CN205231105U - LED lamp pearl packaging structure and display screen that has this structure - Google Patents

LED lamp pearl packaging structure and display screen that has this structure Download PDF

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Publication number
CN205231105U
CN205231105U CN201520996417.8U CN201520996417U CN205231105U CN 205231105 U CN205231105 U CN 205231105U CN 201520996417 U CN201520996417 U CN 201520996417U CN 205231105 U CN205231105 U CN 205231105U
Authority
CN
China
Prior art keywords
led lamp
lamp bead
bonding area
crystal bonding
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520996417.8U
Other languages
Chinese (zh)
Inventor
吴香辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN ANPLIGHT OPTO TECHNOLOGICAL CO Ltd
Original Assignee
SHENZHEN ANPLIGHT OPTO TECHNOLOGICAL CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHENZHEN ANPLIGHT OPTO TECHNOLOGICAL CO Ltd filed Critical SHENZHEN ANPLIGHT OPTO TECHNOLOGICAL CO Ltd
Priority to CN201520996417.8U priority Critical patent/CN205231105U/en
Application granted granted Critical
Publication of CN205231105U publication Critical patent/CN205231105U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The utility model belongs to the emitting diode field provides a LED lamp pearl packaging structure and display screen that has this structure, including supporting seat and LED lamp pole, be equipped with bowl form fluting in the supporting seat, bowl form fluting bottom is equipped with solid crystalline region, LED lamp pearl bonds gu in the crystalline region, gu on the crystalline region with LED lamp pearl abutting edge is concave to be equipped with a plurality of recesses, can solve current supporting seat bottom through such packaging structure and wet back LED lamp pearl and appear easily breaking away from, and then cause the die problem of lamp of LED.

Description

A kind of LED lamp bead encapsulating structure and there is the display screen of this structure
Technical field
The utility model belongs to light-emitting diode field, particularly relates to a kind of LED lamp bead encapsulating structure and has the display screen of this structure.
Background technology
LED (LightEmittingDiode) is a kind of solid-state semiconductor device, and it directly can be converted into light electricity.It is different from the principle of the luminescence of incandescent lamp tungsten filament and the luminescence of electricity-saving lamp tricolor powder, and adopts electroluminescence.Clearly, the life-span is long, light efficiency is high, radiationless and low-power consumption for the feature of LED.Meanwhile, the spectrum of LED almost all concentrates on visible light frequency band.LED light source can utilize the red, green, blue principle of three primary colours, under computer technology controls, three kinds of colors are made to have 256 grades of gray scales and mixing arbitrarily, 256 × 256 × 256=16777216 kind color can be produced, form different photochromic combination, realize colourful dynamic change effect and various image.
In view of the intrinsic advantage of LED, be widely applied at present on display screen market.Because LED industry cannot break through outdoor water-proof protection against the tide always, LED lamp bead in use for some time frame bottom make moist after LED lamp bead there will be disengaging, and then there will be a certain proportion of dead lamp problem.
Utility model content
The purpose of this utility model is to provide a kind of LED lamp bead encapsulating structure, be intended to solve existing frame bottom make moist after LED post easily occur departing from, and then cause the problem of the dead lamp of LED.
The utility model solves like this; A kind of LED lamp bead encapsulating structure, comprise supporting seat and LED post, be provided with bowl-shape fluting in described supporting seat, described bowl-shape fluting bottom is provided with crystal bonding area, described LED post is bonded in described crystal bonding area, and described crystal bonding area is arranged with multiple groove with described LED post abutting edge.
Further, multiple described groove is that regular shape is arranged in described crystal bonding area.
Further, multiple described groove is that polygonal arrangement is in described crystal bonding area.
Further, the sidewall of described bowl-shape fluting is outward extended with platform structure.
Further, the end of described platform structure is upwards extended with boss.
Further, described encapsulating structure also comprises supporting structure, and described supporting seat is connected on described supporting structure, and described crystal bonding area is positioned on described supporting structure.
Further, be provided with the line layer structure that Sheet Metal Forming Technology is formed in described supporting structure, described LED lamp bead is electrically connected with described line layer structure.
The technique effect that the LED lamp bead encapsulating structure that the utility model provides has relative to existing encapsulating structure is; By being arranged with multiple groove with LED post abutting edge on crystal bonding area, when LED post is bonded on crystal bonding area, viscose glue bond area between the two increases, both increase bonding dynamics, and then effectively minimizing viscose glue is peeled off from crystal bonding area, thus reduce the problem causing the dead lamp of LED post.
The utility model also provides a kind of display screen, and this display screen comprises the aforementioned LED lamp bead encapsulating structure of array arrangement; The display screen with this structure can reduce the generation of the dead lamp phenomenon of LED post in it.
Accompanying drawing explanation
Fig. 1 is the LED lamp bead encapsulating structure profile that the utility model embodiment provides.
Fig. 2 is the vertical view of the unassembled LED post of LED lamp bead encapsulating structure that the utility model embodiment provides.
Fig. 3 is the cutaway view of Fig. 2 of providing of the utility model embodiment along A-A direction.
Fig. 4 is the end view of the LED lamp bead encapsulating structure that the utility model embodiment provides.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Please refer to shown in accompanying drawing 1 to Fig. 4, in the utility model embodiment, a kind of LED lamp bead encapsulating structure, comprise supporting seat 20 and LED post 30, bowl-shape fluting 201 is provided with in this supporting seat 20, and crystal bonding area 101 is provided with bottom bowl-shape fluting 201, this LED post 30 is bonded in crystal bonding area 101, and this this crystal bonding area 101 external is arranged with multiple groove 102 with LED post 30 abutting edge.
In the present embodiment, LED post 30 comprises the basic colored lights pearl of three kinds, red light in one line, green light and blue lamp, and wherein blue lamp and green light lamppost are bipolar electrode structure, and it is bonded by ultrasonic resonance by wire and crystal bonding area 101; And red light lamppost is stagged electrode structure, it can only be bonded on crystal bonding area 101 by viscose glue 40, the green light that its tightness combined bonds much smaller than ultrasonic resonance and blue lamp lamppost, so increase multiple grooves 102 of matrix arrangement in the present embodiment on crystal bonding area 101, and then increase bonding dynamics between the two by increasing LED post 30 and the bond area of the viscose glue 40 between crystal bonding area 101.
Display screen LED post 30 encapsulating structure more than designed, by being arranged with multiple groove 102 with LED post 30 abutting edge on crystal bonding area 101, when LED post 30 is bonded on crystal bonding area 101, viscose glue 40 bond area between the two increases, both increase bonding dynamics, and then effectively minimizing viscose glue 40 is peeled off from crystal bonding area 101, thus reduce the problem causing the dead lamp of LED post 30.
Particularly, as depicted in figs. 1 and 2, in the utility model embodiment, this groove 102 multiple is arranged in crystal bonding area 101 in regular shape; And multiple groove 102 is that polygonal arrangement is in crystal bonding area 101, in the present embodiment, rectangular or the triangular pitch of multiple groove 102 is in crystal bonding area 101, and the cross-sectional area of groove 102 is less than the cross-sectional area of LED post 30, can ensure that the groove 102 be positioned at bottom LED post 30 is more like this, and then the bonding area of viscose glue 40 is larger, so bonding also just more firm.
Particularly, as shown in figures 1 and 3, in the utility model embodiment, the sidewall of this bowl-shape fluting 201 is outward extended with platform structure 202, the end of this this platform structure 202 external is upwards extended with boss 2021, in the present embodiment, in this display screen during infiltration, the water infiltrated generally can flow in bowl-shape fluting 201 along supporting seat 20 upper surface, because the sidewall of bowl-shape fluting 201 has certain inclination angle, water can flow to crystal bonding area 101 very soon and then have influence on the intensity that LED post 30 is bonded in crystal bonding area 101, in order to delay the current direction crystal bonding area 101 infiltrated, the sidewall of bowl-shape fluting 201 is outward extended with the platform structure 202 that end is provided with boss 2021, like this this platform structure 202 just forms storage tank, and then can when water leaking-in is few, this storage tank gets off accommodating for a small amount of infiltration, utilize the temperature of LED post 30 luminescence slowly to be evaporated by the moisture in storage tank simultaneously, can reduce further like this and make moist bottom bowl-shape fluting 201 and phenomenon that the viscose glue 40 that occurs is peeled off with crystal bonding area 101.
Particularly, as shown in Figure 1, Figure 3 and Figure 4, in the utility model embodiment, this encapsulating structure also comprises supporting structure 10, this supporting seat 20 is connected on described supporting structure 10, and crystal bonding area 101 is positioned on described supporting structure 10, in addition, in this supporting structure 10, be also provided with the line layer structure that Sheet Metal Forming Technology is formed, LED post 30 is electrically connected with line layer structure.
The utility model also provides a kind of display screen, and this display screen comprises the aforementioned LED lamp bead encapsulating structure of array arrangement; The display screen with this structure can reduce the generation of the dead lamp phenomenon of LED post 30 in it.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.

Claims (8)

1. a LED lamp bead encapsulating structure, comprise supporting seat and LED post, it is characterized in that: in described supporting seat, be provided with bowl-shape fluting, described bowl-shape fluting bottom is provided with crystal bonding area, described LED lamp bead is bonded in described crystal bonding area, and described crystal bonding area is arranged with multiple groove with described LED lamp bead abutting edge.
2. LED lamp bead encapsulating structure as claimed in claim 1, is characterized in that: multiple described groove is that regular shape is arranged in described crystal bonding area.
3. LED lamp bead encapsulating structure as claimed in claim 2, is characterized in that: multiple described groove is that polygonal arrangement is in described crystal bonding area.
4. LED lamp bead encapsulating structure as claimed in claim 1, is characterized in that: the sidewall of described bowl-shape fluting is outward extended with platform structure.
5. LED lamp bead encapsulating structure as claimed in claim 4, is characterized in that: the end of described platform structure is upwards extended with boss.
6. the LED lamp bead encapsulating structure as described in any one of claim 1-5, it is characterized in that: also comprise supporting structure, described supporting seat is connected on described supporting structure, and described crystal bonding area is positioned on described supporting structure.
7. LED lamp bead encapsulating structure as claimed in claim 6, is characterized in that: be provided with the line layer structure that Sheet Metal Forming Technology is formed in described supporting structure, described LED lamp bead is electrically connected with described line layer structure.
8. a display screen, is characterized in that, comprises the LED lamp bead encapsulating structure described in any one of claim 1-7 of array arrangement.
CN201520996417.8U 2015-12-03 2015-12-03 LED lamp pearl packaging structure and display screen that has this structure Expired - Fee Related CN205231105U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520996417.8U CN205231105U (en) 2015-12-03 2015-12-03 LED lamp pearl packaging structure and display screen that has this structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520996417.8U CN205231105U (en) 2015-12-03 2015-12-03 LED lamp pearl packaging structure and display screen that has this structure

Publications (1)

Publication Number Publication Date
CN205231105U true CN205231105U (en) 2016-05-11

Family

ID=55906151

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520996417.8U Expired - Fee Related CN205231105U (en) 2015-12-03 2015-12-03 LED lamp pearl packaging structure and display screen that has this structure

Country Status (1)

Country Link
CN (1) CN205231105U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160511

Termination date: 20211203

CF01 Termination of patent right due to non-payment of annual fee