CN205103520U - Polymer dispersed liquid crystal gluing packaging structure with soft board joint area - Google Patents
Polymer dispersed liquid crystal gluing packaging structure with soft board joint area Download PDFInfo
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- CN205103520U CN205103520U CN201520874794.4U CN201520874794U CN205103520U CN 205103520 U CN205103520 U CN 205103520U CN 201520874794 U CN201520874794 U CN 201520874794U CN 205103520 U CN205103520 U CN 205103520U
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- liquid crystal
- layer
- polymer dispersed
- dispersed liquid
- soft board
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- 239000004983 Polymer Dispersed Liquid Crystal Substances 0.000 title claims abstract description 75
- 238000004806 packaging method and process Methods 0.000 title abstract description 4
- 238000004026 adhesive bonding Methods 0.000 title abstract 2
- 239000002131 composite material Substances 0.000 claims abstract description 21
- 238000009413 insulation Methods 0.000 claims abstract description 13
- 230000003287 optical effect Effects 0.000 claims abstract description 13
- 239000010410 layer Substances 0.000 claims description 93
- 239000004020 conductor Substances 0.000 claims description 30
- 238000006073 displacement reaction Methods 0.000 claims description 23
- 238000004804 winding Methods 0.000 claims description 23
- 239000003292 glue Substances 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 18
- 239000011521 glass Substances 0.000 claims description 17
- 239000008188 pellet Substances 0.000 claims description 10
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000011229 interlayer Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000012943 hotmelt Substances 0.000 claims description 2
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 abstract 2
- 239000004973 liquid crystal related substance Substances 0.000 description 10
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 10
- 230000000694 effects Effects 0.000 description 6
- 238000003475 lamination Methods 0.000 description 6
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 2
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229920002972 Acrylic fiber Polymers 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- HGAZMNJKRQFZKS-UHFFFAOYSA-N chloroethene;ethenyl acetate Chemical compound ClC=C.CC(=O)OC=C HGAZMNJKRQFZKS-UHFFFAOYSA-N 0.000 description 1
- 238000013036 cure process Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 244000144985 peep Species 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000004984 smart glass Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Landscapes
- Liquid Crystal (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
A polymer dispersed liquid crystal (PLDC) gluing packaging structure with a soft board joint area comprises: a PLDC composite layer, two soft boards, an insulation layer, an optical cementing layer, an upper light transmission layer and a lower light transmission layer. The PLDC layer has one upper notch and one lower notch for the upper and the lower wires to be exposed and connected electrically to the two soft boards, and after the two soft boards are connected electrically, one insulating layer is filled inside the upper and the lower notches to provide one smooth insulating structure for the upper and the lower wire distributing areas and prolong the service life of the wire distributing area. In addition, the PDLC composite layer is combined with the upper and lower light-transmitting layers by the optical cementing layer to form a PDLC cementing packaging structure which has high smoothness, high cementing yield and difficult generation of cementing bubbles, and provides a higher-strength appearance for the whole structure so as to be beneficial to the use of an intelligent window of a building or a vehicle.
Description
Technical field
The utility model relates to a transparent encapsulating structure, particularly relate to a kind of in conjunction with a glued construction in cementing layer further clamping one containing the PDLC lamination layer structure of flexible flat cable.
Background technology
A kind of existing high polymer dispersed liquid crystal (PolymerDispersedLiquidCrystal; PDLC), utilize anisotropy liquid crystal droplet to be uniformly distributed in macromolecule, utilize electric field controls LCD alignment reach control light by with the effect of covering, namely market is often referred to as intelligence (wisdom) window (SmartWindows).As, be applied to green can building materials as the wisdom window of outdoor version window or car, ship, aircraft glass avoid privacy to peep stealing and shading energy-saving effect.
Cover energy-saving application for what coordinate building materials or mobile carrier, PDLC material directly can be packaged in electro-conductive glass structure, and structure based security requirement further, can further with glued construction in conjunction with utilization.
So-called glued construction, for glyglass, its structure arranges the bonding coat of a clear adhesive material as PVB ((PolyvinylButyral) polyvinyl butyral resin) between the photic zone structure of two-layer or more layer, then about 70 degree Celsius are heated to, with roller bearing, the air between interlayer is extruded again, allow PVB glue that two photic zone structures are tightly sticked together.Such as glyglass, can between two-layer glass clamping PVB glue, the thickness requirements of PVB glue can coordinate relevant safety regulations require and adjust, and then forms through pressing.Can also gain in strength with more multi-layered, thicker glass.When the glass on glyglass by cracked time, bonding coat still can stick together layer glass, avoids monolithic glass to be broken into the fragment that can hurt sb.'s feelings.Therefore be widely used in life, as the glass as car, ship, aircraft utilization on house articles for use door and window, tables and chairs ornaments or transport vehicle.
And in recent years PDLC lamination layer structure can be formed by stacking with soft conductive plastics film, through technology, PDLC lamination layer structure and glyglass can be packaged together easily, only wherein directly use is electrically connected with plain conductor for the two panels conductive glue slice in PDLC lamination layer structure, this joint (bonding) region generating unit branch affects structure and life problems needs to be designed improvement, such as a kind of technology avoids this wire engaging zones, this engaging zones is exposed to outside this packaging area, shortcoming is that this wire engaging zones exposes and easily has life problems.Maybe this conductive bond region is directly packaged in glass structure again, the planarization of this metal connection is made easily to produce structural issue, and easily produce bubble in encapsulation process, in addition for the wet effect of choke and resistance extending PDLC composite bed is to extend the life-span of encapsulating structure, further in addition design consideration is also needed for the insulated barriers in integrated circuit region, in order to the lengthening in electrically operation and serviceable life.
Utility model content
Fundamental purpose of the present utility model, be to provide a kind of PDLC to glue together encapsulating structure, be the structure improving PDLC composite bed utilize PVB involution glue to be combined into two photic zones planarization is high, pressing yield is high, and the PDLC not easily producing pressing bubble glues together encapsulating structure, for one-piece construction, the higher outward appearance of an intensity is provided to be beneficial to build or the wisdom window purposes of the vehicles such as car, ship or aircraft tool security.
Another object of the present utility model, be that the winding displacement region of PDLC composite bed connects, to replace existing metallic conduction structure, then in conjunction with an insulation course with soft board or electrical property of flat cable, make winding displacement region provide a novel smooth insulation system, the life-span in relevant winding displacement region can be extended.
For reaching above-mentioned purpose, the utility model provides a kind of high polymer dispersed liquid crystal gummed encapsulating structure with soft board engaging zones, is electrically connected, it is characterized in that, comprising with the control module of outside and supply unit:
One high polymer dispersed liquid crystal composite bed, comprises:
Transparency carrier on one, on it, side mask has hardened layer and side on one to have breach on;
Transparency conducting layer on one, being electrically connected with this control module is located on a side of hardened layer on this, on this, transparency conducting layer includes circuit region on, one with this on many upper conductors being electrically connected of circuit region, and one and the upper winding displacement district that is electrically connected of those upper conductors;
Transparency carrier once, on it, side mask has hardened layer, and side has breach;
Transparency conducting layer once, be electrically connected with this control module, and be located on this lower hardened layer one side corresponding with transparency conducting layer on this, this lower transparency conducting layer includes circuit region, one lower wire of many be electrically connected with this lower circuit region, and one and the lower winding displacement district that is electrically connected of those lower wires;
One polymer dispersed liquid crystal layer, is located at transparency conducting layer and this lower electrically conducting transparent interlayer on this;
Two soft boards, on it one end and on this upper conductor in winding displacement district and the lower wire in this lower winding displacement district be electrically connected; The other end and this outside control module and this supply unit;
One insulation course, to be located on this in breach and this lower breach;
One optical veneering layer, is coated on the surface of this high polymer dispersed liquid crystal composite bed;
One upper photic zone, is located on a side of this optical veneering layer; And
Photic zone once, penetrates on the another side of this optical veneering layer.
The above-mentioned high polymer dispersed liquid crystal gummed encapsulating structure with soft board engaging zones, wherein on this, transparency carrier, this lower transparency carrier are light-passing plastic or transparent glass substrate.
The above-mentioned high polymer dispersed liquid crystal gummed encapsulating structure with soft board engaging zones, wherein on this, transparency conducting layer, this lower transparency conducting layer are inorganic conductor material or organic conductor material.
The above-mentioned high polymer dispersed liquid crystal gummed encapsulating structure with soft board engaging zones, wherein this organic conductor material is the conductive material being mixed with CNT or poly-3,4-ethylene dioxythiophene.
The above-mentioned high polymer dispersed liquid crystal gummed encapsulating structure with soft board engaging zones, wherein on this, transparency conducting layer, this lower electrically conducting transparent layer thickness are 100nm ~ 10um.
The above-mentioned high polymer dispersed liquid crystal gummed encapsulating structure with soft board engaging zones, wherein this polymer dispersed liquid crystal layer thickness is 1um ~ 100um.
The above-mentioned high polymer dispersed liquid crystal gummed encapsulating structure with soft board engaging zones, wherein the thickness of this two soft board is respectively 50um ~ 500um.
The above-mentioned high polymer dispersed liquid crystal gummed encapsulating structure with soft board engaging zones, wherein has a conduction bonding coat between this soft board and those upper conductors and those lower wires.
The above-mentioned high polymer dispersed liquid crystal gummed encapsulating structure with soft board engaging zones, wherein this conduction bonding coat is elargol.
The above-mentioned high polymer dispersed liquid crystal gummed encapsulating structure with soft board engaging zones, wherein this insulation course is blue glue or strippable coating.
The above-mentioned high polymer dispersed liquid crystal gummed encapsulating structure with soft board engaging zones, wherein this optical veneering layer is that two glue pellet form through hot melt.
The above-mentioned high polymer dispersed liquid crystal gummed encapsulating structure with soft board engaging zones, wherein this single glue pellet thickness is more than 0.1mm.
The above-mentioned high polymer dispersed liquid crystal gummed encapsulating structure with soft board engaging zones, wherein this upper photic zone and lower photic zone are glass or light transmissive material.
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail, but not as to restriction of the present utility model.
Accompanying drawing explanation
Fig. 1, high molecule liquid crystal lamination layer structure schematic side view of the present utility model;
The schematic top plan view of the upper transparency carrier of Fig. 2, Fig. 1;
The schematic top plan view of the lower transparency carrier of Fig. 3, Fig. 1;
Fig. 4, the schematic side view of another embodiment of high molecule liquid crystal composite bed of the present utility model;
Fig. 5, the schematic side view of the gummed encapsulating structure of high molecule liquid crystal composite bed of the present utility model;
Fig. 6, the schematic top plan view of the gummed encapsulating structure of high molecule liquid crystal composite bed of the present utility model.
Wherein, Reference numeral
High polymer dispersed liquid crystal composite bed 10
Upper transparency carrier 1
Upper hardened layer 11
Upper breach 12
Lower transparency carrier 2
Lower hardened layer 21
Lower breach 22
Upper transparency conducting layer 3
Upper circuit region 31
Upper conductor 32
Upper winding displacement district 33
Lower transparency conducting layer 4
Lower circuit region 41
Lower wire 42
Lower winding displacement district 43
Polymer dispersed liquid crystal layer 5
Conduction mucigel 6
Soft board 7
Insulation course 8
Optical veneering layer 9
Glue pellet 9a, 9b
Upper photic zone 20
Visible area 201
Non-visible area 202
Lower photic zone 30
Visible area 301
Non-visible area 302
Control module 40
Supply unit 50
Embodiment
Hereby about the technical content and a detailed description of the present utility model, accompanying drawing is now coordinated to be described as follows:
Refer to Fig. 1 ~ Fig. 3, the upper transparency carrier of high molecule liquid crystal lamination layer structure of the present utility model side-looking and Fig. 1 and the schematic top plan view of lower transparency carrier.As shown in the figure: high polymer dispersed liquid crystal composite bed 10 of the present utility model, comprising: transparency conducting layer 3, once transparency conducting layer 4 and a high polymer dispersed liquid crystal (PolymerDispersedLiquidCrystal on transparency carrier 1, once transparency carrier 2, on one; Be called for short PDLC) layer 5.
On this, transparency carrier 1 and this lower transparency carrier 2 are light-passing plastic or transparent glass substrate, this light-passing plastic is polyethylene terephthalate (PolyethyleneTerephthalate, PET), tygon (Polyethylene, PE), polyimide (Polyimide, PI), nylon (Nylon, Polyamide, be called for short PA be polyamide macromolecule), polyurethane (Polyurethanes, PU) or acrylic plastics etc., on this, transparency carrier 1 and this lower transparency carrier 2 thickness are that 10um ~ 500um is best.Separately, on this, a side of transparency carrier 1 and this lower transparency carrier 2 is carried out cure process and to be formed with on one hardened layer 11 and once hardened layer 21, the Refractive Index of Material that upper hardened layer 11 and lower hardened layer 21 use 1.1 ~ 3.5 acrylic, epoxy resin, silicon dioxide or aforementioned two or more material combination, and thickness of hardened layer 11 and this lower hardened layer 21 is 500nm ~ 50um on this, on this, the thickness 1um ~ 5um of hardened layer 11 and this lower hardened layer 21 is best.Again, on this transparency carrier 1 and this lower transparency carrier 2 a side on respectively there is on one breach 12 and once breach 22, on this, breach 12 and lower breach 22 make the upper winding displacement district 33 of transparency conducting layer 3 and this lower transparency conducting layer 4 on this and lower winding displacement district 43 expose.
Transparency conducting layer 3 on this, be located at a side of hardened layer 11 on this, on this transparency conducting layer 3 use transmittance 70% ~ 95% the metal oxide of inorganic conductor material as silver, Nano Silver, indium tin oxide (IndiumTinOxide, ITO) or organic conductor material as being mixed with CNT or poly-3,4-ethylenedioxy thiophene (Poly-3,4-Ethylenedioxythiophene, PEDOT) conductive material, the circuit formed through dry type or Wet-type etching or conductive area, and its thickness is 5nm ~ 50um, best with this thickness 100nm ~ 10um.Separately, on this, transparency conducting layer 3 includes winding displacement district 33 on circuit region 31 on, the upper conductor 32 and of many.
This lower transparency conducting layer 4, corresponding with transparency conducting layer on this 3 on the side being located at this lower hardened layer 21, this lower transparency conducting layer 4 use transmittance 70% ~ 95% the metal oxide of inorganic conductor material as silver, Nano Silver, indium tin oxide (IndiumTinOxide, ITO) or organic conductor material as being mixed with CNT or poly-3, 4-ethylenedioxy thiophene (Poly-3, 4-Ethylenedioxythiophene, PEDOT) conductive material, the circuit formed through dry type or Wet-type etching or conductive area, and its thickness is 5nm ~ 50um, best with this thickness 100nm ~ 10um.Separately, this lower transparency conducting layer 4 includes circuit region 41, the lower wire 42 of many and once winding displacement district 43.
This PDLC layer 5 is located on this between transparency conducting layer 3 and this lower transparency conducting layer 4, and its thickness is 1um ~ 100um; Transmittance after this PDLC layer 5 employs conduction 50% ~ 80% and refractive index 1.5 ~ 5.5 PDLC resin be major component and containing being mixed with UV type resin, heat curing-type hardening resin, silicon dioxide or two or more combine aforementioned.
Refer to Fig. 4, another embodiment side-looking and schematic top plan view of high molecule liquid crystal composite bed of the present utility model.As shown in the figure: after the upper transparency carrier 1 of high polymer dispersed liquid crystal composite bed 10 of the present utility model, lower transparency carrier 2, upper transparency conducting layer 3, lower transparency conducting layer 4 and PDLC layer 5 combine, lower breach 22 in this lower transparency carrier 2 makes those upper conductors 32 in winding displacement district 33 on this expose, on this, the upper breach 11 of transparency carrier 1 makes those lower wires 42 in this lower winding displacement district 43 expose, and each painting is laid with the conduction mucigel 6 of one deck on these those upper conductors 32 exposed and those lower wires 42, this conduction mucigel 6 is elargol in detail in this figure.
After the conduction mucigel 6 of these those upper conductors 32 exposed and those lower wires 42 completes, one end of this two soft board (FPC) 7 and those upper conductors 32 and those lower wires 42 are electrically connected.In detail in this figure, the thickness of this soft board 7 is 50um ~ 500um.
After two soft boards 7 and those upper conductors 32 and those lower wires 42 are electrically connected, on this transparency carrier 1 upper breach 12 in the winding displacement district 43 of exposing and soft board 7 and this lower transparency carrier 2 lower breach 22 in the winding displacement district 33 of exposing and soft board 7 have respectively inserted an insulation course 8, with fill and lead up this breach 12,22 make with this on transparency carrier 1 and lower transparency carrier 2 copline.In detail in this figure, this insulation course 8 is blue glue or strippable coating.
Refer to Fig. 5 and Fig. 6, the side-looking of the gummed encapsulating structure of high molecule liquid crystal composite bed of the present utility model and schematic top plan view.After high molecule liquid crystal composite bed 10 of the present utility model and soft board 7 and insulation course 8 complete, a glue pellet 9a, 9b was provided with in each side of a upper photic zone 20 and once photic zone 30 is last, with the side clamping of this upper and lower photic zone 20,30 tool glue pellet high molecule liquid crystal composite bed 10 of the present utility model and soft board 7 and insulation course 8, after hot pressing, fuse each glue pellet 9a, 9b forms so-called optical veneering layer 9, and with optical veneering layer 9 by coated for this high polymer dispersed liquid crystal composite bed 10 in it.In detail in this figure, this glue pellet 9a, 9b are PVB ((PolyvinylButyral) polyvinyl butyral resin), and the thickness of this single glue pellet 9a or 9b is more than 0.1mm.
Can divide into visible area 201,301 and non-visible area 202,302 at this upper photic zone 20 and this lower photic zone 30, wherein this non-visible area 202,302 can apply an alternatively non-transparent coating.This upper photic zone 20 and lower photic zone 30 are glass or light transmissive material in detail in this figure, multiple position can be arranged on, such as: the glass for windows and doors of cabinet, window, door, table, wall, car, ship, aircraft etc. and attemperator, cold-keeping device, curing range, but not as limit, suppose that the utility model is for being arranged at vehicle glass, can provide heat insulation, or on door and window, edge use the utility model glyglass, also have this aforementioned function and privacy peep-proof.But the door of Men Weiyi broad sense herein, therefore be not limited to be the door of household user, can also be car door, refrigerator (cold-keeping device) door or baking box (curing range) door, therefore the utility model is arranged on Men Shangyu and is arranged on curing range, can be two independent events of separating, also can refer to same thing, in like manner, above carried position, all should extendedly explain, as window can be, household's window also can be vehicle window etc.
Further, the utility model utilizes one end of two soft boards 7 to be electrically connected on this in upper winding displacement district 33 of transparency conducting layer 3 and the lower winding displacement district 43 of this lower transparency conducting layer 4, the other end of this two soft board 7 is electrically connected with outside control module 40 and supply unit 50, user can provide information command by the additional touch control operation as touch control line of this high polymer dispersed liquid crystal composite bed 10 or directly provide electrical instruction to the control module 40 of this outside, the relevant corresponding region of high polymer dispersed liquid crystal (PDLC) layer 5 is driven to carry out local transparent or lighttight change to make corresponding high polymer dispersed liquid crystal circuit (not shown), such as hand-written blank, the GTG of PDLC layer shows that printing opacity changes, the regional area printing opacity control etc. of PDLC layer.
Subsidiary one carries, and the utility model relates to PDLC and glues together encapsulating structure, further, is glue together encapsulating structure about this PDLC on material, select transparent material conducting film tool transparent effect.Produce a kind of specific combination effect functionally by this, therefore be more not used to limit interest field of the present utility model about the above-mentioned technology contents how reaching transparent effect.
Certainly; the utility model also can have other various embodiments; when not deviating from the utility model spirit and essence thereof; those of ordinary skill in the art are when making various corresponding change and distortion according to the utility model, but these change accordingly and are out of shape the protection domain that all should belong to the claim appended by the utility model.
Claims (13)
1. there is a high polymer dispersed liquid crystal gummed encapsulating structure for soft board engaging zones, be electrically connected with the control module of outside and supply unit, it is characterized in that, comprising:
One high polymer dispersed liquid crystal composite bed, comprises:
Transparency carrier on one, on it, side mask has hardened layer and side on one to have breach on;
Transparency conducting layer on one, being electrically connected with this control module is located on a side of hardened layer on this, on this, transparency conducting layer includes circuit region on, one with this on many upper conductors being electrically connected of circuit region, and one and the upper winding displacement district that is electrically connected of those upper conductors;
Transparency carrier once, on it, side mask has hardened layer, and side has breach;
Transparency conducting layer once, be electrically connected with this control module, and be located on this lower hardened layer one side corresponding with transparency conducting layer on this, this lower transparency conducting layer includes circuit region, one lower wire of many be electrically connected with this lower circuit region, and one and the lower winding displacement district that is electrically connected of those lower wires;
One polymer dispersed liquid crystal layer, is located at transparency conducting layer and this lower electrically conducting transparent interlayer on this;
Two soft boards, on it one end and on this upper conductor in winding displacement district and the lower wire in this lower winding displacement district be electrically connected; The other end and this outside control module and this supply unit;
One insulation course, to be located on this in breach and this lower breach;
One optical veneering layer, is coated on the surface of this high polymer dispersed liquid crystal composite bed;
One upper photic zone, is located on a side of this optical veneering layer; And
Photic zone once, penetrates on the another side of this optical veneering layer.
2. the high polymer dispersed liquid crystal gummed encapsulating structure with soft board engaging zones according to claim 1, it is characterized in that, on this, transparency carrier, this lower transparency carrier are light-passing plastic or transparent glass substrate.
3. the high polymer dispersed liquid crystal gummed encapsulating structure with soft board engaging zones according to claim 1, it is characterized in that, on this, transparency conducting layer, this lower transparency conducting layer are inorganic conductor material or organic conductor material.
4. the high polymer dispersed liquid crystal gummed encapsulating structure with soft board engaging zones according to claim 3, it is characterized in that, this organic conductor material is the conductive material being mixed with CNT or poly-3,4-ethylene dioxythiophene.
5. the high polymer dispersed liquid crystal gummed encapsulating structure with soft board engaging zones according to claim 1, it is characterized in that, on this, transparency conducting layer, this lower electrically conducting transparent layer thickness are 100nm ~ 10um.
6. the high polymer dispersed liquid crystal gummed encapsulating structure with soft board engaging zones according to claim 1, it is characterized in that, this polymer dispersed liquid crystal layer thickness is 1um ~ 100um.
7. the high polymer dispersed liquid crystal gummed encapsulating structure with soft board engaging zones according to claim 1, it is characterized in that, the thickness of this two soft board is respectively 50um ~ 500um.
8. the high polymer dispersed liquid crystal gummed encapsulating structure with soft board engaging zones according to claim 1, is characterized in that, has a conduction bonding coat between this soft board and those upper conductors and those lower wires.
9. the high polymer dispersed liquid crystal gummed encapsulating structure with soft board engaging zones according to claim 1, it is characterized in that, this conduction bonding coat is elargol.
10. the high polymer dispersed liquid crystal gummed encapsulating structure with soft board engaging zones according to claim 1, it is characterized in that, this insulation course is blue glue or strippable coating.
The 11. high polymer dispersed liquid crystal gummed encapsulating structures with soft board engaging zones according to claim 1, it is characterized in that, this optical veneering layer is that two glue pellet form through hot melt.
The 12. high polymer dispersed liquid crystal gummed encapsulating structures with soft board engaging zones according to claim 11, it is characterized in that, this single glue pellet thickness is more than 0.1mm.
The 13. high polymer dispersed liquid crystal gummed encapsulating structures with soft board engaging zones according to claim 1, it is characterized in that, this upper photic zone and lower photic zone are glass or light transmissive material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104217181 | 2015-10-27 | ||
| TW104217181U TWM520462U (en) | 2015-10-27 | 2015-10-27 | Polymer-dispersed liquid crystal glued package structure with FPC bonding area |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205103520U true CN205103520U (en) | 2016-03-23 |
Family
ID=55519295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520874794.4U Expired - Fee Related CN205103520U (en) | 2015-10-27 | 2015-11-04 | Polymer dispersed liquid crystal gluing packaging structure with soft board joint area |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN205103520U (en) |
| TW (1) | TWM520462U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108107619A (en) * | 2017-12-26 | 2018-06-01 | 上海展扬通信技术有限公司 | A kind of display module structure and terminal device |
-
2015
- 2015-10-27 TW TW104217181U patent/TWM520462U/en not_active IP Right Cessation
- 2015-11-04 CN CN201520874794.4U patent/CN205103520U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108107619A (en) * | 2017-12-26 | 2018-06-01 | 上海展扬通信技术有限公司 | A kind of display module structure and terminal device |
| CN108107619B (en) * | 2017-12-26 | 2021-06-08 | 上海展扬通信技术有限公司 | Display module structure and terminal equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM520462U (en) | 2016-04-21 |
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