CN205194945U - Rf adapter - Google Patents
Rf adapter Download PDFInfo
- Publication number
- CN205194945U CN205194945U CN201520988483.0U CN201520988483U CN205194945U CN 205194945 U CN205194945 U CN 205194945U CN 201520988483 U CN201520988483 U CN 201520988483U CN 205194945 U CN205194945 U CN 205194945U
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- outer conductor
- medium body
- adapter
- jack
- glass insulator
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Abstract
The utility model provides a rf adapter relates to electric elements technical field. Rf adapter includes: first outer conductor, first jack, the first medium body, glass insulator, the second medium body and third outer conductor, first jack has opposite first end and the second end, the first end and the second end of jack insert respectively in the first outer conductor and the first medium body, and first outer conductor and first medium body fastening connection, glass insulator seals the cooperation with the first medium body and the second medium body respectively, the third outer conductor is installed at glass insulator's surface and fixed with first outer conductor. The utility model discloses a rf adapter's overall dimension is great, through glass insulator respectively with the sealed cooperation with the second medium body of the first medium body, can guarantee the higher gas sealing performance of rf adapter acquisition, can also make rf adapter's electrical performance index not influenced. And the utility model discloses a manufacturing cost is greatly reduced also.
Description
Technical field
The utility model relates to electric component technical field, particularly relates to a kind of rf adapter.
Background technology
Rf adapter may be used for circuit board and circuit board, radio-frequency module and radio-frequency module, interconnected between circuit board and radio-frequency module.At present, the rf adapter with high gas sealing ability generally adopts glass sintering structure or O type coil structures.The process costs of glass sintering structure is higher, is generally suitable for the rf adapter that overall dimension is less.For the rf adapter that overall dimension is larger, as adopted Integral glass sintered technique, its production cost can significantly increase.And O type coil structures is for rf adapter, increases the air-tightness of inner wire and dielectric interface if be used for, then can change impedance, affect product electricity function index.
Utility model content
The purpose of this utility model will provide a kind of can ensure that high gas sealing ability, cost are lower and not affect the larger rf adapter of the overall dimension of electricity function index.
Especially, the utility model provides a kind of rf adapter, described rf adapter comprises: the first outer conductor, first jack, first medium body, glass insulator, second medium body and the 3rd outer conductor, described first jack has contrary first end and the second end, the described first end of described jack and described the second end insert in described first outer conductor and described first medium body respectively, and described first outer conductor and described first medium body are fastenedly connected, described glass insulator is sealed and matched with described first medium body and described second medium body respectively, described 3rd outer conductor is arranged on the outer surface of described glass insulator and fixes with described first outer conductor.
Alternatively, described glass insulator comprises the second outer conductor, vitreum and the contact pin that high temperature sintering is integrated, and described vitreum is arranged in the inner side of described second outer conductor and described contact pin is arranged in described Vitrea inner side.
Alternatively, sealed by an O type circle between described second outer conductor and described 3rd outer conductor.
Alternatively, the quantity of a described O type circle is two.
Alternatively, the second end of described first jack is inserted in one end of described contact pin.
Alternatively, also comprise the second jack be arranged in described second medium body, the other end of described contact pin inserts in described second jack.
Alternatively, also comprise reed, described second medium body reaches location by the interference fit of described reed and described 3rd outer conductor.
Alternatively, also comprise sleeve, described sleeve and described 3rd outer conductor interference fit are to realize the protection to described reed.
Alternatively, also comprise the alignment pin for being fixed by described rf adapter, described second outer conductor has a radial installed surface, and described alignment pin is vertically set on described radial installed surface.
The overall dimension of rf adapter of the present utility model is larger, by glass insulator respectively with being sealed and matched of first medium body and second medium body, can ensure that rf adapter obtains higher gas sealing ability, the electricity function index of rf adapter can also be made unaffected.And production cost of the present utility model also reduces greatly.
According to hereafter by reference to the accompanying drawings to the detailed description of the utility model specific embodiment, those skilled in the art will understand above-mentioned and other objects, advantage and feature of the present utility model more.
Accompanying drawing explanation
Hereinafter describe specific embodiments more of the present utility model with reference to the accompanying drawings by way of example, and not by way of limitation in detail.Reference numeral identical in accompanying drawing denotes same or similar parts or part.It should be appreciated by those skilled in the art that these accompanying drawings may not be drawn in proportion.In accompanying drawing:
Fig. 1 is the schematic cross sectional views of the rf adapter according to the utility model embodiment.
Embodiment
Fig. 1 is the schematic cross sectional views of the rf adapter according to the utility model embodiment.Described rf adapter comprises: the first outer conductor 1, first jack 2, first medium body 3, glass insulator 8, second medium body 9 and the 3rd outer conductor 11, described first jack 2 has contrary first end 21 and the second end 22, the described first end 21 of described jack and described the second end 22 insert in described first outer conductor 1 and described first medium body 3 respectively, and described first outer conductor 1 is fastenedly connected with described first medium body 3, described glass insulator 8 is sealed and matched with described first medium body 3 and described second medium body 9 respectively, described 3rd outer conductor 11 is arranged on the outer surface of described glass insulator 8 and fixes with described first outer conductor 1.
The overall dimension of rf adapter of the present utility model is larger, by glass insulator 8 respectively with being sealed and matched of first medium body 3 and second medium body 9, can ensure that rf adapter obtains higher gas sealing ability, the electricity function index of rf adapter can also be made unaffected.And production cost of the present utility model also reduces greatly.
As shown in Figure 1, described glass insulator 8 comprises the second outer conductor 5, vitreum 6 and the contact pin 7 that high temperature sintering is integrated, and described vitreum 6 is arranged in the inner side of described second outer conductor 5 and described contact pin 7 is arranged in the inner side of described vitreum 6.
The all metalwork selections of pure glass sintering product requirement of the prior art are 4J29 material, and this material costly.And the glass insulator 8 in the utility model uses a small amount of 4J29 material, most of material can with copper alloy even aluminium alloy replace.Therefore, rf adapter of the present utility model can reduce production cost greatly.
With reference to figure 1, sealed by an O type circle 4 between described second outer conductor 5 and described 3rd outer conductor 11.One O type circle 4 can ensure the sealing property between the second outer conductor 5 and the 3rd outer conductor 11.Preferably, the quantity of a described O type circle 4 is two.
As shown in Figure 1, the second end 22 of described first jack 2 is inserted in one end of described contact pin 7.
As shown in Figure 1, described rf adapter also comprises the second jack 13 be arranged in described second medium body 9, and the other end of described contact pin 7 inserts in described second jack 13.
As shown in Figure 1, described rf adapter also comprises reed 12, and described second medium body 9 reaches location by described reed 12 with the interference fit of described 3rd outer conductor 11.Between reed 12 and the 3rd outer conductor 11, interference fit can realize the location of second medium body 9.
As shown in Figure 1, described rf adapter also comprises sleeve 14, and described sleeve 14 and described 3rd outer conductor 11 interference fit are to realize the protection to described reed 12.Reed 12 is arranged between described second medium body 9 and described 3rd outer conductor 11, easily causes the damage to reed 12, and the utility model can be protected reed 12 by the sleeve 14 being arranged on reed 12 outside.
As shown in Figure 1, described rf adapter also comprises the alignment pin 10 for being fixed by described rf adapter, and described second outer conductor 5 has a radial installed surface 15, and described alignment pin 10 is vertically set on described radial installed surface 15.The utility model can realize the fixing of rf adapter by utilizing alignment pin 10.
So far, those skilled in the art will recognize that, although multiple exemplary embodiment of the present utility model is illustrate and described herein detailed, but, when not departing from the utility model spirit and scope, still can directly determine or derive other modification many or amendment of meeting the utility model principle according to content disclosed in the utility model.Therefore, scope of the present utility model should be understood and regard as and cover all these other modification or amendments.
Claims (9)
1. a rf adapter, it is characterized in that, described rf adapter comprises: the first outer conductor, first jack, first medium body, glass insulator, second medium body and the 3rd outer conductor, described first jack has contrary first end and the second end, the described first end of described jack and described the second end insert in described first outer conductor and described first medium body respectively, and described first outer conductor and described first medium body are fastenedly connected, described glass insulator is sealed and matched with described first medium body and described second medium body respectively, described 3rd outer conductor is arranged on the outer surface of described glass insulator and fixes with described first outer conductor.
2. rf adapter according to claim 1, it is characterized in that, described glass insulator comprises the second outer conductor, vitreum and the contact pin that high temperature sintering is integrated, and described vitreum is arranged in the inner side of described second outer conductor and described contact pin is arranged in described Vitrea inner side.
3. rf adapter according to claim 2, is characterized in that, is sealed between described second outer conductor and described 3rd outer conductor by an O type circle.
4. rf adapter according to claim 3, is characterized in that, the quantity of a described O type circle is two.
5. rf adapter according to claim 2, is characterized in that, the second end of described first jack is inserted in one end of described contact pin.
6. rf adapter according to claim 5, is characterized in that, also comprises the second jack be arranged in described second medium body, and the other end of described contact pin inserts in described second jack.
7. rf adapter according to claim 6, is characterized in that, also comprises reed, and described second medium body reaches location by the interference fit of described reed and described 3rd outer conductor.
8. rf adapter according to claim 7, is characterized in that, also comprises sleeve, and described sleeve and described 3rd outer conductor interference fit are to realize the protection to described reed.
9. the rf adapter according to any one of claim 2-8, it is characterized in that, also comprise the alignment pin for being fixed by described rf adapter, described second outer conductor has a radial installed surface, and described alignment pin is vertically set on described radial installed surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520988483.0U CN205194945U (en) | 2015-12-03 | 2015-12-03 | Rf adapter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520988483.0U CN205194945U (en) | 2015-12-03 | 2015-12-03 | Rf adapter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205194945U true CN205194945U (en) | 2016-04-27 |
Family
ID=55787903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520988483.0U Active CN205194945U (en) | 2015-12-03 | 2015-12-03 | Rf adapter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205194945U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106848788A (en) * | 2017-03-10 | 2017-06-13 | 苏州华旃航天电器有限公司 | A kind of adapter of boundling glass sintering |
| CN109193210A (en) * | 2018-09-19 | 2019-01-11 | 中国舰船研究设计中心 | A kind of deep diving multicore watertight high-frequency socket |
-
2015
- 2015-12-03 CN CN201520988483.0U patent/CN205194945U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106848788A (en) * | 2017-03-10 | 2017-06-13 | 苏州华旃航天电器有限公司 | A kind of adapter of boundling glass sintering |
| CN109193210A (en) * | 2018-09-19 | 2019-01-11 | 中国舰船研究设计中心 | A kind of deep diving multicore watertight high-frequency socket |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180102 Address after: No. 2596, Tai Dong Road, Cao Hu Street, Xiangcheng Economic Development Zone, Suzhou, Jiangsu Province Patentee after: Hutong Holdings Group Co., Ltd. Address before: 215132 Xiangcheng District, Suzhou, Huangqiao, Jiangsu Street Wing Road, No. 32 Patentee before: JIANGSU FOULEN OPTIC-ELECTRICAL TECHNOLGY Co.,Ltd. |