CN205141009U - A glass base circuit board for LED filament - Google Patents
A glass base circuit board for LED filament Download PDFInfo
- Publication number
- CN205141009U CN205141009U CN201520862284.5U CN201520862284U CN205141009U CN 205141009 U CN205141009 U CN 205141009U CN 201520862284 U CN201520862284 U CN 201520862284U CN 205141009 U CN205141009 U CN 205141009U
- Authority
- CN
- China
- Prior art keywords
- resistance
- glass substrate
- glass
- led
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model provides a glass base circuit board for LED filament, including glass substrate, set up one deck ITO thin layer on this glass substrate through etching process formation line layer on the ITO thin layer, and the solid crystalline region of the last formation of glass substrate the line layer is equipped with resistance pattern and passes through sputtering technology deposit ITO material formation above that resistance, gu the crystalline region is used for setting up LED chip and the laminiform one -tenth electrical connection of and gate. Adopt the technical scheme of the utility model, owing to adopt glass substrate to make the LED chip really realize 360 light -emittings, promoted the three -dimensional light -emitting effect of LED filament greatly, the conducting layer adopts the ITO material simultaneously, and its resistivity is more than metals such as copper, so can form resistance by direct deposit ITO material on the line layer to do not need the welding resistance component, and guaranteed resistance element's uniformity and stability, thus the life of extension LED filament.
Description
Technical field
The utility model relates to LED circuit board technical field, particularly relates to a kind of glass-based wiring board for LED silk.
Background technology
Along with the continuous maturation of LED technology, conventional incandescent will gradually replace by LED silk lamp.In order to increase lighting area and angle, LED silk lamp is usually mutually spliced by many LED silks and forms.In prior art, LED silk adopts the alternatively non-transparent substrates such as metal substrate usually, can only one side printing opacity, and the rising angle of its single LED silk can only be 180 ° at most, which greatly limits the illumination effect of LED.Simultaneously in prior art, resistive element on LED silk adopts Chip-R to be fixed on LED silk in a welding manner usually, the consistency of Chip-R and stability exist and cannot be guaranteed, especially when the LED filament length time uses, the life-span of meeting extreme influence LED silk, in preparation process, add one paster technique simultaneously, add the complexity of LED silk preparation technology.
Therefore, for the above-mentioned defect existed in currently available technology, be necessary to study in fact, to provide a kind of scheme, solve the defect existed in prior art.
Utility model content
In order to solve prior art Problems existing, the purpose of this utility model is to provide a kind of and achieves the glass-based wiring board of 360 ° of bright dippings for LED silk.
In order to overcome the defect of prior art, the technical solution of the utility model is:
A kind of glass-based wiring board for LED silk, comprise glass substrate, this glass substrate is arranged one deck ito thin film layer, described ito thin film layer forms line layer by etching technics, and crystal bonding area is formed on described glass substrate, be provided with resistance pattern at described line layer and deposited ITO material formation resistance by sputtering technology thereon; Described crystal bonding area is used for arranging LED chip and is formed with line layer and is electrically connected.
Preferably, described ito thin film layer is formed on described glass substrate by sputtering technology.
Preferably, described ito thin film layer is formed on described glass substrate by spraying coating process.
Preferably, control according to the resistance of described resistance the ITO material depositing respective amount on the resistance pattern of described line layer, thus realize the resistance that different resistance is set.
Preferably, described glass substrate is strip.
Preferably, described crystal bonding area is provided with support, and described LED chip is arranged on the bracket by crystal-bonding adhesive.
Preferably, described ito thin film layer is 35 μm ~ 280 μm.
Relative to prior art, adopt the technical solution of the utility model, owing to adopting glass substrate, thus make LED chip really realize 360 ° of bright dippings, greatly improve the three-dimensional light-out effect of LED silk; Conductive layer adopts ITO material simultaneously, its resistivity much larger than metals such as copper, therefore can form resistance by Direct precipitation ITO material on line layer, thus does not need welding kesistance element, and ensure that consistency and the stability of resistive element, thus extend the useful life of LED silk.
Accompanying drawing explanation
The structural representation of a kind of glass-based wiring board for LED silk that Fig. 1 provides for the utility model embodiment.
The planar structure schematic diagram of a kind of glass-based wiring board for LED silk that Fig. 2 provides for the utility model embodiment.
Embodiment
Be below specific embodiment of the utility model and by reference to the accompanying drawings, the technical solution of the utility model is further described, but the utility model be not limited to these embodiments.
In order to overcome the defect that prior art exists, refer to Fig. 1 and Fig. 2, be depicted as the structural representation of a kind of glass-based wiring board for LED silk that the utility model embodiment provides, comprise glass substrate 1, glass substrate 1 is one piece of thin glass sheet, its surperficial unusual light, light transmittance is more than 95%.Glass substrate 1 arranges one deck ITO (tin indium oxide) thin layer 2, and ito thin film layer 2 is by sputtering technology or is formed on described glass substrate 1 by spraying coating process, and its thickness is 35 μm ~ 280 μm.Material ITO (tin indium oxide) has superior electrical conduction and optically transparent characteristic simultaneously, is widely used as transparent conductive plated film.Owing to adopting glass substrate, thus make LED chip really realize 360 ° of bright dippings, greatly improve the three-dimensional light-out effect of LED silk.
Ito thin film layer 2 is as conductive layer, and its effect is similar to copper foil layer of the prior art.Circuitous pattern can be printed on ito thin film layer 2 by photoresist mask etch technique, also namely on ito thin film layer 2, line layer 3 is formed by etching technics, on glass substrate 1, form crystal bonding area 5, crystal bonding area 5 is electrically connected for arranging LED chip and being formed with line layer 3 simultaneously.Be provided with resistance pattern at line layer and deposited ITO material by sputtering technology thereon and form resistance 4.
Because the resistivity of ITO material is much larger than metals such as copper, therefore resistance 4 can be directly set on ito thin film layer 2.Namely in the resistive element position of circuitous pattern, control at the corresponding resistance pattern of described line layer 3 and the ITO material depositing respective amount thereon according to the resistance of resistance 4, thus realize the resistance that different resistance is set.According to the size of its resistance by the size of resistance pattern and deposit ITO material thickness determine, can calculate according to the resistivity of ITO material.Owing to directly forming resistance 4 on ito thin film layer 2, greatly improve consistency and the stability of resistive element, do not need welding kesistance element simultaneously, greatly promote the performance and used life of LED silk.
In a preferred embodiment, glass substrate is strip, adapts with the shape of LED silk.
In a preferred embodiment, crystal bonding area 5 is provided with support, and LED chip is arranged on the bracket by crystal-bonding adhesive.
In a preferred embodiment, arrange loophole in crystal bonding area 5, LED chip arranges this loophole by crystal-bonding adhesive, and LED chip is connected with line layer in the mode of gold thread bonding.Thus strengthen stereo luminous effect further.
The explanation of above embodiment just understands method of the present utility model and core concept thereof for helping.Should be understood that; for those skilled in the art; under the prerequisite not departing from the utility model principle, can also carry out some improvement and modification to the utility model, these improve and modify and also fall in the protection range of the utility model claim.Be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can realize in other embodiments when not departing from spirit or scope of the present utility model.Therefore, the utility model can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (7)
1. the glass-based wiring board for LED silk, it is characterized in that, comprise glass substrate, this glass substrate is arranged one deck ito thin film layer, described ito thin film layer forms line layer by etching technics, and crystal bonding area is formed on described glass substrate, be provided with resistance pattern at described line layer and deposited ITO material formation resistance by sputtering technology thereon; Described crystal bonding area is used for arranging LED chip and is formed with line layer and is electrically connected.
2., as claimed in claim 1 for the glass-based wiring board of LED silk, it is characterized in that, described ito thin film layer is formed on described glass substrate by sputtering technology.
3., as claimed in claim 1 for the glass-based wiring board of LED silk, it is characterized in that, described ito thin film layer is formed on described glass substrate by spraying coating process.
4. as claimed in claim 1 for the glass-based wiring board of LED silk, it is characterized in that, control according to the resistance of described resistance the ITO material depositing respective amount on the resistance pattern of described line layer, thus realize the resistance that different resistance is set.
5., as claimed in claim 1 for the glass-based wiring board of LED silk, it is characterized in that, described glass substrate is strip.
6., as claimed in claim 1 for the glass-based wiring board of LED silk, it is characterized in that, described crystal bonding area is provided with support, and described LED chip is arranged on the bracket by crystal-bonding adhesive.
7., as claimed in claim 1 for the glass-based wiring board of LED silk, it is characterized in that, described ito thin film layer is 35 μm ~ 280 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520862284.5U CN205141009U (en) | 2015-10-31 | 2015-10-31 | A glass base circuit board for LED filament |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520862284.5U CN205141009U (en) | 2015-10-31 | 2015-10-31 | A glass base circuit board for LED filament |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205141009U true CN205141009U (en) | 2016-04-06 |
Family
ID=55626771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520862284.5U Expired - Fee Related CN205141009U (en) | 2015-10-31 | 2015-10-31 | A glass base circuit board for LED filament |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205141009U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105355754A (en) * | 2015-10-31 | 2016-02-24 | 嘉兴市上村电子有限公司 | Glass-based circuit board for LED filaments |
-
2015
- 2015-10-31 CN CN201520862284.5U patent/CN205141009U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105355754A (en) * | 2015-10-31 | 2016-02-24 | 嘉兴市上村电子有限公司 | Glass-based circuit board for LED filaments |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI693459B (en) | Transparent light emitting device display | |
| KR102129674B1 (en) | Electrode substrate for transparent light emitting device display and method for manufacturing thereof | |
| CN103257748B (en) | Contact panel and manufacture method | |
| CN107482039B (en) | Flexible touch mother board, preparation method, flexible touch substrate and touch panel | |
| TW201409336A (en) | Thin film sensor, capacitive touch panel having the same, preparation method thereof and terminal product | |
| JP2021516785A (en) | Electrode substrate for transparent light emitting element display and transparent light emitting element display including this | |
| CN205141009U (en) | A glass base circuit board for LED filament | |
| US20140290980A1 (en) | Touch screen and method of producing the same | |
| CN108361573A (en) | A kind of production method of light bar | |
| CN205141012U (en) | A transparent ceramic base circuit board for LED filament | |
| JP2013153117A (en) | Interior led lighting substrate | |
| CN205159355U (en) | Transparent ceramic base plate LED filament | |
| CN105355754A (en) | Glass-based circuit board for LED filaments | |
| CN205141010U (en) | A sapphire base circuit board for LED filament | |
| CN105355755A (en) | LED filament based on glass substrate | |
| CN205141011U (en) | LED filament based on glass substrate | |
| TWI687747B (en) | Transparent light emitting device display | |
| CN205122631U (en) | Glass substrate LED filament | |
| CN205140968U (en) | LED filament based on transparent ceramic base plate | |
| CN208207770U (en) | A kind of flexible touch display screen | |
| CN205140981U (en) | Sapphire base plate LED filament | |
| CN105355623A (en) | LED filament based on transparent ceramic substrate | |
| CN105355756A (en) | Transparent ceramic-based circuit board for LED filaments | |
| CN204331654U (en) | Touch screen | |
| CN202309666U (en) | Touch induction key |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160406 Termination date: 20161031 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |