CN205248408U - Interpolation buckle closure formula attenuator module - Google Patents

Interpolation buckle closure formula attenuator module Download PDF

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Publication number
CN205248408U
CN205248408U CN201520954782.2U CN201520954782U CN205248408U CN 205248408 U CN205248408 U CN 205248408U CN 201520954782 U CN201520954782 U CN 201520954782U CN 205248408 U CN205248408 U CN 205248408U
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CN
China
Prior art keywords
box body
buckle closure
interpolation
cavity
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520954782.2U
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Chinese (zh)
Inventor
汤咏
王腾飞
刘鲁军
丁飞
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Anhui Sun Create Electronic Co Ltd
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Anhui Sun Create Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anhui Sun Create Electronic Co Ltd filed Critical Anhui Sun Create Electronic Co Ltd
Priority to CN201520954782.2U priority Critical patent/CN205248408U/en
Application granted granted Critical
Publication of CN205248408U publication Critical patent/CN205248408U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses an interpolation buckle closure formula attenuator module, including arranging upper cover plate, box body, the lower apron that even encloses into airtight space in proper order, be equipped with a plurality of cavitys in the box body, the corresponding signal microstrip board that is fixed with on the box body bottom in the cavity encloses into the space, in arbitrary cavity of box body the homogeneous phase should install with the interpolation formula buckle closure of cavity shape size adaptation, power microstrip board passes through the fix with screw to be fixed on the back of box body bottom. The bottom of box body is equipped with runs through a plurality of cavitys for the recess that holds signal microstrip board, interpolation formula buckle closure is fixed and is gone up corresponding the fixing in the cavity of formation with signal microstrip board in box body bottom, and is arbitrary the upper surface of buckle closure all is equipped with to help and pulls out the breach. SMA connector and rectangular connector has still set firmly on the box body periphery. The utility model discloses rational in infrastructure, the practicality is strong, when guaranteeing equipment work high reliability, do and reduce module assembly work task load, and the modular debugging of being convenient for.

Description

A kind of interpolation button type attenuator module
Technical field
The utility model belongs to Structural Design of Electronic System technical field, relates to a kind of attenuator module, spyDo not relate to a kind of interpolation button type attenuator module.
Background technology
Electromagnetic shielding and ground connection are especially two large key properties of microwave module of electronic equipment. Conventional is micro-In ripple modular design, on the one hand, arrange a large amount of screw holes in box body bottom, for fixing micro-band plate, comeEnsure that micro-band plate contacts well with box body, and then ensure the good performance of ground connection; On the other hand, at cover plateUpper design is also arranged a large amount of fixing screw holes, for closely connecting cover plate and box body, ensures in box bodyThe capability of electromagnetic shielding of unlike signal in box body cavity. This conventional design is being applied to attenuator moduleIn design, there is following shortcoming: (1) module whole assembly work amount strengthens, need module for designIn design, used a large amount of screws, and in order to ensure electromagnetic shielding and earthing effect, all screws mustMust all assemble, this has strengthened assembly work amount; (2) be unfavorable for debugging, necessary before each debuggingAll screw assemblings completely, after going wrong in debugging, must pull down again a large amount of screws on cover plate,So that maintenance module, a large amount of screws of therefore installing on cover plate are not easy to quick modular debugging; (3) decayDevice module requires high to loss of signal, conventional design can not ensure attenuator completely to electromagnetic shielding and connectThe requirement of ground performance, can strengthen debugging work difficulty, and in work, reliability is not high.
Utility model content
The utility model, in order to overcome above-mentioned the deficiencies in the prior art, provides a kind of rational in infrastructure, practicalProperty strong interpolation button type attenuator module, with in the equipment of guarantee work high reliability, also can fallLow module assembly task amount, and be convenient to modular debugging.
For achieving the above object, the utility model has adopted following technical scheme:
A kind of interpolation button type attenuator module, comprises successively along connecting the upper cover plate, the box that surround confined spaceBody, lower cover, be provided with multiple cavitys in described box body, phase on the box body bottom in cavity surrounds spaceShould be fixed with the micro-band plate of signal, equal corresponding being provided with and cavity geometry size in arbitrary cavity of described box bodyAdaptive interpolation type buckle closure; The micro-band plate of described power supply is fixed on the back side of box body bottom.
Preferably, the bottom of described box body is provided with runs through multiple cavitys, for holding signal micro-band plateGroove.
Further, on described interpolation type buckle closure, surrounding is provided with the installation of being convenient to be fixed on box body bottomHole; When the micro-band plate of signal is put into groove and completes after soldering, because of the installation of interpolation type buckle closure and box body bottomHole correspondence, after fastened by screw, is sealed in micro-signal band plate in cavity; On the wall of described cavity,On box body, be equipped with and be convenient to the installing hole fixing with upper cover plate.
Preferably, described cavity is made as 4, and corresponding interpolation type buckle closure is made as upper left buckle closure, upper right buttonLid, lower-left buckle closure, bottom right buckle closure.
Preferably, the upper surface of arbitrary described buckle closure is equipped with helping of 2 groups of symmetries and pulls out breach.
Preferably, the micro-band plate of back side power supply of described box body bottom is adopted and is screwed.
Further, described box body is placed outward and is also installed with SMA connector and rectangular connector.
Further, described upper cover plate, box body, lower cover, cavity, interpolation type buckle closure all adopt 2A12Aluminium sheet material.
Further, described box body bottom positive silver-plated, be convenient to micro-band plate soldering; Its remaining part of this moduleDivide and all adopt the workpiece through electric conductive oxidation.
The beneficial effects of the utility model are:
1), the utility model has been abandoned in module conventional design and has been used a large amount of screws to fix micro-band plate, lidThe mode of plate, first bottom, box body front machined grooves is for micro-band plate location, in the positive plating in box body bottomSilver (box body bottom is positive towards the face of inside cavity), is convenient to micro-band plate soldering, and this improves effectivelyThe ground connection performance of the micro-band plate of signal; Then by each cavity of box body, interpolation buckle closure being installed, detainIt is upper that lid can be fixed on box body bottom by a small amount of screw, ensureing adjacent chambers body electromagnetic shielding performanceTime, reduce the task amount of module assembly work.
2), in the utility model, box body bottom has processed the micro-band plate of signal of being convenient to that runs through multiple cavitys and has fixedGroove, the pad of having realized between the micro-band plate of adjacent signals is effectively taken knot, avoids buckle closure and signal micro-simultaneouslyThe location conflicts phenomenon that between band plate, assembling may occur, and effectively improved the efficiency of welding job.
3), on buckle closure, be provided with 2 groups in the utility model and help and pull out breach, contribute to dismantle in debuggingBuckle closure.
Brief description of the drawings
Fig. 1 is blast structural representation of the present utility model.
Fig. 2 is the perspective view of upper left buckle closure in the utility model;
Fig. 3 is the perspective view of box body in the utility model.
In figure, the implication of label symbol is as follows:
Buckle closure 5-bottom right, buckle closure 4-lower-left, buckle closure 3-upper right, 1-upper cover plate 2-upper left buckle closure
6-SMA connector 7-box body 70-groove 8-rectangular connector 9-lower cover
Detailed description of the invention
Below in conjunction with the accompanying drawing in the utility model embodiment, to the technology in the utility model embodimentScheme is clearly and completely described. Based on the embodiment in the utility model, ordinary skillPersonnel, not making the every other embodiment obtaining under creative work prerequisite, belong to this practicalityNovel protected scope.
As shown in Figure 1, a kind of interpolation button type attenuator module, comprises successively and surrounds confined space along connectingUpper cover plate 1, box body 7, lower cover 9, in described box body 7, be provided with multiple cavitys, surround sky at cavityThe corresponding micro-band plate of signal that is fixed with on interior box body 7 bottoms, homogeneous phase in arbitrary cavity of described box body 7The interpolation type buckle closure adaptive with cavity geometry size should be installed; The micro-band plate of described power supply is fixed on box body 7On the back side of bottom, and the micro-band plate of back side power supply of box body 7 bottoms is adopted and is screwed.
As shown in Figure 3, the bottom of described box body 7 is provided with runs through multiple cavitys, for holding signal micro-The groove 70 of band plate; On described interpolation type buckle closure, surrounding is provided with and is convenient to be fixed on the installation on box body bottom 7Hole; When the micro-band plate of signal is put into groove 70 and completes after soldering, due to interpolation type buckle closure and box body bottomInstalling hole correspondence, after fastened by screw, thereby micro-signal band plate is sealed in cavity; Thereby makeObtain cavity except leaving the confined space of micro-band plate pad overlap joint for, do not affect the shielding between cavityEnergy.
On the wall of described cavity, on box body 7, be equipped with and be convenient to the installing hole fixing with upper cover plate 1.
Concrete, described cavity is made as 4, and corresponding interpolation type buckle closure is made as upper left buckle closure 2, upper rightBuckle closure 3, lower-left buckle closure 4, bottom right buckle closure 5. The upper surface of arbitrary described buckle closure is equipped with 2 groups of symmetriesHelp and pull out breach, as shown in Figure 2.
The outer SMA connector 6 and the rectangle that are also installed with for being connected with the external world placed of described box body 7 connectsDevice 8.
Described upper cover plate 1, box body 7, lower cover 9, cavity wall, interpolation type buckle closure all adopt 2A12 aluminiumPlate material. Described box body 7 fronts, bottom are silver-plated, be convenient to micro-band plate soldering; The remainder of this module is equalAdopt the workpiece through electric conductive oxidation.
Below in conjunction with accompanying drawing, structural design of the present utility model is done to following detailed explanation.
Upper cover plate 1, box body 7, lower cover 9, cavity wall, interpolation type buckle closure all adopt 2A12 aluminium plateMaterial is as workpiece; The positive 7a in box body bottom (box body bottom is positive towards the face of inside cavity) applicationSilver plating process, be convenient to micro-band plate soldering, during simultaneously for soldering, pad effectively overlaps, in box body 7 bottomsMachined grooves, for the relative position between fixing micro-band plate; This module remainder all adopts conduction oxygenChange plating and be coated with technique.
As shown in Figure 1, respectively by micro-signal band plate and the positive 7a in the micro-band plate fixed bin body of power supply bottomIn groove 70 and box body bottom rear, then be respectively charged into upper left buckle closure 2, upper right buckle closure 3, lower-left buckle closure4, bottom right buckle closure 5, is fixed on buckle closure surrounding installing hole on front, box body bottom with screw; Then use spiral shellNail is fixed through the installing hole on upper cover plate 1 and box body 7, on cavity wall, then distinguishes outside fixed bin body 7The SMA connector 6, the rectangular connector 8 that enclose, be finally screwed lower cover 9, forms airtight wholeBody.
Wherein, the positive micro-band plate of signal in box body bottom adopts soldering to be fixed on box body bottom, the electricity at the back sideThe micro-band plate in source adopts 4 screws to fix.
And upper left buckle closure 2, upper right buckle closure 3, lower-left buckle closure 4, bottom right buckle closure 5, upper at arbitrary buckle closureSurface has been arranged respectively and helping of 2 groups of symmetries has been pulled out breach (as shown in Figure 2, helping of upper left buckle closure 2 pulled out breach2a)。

Claims (9)

1. an interpolation button type attenuator module, comprise successively along connecting the upper cover plate (1), box body (7), the lower cover (9) that surround confined space, it is characterized in that: described box body is provided with multiple cavitys in (7), the corresponding micro-band plate of signal that is fixed with on box body (7) bottom in cavity surrounds space, equal corresponding being provided with and interpolation type buckle closure that cavity geometry size is adaptive in arbitrary cavity of described box body (7); On the back side of box body (7) bottom, be fixed with the micro-band plate of power supply.
2. a kind of interpolation button type attenuator module according to claim 1, is characterized in that: the bottom of described box body (7) is provided with runs through multiple cavitys, for holding the groove (70) of the micro-band plate of signal.
3. a kind of interpolation button type attenuator module according to claim 2, is characterized in that: on described interpolation type buckle closure, surrounding is provided with and is convenient to be fixed on the installing hole on box body (7) bottom; When the micro-band plate of signal is put into after groove (70), interpolation type buckle closure is corresponding with the installing hole of box body bottom, by soldering, micro-signal band plate is sealed in cavity; On the wall of described cavity, on box body (7), be equipped with and be convenient to the installing hole fixing with upper cover plate (1).
4. a kind of interpolation button type attenuator module according to claim 1, it is characterized in that: described cavity is made as 4, corresponding interpolation type buckle closure is made as upper left buckle closure (2), upper right buckle closure (3), lower-left buckle closure (4), bottom right buckle closure (5).
5. a kind of interpolation button type attenuator module according to claim 1, is characterized in that: the upper surface of arbitrary described buckle closure is equipped with helping of 2 groups of symmetries and pulls out breach.
6. a kind of interpolation button type attenuator module according to claim 1, is characterized in that: the micro-band plate of back side power supply of described box body (7) bottom is adopted and is screwed.
7. according to a kind of interpolation button type attenuator module described in claim 1~6 any one, it is characterized in that: outer the placing of described box body (7) is also installed with SMA connector (6) and rectangular connector (8).
8. a kind of interpolation button type attenuator module according to claim 7, is characterized in that: described upper cover plate (1), box body (7), lower cover (9), cavity, interpolation type buckle closure all adopt 2A12 aluminium sheet material.
9. a kind of interpolation button type attenuator module according to claim 8, is characterized in that: described box body (7) bottom positive silver-plated, be convenient to the micro-band plate soldering of signal; The remainder of this module all adopts the workpiece through electric conductive oxidation.
CN201520954782.2U 2015-11-25 2015-11-25 Interpolation buckle closure formula attenuator module Expired - Fee Related CN205248408U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520954782.2U CN205248408U (en) 2015-11-25 2015-11-25 Interpolation buckle closure formula attenuator module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520954782.2U CN205248408U (en) 2015-11-25 2015-11-25 Interpolation buckle closure formula attenuator module

Publications (1)

Publication Number Publication Date
CN205248408U true CN205248408U (en) 2016-05-18

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106374862A (en) * 2016-08-31 2017-02-01 安徽华东光电技术研究所 Microwave four-channel amplifier module and manufacturing method thereof
CN107275814A (en) * 2017-06-26 2017-10-20 安徽四创电子股份有限公司 A kind of synthesizer structure for radar

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106374862A (en) * 2016-08-31 2017-02-01 安徽华东光电技术研究所 Microwave four-channel amplifier module and manufacturing method thereof
CN106374862B (en) * 2016-08-31 2019-03-12 安徽华东光电技术研究所 Microwave four-way amplifier module and preparation method thereof
CN107275814A (en) * 2017-06-26 2017-10-20 安徽四创电子股份有限公司 A kind of synthesizer structure for radar

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160518

Termination date: 20211125