CN205069627U - Intelligent power module - Google Patents
Intelligent power module Download PDFInfo
- Publication number
- CN205069627U CN205069627U CN201520761941.7U CN201520761941U CN205069627U CN 205069627 U CN205069627 U CN 205069627U CN 201520761941 U CN201520761941 U CN 201520761941U CN 205069627 U CN205069627 U CN 205069627U
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- China
- Prior art keywords
- circuit board
- printed circuit
- pcb
- power module
- intelligent power
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
- H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
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- Combinations Of Printed Boards (AREA)
Abstract
The utility model discloses an intelligent power module, intelligent power module includes: frame and printed circuit board, the frame has at least one pin, printed circuit board establishes on the frame, last at least one driver chip that is equipped with of printed circuit board, at least one the pin with the printed circuit board electricity is connected. According to the utility model discloses an intelligent power module is through establishing driver chip on printed circuit board to the printed circuit board that will be equipped with driver chip only needs walk the line be connected to the frame as a whole part on printed circuit board, the routing is to the pin of frame again, and from this, the driver chip that chooses different producers for use also can realize the unity that the pin defined, has improved intelligent power module's compatibility. In addition, before the aforesaid is connected, can detect the printed circuit board who load driver chip to select functional printed circuit board, reduced the disability rate of whole module.
Description
Technical field
The utility model relates to power model technical field, especially relates to a kind of Intelligent Power Module.
Background technology
In correlation technique, different driving chip supplier is different to the definition of the pin of driving chip, cause the pin of the pin of driving chip and framework can not one_to_one corresponding, when nation's line, the path that line is walked is interfered mutually, the requirement of nation's Wiring technology cannot be met, limit designer and select the model of driving chip and the definition mode to pin.
Utility model content
The utility model is intended at least to solve one of technical problem existed in prior art.For this reason, an object of the present utility model is to propose a kind of Intelligent Power Module, and the compatibility of described Intelligent Power Module is good.
According to Intelligent Power Module of the present utility model, comprising: framework, described framework has at least one pin; And printed circuit board (PCB), described printed circuit board (PCB) is established on said frame, and described printed circuit board (PCB) is provided with at least one driving chip, and pin described at least one is electrically connected with described printed circuit board (PCB).
According to Intelligent Power Module of the present utility model, by driving chip is established on a printed circuit, and by the printed circuit board (PCB) being provided with driving chip integrally parts be connected on framework, only need cabling on a printed circuit, routing is on the pin of framework again, thus, select the driving chip of different manufacturers also can realize the unification of pinout, improve the compatibility of Intelligent Power Module.In addition, before above-mentioned connection, can the printed circuit board (PCB) being loaded with driving chip be detected, to filter out printed circuit board (PCB) of good performance, reduce the scrappage of whole module.
In addition, following additional technical characteristic can also be had according to Intelligent Power Module of the present utility model:
According to an embodiment of the present utility model, described pin is multiple, described multiple pin comprises at least one sub-pin and at least one angle, sub-pin described at least one and angle described at least one are electrically connected with described printed circuit board (PCB), and the length of wherein said angle is greater than the length of described sub-pin.
Alternatively, described angle is that multiple and described multiple angle is spaced apart from each other setting.
Alternatively, described multiple angle is uniformly distributed on said frame, and the middle part of corresponding described printed circuit board (PCB).
According to an embodiment of the present utility model, described printed circuit board (PCB) is fixedly attached to described framework by least one fixed structure, wherein said fixed structure comprises: fixture, and described fixture is located in one of them in described printed circuit board (PCB) and described framework; And fixing hole, described fixing hole is formed on another in described printed circuit board (PCB) and described framework, with described fixing hole, described fixture coordinates that described printed circuit board (PCB) is fixedly attached to described framework.
Alternatively, described fixing hole is formed on the printed circuit board, described fixture is established on said frame, described fixture is fixing hook, the free end of described fixing hook has at least one fixed claw, through after described fixing hole, fixed claw described at least one bends that described printed circuit board (PCB) is fixedly attached to described framework.
Particularly, described stay hook grippers has heavy stand section and tilting section, and described fixed claw has first end and the second end, and described second end of described fixed claw is connected with the side of described heavy stand section, and the opposite side of described heavy stand section is inclined upwardly and extends to form described tilting section.
Alternatively, described fixing hook and described framework one-body molded.
Alternatively, described fixed structure is that multiple and described multiple fixed structure is spaced apart from each other setting.
Alternatively, described fixed structure is two and described two fixed structures lay respectively at the both sides of the length direction of described framework.
Additional aspect of the present utility model and advantage will part provide in the following description, and part will become obvious from the following description, or be recognized by practice of the present utility model.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present utility model and advantage will become obvious and easy understand from accompanying drawing below combining to the description of embodiment, wherein:
Fig. 1 is the structural representation of the Intelligent Power Module according to the utility model embodiment;
Fig. 2 is the stereogram of the fixing hook shown in Fig. 1;
Fig. 3 is the front view of the fixing hook shown in Fig. 2;
Fig. 4 is the vertical view of the fixing hook shown in Fig. 2;
Fig. 5 is the upward view of the fixing hook shown in Fig. 2;
Fig. 6 is the left view of the fixing hook shown in Fig. 2;
Fig. 7 is the right view of the fixing hook shown in Fig. 2.
Reference numeral:
100: Intelligent Power Module; 1: framework; 11: pin; 111: sub-pin; 112: angle;
12: pin; 2: printed circuit board (PCB); 3: driving chip; 4: fixed structure; 41: fixing hook;
411: fixed claw; 4111: first end; 4112: the second ends; 412: heavy stand section; 413: tilting section;
42: fixing hole; 5: substrate; 6: power chip; 7: packaging body.
Embodiment
Be described below in detail embodiment of the present utility model, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Being exemplary below by the embodiment be described with reference to the drawings, only for explaining the utility model, and can not being interpreted as restriction of the present utility model.
In description of the present utility model, it will be appreciated that, term " " center ", " length ", " width ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " interior ", " outward ", " clockwise ", orientation or the position relationship of the instruction such as " counterclockwise " are based on orientation shown in the drawings or position relationship, only the utility model and simplified characterization for convenience of description, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as restriction of the present utility model.In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise one or more these features.In description of the present utility model, except as otherwise noted, the implication of " multiple " is two or more.
In description of the present utility model, it should be noted that, unless otherwise clearly defined and limited, term " installation ", " being connected ", " connection " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, concrete condition the concrete meaning of above-mentioned term in the utility model can be understood.
In the utility model, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score can comprise the first and second features and directly contact, also can comprise the first and second features and not be directly contact but by the other characterisation contact between them.And, fisrt feature second feature " on ", " top " and " above " comprise fisrt feature directly over second feature and oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " comprise fisrt feature directly over second feature and oblique upper, or only represent that fisrt feature level height is less than second feature.
Below with reference to Fig. 1-Fig. 7, the Intelligent Power Module 100 according to the utility model embodiment is described.
As shown in Figure 1, according to the Intelligent Power Module 100 of the utility model embodiment, comprise framework 1 and printed circuit board (PCB) 2.Framework 1 has at least one pin 11, and printed circuit board (PCB) 2 is located on framework 1, and printed circuit board (PCB) 2 is provided with at least one driving chip 3, and at least one pin 11 above-mentioned is electrically connected with printed circuit board (PCB) 2.
Driving chip 3 on printed circuit board (PCB) 2 can be one or more.Such as, in the example of fig. 1, driving chip 3 is multiple.When assembling, can first driving chip 3 be attached on printed circuit board (PCB) 2, then by driving chip 3 nation line on the pad of printed circuit board (PCB) 2, finally with glue, driving chip 3 and nation line envelope are got up into as a whole.Thus, driving chip 3 and nation's line can be protected not to be damaged, to significantly reduce the spoilage of driving chip 3.
Pin 11 on framework 1 can be one or more, and the printed circuit board (PCB) 2 being loaded with driving chip 3 integrally parts is electrically connected with framework 1 by one or more pin 11 on framework 1.In addition, before above-mentioned electrical connection, can first detect the printed circuit board (PCB) 2 being loaded with driving chip 3, assemble again after filtering out qualified printed circuit board (PCB) 2, significantly reduce the scrappage of whole module, thus reduce cost, and improve the reliability and stability of Intelligent Power Module 100.
According to the Intelligent Power Module 100 of the utility model embodiment, by driving chip 3 is located on printed circuit board (PCB) 2, and by the printed circuit board (PCB) 2 being provided with driving chip 3 integrally parts be connected on framework 1, only need at printed circuit board (PCB) 2 upward wiring, routing is on the pin 11 of framework 1 again, thus, select the driving chip 3 of different manufacturers also can realize the unification of pin 11 definition, improve the compatibility of Intelligent Power Module 100.In addition, before above-mentioned connection, can the printed circuit board (PCB) 2 being loaded with driving chip 3 be detected, to filter out qualified printed circuit board (PCB) 2, reduce the scrappage of whole module.
According to an embodiment of the present utility model, with reference to Fig. 1, pin 11 on framework 1 is multiple, and multiple pin 11 comprises at least one sub-pin 111 and at least one angle 112, and at least one above-mentioned sub-pin 111 and at least one above-mentioned angle 112 are electrically connected with printed circuit board (PCB) 2.Its neutron pin 111 can be one or more, and angle 112 also can be one or more, and the length of above-mentioned angle 112 is greater than the length of above-mentioned sub-pin 111.Thus, easily printed circuit board (PCB) 2 can be connected on angle 112, realize the location of printed circuit board (PCB) 2.
The length that angle 112 stretches out than sub-pin more than 111, can carry out design modifying according to the specification of printed circuit board (PCB) 2 in Intelligent Power Module 100.Such as, angle 112 can 0.4mm longer than sub-pin 111.The results showed, in above-mentioned Intelligent Power Module 100, when angle 112 stretches out 0.4mm than sub-pin more than 111, the location of printed circuit board (PCB) 2 can be realized preferably, and the nation's line on printed circuit board (PCB) 2 can not be interfered.
Alternatively, angle 112 is multiple, the setting and multiple angle 112 is spaced apart from each other.Alternatively, multiple angle 112 is evenly distributed on framework 1, and the middle part of corresponding printed circuit board (PCB) 2.Such as, in the example of fig. 1, the number of angle 112 is 4,4 angles 112 on framework 1 each other uniform intervals offer and put, and the middle part of corresponding printed circuit board (PCB) 2.Thus, when positioning printing circuit board 2, printed circuit board (PCB) 2 uniform force can be made.
According to an embodiment of the present utility model, printed circuit board (PCB) 2 is fixedly attached to framework 1 by least one fixed structure 4.Wherein fixed structure 4 comprises: fixture and fixing hole 42.Fixture is located in one of them in printed circuit board (PCB) 2 and framework 1, and fixing hole 42 is formed on another in printed circuit board (PCB) 2 and framework 1, with fixing hole 42, fixture coordinates that printed circuit board (PCB) 2 is fixedly attached to framework 1.Understandably, when fixture is located on printed circuit board (PCB) 2, fixing hole 42 is formed on framework 1; Correspondingly, when fixture is located on framework 1, fixing hole 42 is formed on printed circuit board (PCB) 2.Such as, in the example of fig. 1, fixing hole 42 is formed on printed circuit board (PCB) 2, and fixture is located on framework 1.
Alternatively, fixture is fixing hook 41, and with reference to Fig. 2-Fig. 7, the free end of fixing hook 41 has at least one fixed claw 411, and after at least one fixed claw 411 passes fixing hole 42, bending is to be fixedly attached to framework 1 by printed circuit board (PCB) 2.Fixed claw 411 can be one or more.Alternatively, as shown in Figure 4 and Figure 5, fixed claw 411 is two, and two fixed claws 411 are intervally installed.Wherein, fixing hook 41 can be one-body molded with framework 1, thus, can Simplified flowsheet, be easy to realize, and reduce cost.
Particularly, as shown in Figures 2 and 3, fixing hook 41 has heavy stand section 412 and tilting section 413, and fixed claw 411 has first end 4111 and the second end 4112.Second end 4112 of fixed claw 411 is connected with the side of heavy stand section 412, and the opposite side of heavy stand section 412 is inclined upwardly and extends to form tilting section 413.
Alternatively, fixed structure 4 is multiple, and multiple fixed structure 4 is intervally installed.Such as, fixed structure 4 is two in the example of fig. 1, and two fixed structures 4 lay respectively at the left and right sides of framework 1.Thus, printed circuit board (PCB) 2 uniform force can be made, fixed.
According to a specific embodiment of the present utility model, with reference to Fig. 1-Fig. 7, Intelligent Power Module 100 comprises: have the framework 1 of multiple sub-pins 111 and 4 angles 112, be provided with the printed circuit board (PCB) 2 of multiple driving chip 3.Wherein the setting that is spaced apart from each other of 4 angles 112 is evenly distributed on framework 1, and angle 112 stretches out 0.4mm than sub-pin more than 111.Printed circuit board (PCB) 2 is connected with framework 1 with the integrated fixing hook 41 of framework 1 with 2 by 4 angles 112, and fixing hook 41 comprises two fixed claws 411, heavy stand section 412 and tilting section 413.
The technological process that Intelligent Power Module 100 is processed is as follows: be first attached on printed circuit board (PCB) 2 by driving chip 3, and by driving chip 3 nation line on the pad of printed circuit board (PCB) 2; Then with glue, driving chip 3 and nation's line envelope are got up into as a whole; Then the printed circuit board (PCB) 2 posting driving chip 3 is detected, to filter out qualified printed circuit board (PCB) 2.Now, the miscellaneous part of Intelligent Power Module 100 can be connected, such as, power chip 5, substrate 6 etc.As shown in Figure 1, power chip 5 can be affixed on substrate 6, the substrate 6 being loaded with power chip 5 is connected with framework 1 by the pin one 2 on framework 1.
Then, by the printed circuit board (PCB) 2 being loaded with driving chip 3 integrally parts be connected with framework 1, concrete steps are as follows: be first connected with printed circuit board (PCB) 2 by 4 angles 112, realize the location of printed circuit board (PCB) 2; Then, with fixing hook 41 fixed printed circuit board 2 of framework 1 left and right sides.In fixation procedure, first two fixed claws 411 on fixing hook 41 are penetrated in the fixing hole 42 of the correspondence on printed circuit board (PCB) 2, make the heavy stand section 412 of fixing hook 41 support the back edge of printed circuit board (PCB) 2; Then the direction of the first end 4111 of two fixed claws 411 towards tilting section 413 is bent clockwise, or by the first end 4111 of two fixed claws 411 respectively to direction bending away from each other, reach the effect of fixed printed circuit board 2; Finally Intelligent Power Module 100 plastic packaging material is carried out mould envelope, become a packaging body 7.
The mode of fixing hook 41 fixed printed circuit board 2 of this angle 112 positioning printing circuit board 2, again use; can effectively protect printed circuit board (PCB) 2; make it not by the damage of the not eliminable stress of welding procedure generation; improve reliability and the stability of Intelligent Power Module 100, and structure is simple, easy to assembly.In addition, before being connected with framework 1, first the printed circuit board (PCB) 2 being loaded with driving chip 3 is detected, assemble again after selecting the printed circuit board (PCB) 2 of test passes, effectively can reduce the scrappage of whole module, thus reduce cost.Moreover, the printed circuit board (PCB) 2 being loaded with driving chip 3 is integrally connected on framework 1, can on printed circuit board (PCB) 2 cabling as required, routing is on the pin 11 of framework 1 again, the unification that the driving chip 3 achieving different manufacturers defines with pin 11, improves the compatibility of intelligent object.
According to the Intelligent Power Module 100 of the utility model embodiment, by by the printed circuit board (PCB) 2 being loaded with driving chip 3 integrally parts be connected to framework 1, can detect printed circuit board (PCB) 2 before assembling, and can direct cabling as required on printed circuit board (PCB) 2, significantly reduce the scrappage of whole module, improve the compatibility of Intelligent Power Module 100, and structure simple, be easy to realize.
In the description of this specification, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " illustrative examples ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present utility model or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
Although illustrate and described embodiment of the present utility model, those having ordinary skill in the art will appreciate that: can carry out multiple change, amendment, replacement and modification to these embodiments when not departing from principle of the present utility model and aim, scope of the present utility model is by claim and equivalents thereof.
Claims (10)
1. an Intelligent Power Module, is characterized in that, comprising:
Framework, described framework has at least one pin; With
Printed circuit board (PCB), described printed circuit board (PCB) is established on said frame, and described printed circuit board (PCB) is provided with at least one driving chip, and pin described at least one is electrically connected with described printed circuit board (PCB).
2. Intelligent Power Module according to claim 1, it is characterized in that, described pin is multiple, described multiple pin comprises at least one sub-pin and at least one angle, sub-pin described at least one and angle described at least one are electrically connected with described printed circuit board (PCB), and the length of wherein said angle is greater than the length of described sub-pin.
3. Intelligent Power Module according to claim 2, is characterized in that, described angle is that multiple and described multiple angle is spaced apart from each other setting.
4. Intelligent Power Module according to claim 3, is characterized in that, described multiple angle is uniformly distributed on said frame, and the middle part of corresponding described printed circuit board (PCB).
5. the Intelligent Power Module according to any one of claim 1-4, is characterized in that, described printed circuit board (PCB) is fixedly attached to described framework by least one fixed structure, and wherein said fixed structure comprises:
Fixture, described fixture is located in one of them in described printed circuit board (PCB) and described framework; With
Fixing hole, described fixing hole is formed on another in described printed circuit board (PCB) and described framework, with described fixing hole, described fixture coordinates that described printed circuit board (PCB) is fixedly attached to described framework.
6. Intelligent Power Module according to claim 5, it is characterized in that, described fixing hole is formed on the printed circuit board, described fixture is established on said frame, described fixture is fixing hook, the free end of described fixing hook has at least one fixed claw, through after described fixing hole, fixed claw described at least one bends that described printed circuit board (PCB) is fixedly attached to described framework.
7. Intelligent Power Module according to claim 6, it is characterized in that, described stay hook grippers has heavy stand section and tilting section, described fixed claw has first end and the second end, described second end of described fixed claw is connected with the side of described heavy stand section, and the opposite side of described heavy stand section is inclined upwardly and extends to form described tilting section.
8. Intelligent Power Module according to claim 6, is characterized in that, described fixing hook and described framework one-body molded.
9. Intelligent Power Module according to claim 5, is characterized in that, described fixed structure is that multiple and described multiple fixed structure is spaced apart from each other setting.
10. Intelligent Power Module according to claim 9, is characterized in that, described fixed structure is two and described two fixed structures lay respectively at the both sides of the length direction of described framework.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520761941.7U CN205069627U (en) | 2015-09-29 | 2015-09-29 | Intelligent power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520761941.7U CN205069627U (en) | 2015-09-29 | 2015-09-29 | Intelligent power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205069627U true CN205069627U (en) | 2016-03-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520761941.7U Active CN205069627U (en) | 2015-09-29 | 2015-09-29 | Intelligent power module |
Country Status (1)
| Country | Link |
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| CN (1) | CN205069627U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024104117A1 (en) * | 2022-11-17 | 2024-05-23 | 海信家电集团股份有限公司 | Power module and electronic device having same |
-
2015
- 2015-09-29 CN CN201520761941.7U patent/CN205069627U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024104117A1 (en) * | 2022-11-17 | 2024-05-23 | 海信家电集团股份有限公司 | Power module and electronic device having same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191129 Address after: 518119 1 Yanan Road, Kwai Chung street, Dapeng New District, Shenzhen, Guangdong Patentee after: SHENZHEN BYD MICROELECTRONICS Co.,Ltd. Address before: BYD 518118 Shenzhen Road, Guangdong province Pingshan New District No. 3009 Patentee before: BYD Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee after: BYD Semiconductor Co.,Ltd. Address before: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee before: BYD Semiconductor Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP03 | Change of name, title or address |
Address after: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee after: BYD Semiconductor Co.,Ltd. Address before: 518119 No.1 Yan'an Road, Kwai Chung street, Dapeng New District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN BYD MICROELECTRONICS Co.,Ltd. |
|
| CP03 | Change of name, title or address |