CN205177864U

CN205177864U - Building integrated photovoltaic closes piece subassembly

Info

Publication number: CN205177864U
Application number: CN201520873665.3U
Authority: CN
Inventors: 蒋江涛
Original assignee: Luoyang Chuangsheng Energy Technology Co Ltd
Current assignee: Luoyang Chuangsheng Energy Technology Co Ltd
Priority date: 2015-10-29
Filing date: 2015-10-29
Publication date: 2016-04-20
Anticipated expiration: 2025-10-29

Abstract

The utility model discloses a building integrated photovoltaic closes piece subassembly. It includes two at least transparency glass plate to and be located two colored glass boards between the transparency glass plate, and transparency glass plate passes through viscous fluid form material and the colored glass board pastes tightly. Transparency glass plate's one side is equipped with the fixture block, is equipped with the draw -in groove that uses with the fixture block cooperation on the colored glass board, realizes the neat combination of transparency glass plate and colored glass board. The utility model discloses a building integrated photovoltaic closes piece subassembly can effectively block the ultraviolet ray, has the efficiency that gives sound insulation, keeps warm simultaneously, just the utility model discloses a building integrated photovoltaic closes piece subassembly is neat pleasing to the eye, has reduced unneccessary regular procedure, has improved work efficiency greatly, has apparent economic benefits.

Description

Chip module is closed in a kind of BIPV

Technical field

The utility model relates to a kind of BIPV and closes chip module.

Background technology

At present, the cost of domestic and international photovoltaic module is most important, has both required that outward appearance meets component calls, requires that again assembly reduces cost in process of production as far as possible, and the conjunction existing equipment of chip module and personnel cannot meet the demands.

Utility model content

For the deficiencies in the prior art, the purpose of this utility model is to provide a kind of BIPV to close chip module.

For realizing aforementioned utility model object, the technical solution adopted in the utility model comprises:

Chip module is closed in a kind of BIPV, comprises at least two transparency glass plates, and the coloured glass plate between two transparency glass plates, and transparency glass plate is adjacent to by viscous fluid shape material and coloured glass plate; The one side of described transparency glass plate is provided with fixture block, coloured glass plate be provided with fixture block with the use of draw-in groove, realize the neat combination of transparency glass plate and coloured glass plate.Described fixture block primarily of V-arrangement shell fragment, and makes the Compress Spring of V-arrangement shell fragment generation deformation form.

Among some embodiments, described transparency glass plate is different from the thickness of coloured glass plate, thus makes BIPV of the present utility model conjunction chip module have sound insulation effect.The thickness of described transparency glass plate is 1-2cm.The thickness of described coloured glass plate is 4-6cm.

Compared with prior art, advantage of the present utility model comprises:

Chip module is closed in BIPV of the present utility model can effective block ultraviolet, has sound insulation, warming effect simultaneously; And chip module neat appearance is closed in BIPV of the present utility model, decreases unnecessary regular program, substantially increases operating efficiency, have significant economic benefit.

Accompanying drawing explanation

Fig. 1 is the structural representation that chip module is closed in a kind of BIPV of the utility model;

Fig. 2 is the structural representation that fixture block and draw-in groove in chip module are closed in a kind of BIPV of the utility model;

Description of reference numerals: 1-transparency glass plate; 2-coloured glass plate; 3-fixture block; 301-V shape shell fragment; 302-stopper.

Embodiment

In view of deficiency of the prior art, this case utility model people, through studying for a long period of time and putting into practice in a large number, is proposed the technical solution of the utility model.To be further explained this technical scheme, its implementation process and principle etc. as follows.

Chip module is closed in a kind of BIPV, comprises at least two transparency glass plates, and the coloured glass plate between two transparency glass plates, and transparency glass plate is adjacent to by viscous fluid shape material and coloured glass plate; The one side of described transparency glass plate is provided with fixture block, coloured glass plate be provided with fixture block with the use of draw-in groove, realize the neat combination of transparency glass plate and coloured glass plate; Described fixture block primarily of V-arrangement shell fragment, and makes the Compress Spring of V-arrangement shell fragment generation deformation form.

Among some embodiments, described transparency glass plate is different from the thickness of coloured glass plate, thus makes BIPV of the present utility model conjunction chip module have sound insulation effect; The thickness of described transparency glass plate is 1-2cm; The thickness of described coloured glass plate is 4-6cm.

Preparation method of the present utility model is: the binding face of transparency glass plate and coloured glass plate is filled glue, afterwards fixture block is put into draw-in groove, and sliding slider, dry afterwards.

Should be appreciated that above-described embodiment is only and technical conceive of the present utility model and feature are described, its object is to person skilled in the art can be understood content of the present utility model and implement according to this, protection range of the present utility model can not be limited with this.All equivalences done according to the utility model Spirit Essence change or modify, and all should be encompassed within protection range of the present utility model.

Claims

1. a chip module is closed in BIPV, it is characterized in that: comprise at least two transparency glass plates, and the coloured glass plate between two transparency glass plates, and transparency glass plate is adjacent to by viscous fluid shape material and coloured glass plate; The one side of transparency glass plate is provided with fixture block, coloured glass plate be provided with fixture block with the use of draw-in groove; Fixture block primarily of V-arrangement shell fragment, and makes the Compress Spring of V-arrangement shell fragment generation deformation form, and the both sides of V-arrangement shell fragment are also provided with stopper.

2. chip module is closed in BIPV according to claim 1, it is characterized in that: the thickness of transparency glass plate is 1-2cm; The thickness of coloured glass plate is 4-6cm.