CN205193823U - Fingerprint identification sensing apparatus, electronic equipment and mobile device - Google Patents

Fingerprint identification sensing apparatus, electronic equipment and mobile device Download PDF

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Publication number
CN205193823U
CN205193823U CN201520780291.0U CN201520780291U CN205193823U CN 205193823 U CN205193823 U CN 205193823U CN 201520780291 U CN201520780291 U CN 201520780291U CN 205193823 U CN205193823 U CN 205193823U
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CN
China
Prior art keywords
fingerprint
sensing apparatus
user
finger
sensor assembly
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520780291.0U
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Chinese (zh)
Inventor
张海平
汤星星
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Priority to CN201520780291.0U priority Critical patent/CN205193823U/en
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Publication of CN205193823U publication Critical patent/CN205193823U/en
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Abstract

The utility model discloses a fingerprint identification sensing apparatus and the electronic equipment and the mobile device that have it. The fingerprint identification sensing apparatus includes: device element, device element has the splenium of pressing that is suitable for with the user's finger contact, the fingerprint sensor subassembly, the fingerprint sensor subassembly is established in the device element below, the fingerprint sensor subassembly can be coupled to user's finger's fingerprint, response element, response element is constituted to be pressed at user's finger self moves when pressing the splenium, with the response the action of pressing the splenium, wherein, the fingerprint sensor subassembly establish than response element more is close to user's finger's position. According to the utility model discloses the fingerprint identification sensing apparatus has good fingerprint function, does not nevertheless have the response control function, can satisfy the use of some special occasion, for example, the fingerprint identification sensing apparatus can be used for the manufacturing of false button.

Description

Fingerprint recognition sensing apparatus, electronic equipment and mobile device
Technical field
The utility model relates to and identifying and detection technology field, more specifically, relates to a kind of fingerprint recognition sensing apparatus and has its electronic equipment and mobile device.
Background technology
In the related, electronic key only has response limiting function usually, and does not have fingerprint identification function.For some special key, these two kinds of functions can have simultaneously.But, in actual use, occur sometimes only needing the fingerprint to user to gather, and do not need to perform response limiting function, now, be necessary to arrange and a kind ofly there is fingerprint identification function but not there is the button of response limiting function.
Utility model content
The utility model is intended to solve one of technical matters in correlation technique at least to a certain extent.For this reason, the utility model proposes a kind of fingerprint recognition sensing apparatus, described fingerprint recognition sensing apparatus has good fingerprint identification function, and may be used for building the button without response limiting function.
The utility model also proposed a kind of electronic equipment with above-mentioned fingerprint recognition sensing apparatus.
The utility model also proposed a kind of mobile device with above-mentioned fingerprint recognition sensing apparatus.
According to fingerprint recognition sensing apparatus of the present utility model, comprising: equipment component, described equipment component has the press section be suitable for user's finger contacts; Fingerprint sensor assembly, described fingerprint sensor assembly is located at below equipment component, and described fingerprint sensor assembly can be coupled to the fingerprint of user's finger; Response element, self action when described response element is formed in press section described in user's finger presses, to respond the action of described press section, described fingerprint sensor assembly is located at the position pointed closer to described user than described response element.
Have good fingerprint function according to fingerprint recognition sensing apparatus of the present utility model, but do not have response limiting function, can meet the use of some special occasions, such as, fingerprint fingerprint recognition sensing apparatus may be used for the manufacture of false button.
In addition, following additional technical characteristic can also be had according to fingerprint recognition sensing apparatus of the present utility model:
According to embodiments more of the present utility model, described fingerprint sensor assembly comprises one group of capacitive element of the fingerprint that can be coupled to user's finger in a capacitive manner.
According to embodiments more of the present utility model, described fingerprint sensor assembly comprises silicon wafer and sensor circuit, and described sensor circuit is arranged on the top of close user's finger of described silicon wafer.
According to embodiments more of the present utility model, in described silicon wafer, be formed with at least one through hole and/or at least one fluting, described sensor circuit be located at described through hole with or closing line in slotting be coupled.
According to embodiments more of the present utility model, described fingerprint sensor assembly also comprises the encapsulated layer with upper opening, and described sensor circuit is located in described encapsulated layer, and the circuit of described sensor circuit or described sensor circuit exposes from described upper opening.
According to embodiments more of the present utility model, described fingerprint sensor assembly also comprises the soldered elements of at least one compression, and described sensor circuit is coupled with described soldered elements.
Alternatively, described equipment component is made up of at least one in glass, pottery and sapphire material and described press section is made up of anisotropic dielectric material.
Alternatively, described button upper surface be formed as being suitable for the plane with user's finger contacts at least partially.
According to electronic equipment of the present utility model, comprise according to fingerprint recognition sensing apparatus of the present utility model.
According to mobile device of the present utility model, comprise according to fingerprint recognition sensing apparatus of the present utility model.
Additional aspect of the present utility model and advantage will part provide in the following description, and part will become obvious from the following description, or be recognized by practice of the present utility model.
Accompanying drawing explanation
Fig. 1 is the structural representation of the fingerprint recognition sensing apparatus according to the utility model embodiment.
Reference numeral:
Fingerprint recognition sensing apparatus 100;
Equipment component 10;
Fingerprint sensor assembly 20; Silicon wafer 21; Sensor circuit 22; Closing line 23; Fluting 201;
Response element 30;
Pedestal 40; Pilot hole 41.
Embodiment
Be described below in detail embodiment of the present utility model, the example of described embodiment is shown in the drawings.Be exemplary below by the embodiment be described with reference to the drawings, be intended to for explaining the utility model, and can not be interpreted as restriction of the present utility model.
The device for fingerprint recognition sensing according to the utility model embodiment is described in detail below in conjunction with accompanying drawing.
With reference to shown in Fig. 1, equipment component 10, fingerprint sensor assembly 20 and response element 30 can be comprised according to the fingerprint recognition sensing apparatus 100 of the utility model embodiment.
Fingerprint sensor assembly 20 can be located at below equipment component 10, and fingerprint sensor assembly 20 can be coupled to the fingerprint of user's finger.Equipment component 10 can comprise the press section be suitable for user's finger contacts, and self action when response element 30 is formed in user's finger presses press section, to respond the action of press section.
In other words, equipment component 10 is positioned at above fingerprint sensor assembly 20, and press section can be positioned at above fingerprint sensor assembly 20, when finger is placed on equipment component 10 by user, fingerprint sensor assembly 20 can recognize the fingerprint of user's finger, and now response element 30 is failure to actuate.When user's finger presses press section, self action of response element 30, to respond press section, press section can be pressed, user's finger can have the sense of touch that press section is pressed, and response element 30 externally can not send control signal simultaneously, and response element 30 does not have response limiting function.
Thus, fingerprint sensor assembly 20 can have fingerprint identification function, and response element 30 does not have response limiting function, but has the effect that response user finger presses down press section, and user is pointed can have pressing touch.
Wherein, fingerprint sensor assembly 20 is located at the position pointed closer to user than response element 30.Such as, response element 30 can be located at the below of fingerprint sensor assembly 20.Thus, fingerprint sensor assembly 20 distance users finger is nearer, and the fingerprint of fingerprint sensor assembly 20 pairs of user's fingers of being more convenient for identifies, identity is good.
Fingerprint recognition sensing apparatus 100 according to the utility model embodiment can have fingerprint identification function, but not there is response limiting function, and fingerprint recognition performance is good, the use of some special occasions can be met, such as, fingerprint fingerprint recognition sensing apparatus 100 may be used for the manufacture of false button or membrane keyboard.
If this fingerprint recognition sensing apparatus 100 is wanted to realize control action, can having coordinated by fingerprint sensor assembly 20 and miscellaneous part, and no longer realized by response element 30.
Be understandable that to there is action response function but the structure without the response element 30 of response limiting function can be formed as multiple.Such as, response element 30 can deform at least partially or mobile, with in press section by can action during finger presses, response element 30 does not have control element or operation circuit simultaneously, thus externally can not send control signal, realize the control to miscellaneous part.
Alternatively, the position of press section on equipment component 10 can be arranged as required, such as, in embodiments more of the present utility model, equipment component 10 can comprise at least one in button and display element, and press section can be located on button, also can arrange on the display element.
Alternatively, according to embodiments more of the present utility model, fingerprint sensor assembly 20 can comprise one group of capacitive element, and this group capacitive element can be coupled to the fingerprint of user's finger in a capacitive manner, thus realize identifying the fingerprint of user's finger, recognition performance is good.
According to embodiments more of the present utility model, fingerprint sensor assembly 20 can comprise sensor circuit 22 and silicon wafer 21, and sensor circuit 22 is located on silicon wafer 21.Sensor circuit 22 may be used for the fingerprint (electric capacity between the supracutaneous ridge of such as user's finger and paddy) measuring user's finger, with the effect provided about the ridge of user's finger and the information in fingerprint of paddy.Wherein, sensor circuit 22 can be arranged on the top of close user's finger of silicon wafer 21.
Specifically, equipment component 10 can be positioned at the top of silicon wafer 21, and sensor circuit 22 can be arranged on the end face of silicon wafer 21.Thus, fingerprint Identification sensor circuit 22 can be placed closer to user's finger, and can have better resolution and validity comparatively speaking.Such as, sensor circuit 22 can directly be printed on the end face of silicon wafer 21, and sensor circuit 22 can overlap with button part, or all overlaps.
Further, at least one through hole and/or at least one fluting 201 in silicon wafer 21, can be formed with, sensor circuit 22 can be located at through hole and/or the closing line 23 of slotting in 201 is coupled.That is, silicon wafer 21 can be arranged separately through hole or fluting 201 is set separately, or through hole and fluting 201 are all arranged, when silicon wafer 21 is provided with through hole, through hole can be one also can be multiple, when silicon wafer 21 is provided with fluting 201, fluting 201 can be one also can be multiple.Fluting 201 be provided with the closing line 23 be connected with miscellaneous part or circuit in through hole, when sensor circuit 22 can by with the connection realization of closing line 23 and the connection of miscellaneous part or circuit.
Thus, can realize the connection of sensor circuit 22 and other circuit or parts easily, syndeton is more regular.Meanwhile, in the through hole that closing line 23 is arranged on silicon wafer 21 and/or fluting 201, and need not to arch upward from the surface of silicon wafer 21, so that sensor circuit 22 is connected to other places from silicon wafer 21.Thus, joint line can not occupy the vertical space between the object above silicon wafer 21 and adjacent silicon wafer 21, sensor circuit 22 can be connected to another location, such as, the circuit of the circuit bottom silicon wafer 21 or silicon wafer 21 side), the vertical space amount that fingerprint Identification sensor assembly needs is less.
Wherein, other circuit that through hole can connect as required or the position of parts are arranged, and such as, through hole can be positioned at silicon wafer 21, and side or the bottom surface of silicon wafer 21 can be extended to, to realize being connected with other circuit on the side of silicon wafer 21 or end face.Fluting 201 can be arranged on the top of silicon wafer 21 or top and sidepiece, to realize being connected with other circuit on the side of silicon wafer 21 or bottom surface.As shown in Figure 1, the end face that fluting 201 is located at silicon wafer 21 extends to the side of silicon wafer 21, make closing line 23 can the circuit etc. of connecting sensor circuit 22 and sidepiece.
Alternatively, according to embodiments more of the present utility model, fingerprint sensor assembly 20 can also comprise the encapsulated layer with upper opening, and sensor circuit 22 can be located in encapsulated layer, and the circuit of sensor circuit 22 or sensor circuit 22 can expose from upper opening.Specifically, the top of encapsulated layer can open wide formation upper opening at least partly, sensor circuit 22 comprises logicalnot circuit part and circuit, and circuit can expose from upper opening, and logicalnot circuit part can be exposed in upper opening, or does not expose.Thus, encapsulated layer can protect sensor circuit 22, can also ensure the fingerprint identification function of sensor circuit 22 simultaneously.
Wherein, when sensor circuit 22 exposes in encapsulated layer, namely when the circuit of sensor circuit 22 and logicalnot circuit part are all upwards exposed in encapsulated layer, the silicon wafer 21 of manufacture can be made as far as possible reasonably to use vertical space less, because the amount that the silicon wafer 21 of finger identification sensor encapsulates the extra vertical space used is limited comparatively speaking.Wherein, not limiting for the material preparing encapsulated layer, such as, can be plastics, resin or pottery etc.
Alternatively, fingerprint sensor assembly 20 can also comprise the soldered elements of at least one compression, and sensor circuit 22 can be coupled with soldered elements.Such as, in embodiments more of the present utility model, silicon wafer 21 is built as and comprises an assembly welding ball, and this assembly welding ball randomly (or pseudorandomly) is coupled with silicon wafer 21.Alternatively, soldered ball need not comprise actual solder, but can comprise other conductive materials, such as gold, other deformable metals, or in response to other conduction or semiconductor materials that the physical process of such as pressure and so on can be out of shape.
Next for the fingerprint sensor assembly 20 with encapsulated layer, soldered ball can be encapsulated in encapsulated layer, compression soldered ball and encapsulated layer, to soldered ball and encapsulated layer by the degree compressed.Thus, encapsulated layer is extruded away from soldered ball substantially, and soldered ball can be positioned between other elements of silicon wafer 21 and such as button and so on, with conducting electrical signals.Because soldered ball or other materials flatly disperse in their layer, therefore this also has such effect: their layer operation with the one deck below being transmitted to from one deck of top, not across their layer or any level conduction in their layer.
When silicon wafer 21 is coupled to button, this has such effect: the conduction between the capacitor plate of silicon wafer 21 and the surface of button strengthens; Simultaneously, Distance Shortened between the epidermis pointed due to user and silicon wafer 21, electric capacity between user's finger and silicon wafer 21 increases, and this can make again fingerprint sensor assembly 20 realize the capacitance sensing of the brilliance of the information in fingerprint to user, and fingerprint recognition is comparatively accurate.
Alternatively, equipment component 10 can be made up of at least one in glass, pottery and sapphire material.What material manufacture of concrete employing can be selected as required.Press section can be made up of anisotropic dielectric material.Such as, in some concrete examples of the utility model, press section adopts sapphire to make.Wherein, sapphire can be monocrystalline also can be polycrystalline.Sapphire has anisotropy, can make the epidermis (or optionally, the subcutaneous part of the finger of user) of sensor circuit 22 sensing user finger preferably.Thus, sensor circuit 22 by means of sapphire anisotropy, can show and point capacitive coupling remarkable comparatively speaking with user, and sensor circuit 22 will obtain one group of remarkable comparatively speaking information in fingerprint.
Certainly, press section can also be made up of one or more in llowing group of materials or its equivalent: aluminium oxide, glass or through chemically treated glass, through the chemically treated compound with its at least some feature, or has the another kind of compound of similarity.Similarly, under applicable circumstances, sensor circuit 22 can also utilize the electromagnetic property of other materials, with by means of these electromagnetic propertys, shows the capacitive coupling remarkable comparatively speaking pointed with user.
According to embodiments more of the present utility model, the upper surface of press section be formed as plane at least partially, this plane is suitable for and user's finger contacts.Thus, the placement of user's finger and the collection of user fingerprints is convenient to.
As shown in Figure 1, fingerprint recognition sensing apparatus 100 can also comprise pedestal 40, pedestal 40 has pilot hole 41, and equipment component 10 and fingerprint sensor assembly 20 can be arranged in pilot hole 41.Alternatively, pedestal 40 can adopt the anodized aluminum of such as SOS aluminium and so on to build.Can coordinate formation sunk structure between equipment component 10 with pedestal 40, as shown in Figure 1, pedestal 40 can arrange chamfering, a part for sunk structure can be formed by chamfering.
Thus, user's finger can be guided into the press section of equipment component 10 by sunk structure, and user is pointed can be located well, to carry out fingerprint recognition.Simultaneously, pedestal 40 can be used to provide electrical isolation or be used to shield galvanomagnetic effect, with the effect providing Capacitor apart or other electromagnetic isolation, the electric capacity measured is made to be that user points between fingerprint sensor assembly 20, instead of between any other object and fingerprint sensor assembly 20, fingerprint detection is more accurate.
The fingerprint recognition sensing apparatus 100 according to the utility model embodiment is comprised according to the electronic equipment of the utility model embodiment.Wherein, electronic equipment can be desktop computer etc.The fingerprint recognition sensing apparatus 100 according to the utility model embodiment is comprised according to the mobile device of the utility model embodiment.Mobile device can be mobile phone or panel computer etc.Wherein, the installation of fingerprint recognition sensing apparatus 100 on electronic equipment or mobile device and be appreciated that for a person skilled in the art with the annexation of miscellaneous part and easily realize, does not repeat them here.
To form according to other of the electronic equipment of the utility model embodiment and mobile device and operation is known for the person of ordinary skill of the art, be not described in detail at this.
In description of the present utility model, it will be appreciated that, orientation or the position relationship of the instruction such as term " " center ", " on ", D score, "front", "rear", " vertically ", " level ", " top ", " end ", " interior ", " outward " they be based on orientation shown in the drawings or position relationship; be only the utility model and simplified characterization for convenience of description; instead of instruction or imply the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as restriction of the present utility model.
In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise at least one this feature.In description of the present utility model, the implication of " multiple " is at least two, such as two, three etc., unless otherwise expressly limited specifically.
In the utility model, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or integral; Can be mechanical connection, also can be electrical connection or each other can communication; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals or the interaction relationship of two elements, unless otherwise clear and definite restriction.For the ordinary skill in the art, the concrete meaning of above-mentioned term in the utility model can be understood as the case may be.
In the utility model, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score can be that the first and second features directly contact, or the first and second features are by intermediary indirect contact.And, fisrt feature second feature " top " and " above " can be fisrt feature directly over second feature or oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " below " and " below " can be fisrt feature immediately below second feature or tiltedly below, or only represent that fisrt feature level height is less than second feature.
In the description of this instructions, specific features, structure, material or feature that the description of reference term " embodiment " or " specific embodiment ", " example " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present utility model or example.In this manual, to the schematic representation of above-mentioned term not must for be identical embodiment or example.And the specific features of description, structure, material or feature can combine in one or more embodiment in office or example in an appropriate manner.In addition, when not conflicting, the feature of the different embodiment described in this instructions or example and different embodiment or example can carry out combining and combining by those skilled in the art.
Although illustrate and described embodiment of the present utility model above, be understandable that, above-described embodiment is exemplary, can not be interpreted as restriction of the present utility model, those of ordinary skill in the art can change above-described embodiment, revises, replace and modification in scope of the present utility model.

Claims (10)

1. a fingerprint recognition sensing apparatus, is characterized in that, comprising:
Equipment component, described equipment component has the press section be suitable for user's finger contacts;
Fingerprint sensor assembly, described fingerprint sensor assembly is located at below equipment component, and described fingerprint sensor assembly can be coupled to the fingerprint of user's finger;
Response element, self action when described response element is formed at press section described in user's finger presses, to respond the action of described press section, wherein, described fingerprint sensor assembly is located at the position pointed closer to described user than described response element.
2. fingerprint recognition sensing apparatus according to claim 1, is characterized in that, described fingerprint sensor assembly comprises one group of capacitive element of the fingerprint that can be coupled to user's finger in a capacitive manner.
3. fingerprint recognition sensing apparatus according to claim 1, is characterized in that, described fingerprint sensor assembly comprises silicon wafer and sensor circuit, and described sensor circuit is arranged on the top of close user's finger of described silicon wafer.
4. fingerprint recognition sensing apparatus according to claim 3, is characterized in that, be formed with at least one through hole and/or at least one fluting in described silicon wafer, described sensor circuit is coupled with the closing line in being located at described through hole and/or slot.
5. fingerprint recognition sensing apparatus according to claim 3, it is characterized in that, described fingerprint sensor assembly also comprises the encapsulated layer with upper opening, described sensor circuit is located in described encapsulated layer, and the circuit of described sensor circuit or described sensor circuit exposes from described upper opening.
6. fingerprint recognition sensing apparatus according to claim 3, is characterized in that, described fingerprint sensor assembly also comprises the soldered elements of at least one compression, and described sensor circuit is coupled with described soldered elements.
7. fingerprint recognition sensing apparatus according to claim 1, is characterized in that, described equipment component is made up of at least one in glass, pottery and sapphire material and described press section is made up of anisotropic dielectric material.
8. the fingerprint recognition sensing apparatus according to any one of claim 1-7, is characterized in that, the upper surface of described button be formed as being suitable for the plane with user's finger contacts at least partially.
9. an electronic equipment, is characterized in that, comprises the fingerprint recognition sensing apparatus according to any one of claim 1-8.
10. a mobile device, is characterized in that, comprises the fingerprint recognition sensing apparatus according to any one of claim 1-8.
CN201520780291.0U 2015-10-09 2015-10-09 Fingerprint identification sensing apparatus, electronic equipment and mobile device Expired - Fee Related CN205193823U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520780291.0U CN205193823U (en) 2015-10-09 2015-10-09 Fingerprint identification sensing apparatus, electronic equipment and mobile device

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CN205193823U true CN205193823U (en) 2016-04-27

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105956583A (en) * 2016-06-29 2016-09-21 广东欧珀移动通信有限公司 Fingerprint recognition device and mobile terminal
CN107346966A (en) * 2017-04-26 2017-11-14 深圳信炜生物识别科技有限公司 Button assembly and electronic equipment
CN108629239A (en) * 2017-03-21 2018-10-09 南昌欧菲生物识别技术有限公司 Fingerprint Identification sensor and fingerprint recognition module

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105956583A (en) * 2016-06-29 2016-09-21 广东欧珀移动通信有限公司 Fingerprint recognition device and mobile terminal
CN105956583B (en) * 2016-06-29 2017-11-17 广东欧珀移动通信有限公司 Fingerprint identification device and mobile terminal
CN108629239A (en) * 2017-03-21 2018-10-09 南昌欧菲生物识别技术有限公司 Fingerprint Identification sensor and fingerprint recognition module
CN107346966A (en) * 2017-04-26 2017-11-14 深圳信炜生物识别科技有限公司 Button assembly and electronic equipment

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CP03 Change of name, title or address

Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18

Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd.

Address before: Changan town in Guangdong province Dongguan 523859 usha Beach Road No. 18

Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd.

CP03 Change of name, title or address
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160427

CF01 Termination of patent right due to non-payment of annual fee