CN205119837U - Copper cooling arrangement cools off water course with brazing filler metal seal structure - Google Patents
Copper cooling arrangement cools off water course with brazing filler metal seal structure Download PDFInfo
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- CN205119837U CN205119837U CN201520861160.5U CN201520861160U CN205119837U CN 205119837 U CN205119837 U CN 205119837U CN 201520861160 U CN201520861160 U CN 201520861160U CN 205119837 U CN205119837 U CN 205119837U
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- cooling water
- filler metal
- brazing filler
- solder
- end cap
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Abstract
The utility model provides a copper cooling arrangement cools off water course with brazing filler metal seal structure, is including cooling water course body, end cap, the seal port of cooling water course body, its characterized in that are filled in to the end cap: cooling water course seal structure still includes the brazing filler metal ring, the end cap is opened has the brazing filler metal ring mounting groove that is used for settling the brazing filler metal ring, the brazing filler metal layer is filled up in clearance between end cap and the cooling water course body, the end cap top is the welding seam sealing layer. Compared with the prior art, the beneficial effects of the utility model are that, owing to filled up by the brazing filler metal earlier between end cap and the body, play earlier the sealed effect of first layer, fang zaijia welds the one deck welding seam, forms the welding seam sealing layer that has sealed effect above that, and to carry out the second floor sealed, and this has improved copper cooling arrangement sealed reliability in the use greatly, and even the welding seam of end cap top is corroded, the brazing filler metal layer is sealed in addition, has lengthened the life of copper cooling arrangement cooling water course by a wide margin.
Description
Technical field
The utility model relates to the cooling water channel of the copper cooling device of a kind of blast furnace or electric furnace, more specifically to a kind of copper cooling device cooling water channel with solder hermetically-sealed construction that can play better sealing effectiveness.
Background technology
Existing blast furnace or electric furnace in use, usually adopt plug to clog cooling water channel, then plug and body are welded together.Like this, the sealing of copper cooling device cooling water channel, mainly relies on the weld seam above plug and plug to realize.Inherently see, the water channel hermetically-sealed construction of traditional copper cooling device is made up of two-layer hermetically-sealed construction.There is certain interval between plug and cooling water channel madial wall, good sealing effectiveness cannot be played, once after plug weld seam is etched, just easily occur leaking water problem.
Summary of the invention
Technical problem to be solved in the utility model only relies on weld seam and plug to seal for prior art, weld seam is etched rear shortcoming of easily leaking, a kind of copper cooling device cooling water channel with solder hermetically-sealed construction is provided, this copper cooling device cooling water channel with solder hermetically-sealed construction can strengthen the sealing property of cooling water channel sealing structure, leaks after avoiding weld seam to be etched.The technical scheme adopted is as follows:
A kind of copper cooling device cooling water channel with solder hermetically-sealed construction, comprise cooling water channel body, plug, described plug fills in the seal of cooling water channel body, it is characterized in that: described cooling water channel sealing structure also comprises solder ring, described plug has the solder ring mounting groove for settling solder ring, solder layer is filled up in gap between described plug and cooling water channel body, is weld joint close sealing above described plug.By first soldering, solder ring is melted, due to the siphon principle of soldering, the gap between plug and cooling water channel body fill up by solder, add one deck weld seam again above last plug.Owing to first being filled up by solder between plug and cooling water channel body, play the effect of sealing, be welded with one deck weld seam up, also have the sealing of many one decks.Improve the reliability that copper cooling device in use seals: the weld seam namely above plug is etched, also have solder layer sealing, extend service life.
The first is scheme preferably, and described solder ring mounting groove is positioned at plug top.The advantage of this scheme is convenient to processing.
The second is scheme preferably, and described solder ring mounting groove is positioned in the middle part of plug.The advantage of this scheme is that solder layer separates substantially with weld joint close sealing, makes solder layer be not easy to be subject to the impact of weld joint close sealing.
The third is scheme preferably, and described solder ring mounting groove is positioned at bottom plug.The advantage of this scheme is that solder layer separates with weld joint close sealing, makes solder layer can not be subject to the impact of weld joint close sealing.
The utility model beneficial effect is against existing technologies, owing to first being filled up by solder between plug and body, first play ground floor sealing function, be welded with one deck weld seam above it again, form the weld joint close sealing with sealing function, carry out second layer sealing, which greatly enhances the reliability that copper cooling device in use seals, even if the weld seam above plug is etched, also have the sealing of solder layer, significantly extend the service life of copper cooling device cooling water channel.
Accompanying drawing explanation
Fig. 1 is that solder ring is installed to the structural representation after in solder ring mounting groove by the utility model embodiment 1;
Fig. 2 is the structural representation after the utility model embodiment 1 solder ring melts;
Fig. 3 is the structural representation after the utility model embodiment 1 increases weld seam;
Fig. 4 is that solder ring is installed to the structural representation after in solder ring mounting groove by the utility model embodiment 2;
Fig. 5 is the structural representation after the utility model embodiment 2 solder ring melts;
Fig. 6 is the structural representation after the utility model embodiment 2 increases weld seam;
Fig. 7 is that solder ring is installed to the structural representation after in solder ring mounting groove by the utility model embodiment 3;
Fig. 8 is the structural representation after the utility model embodiment 3 solder ring melts;
Fig. 9 is the structural representation after the utility model embodiment 3 increases weld seam.
Detailed description of the invention
Embodiment 1
As shown in Figure 3, the copper cooling device cooling water channel with solder hermetically-sealed construction in the present embodiment, comprise cooling water channel body 1, plug 2, solder ring 3, described plug 2 fills in the seal 101 of cooling water channel body 1, described plug 2 has the solder ring mounting groove 4 for settling solder ring 3, solder layer 5 is filled up in gap between described plug 2 and cooling water channel body 1, is weld joint close sealing 6 above described plug 2.
The first solder ring mounting groove 4 described is positioned at plug 2 top.
As Figure 1-3, first solder ring 3 is installed in solder ring mounting groove 4, then by soldering, solder ring 3 is melted, due to the siphon principle of soldering, gap between plug 2 and cooling water channel body 1 fill up by solder, form solder layer 5, finally above plug 2, weld one deck weld seam again, form weld joint close sealing 6.
Owing to first being filled up by solder between plug 2 and cooling water channel body 1, play the effect of sealing, be welded with one deck weld seam up, also have the sealing of many one decks.Improve the reliability that copper cooling device in use seals: the weld seam namely above plug 2 is etched, also have solder layer 5 to seal, extend service life.
The advantage of this scheme is convenient to processing, but solder layer 5 may be connected with weld joint close sealing 6, makes solder layer 5 easily be subject to the impact of weld joint close sealing 6.
Embodiment 2
As shown in Figure 6, the difference of the copper cooling device cooling water channel and embodiment 1 with solder hermetically-sealed construction in the present embodiment is:
Described the second solder ring mounting groove 4 ＇ is positioned at plug 2 middle-end.
Fig. 4-6 is schematic diagrames of the cooling water channel sealing structure of copper cooling device in the present embodiment in process.
The advantage of this scheme is that solder layer 5 separates substantially with weld joint close sealing 6, makes solder layer 5 be not easy to be subject to the impact of weld joint close sealing 6.
Embodiment 3
As shown in Figure 9, the difference of the copper cooling device cooling water channel and embodiment 1 with solder hermetically-sealed construction in the present embodiment is:
Described the third solder ring mounting groove 4 ＂ is positioned at plug 2 middle-end.
Fig. 7-9 is schematic diagrames of the cooling water channel sealing structure of copper cooling device in the present embodiment in process.
The advantage of this scheme is that solder layer 5 separates with weld joint close sealing 6, makes solder layer 5 can not be subject to the impact of weld joint close sealing 6.
In addition; it should be noted that, the specific embodiment described in this description, its each several part title etc. can be different; all equivalences of doing according to structure, feature and the principle described in the utility model inventional idea or simple change, be included in the protection domain of the utility model patent.The utility model person of ordinary skill in the field can make various amendment or supplements or adopt similar mode to substitute to described specific embodiment; only otherwise depart from structure of the present utility model or surmount this scope as defined in the claims, protection domain of the present utility model all should be belonged to.
Claims (4)
1. one kind has the copper cooling device cooling water channel of solder hermetically-sealed construction, comprise cooling water channel body, plug, described plug fills in the seal of cooling water channel body, it is characterized in that: described cooling water channel sealing structure also comprises solder ring, described plug has the solder ring mounting groove for settling solder ring, solder layer is filled up in gap between described plug and cooling water channel body, is weld joint close sealing above described plug.
2. there is the copper cooling device cooling water channel of solder hermetically-sealed construction as claimed in claim 1, it is characterized in that: described solder ring mounting groove is positioned at plug top.
3. there is the copper cooling device cooling water channel of solder hermetically-sealed construction as claimed in claim 1, it is characterized in that: described solder ring mounting groove is positioned in the middle part of plug.
4. there is the copper cooling device cooling water channel of solder hermetically-sealed construction as claimed in claim 1, it is characterized in that: described solder ring mounting groove is positioned at bottom plug.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520861160.5U CN205119837U (en) | 2015-11-02 | 2015-11-02 | Copper cooling arrangement cools off water course with brazing filler metal seal structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520861160.5U CN205119837U (en) | 2015-11-02 | 2015-11-02 | Copper cooling arrangement cools off water course with brazing filler metal seal structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205119837U true CN205119837U (en) | 2016-03-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520861160.5U Active CN205119837U (en) | 2015-11-02 | 2015-11-02 | Copper cooling arrangement cools off water course with brazing filler metal seal structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112077409A (en) * | 2020-08-31 | 2020-12-15 | 温州俊安液压科技有限公司 | Magnetic sleeve and processing technology thereof |
| CN115488461A (en) * | 2022-11-15 | 2022-12-20 | 西安热工研究院有限公司 | Brazing plug for blocking heat transfer pipe and blocking method |
-
2015
- 2015-11-02 CN CN201520861160.5U patent/CN205119837U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112077409A (en) * | 2020-08-31 | 2020-12-15 | 温州俊安液压科技有限公司 | Magnetic sleeve and processing technology thereof |
| CN115488461A (en) * | 2022-11-15 | 2022-12-20 | 西安热工研究院有限公司 | Brazing plug for blocking heat transfer pipe and blocking method |
| CN115488461B (en) * | 2022-11-15 | 2023-03-24 | 西安热工研究院有限公司 | Brazing plug for blocking heat transfer pipe and blocking method |
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