CN205209439U - Wafer thickness measurement device - Google Patents
Wafer thickness measurement device Download PDFInfo
- Publication number
- CN205209439U CN205209439U CN201521021972.5U CN201521021972U CN205209439U CN 205209439 U CN205209439 U CN 205209439U CN 201521021972 U CN201521021972 U CN 201521021972U CN 205209439 U CN205209439 U CN 205209439U
- Authority
- CN
- China
- Prior art keywords
- frame
- driving wheel
- thickness measuring
- wheel
- observation device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Length Measuring Devices By Optical Means (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model relates to a wafer thickness measurement device, including the frame, the frame is equipped with the action wheel, and the frame is equipped with the follow driving wheel, and the action wheel passes through the drive belt with the follow driving wheel and is connected, the interior bottom of frame is equipped with the support column, is equipped with driving motor on the support column, and driving motor is equipped with the drive wheel, and the drive wheel passes through the drive shaft and is connected with driving motor, the drive wheel is connected with the action wheel, being equipped with the support pipeline in the frame, being equipped with the thickness measurement appearance on the support pipeline, be equipped with the guide bar in the frame, the guide bar cover is equipped with the slip pipe, and the slip pipe is equipped with the infrared ray monitor, and the infrared ray monitor is connected with the thickness measurement appearance. The utility model discloses an infrared ray monitor can realize slide along the guide bar through the slip pipe, detects through the convenient thickness to the wafer of infrared ray monitor, conveniently measures the thickness of wafer through the thickness measurement appearance.
Description
Technical field
The utility model relates to a kind of measurement mechanism, is specifically related to a kind of wafer thickness measuring device.
Background technology
Size measurement instruments has a probe, and described probe moves along measurement axis.Elastic transmission element makes probe can move under the effect of ergometry; Probe can be rigidly connected with instrument, such as, measure to implement profile or describe.Instrument is entirely protected from liquid with a shell and injects the impact with dust, and probe can be locked when not opening shell or not entering enclosure.Supersonic thickness meter adopts up-to-date high-performance, low-power microprocessor technology, based on ultrasonic measurement principle, can measure the thickness of metal and other multiple material, and can measure the velocity of sound of material.Existing wafer thickness is inconvenient to detect, and detection efficiency is low.
Utility model content
The purpose of this utility model is defect for prior art and deficiency, and providing a kind of can place wafer to be detected on the belt, and drive motor can control driving wheel, driving-belt and driving wheel and realize rotating, thus conveniently carries out transmission to wafer; Infrared observation device can realize sliding along guide pole by slip pipe, detects, be convenient for measuring out the wafer thickness measuring device of the thickness of wafer by thickness measuring instrument by infrared observation device is convenient to the thickness of wafer.
For achieving the above object, the technical solution adopted in the utility model is:
A kind of wafer thickness measuring device, comprise frame, frame is provided with driving wheel, the axial location of driving wheel is provided with the first abutment shaft, and the first abutment shaft is arranged in frame, and frame is provided with engaged wheel, the axial location of engaged wheel is provided with the second abutment shaft, and the second abutment shaft is arranged in frame, driving wheel docks with engaged wheel, and driving wheel is connected by driving-belt with engaged wheel, the inner bottom part of frame is provided with support column, and support column is provided with drive motor, and drive motor is provided with driving wheel, and driving wheel is connected with drive motor by driving shaft, driving wheel is connected with driving wheel, frame is provided with supporting pipeline, supporting pipeline is arranged vertically, supporting pipeline is provided with thickness measuring instrument, frame is provided with guide pole, guide pole is set with the first slip pipe, first slip pipe is provided with the first infrared observation device, first infrared observation device is connected with thickness measuring instrument, first infrared observation device is connected by the first butted line with thickness measuring instrument, guide pole is set with the second slip pipe, second slip pipe is provided with the second infrared observation device, second infrared observation device is connected with thickness measuring instrument, second infrared observation device is connected by the second butted line with thickness measuring instrument.
Further, described frame is provided with support bar, and support bar is connected with guide pole.
Further, the outer end of described guide pole is provided with spacing ball.
Further, described spacing ball is spherical form.
Further, the outside surface of described driving wheel is provided with external thread, and the outside surface of driving wheel is provided with external thread, and driving wheel and driving wheel are threaded connection.
After adopting said structure, the utility model beneficial effect is: wafer to be detected can be placed on the belt, and drive motor can control driving wheel, driving-belt and driving wheel and realize rotating, thus conveniently carries out transmission to wafer; First infrared observation device can realize sliding along guide pole by the first slip pipe, second infrared observation device can realize sliding along guide pole by the second slip pipe, conveniently the thickness of wafer is detected by the first infrared observation device and the second infrared observation device, be convenient for measuring out the thickness of wafer by thickness measuring instrument.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Description of reference numerals:
Frame 11, driving wheel 12, first abutment shaft 13, engaged wheel 14, second abutment shaft 15, driving-belt 16, support column 17, drive motor 18, driving wheel 19, driving shaft 20, support bar 21, guide pole 22, spacing ball 23, supporting pipeline 24, thickness measuring instrument 25, first slip pipe 26, first infrared observation device 27, first butted line 28, second slip pipe 29, second infrared observation device 30, second butted line 31.
Embodiment
Below in conjunction with accompanying drawing, the utility model is further described.
As shown in Figure 1, a kind of wafer thickness measuring device described in the utility model, comprise frame 11, frame 11 is provided with driving wheel 12, the axial location of driving wheel 12 is provided with the first abutment shaft 13, first abutment shaft 13 and is arranged in frame 11, and frame 11 is provided with engaged wheel 14, the axial location of engaged wheel 14 is provided with the second abutment shaft 15, second abutment shaft 15 and is arranged in frame 11, driving wheel 12 docks with engaged wheel 14, and driving wheel 12 is connected by driving-belt 16 with engaged wheel 14, the inner bottom part of frame 11 is provided with support column 17, and support column 17 is provided with drive motor 18, and drive motor 18 is provided with driving wheel 19, and driving wheel 19 is connected with drive motor 18 by driving shaft 20, driving wheel 19 is connected with driving wheel 12, frame 11 is provided with supporting pipeline 24, supporting pipeline 24 is arranged vertically, supporting pipeline 24 is provided with thickness measuring instrument 25, frame 11 is provided with guide pole 22, guide pole 22 is set with the first slip pipe 26, first slip pipe 26 is provided with the first infrared observation device 27, first infrared observation device 27 is connected with thickness measuring instrument 25, first infrared observation device 27 is connected by the first butted line 28 with thickness measuring instrument 25, guide pole 22 is set with the second slip pipe 29, second slip pipe 29 is provided with the second infrared observation device 30, second infrared observation device 30 is connected with thickness measuring instrument 25, second infrared observation device 30 is connected by the second butted line 31 with thickness measuring instrument 25, frame 11 is provided with support bar 21, and support bar 21 is connected with guide pole 22, the outer end of guide pole 22 is provided with spacing ball 23, and spacing ball 23 is spherical form, and the outside surface of driving wheel 19 is provided with external thread, and the outside surface of driving wheel 12 is provided with external thread, and driving wheel 19 and driving wheel 12 are threaded connection.
The utility model wafer thickness measuring device, can be placed on driving-belt 16 by wafer to be detected, drive motor 18 can control driving wheel 19, driving-belt 16 and driving wheel 12 and realize rotating, thus conveniently carries out transmission to wafer; First infrared observation device 27 can realize sliding along guide pole 22 by the first slip pipe 26, second infrared observation device 30 can realize sliding along guide pole 22 by the second slip pipe 29, conveniently the thickness of wafer is detected by the first infrared observation device 27 and the second infrared observation device 30, be convenient for measuring out the thickness of wafer by thickness measuring instrument 25.
Wherein, frame 11 is provided with support bar 21, and support bar 21 is connected with guide pole 22; The outer end of guide pole 22 is provided with spacing ball 23, and spacing ball 23 is spherical form, installs, also have limit function so convenient to support bar 21.
Wherein, the outside surface of driving wheel 19 is provided with external thread, and the outside surface of driving wheel 12 is provided with external thread, and driving wheel 19 and driving wheel 12 are threaded connection; So transmission stability is better.
The above is only better embodiment of the present utility model, therefore all equivalences done according to structure, feature and the principle described in the utility model patent claim change or modify, and are included in the utility model patent claim.
Claims (5)
1. a wafer thickness measuring device, comprise frame (11), it is characterized in that: frame (11) is provided with driving wheel (12), the axial location of driving wheel (12) is provided with the first abutment shaft (13), first abutment shaft (13) is arranged in frame (11), frame (11) is provided with engaged wheel (14), and the axial location of engaged wheel (14) is provided with the second abutment shaft (15), and the second abutment shaft (15) is arranged in frame (11), driving wheel (12) docks with engaged wheel (14), and driving wheel (12) is connected by driving-belt (16) with engaged wheel (14), the inner bottom part of frame (11) is provided with support column (17), and support column (17) is provided with drive motor (18), and drive motor (18) is provided with driving wheel (19), and driving wheel (19) is connected with drive motor (18) by driving shaft (20), driving wheel (19) is connected with driving wheel (12), frame (11) is provided with supporting pipeline (24), supporting pipeline (24) is arranged vertically, supporting pipeline (24) is provided with thickness measuring instrument (25), frame (11) is provided with guide pole (22), guide pole (22) is set with the first slip pipe (26), first slip pipe (26) is provided with the first infrared observation device (27), first infrared observation device (27) is connected with thickness measuring instrument (25), first infrared observation device (27) is connected by the first butted line (28) with thickness measuring instrument (25), guide pole (22) is set with the second slip pipe (29), second slip pipe (29) is provided with the second infrared observation device (30), second infrared observation device (30) is connected with thickness measuring instrument (25), second infrared observation device (30) is connected by the second butted line (31) with thickness measuring instrument (25).
2. wafer thickness measuring device according to claim 1, is characterized in that: frame (11) is provided with support bar (21), and support bar (21) is connected with guide pole (22).
3. wafer thickness measuring device according to claim 1, is characterized in that: the outer end of guide pole (22) is provided with spacing ball (23).
4. wafer thickness measuring device according to claim 3, is characterized in that: spacing ball (23) is spherical form.
5. wafer thickness measuring device according to claim 1, is characterized in that: the outside surface of driving wheel (19) is provided with external thread, and the outside surface of driving wheel (12) is provided with external thread, and driving wheel (19) and driving wheel (12) are threaded connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521021972.5U CN205209439U (en) | 2015-12-10 | 2015-12-10 | Wafer thickness measurement device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521021972.5U CN205209439U (en) | 2015-12-10 | 2015-12-10 | Wafer thickness measurement device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205209439U true CN205209439U (en) | 2016-05-04 |
Family
ID=55847149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521021972.5U Expired - Fee Related CN205209439U (en) | 2015-12-10 | 2015-12-10 | Wafer thickness measurement device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205209439U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105856315A (en) * | 2016-06-02 | 2016-08-17 | 宜兴正阳制衣有限公司 | Improved fabric cutting workbench |
| CN110670044A (en) * | 2019-11-27 | 2020-01-10 | 昆山国显光电有限公司 | Film formation thickness detection device, detection method and evaporation equipment |
-
2015
- 2015-12-10 CN CN201521021972.5U patent/CN205209439U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105856315A (en) * | 2016-06-02 | 2016-08-17 | 宜兴正阳制衣有限公司 | Improved fabric cutting workbench |
| CN110670044A (en) * | 2019-11-27 | 2020-01-10 | 昆山国显光电有限公司 | Film formation thickness detection device, detection method and evaporation equipment |
| CN110670044B (en) * | 2019-11-27 | 2021-10-01 | 昆山国显光电有限公司 | Film formation thickness detection device, detection method and evaporation equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160504 Termination date: 20181210 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |