CN205133783U - Plating device - Google Patents

Plating device Download PDF

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Publication number
CN205133783U
CN205133783U CN201520888622.2U CN201520888622U CN205133783U CN 205133783 U CN205133783 U CN 205133783U CN 201520888622 U CN201520888622 U CN 201520888622U CN 205133783 U CN205133783 U CN 205133783U
Authority
CN
China
Prior art keywords
plating tank
electrolytic solution
computer program
plating
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520888622.2U
Other languages
Chinese (zh)
Inventor
钱君
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangxi Province Jiujiang City Sanlian Electroplating Co Ltd
Original Assignee
Jiangxi Province Jiujiang City Sanlian Electroplating Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangxi Province Jiujiang City Sanlian Electroplating Co Ltd filed Critical Jiangxi Province Jiujiang City Sanlian Electroplating Co Ltd
Priority to CN201520888622.2U priority Critical patent/CN205133783U/en
Application granted granted Critical
Publication of CN205133783U publication Critical patent/CN205133783U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

In order to overcome not enough that a current plating device exists, the utility model provides a plating device, the utility model discloses a plating bath, DC power supply, positive pole, negative pole wire, fixed baseplate, work piece supporting part, electrolyte spray controlling means, electrolyte spout, computer program input, this plating device can utilize the process of computer program control electroplating.

Description

A kind of electroplanting device
Technical field
The utility model relates to a kind of electroplanting device field devices, especially a kind of a kind of electroplanting device that computer program can be utilized to control the process of plating.
Background technology
At present, known a kind of electroplanting device structure is plating tank, direct supply, anode, cathode wire, permanent seat, workpiece support section.This kind of electroplanting device, can not control the process of electroplating.
Summary of the invention
In order to overcome the deficiency that existing a kind of electroplanting device exists, the utility model provides a kind of electroplanting device, this kind of electroplanting device, and computer program can be utilized to control the process of plating.
The utility model solves the technical scheme that its technical problem adopts: the utility model comprises plating tank, direct supply, anode, cathode wire, permanent seat, workpiece support section, electrolytic solution ejection control device, electrolytic solution spout, computer program input terminus.The beneficial effects of the utility model are, computer program can be utilized to control the process of plating.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is the structural map of a kind of electroplanting device first embodiment.
In figure
1. plating tank
2. direct supply
3. anode
4. cathode wire
5. permanent seat
6. workpiece support section
7. electrolytic solution ejection control device
8. electrolytic solution spout
9. computer program input terminus.
Embodiment
In the embodiment shown in fig. 1, the utility model comprises plating tank (1), direct supply (2), anode (3), cathode wire (4), permanent seat (5), workpiece support section (6), electrolytic solution ejection control device (7), electrolytic solution spout (8), computer program input terminus (9).
Electroplanting device comprises plating tank (1), is filled with enough electroplate liquids in plating tank.Comprise the anode (3) that a plating metal material is made in plating tank (1), this anode metal is wired to a direct supply (2).The other end of direct supply (2) is connected to a workpiece permanent seat (5) by cathode wire (4).Workpiece permanent seat inner top comprises a workpiece support section (6), an electrolytic solution ejection control device (7) the left side cell wall of plating tank (1) is equipped with, electrolytic solution spout (8) is contained on electrolytic solution ejection control device (7), the outer wall of plating tank (1) has a computer program input terminus (9).
As known by the technical knowledge, the utility model can be realized by other the embodiment not departing from its spirit or essential feature.Above-mentioned disclosed embodiment, with regard to each side, all just illustrates, is not only.Allly all to be included in the utility model within the scope of the utility model or being equal to the change in scope of the present utility model.

Claims (3)

1. an electroplanting device, comprise plating tank (1), direct supply (2), anode (3), cathode wire (4), permanent seat (5), workpiece support section (6), electrolytic solution ejection control device (7), electrolytic solution spout (8), computer program input terminus (9), it is characterized in that: electroplanting device comprises plating tank (1), is filled with enough electroplate liquids in plating tank; Comprise the anode (3) that a plating metal material is made in plating tank (1), this anode metal is wired to a direct supply (2).
2. a kind of electroplanting device according to claim 1, it is characterized in that: workpiece permanent seat inner top comprises a workpiece support section (6), an electrolytic solution ejection control device (7) the left side cell wall of plating tank (1) is equipped with, electrolytic solution spout (8) is contained on electrolytic solution ejection control device (7), the outer wall of plating tank (1) has a computer program input terminus (9).
3. a kind of electroplanting device according to claim 1, is characterized in that: the other end of direct supply (2) is connected to a workpiece permanent seat (5) by cathode wire (4).
CN201520888622.2U 2015-11-09 2015-11-09 Plating device Expired - Fee Related CN205133783U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520888622.2U CN205133783U (en) 2015-11-09 2015-11-09 Plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520888622.2U CN205133783U (en) 2015-11-09 2015-11-09 Plating device

Publications (1)

Publication Number Publication Date
CN205133783U true CN205133783U (en) 2016-04-06

Family

ID=55619591

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520888622.2U Expired - Fee Related CN205133783U (en) 2015-11-09 2015-11-09 Plating device

Country Status (1)

Country Link
CN (1) CN205133783U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160406

Termination date: 20171109