CN205051871U - Silicon microphone shocks resistance - Google Patents
Silicon microphone shocks resistance Download PDFInfo
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- CN205051871U CN205051871U CN201520770665.0U CN201520770665U CN205051871U CN 205051871 U CN205051871 U CN 205051871U CN 201520770665 U CN201520770665 U CN 201520770665U CN 205051871 U CN205051871 U CN 205051871U
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- pcb board
- middle level
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- silicon microphone
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Abstract
The utility model discloses a silicon microphone shocks resistance, which comprises an outer shell, the shell cavity bottom is equipped with metal plates, be equipped with the polar plate gas pocket on the polar plate, the polar plate top is equipped with insulating backing ring, the up end take -up of insulating backing ring is pasted and is had the vibrating diaphragm, vibrating diaphragm surface plated nickel, the vibrating diaphragm top is equipped with the backing ring, the backing ring top is equipped with the circuit board, be equipped with the middle level hole on the circuit board, shell upper portion compresses tightly each part of the aforesaid together through inside turn down rims form, the circuit board outside is equipped with the wiring and welds the needle, the shell bottom is equipped with the air current hole that corresponds with the film position that shakes, middle level hole and polar plate gas pocket all are the inclined holes towards the middle part slope of backing ring inner wall, and reasonable in structure, small volume, the sensitivity is high, and be difficult for the rupture of membranes when receiving loud big gas shock and lead to the fact transaudient distortion, long service lifetime, have antifogly, rain -proof function, be particularly suitable for using in winter or rainy day.
Description
Technical field
The utility model relates to a kind of shock resistance silicon microphone.
Background technology
Silicon microphone, is microphone again, as the term suggests be exactly perceives sound variations in flow, and variations in flow is converted into the transducer of switching signal output corresponding with it.Microphone traditional at present drives magnetic switch to form by silicone rubber membrane, when there being air-flow to flow through silicone rubber membrane, silicone rubber membrane shakes, thus trigger magnetic switch action, the on-off model representing air-flow and convert is exported by magnetic switch, traditional microphones structure is simple, easy to use, and application widely.The weak point of traditional microphones is: volume is large, and sensitivity is low, is unsuitable for requiring higher applications in induction sensitivity.
At present, microphone is applied to online transaudient field more, such as, on the earphone cord of mouth.When user wears the earphone with function of speaking, the air-flow of speaking can be delivered near microphone, the air-flow of speaking can drive the diaphragm oscillations of microphone, the signal of telecommunication on such microphone will follow sound variation, thus the effect played induction sound, transform voice signal, transmit voice signal.For user, different people has different customs.Such as, somebody likes gulping down and mumbles, and onlying demand the other side can hear, for such user, general microphone is installed on earphone cord and can meets the demands.Somebody then likes speaking up, for the purpose of can catching by the other side, understanding, more obvious when particularly speaking under noisy environment.This just requires that the frequency range of microphone perceives sound is wider, amplitude is comparatively large, also just requires that microphone needs to produce wider induced signal, and this must increase its inner diaphragm oscillations amplitude and realize by propagandaing directed to communicate to microphone loudly.Because microphone general distance oral area on earphone is comparatively near, large mouth is spoken and is caused impelling the moment of vibrating diaphragm quick violent oscillatory motion in microphone compared with air flow, and this often causes breaking of vibrating diaphragm, also just causes transaudient distortion, substantially reduces useful life.In addition, conventional earphone microphone is directly fixed on earphone cord by common microphone, and it is not firm not only to connect, and not to voice signal output control member, uses very inconvenient.
In addition, when using in the winter time, because outdoor temperature is lower, the air-flow that people speak can produce a large amount of fog.Because transmission silicon microphone does not have anti-fog effect, can be attached on vibrating mass after these fogs enter microphone, cause transaudient distortion even failed.If when using in the wild, if run into the rainy day, because traditional silicon microphone does not have waterproof construction, directly can block silicon Mike after rainwater enters silicon microphone, directly cause silicon microphone to lose efficacy.
Utility model content
The technical problems to be solved in the utility model provides a kind of rational in infrastructure for above-mentioned deficiency, compact, sensitivity is higher, and when being subject to loud air flow and impacting not easily rupture of membranes and cause transaudient distortion, long service life, there is antifog, rainproof function, be particularly suitable in the winter time or the rainy day use a kind of shock resistance silicon microphone.
For solving the problems of the technologies described above, the design feature of this shock resistance silicon microphone is: comprise bottom pcb board, MEMS sensor and asic chip is welded with in the middle part of bottom pcb board, the output of MEMS sensor is electrically connected by holding wire is corresponding with the input of asic chip, the output of asic chip is electrically connected by output line is corresponding with the lead-out terminal of bottom pcb board, bottom pcb board is fixedly pasted with gasket ring, gasket ring top is fixedly pasted with middle level pcb board, middle level pcb board is provided with hole, middle level, hole, middle level is the inclined hole be obliquely installed in the middle part of gasket ring inwall, the supporting network of the outside round and smooth protrusion in middle part is installed with in hole, middle level, the middle level pcb board end face of periphery, hole, middle level and supporting network are fixedly coated with fine-structure mesh cloth, middle level pcb board end face is also installed with upper strata pcb board, the upper strata hole corresponding with hole, middle level is provided with in the middle part of the pcb board of upper strata, middle level pcb board is welded with the mozzle corresponding with hole, middle level, mozzle end is installed with two symmetrically arranged outward extending copper sheets, copper sheet is welded on inside the pcb board of middle level, mozzle tilts in the middle part of gasket ring inwall
The shock resistance silicon microphone of this structure is that to carry out implementation structure by stacked evagination isolation structure reasonable, compact, sensitivity is higher, and when being subject to loud air flow and impacting not easily rupture of membranes and cause transaudient distortion, long service life, there is antifog, rainproof function, be particularly suitable in the winter time or the rainy day use.
Stacked evagination isolation structure mainly refers to that structure of the present utility model is the sandwich construction be in layer mutually superimposed, and is mainly divided into fabric, media layer damage and superstructure in general.Wherein, fabric is primary structure of the present utility model, mainly comprises bottom pcb board, is arranged on other circuit elements such as the MEMS sensor on bottom pcb board, asic chip and lead-out terminal.In fabric, MEMS sensor is again its core component, and the Main Function of MEMS sensor is perception ambient sound signal, and this voice signal is converted into corresponding signal of telecommunication output.The signal input part of asic chip is corresponding with the output of MEMS sensor to be electrically connected, and the sound signal of telecommunication received carries out processing and amplifying by asic chip, exports finally by the lead-out terminal on bottom pcb board, the Main Function of Here it is asic chip.Media layer damage mainly comprises the gasket ring arranged on bottom pcb board and the middle level pcb board be arranged on gasket ring, and bottom pcb board, gasket ring and middle level pcb board are fixedly pasted together by glue.Because gasket ring is a loop configuration, therefore gasket ring is fixedly supported between bottom pcb board and middle level pcb board, so just between bottom pcb board and middle level pcb board, form a cavity, and this cavity is exactly the space of splendid attire MEMS sensor and asic chip, this space is also the passage that sound enters MEMS sensor.
In the utility model, be provided with hole, middle level in the middle part of the pcb board of middle level, the effect in hole, middle level is just to provide the passage or entrance that aforementioned cavity is connected with the external world, makes MEMS sensor can by aforementioned cavity, hole, middle level perception external voice.
In the utility model, be welded with the mozzle corresponding with hole, middle level inside the pcb board of middle level, mozzle is obliquely installed in the middle part of gasket ring inwall, so just makes the air-flow flowing through hole, middle level be provided with oriented effect in the middle part of gasket ring inwall.When there is higher acoustical vibration air-flow outside, the strong air flow flowing through hole, middle level can flow under the guide effect of mozzle in the middle part of gasket ring, or in the middle part of gasket ring inwall through mozzle outwardly.Like this, the path that flows through of air-flow is exactly: in the middle part of hole, middle level, mozzle, gasket ring inwall, MEMS sensor, is a bending C shape path.And the circulation path of air-flow is in traditional silicon microphone: hole, middle level, MEMS sensor, it is a straight line path be directly communicated with.Therefore, air flow path of the present utility model is longer than the air flow path of traditional silicon microphone, serves the effect relaxing current rate; make air-flow can not produce the large vibration of moment to the vibrating diaphragm of MEMS sensor; therefore can not tear vibrating diaphragm, available protecting vibrating diaphragm, substantially prolongs useful life.Constant owing to entering air-flow total amount of the present utility model, therefore the Oscillation Amplitude of vibrating diaphragm is identical, and the signal of generation is identical.
In the utility model, mozzle end is installed with two symmetrically arranged outward extending copper sheets, and mozzle is fixedly welded on inside the pcb board of middle level by these two copper sheets exactly.Such setting, connection welding is few, simple to operate, and it is firm to connect.
Media layer damage also comprises the supporting network be installed in hole, middle level, and supporting network is the arc surfaced of the outside round and smooth protrusion in the affixed middle part of periphery and hole, middle level.Fixedly be coated with fine-structure mesh cloth outside the middle level pcb board end face of periphery, hole, middle level and supporting network, the aperture in fine-structure mesh cloth is less, has good ventilative, logical sound effect.Because fine-structure mesh cloth aperture is less; therefore also there is good waterproof action; rainwater under normal pressure or fog are difficult to enter aforementioned cavity through fine-structure mesh cloth, greatly protect the fail safe of MEMS sensor and asic chip in cavity, make the utility model be provided with fabulous antifog, water-proof function.In addition, supporting network and fine-structure mesh cloth are all the cambered surfaces be connected with middle level pcb board in middle part evagination periphery, therefore the feature that Water seeks its own level is utilized, there is outside shunting action automatically for external fog or rainwater, therefore can not cause the accumulation of fog or rainwater, effectively prevent the infiltration of fog or rainwater.
In the utility model, superstructure mainly comprises the upper strata pcb board being arranged on middle level pcb board end face, is provided with the upper strata hole corresponding with hole, middle level in the middle part of the pcb board of upper strata.The effect of upper strata pcb board is set, exactly will fine-structure mesh cloth edge strain after be fixed on the pcb board of middle level, such fine-structure mesh cloth just can tightly be attached on supporting network, effectively prevent fine-structure mesh cloth and swings with the wind and the noise that produces, contributes to raising pickup quality.
As improvement, upper strata is installed with bracing frame in hole.
In hole, upper strata, can bracing frame be set, be equivalent in fine-structure mesh cloth arranged outside a netted protective layer, so not only affected the transmission of sound, can also play and prevent fine-structure mesh cloth by the effect of scratching, also namely protect the effect of fine-structure mesh cloth.
As further improvement, outside bracing frame, be fixedly pasted with Air Filter.
To be pasted on fine-structure mesh cloth by bracing frame to prevent the impurity in air-flow and result in blockage, outside bracing frame, be pasted with Air Filter, can filter out impurities after Air Filter is set, ensure sensitivity and the life-span of this shock resistance silicon microphone.
As improvement, hole, described middle level is the large conical bore in little the inner, outer end.
Because hole, the middle level conical bore that to be inner large outer end little, when therefore outer gas stream enters the utility model, by first by less outer stomidium and then by stomidium in larger, finally just can enter the utility model inner chamber.Air-flow from less outer stomidium to comparatively imperial palace stomidium flow process, airflow passes aisle spare can become large gradually, and air-flow can extend out gradually.Under the prerequisite that air-flow total amount is certain, the air velocity flowing out conical bore can be starkly lower than the air velocity entering conical bore, therefore serves reduction of speed effect, greatly reduces the impact to vibrating diaphragm.As a same reason, when air-flow flows from larger conical bore the inner to less outer end, although the air velocity flowing out conical bore is very fast, the inner air velocity outwardly of the utility model is lower, ensure that the safety in utilization of vibrating diaphragm.
As improvement, gasket ring peripheral ring is provided with the metal level corresponding with lead-out terminal, is installed with by the metal level metal connection dish that be electrically connected corresponding to bottom pcb board outside the pcb board of upper strata He on the pcb board of middle level.
After gasket ring arranges metal level, the signal of telecommunication just can be transmitted to middle level pcb board by metal level by bottom pcb board, serves the effect of transmitting the signal of telecommunication.Corresponding metal connection dish is installed with outside the pcb board of upper strata and on the pcb board of middle level, metal connection dish is electrically connected by metal level is corresponding with the lead-out terminal of bottom pcb board, so just be equivalent to also be provided with a set of lead-out terminal at upper strata pcb board, also just can carry out the output of signal at end face of the present utility model and bottom surface respectively, greatly facilitate application of the present utility model.
As improvement, the power positive end of asic chip is electrically connected with electrode line, the power-of asic chip is extremely electrically connected with negative line, anti-interference electric capacity is parallel with between the power positive end of asic chip and power-are extreme, the output of asic chip is electrically connected with electrode line by coupling capacitance, and the electrode line between coupling capacitance and anti-interference electric capacity is serially connected with current-limiting resistance.
The power positive end of asic chip is extremely connected with external power source with negative line respectively by electrode line with power-, and such asic chip just can normally work.The power positive end of asic chip and power-extreme between be parallel with anti-interference electric capacity, its Main Function eliminates the series connection disturbance of DC power supply to the utility model induction sound signal of telecommunication, makes voice signal more fidelity.In the utility model, the signal output part of asic chip is electrically connected with electrode line by coupling capacitance, can will is coupled on electrode line by coupling capacitance as the sound signal of telecommunication of AC signal and be exported by electrode line like this.Like this, the utility model just only has two output points, and for traditional silicon microphone, output is less, and circuit is less, and the interference be subject to is also just less, contributes to improving voice signal quality.Electrode line between coupling capacitance and anti-interference electric capacity is serially connected with current-limiting resistance, and current-limiting resistance has the effect of limiting circuit current protection MEMS sensor and asic chip.
In sum, adopt the shock resistance silicon microphone of this structure, rational in infrastructure, compact, sensitivity is higher, and when being subject to loud air flow and impacting not easily rupture of membranes and cause transaudient distortion, long service life, has antifog, rainproof function, is particularly suitable in the winter time or rainy day use.
Accompanying drawing explanation
By reference to the accompanying drawings the utility model is described in further details:
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the fit structure schematic diagram of upper strata pcb board, middle level pcb board, supporting network, fine-structure mesh cloth, bracing frame and Air Filter;
Fig. 3 is the fit structure schematic diagram of mozzle and copper sheet;
Fig. 4 is electrical schematic diagram of the present utility model.
Embodiment
As shown in the figure, this shock resistance silicon microphone comprises bottom pcb board 1, MEMS sensor 2 and asic chip 3 is welded with in the middle part of bottom pcb board, the output of MEMS sensor is electrically connected by holding wire 4 is corresponding with the input of asic chip, and the output of asic chip is electrically connected by output line 5 is corresponding with the lead-out terminal 6 of bottom pcb board.Bottom pcb board is fixedly pasted with gasket ring 7, and gasket ring top is fixedly pasted with middle level pcb board 8, and middle level pcb board is provided with hole, middle level 9.The supporting network 10 of the outside round and smooth protrusion in middle part is installed with in hole, middle level, the middle level pcb board end face of periphery, hole, middle level and supporting network are fixedly coated with fine-structure mesh cloth 11, middle level pcb board end face is also installed with upper strata pcb board 12, is provided with the upper strata hole 13 corresponding with hole, middle level in the middle part of the pcb board of upper strata.Middle level pcb board 8 is welded with the mozzle 013 corresponding with hole, middle level 9, mozzle 013 end is installed with two symmetrically arranged outward extending copper sheets 014, and copper sheet 014 is welded on inside middle level pcb board 8, and mozzle 013 tilts in the middle part of gasket ring 7 inwall.
The shock resistance silicon microphone of this structure is the sandwich construction be in layer mutually superimposed, and is mainly divided into fabric, media layer damage and superstructure in general.Wherein, fabric is primary structure of the present utility model, mainly comprises bottom pcb board, is arranged on other circuit elements such as the MEMS sensor on bottom pcb board, asic chip and lead-out terminal.In fabric, MEMS sensor is again its core component, and the Main Function of MEMS sensor is perception ambient sound signal, and this voice signal is converted into corresponding signal of telecommunication output.The signal input part of asic chip is corresponding with the output of MEMS sensor to be electrically connected, and the sound signal of telecommunication received carries out processing and amplifying by asic chip, exports finally by the lead-out terminal on bottom pcb board, the Main Function of Here it is asic chip.Media layer damage mainly comprises the gasket ring arranged on bottom pcb board and the middle level pcb board be arranged on gasket ring, and bottom pcb board, gasket ring and middle level pcb board are fixedly pasted together by glue.Because gasket ring is a loop configuration, therefore gasket ring is fixedly supported between bottom pcb board and middle level pcb board, so just between bottom pcb board and middle level pcb board, form a cavity, and this cavity is exactly the space of splendid attire MEMS sensor and asic chip, this space is also the passage that sound enters MEMS sensor.
In the utility model, be provided with hole, middle level in the middle part of the pcb board of middle level, the effect in hole, middle level is just to provide the passage or entrance that aforementioned cavity is connected with the external world, makes MEMS sensor can by aforementioned cavity, hole, middle level perception external voice.
In the utility model, be welded with the mozzle corresponding with hole, middle level inside the pcb board of middle level, mozzle is obliquely installed in the middle part of gasket ring inwall, so just makes the air-flow flowing through hole, middle level be provided with oriented effect in the middle part of gasket ring inwall.When there is higher acoustical vibration air-flow outside, the strong air flow flowing through hole, middle level can flow under the guide effect of mozzle in the middle part of gasket ring, or in the middle part of gasket ring inwall through mozzle outwardly.Like this, the path that flows through of air-flow is exactly: in the middle part of hole, middle level, mozzle, gasket ring inwall, MEMS sensor, is a bending C shape path.And the circulation path of air-flow is in traditional silicon microphone: hole, middle level, MEMS sensor, it is a straight line path be directly communicated with.Therefore, air flow path of the present utility model is longer than the air flow path of traditional silicon microphone, serves the effect relaxing current rate; make air-flow can not produce the large vibration of moment to the vibrating diaphragm of MEMS sensor; therefore can not tear vibrating diaphragm, available protecting vibrating diaphragm, substantially prolongs useful life.Constant owing to entering air-flow total amount of the present utility model, therefore the Oscillation Amplitude of vibrating diaphragm is identical, and the signal of generation is identical.
In the utility model, mozzle end is installed with two symmetrically arranged outward extending copper sheets, and mozzle is fixedly welded on inside the pcb board of middle level by these two copper sheets exactly.Such setting, connection welding is few, simple to operate, and it is firm to connect.
Media layer damage also comprises the supporting network be installed in hole, middle level, and supporting network is the arc surfaced of the outside round and smooth protrusion in the affixed middle part of periphery and hole, middle level.Fixedly be coated with fine-structure mesh cloth outside the middle level pcb board end face of periphery, hole, middle level and supporting network, the aperture in fine-structure mesh cloth is less, has good ventilative, logical sound effect.Because fine-structure mesh cloth aperture is less; therefore also there is good waterproof action; rainwater under normal pressure or fog are difficult to enter aforementioned cavity through fine-structure mesh cloth, greatly protect the fail safe of MEMS sensor and asic chip in cavity, make the utility model be provided with fabulous antifog, water-proof function.In addition, supporting network and fine-structure mesh cloth are all the cambered surfaces be connected with middle level pcb board in middle part evagination periphery, therefore the feature that Water seeks its own level is utilized, there is outside shunting action automatically for external fog or rainwater, therefore can not cause the accumulation of fog or rainwater, effectively prevent the infiltration of fog or rainwater.
In the utility model, superstructure mainly comprises the upper strata pcb board being arranged on middle level pcb board end face, is provided with the upper strata hole corresponding with hole, middle level in the middle part of the pcb board of upper strata.The effect of upper strata pcb board is set, exactly will fine-structure mesh cloth edge strain after be fixed on the pcb board of middle level, such fine-structure mesh cloth just can tightly be attached on supporting network, effectively prevent fine-structure mesh cloth and swings with the wind and the noise that produces, contributes to raising pickup quality.
Bracing frame 14 is installed with in hole, upper strata.In hole, upper strata, can bracing frame be set, be equivalent in fine-structure mesh cloth arranged outside a netted protective layer, so not only affected the transmission of sound, can also play and prevent fine-structure mesh cloth by the effect of scratching, also namely protect the effect of fine-structure mesh cloth.
Air Filter 15 is fixedly pasted with outside bracing frame.To be pasted on fine-structure mesh cloth by bracing frame to prevent the impurity in air-flow and result in blockage, outside bracing frame, be pasted with Air Filter, can filter out impurities after Air Filter is set, ensure sensitivity and the life-span of this shock resistance silicon microphone.
Hole, described middle level is the large conical bore in little the inner, outer end.Because hole, the middle level conical bore that to be inner large outer end little, when therefore outer gas stream enters the utility model, by first by less outer stomidium and then by stomidium in larger, finally just can enter the utility model inner chamber.Air-flow from less outer stomidium to comparatively imperial palace stomidium flow process, airflow passes aisle spare can become large gradually, and air-flow can extend out gradually.Under the prerequisite that air-flow total amount is certain, the air velocity flowing out conical bore can be starkly lower than the air velocity entering conical bore, therefore serves reduction of speed effect, greatly reduces the impact to vibrating diaphragm.As a same reason, when air-flow flows from larger conical bore the inner to less outer end, although the air velocity flowing out conical bore is very fast, the inner air velocity outwardly of the utility model is lower, ensure that the safety in utilization of vibrating diaphragm.
Gasket ring peripheral ring is provided with the metal level 16 corresponding with lead-out terminal, is installed with by the metal level metal connection dish 17 that be electrically connected corresponding to bottom pcb board outside the pcb board of upper strata He on the pcb board of middle level.
After gasket ring arranges metal level, the signal of telecommunication just can be transmitted to middle level pcb board by metal level by bottom pcb board, serves the effect of transmitting the signal of telecommunication.Corresponding metal connection dish is installed with outside the pcb board of upper strata and on the pcb board of middle level, metal connection dish is electrically connected by metal level is corresponding with the lead-out terminal of bottom pcb board, so just be equivalent to also be provided with a set of lead-out terminal at upper strata pcb board, also just can carry out the output of signal at end face of the present utility model and bottom surface respectively, greatly facilitate application of the present utility model.
The power positive end of asic chip is electrically connected with electrode line 20, the power-of asic chip is extremely electrically connected with negative line 21, anti-interference electric capacity 18 is parallel with between the power positive end of asic chip and power-are extreme, the output of asic chip is electrically connected with electrode line by coupling capacitance 19, the electrode line between coupling capacitance and anti-interference electric capacity is serially connected with current-limiting resistance 22.
The power positive end of asic chip is extremely connected with external power source with negative line respectively by electrode line with power-, and such asic chip just can normally work.The power positive end of asic chip and power-extreme between be parallel with anti-interference electric capacity, its Main Function eliminates the series connection disturbance of DC power supply to the utility model induction sound signal of telecommunication, makes voice signal more fidelity.In the utility model, the signal output part of asic chip is electrically connected with electrode line by coupling capacitance, can will is coupled on electrode line by coupling capacitance as the sound signal of telecommunication of AC signal and be exported by electrode line like this.Like this, the utility model just only has two output points, and for traditional silicon microphone, output is less, and circuit is less, and the interference be subject to is also just less, contributes to improving voice signal quality.Electrode line between coupling capacitance and anti-interference electric capacity is serially connected with current-limiting resistance, and current-limiting resistance has the effect of limiting circuit current protection MEMS sensor and asic chip.
In the present embodiment, the model that MEMS sensor adopts Japanese JRC company to produce is the transducer of NJD3002W, the model that asic chip adopts Japanese JRC company to produce is the chip of NJU72082, and its structure and operation principle belong to known technology, no longer carefully state at this.
Claims (5)
1. a shock resistance silicon microphone, it is characterized in that: comprise bottom pcb board (1), bottom pcb board (1) middle part is welded with MEMS sensor (2) and asic chip (3), the output of MEMS sensor (2) is electrically connected by holding wire (4) is corresponding with the input of asic chip (3), the output of asic chip (3) is electrically connected by output line (5) is corresponding with the lead-out terminal (6) of bottom pcb board, bottom pcb board (1) is upper is fixedly pasted with gasket ring (7), gasket ring (7) top is fixedly pasted with middle level pcb board (8), middle level pcb board (8) is provided with hole, middle level (9), the supporting network (10) of the outside round and smooth protrusion in middle part is installed with in hole, middle level (9), middle level pcb board (8) end face of hole, middle level (9) periphery and supporting network (10) are above fixedly coated with fine-structure mesh cloth (11), middle level pcb board (8) end face is also installed with upper strata pcb board (12), upper strata pcb board (12) middle part is provided with the upper strata hole (13) corresponding with hole, middle level (9), middle level pcb board (8) is welded with the mozzle (013) corresponding with hole, middle level (9), mozzle (013) end is installed with two symmetrically arranged outward extending copper sheets (014), copper sheet (014) is welded on middle level pcb board (8) inner side, mozzle (013) tilts in the middle part of gasket ring (7) inwall.
2. a kind of shock resistance silicon microphone as claimed in claim 1, is characterized in that: be installed with bracing frame (14) in hole, upper strata (13).
3. a kind of shock resistance silicon microphone as claimed in claim 1 or 2, is characterized in that: bracing frame (14) outside is fixedly pasted with Air Filter (15).
4. a kind of shock resistance silicon microphone as claimed in claim 3, is characterized in that: hole, described middle level (9) is the large conical bore in little the inner, outer end.
5. a kind of shock resistance silicon microphone as claimed in claim 4, it is characterized in that: gasket ring (7) peripheral ring is provided with the metal level (16) corresponding with lead-out terminal, upper strata pcb board (12) outside and middle level pcb board (8) are installed with by metal level (16) the metal connection dish (17) that be electrically connected corresponding to bottom pcb board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520770665.0U CN205051871U (en) | 2015-10-08 | 2015-10-08 | Silicon microphone shocks resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520770665.0U CN205051871U (en) | 2015-10-08 | 2015-10-08 | Silicon microphone shocks resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205051871U true CN205051871U (en) | 2016-02-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520770665.0U Expired - Fee Related CN205051871U (en) | 2015-10-08 | 2015-10-08 | Silicon microphone shocks resistance |
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| Country | Link |
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| CN (1) | CN205051871U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11395058B2 (en) | 2018-07-19 | 2022-07-19 | Cochlear Limited | Contaminant-proof microphone assembly |
-
2015
- 2015-10-08 CN CN201520770665.0U patent/CN205051871U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11395058B2 (en) | 2018-07-19 | 2022-07-19 | Cochlear Limited | Contaminant-proof microphone assembly |
| US11706551B2 (en) | 2018-07-19 | 2023-07-18 | Cochlear Limited | Contaminant-proof microphone assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160224 Termination date: 20171008 |