one conductor, and described in each, one end of conductor is connected with described metal substrate, the other end is connected with the earth terminal of described control device, makes described conductor in parallel with described parasitic capacitance.
2. metal substrate module as claimed in claim 1, is characterized in that,
Described control device comprises:
EMC filter unit and rectification unit;
Described EMC filter unit is connected in the output of described rectification unit, and is connected with described metal substrate;
Described EMC filter unit can an external high-frequency signal emission source;
Described rectification unit is connected with described earth terminal, and can an external EMC test lead;
Described EMC filter unit is connected between described rectification unit and described high-frequency signal emission source.
3. metal substrate module as claimed in claim 2, is characterized in that,
Described EMC filter unit comprises the first electric capacity, the second electric capacity and the first inductance;
Described the first electric capacity is in parallel with described rectification unit;
Described the second electric capacity is in parallel with described high-frequency signal emission source;
Described the first inductance is connected between described the first electric capacity and the second electric capacity.
4. metal substrate module as claimed in claim 2, is characterized in that,
Described rectification unit comprises full bridge rectifier;
The output of described full bridge rectifier is connected with described EMC test lead;
The input of described full bridge rectifier is connected with described EMC filter unit.
5. metal substrate module as claimed in claim 2, is characterized in that,
Described EMC test lead comprises live wire and zero line, is connected respectively with described metal substrate.
6. metal substrate module as claimed in claim 1, is characterized in that,
Described metal substrate comprises:
Metal substrate layer, Copper Foil routing layer and be located at described metal substrate layer and Copper Foil routing layer between insulating barrier;
Described parasitic capacitance is formed between described metal substrate layer and described Copper Foil routing layer.
7. metal substrate module as claimed in claim 1, is characterized in that,
Described conductor is wire or metal base.
8. a LED light fixture, is characterized in that, described LED light fixture comprises electronic device and the metal substrate module as described in claim 1-7 any one, and described electronic device is arranged on described metal substrate.
9. LED light fixture as claimed in claim 8, is characterized in that,
Described electronic device comprises LED light source and drives module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520951132.2U CN205249523U (en) | 2015-11-25 | 2015-11-25 | Metal substrate module and have LED lamps and lanterns of this metal substrate module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520951132.2U CN205249523U (en) | 2015-11-25 | 2015-11-25 | Metal substrate module and have LED lamps and lanterns of this metal substrate module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205249523U true CN205249523U (en) | 2016-05-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520951132.2U Active CN205249523U (en) | 2015-11-25 | 2015-11-25 | Metal substrate module and have LED lamps and lanterns of this metal substrate module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205249523U (en) |
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2015
- 2015-11-25 CN CN201520951132.2U patent/CN205249523U/en active Active
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