CN205097551U - Photocuring resin storage tank system and three -dimensional printing device - Google Patents
Photocuring resin storage tank system and three -dimensional printing device Download PDFInfo
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- CN205097551U CN205097551U CN201520817836.0U CN201520817836U CN205097551U CN 205097551 U CN205097551 U CN 205097551U CN 201520817836 U CN201520817836 U CN 201520817836U CN 205097551 U CN205097551 U CN 205097551U
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- cured resin
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Abstract
The utility model provides a photocuring resin storage tank system and three -dimensional printing device assembles in three -dimensional printing device. Three -dimensional printing device includes light source and microscope carrier. Photocuring resin storage tank system includes the major trough body, the secondary notch body, heating module and transmission assembly. The major trough body and function just is used for adorning the chengguang cured resin with the configuration between light source and microscope carrier. The heating module configuration personally experience sth. Part of the body in secondary notch. Transmission assembly connects in the major trough body and the secondary notch body to to be located the internal photocuring resin of major trough and carry to the heating of the secondary notch body, and carry back the major trough body with the internal heated photocuring resin of secondary notch, in order to promote the three -dimensional solidification rate of printing the time cured resin.
Description
Technical field
The utility model relates to a kind of light-cured resin tank systems and 3 D-printing device, particularly relates to a kind of light-cured resin tank systems and 3 D-printing device of solidification rate of light-cured resin when promoting 3 D-printing.
Background technology
Along with development in science and technology, 3 D-printing (3Dprinting) technology and increasing material manufacture (AdditiveManufacturing, AM) technology have become one of technology of main development.These technology above-mentioned belong to the one of rapid shaping technique, and it directly can directly produce required finished product by the mathematical model file that user design is good, and finished product is almost the 3D solid of arbitrary shape.
Generally speaking, adding accepted way of doing sth manufacturing technology is the design data of the 3D model utilizing the software institute construction such as CAD (computeraideddesign, CAD) is converted to continuously stacking multiple thin (accurate two dimension) cross-sectional layer.Simultaneously, many technological means that can form multiple thin cross-sectional layer are also suggested gradually.For example, the print module of printing equipment usually can according to the space coordinates XYZ of the design data institute construction of 3D model above pedestal along XY planar movement, thus make construction materials form correct cross-sectional layer shape.The construction materials deposited can air-set subsequently, or is cured by the irradiation of heating or light source, thus forms desired cross-sectional layer.Therefore, by print module axially Z successively move, multiple cross-sectional layer can be made stacking gradually along Z axis, and then make construction materials form stereo object under the state of successively solidifying.
Existing three-dimensional printing technology has multiple different shaping mechanism according to various type and material, it is such as the material such as liquid photocurable resin, slurry, the 3D solid of required form is constructed by the mode of successively stacking accumulation, wherein Stereolithography (Stereolithography, SLA) and digitlization light process (DigitalLightProcessing, DLP) there is higher making precision and preferably surface quality.To be formed the technology of stereo object by light source curing construction materials, 3 D-printing microscope carrier is suitable for immersing in the light-cured resin be contained in light-cured resin groove, and light source module irradiates light-cured resin below light-cured resin groove, the light-cured resin of the inner bottom surface of 3 D-printing microscope carrier and light-cured resin groove (namely between) is cured making in XY plane, and is stacked on the 3 D-printing microscope carrier of print module.So, by 3 D-printing microscope carrier be moved mechanism drive and axially Z successively move, light-cured resin can be made successively to solidify and be stacked into 3 D-printing object.
Generally speaking, the light-cured resin irradiation solidification general time needing 7 to 8 seconds of each layer, if the hardening time of the light-cured resin of each layer can be shortened, the making speed promoting 3 D-printing object will be contributed to.
Utility model content
The utility model provides a kind of light-cured resin tank systems, the solidification rate of light-cured resin when it can promote 3 D-printing.
The utility model provides a kind of 3 D-printing device, and it has above-mentioned light-cured resin tank systems.
A kind of light-cured resin tank systems of the present utility model, is assemblied in 3 D-printing device.3 D-printing device comprises light source and microscope carrier.Light-cured resin tank systems comprises major trough body, secondary cell body, heating module and transmission assembly.Major trough body is in order to be configured between light source and microscope carrier and in order to fill chengguang cured resin.Heating module is configured at secondary cell body.Transmission assembly is connected to major trough body and secondary cell body, the light-cured resin being positioned at major trough body to be delivered to the heating of secondary cell body, and the light-cured resin heated in secondary cell body is transmitted back to major trough body.
A kind of light-cured resin tank systems of the present utility model, is assemblied in 3 D-printing device.3 D-printing device comprises light source and microscope carrier.Light-cured resin tank systems comprises major trough body and heating module.Major trough body is in order to be configured between light source and microscope carrier and in order to fill chengguang cured resin.Heating module is configured at this major trough body, to heat light-cured resin.
A kind of 3 D-printing device of the present utility model, comprises light source, microscope carrier and light-cured resin tank systems.Light-cured resin tank systems comprises major trough body, secondary cell body, heating module and transmission assembly.Major trough body is in order to be configured between light source and microscope carrier and in order to fill chengguang cured resin.Heating module is configured at secondary cell body.Transmission assembly is connected to major trough body and secondary cell body, the light-cured resin being positioned at major trough body to be delivered to the heating of secondary cell body, and the light-cured resin heated in secondary cell body is transmitted back to major trough body.
A kind of 3 D-printing device of the present utility model, comprises light source, microscope carrier and light-cured resin tank systems.Light-cured resin tank systems comprises major trough body and heating module.Major trough body is in order to be configured between light source and microscope carrier and in order to fill chengguang cured resin.Heating module is configured at this major trough body, to heat light-cured resin.
In an embodiment of the present utility model, above-mentioned heating module comprises resistive heating elements.
In an embodiment of the present utility model, above-mentioned heating module comprises microwave heatable element.
Based on above-mentioned, the light-cured resin tank systems of 3 D-printing device of the present utility model sends major trough body back to again by the light-cured resin being originally positioned at major trough body is delivered to the heating of secondary cell body by transmission assembly, or at major trough body configuration heating module, directly to the light-cured resin heating in major trough body, promote the temperature of the light-cured resin in major trough body, and enable light-cured resin increase the speed of polymerisation when being solidified by irradiation, to promote the make efficiency of 3 D-printing object.
For above-mentioned feature and advantage of the present utility model can be become apparent, special embodiment below, and coordinate accompanying drawing to be described in detail below.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of a kind of 3 D-printing device according to an embodiment of the present utility model;
Fig. 2 is the schematic diagram of a kind of 3 D-printing device according to another embodiment of the present utility model.
Description of reference numerals:
10: light-cured resin;
100,200: 3 D-printing device;
110,210: light source;
120,220: microscope carrier;
130,230: light-cured resin tank systems;
132,232: major trough body;
134: secondary cell body;
136,236: heating module;
138: transmission assembly.
Detailed description of the invention
Fig. 1 is the schematic diagram of a kind of 3 D-printing device according to an embodiment of the present utility model.Refer to Fig. 1, the 3 D-printing device 100 of the present embodiment uses Stereolithography (Stereolithography, SLA) and the 3 D-printing device of digitlization light process (DigitalLightProcessing, DLP) technology be example.The 3 D-printing device 100 of the present embodiment comprises light source 110, microscope carrier 120 and light-cured resin tank systems 130.Light-cured resin tank systems 130 comprises major trough body 132.Major trough body 132 is in order to be configured between light source 110 and microscope carrier 120 and in order to fill chengguang cured resin 10.Microscope carrier 120 is arranged on travel mechanism's (not shown), microscope carrier 120 is suitable for immersing in the light-cured resin 10 of the liquid state be contained in major trough body 132, and near the bottom surface of major trough body 132, light source 110 irradiates light-cured resin 10 below major trough body 132, is cured on microscope carrier 120 to make the light-cured resin 10 (about 50 micron thickness) between microscope carrier 120 and major trough body 132.By microscope carrier 120 be moved mechanism drive and axially Z successively move, light-cured resin 10 can be made successively to solidify and be stacked into 3 D-printing object.
Generally speaking, light-cured resin 10 (about 50 micron thickness) the irradiation solidification general time needing 7 to 8 seconds of each layer, if the hardening time of the light-cured resin 10 of each layer can be shortened, the make efficiency promoting 3 D-printing object will be contributed to.The light-cured resin tank systems 130 of the present embodiment effectively can shorten the hardening time of light-cured resin 10 in print procedure, will be introduced below to this.
As shown in Figure 1, in the present embodiment, light-cured resin tank systems 130 also comprises secondary cell body 134, heating module 136 and transmission assembly 138.Heating module 136 is configured at secondary cell body 134.Transmission assembly 138 is connected to major trough body 132 and secondary cell body 134.In the present embodiment, transmission assembly 138 comprises the body being communicated in major trough body 132 and secondary cell body 134 and the pump (not shown) causing fluid to circulate.The light-cured resin 10 being positioned at major trough body 132 can be delivered to secondary cell body 134 and heat by transmission assembly 138, and the light-cured resin 10 heated in secondary cell body 134 between 30 degree to 50 degree Celsius, and is transmitted back to major trough body 132 by the temperature of heating.The light-cured resin 10 being positioned at major trough body 132 has higher temperature by above-mentioned circulation, and the speed after increasing light-cured resin 10 irradiation when carrying out polymerisation.After tested, the light-cured resin 10 irradiation solidification of about 50 micron thickness probably can foreshorten to 4 to 5 seconds, effectively promotes the make efficiency of 3 D-printing object.
In the present embodiment, heating module 136 comprises resistive heating elements, but the kind of heating module 136 is not as restriction.In other embodiments, as long as do not have metal in secondary cell body 134, and be placed in airtight cavity, heating module 136 also can comprise microwave heatable element, and that is, heating module 136 also can be heated by the mode of microwave.
In addition, it should be noted that, in FIG, quantity and the position of heating module 136 only schematically show, not as restriction, as long as the light-cured resin 10 in secondary cell body 134 can be made to be uniformly heated.In addition, the light-cured resin 10 in secondary cell body 134 can be heated to higher temperature, with in response to the heat loss of light-cured resin 10 in transmitting procedure, and allows the light-cured resin 10 got back in major trough body 132 still have enough temperature.
Fig. 2 is the schematic diagram of a kind of 3 D-printing device according to another embodiment of the present utility model.Refer to Fig. 2, the 3 D-printing device 200 of the present embodiment is with the Main Differences of the 3 D-printing device 100 of Fig. 1, in the present embodiment, the heating module 236 of light-cured resin tank systems 230 is directly configured at this major trough body 232, directly to heat light-cured resin 10 in major trough body 232.Therefore, light-cured resin 10 does not need to be transported to outside major trough body 232 and heats.Bottom surface due to major trough body 232 can need to be transparent in make light pass through, so heating module 236 can be configured in the side of major trough body 232, or, if when heating module 236 includes transparent resistance, also can be configured in the below of major trough body 232, and can not irradiation be affected.
Similarly, in the present embodiment, heating module 236 comprises resistive heating elements, but the kind of heating module 236 is not as restriction.In other embodiments, as long as do not have metal in major trough body 232, and be placed in airtight cavity, heating module 236 also can comprise microwave heatable element, and that is, heating module 236 also can be heated by the mode of microwave.
In sum, the light-cured resin tank systems of 3 D-printing device of the present utility model sends major trough body back to again by the light-cured resin being originally positioned at major trough body is delivered to the heating of secondary cell body by transmission assembly, or at major trough body configuration heating module, directly to the light-cured resin heating in major trough body, promote the temperature of the light-cured resin in major trough body, and enable light-cured resin increase the speed of polymerisation when being solidified by irradiation, to promote the make efficiency of 3 D-printing object.
Last it is noted that above each embodiment is only in order to illustrate the technical solution of the utility model, be not intended to limit; Although be described in detail the utility model with reference to foregoing embodiments, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein some or all of technical characteristic; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of each embodiment technical scheme of the utility model.
Claims (12)
1. a light-cured resin tank systems, is assemblied in 3 D-printing device, and described 3 D-printing device comprises light source and microscope carrier, it is characterized in that, described light-cured resin tank systems comprises:
Major trough body, in order to be configured between described light source and described microscope carrier and in order to fill chengguang cured resin;
Secondary cell body;
Heating module, is configured at described secondary cell body; And
Transmission assembly, is connected to described major trough body and described secondary cell body, the described light-cured resin being positioned at described major trough body to be delivered to described secondary cell body heating, and the described light-cured resin heated in described secondary cell body is transmitted back to described major trough body.
2. light-cured resin tank systems according to claim 1, is characterized in that, described heating module comprises resistive heating elements.
3. light-cured resin tank systems according to claim 1, is characterized in that, described heating module comprises microwave heatable element.
4. a light-cured resin tank systems, is assemblied in 3 D-printing device, and described 3 D-printing device comprises light source and microscope carrier, it is characterized in that, described light-cured resin tank systems comprises:
Major trough body, in order to be configured between described light source and described microscope carrier and in order to fill chengguang cured resin; And
Heating module, is configured at described major trough body, to heat described light-cured resin.
5. light-cured resin tank systems according to claim 4, is characterized in that, described heating module comprises resistive heating elements.
6. light-cured resin tank systems according to claim 4, is characterized in that, described heating module comprises microwave heatable element.
7. a 3 D-printing device, is characterized in that, comprising:
Light source;
Microscope carrier; And
Light-cured resin tank systems, comprising:
Major trough body, to be configured between described light source and described microscope carrier and in order to fill chengguang cured resin;
Secondary cell body; And
Heating module, is configured at described secondary cell body; And
Transmission assembly, is connected to described major trough body and described secondary cell body, the described light-cured resin being positioned at described major trough body to be delivered to described secondary cell body heating, and the described light-cured resin heated in described secondary cell body is transmitted back to described major trough body.
8. 3 D-printing device according to claim 7, is characterized in that, described heating module comprises resistive heating elements.
9. 3 D-printing device according to claim 7, is characterized in that, described heating module comprises microwave heatable element.
10. a 3 D-printing device, is characterized in that, comprising:
Light source;
Microscope carrier; And
Light-cured resin tank systems, comprising:
Major trough body, in order to be configured between described light source and described microscope carrier and in order to fill chengguang cured resin; And
Heating module, is configured at described major trough body, to heat described light-cured resin.
11. 3 D-printing devices according to claim 10, it is characterized in that, described heating module comprises resistive heating elements.
12. 3 D-printing devices according to claim 10, it is characterized in that, described heating module comprises microwave heatable element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520817836.0U CN205097551U (en) | 2015-10-21 | 2015-10-21 | Photocuring resin storage tank system and three -dimensional printing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520817836.0U CN205097551U (en) | 2015-10-21 | 2015-10-21 | Photocuring resin storage tank system and three -dimensional printing device |
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| Publication Number | Publication Date |
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| CN205097551U true CN205097551U (en) | 2016-03-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520817836.0U Expired - Fee Related CN205097551U (en) | 2015-10-21 | 2015-10-21 | Photocuring resin storage tank system and three -dimensional printing device |
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| CN (1) | CN205097551U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107160683A (en) * | 2017-06-27 | 2017-09-15 | 苏州市慧通塑胶有限公司 | A kind of multibeam laser light source is molded 3D printer |
| CN107214959A (en) * | 2017-06-27 | 2017-09-29 | 苏州市慧通塑胶有限公司 | It is a kind of can bulk print laser formation 3D printer |
| CN108081598A (en) * | 2016-11-22 | 2018-05-29 | 湖南华曙高科技有限责任公司 | Stereolithography equipment and its heating unit |
| CN109334012A (en) * | 2018-11-09 | 2019-02-15 | 南宁壶兰科技有限公司 | A kind of photocuring 3D printing system and 3D printer |
-
2015
- 2015-10-21 CN CN201520817836.0U patent/CN205097551U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108081598A (en) * | 2016-11-22 | 2018-05-29 | 湖南华曙高科技有限责任公司 | Stereolithography equipment and its heating unit |
| CN107160683A (en) * | 2017-06-27 | 2017-09-15 | 苏州市慧通塑胶有限公司 | A kind of multibeam laser light source is molded 3D printer |
| CN107214959A (en) * | 2017-06-27 | 2017-09-29 | 苏州市慧通塑胶有限公司 | It is a kind of can bulk print laser formation 3D printer |
| CN109334012A (en) * | 2018-11-09 | 2019-02-15 | 南宁壶兰科技有限公司 | A kind of photocuring 3D printing system and 3D printer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160323 Termination date: 20161021 |