CN205040045U - Far infrared radiation heating device - Google Patents
Far infrared radiation heating device Download PDFInfo
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- CN205040045U CN205040045U CN201520739109.7U CN201520739109U CN205040045U CN 205040045 U CN205040045 U CN 205040045U CN 201520739109 U CN201520739109 U CN 201520739109U CN 205040045 U CN205040045 U CN 205040045U
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Abstract
The utility model provides a far infrared radiation heating device, belongs to indoor electric heater unit technical field. Including the infrared emission board, the one of which side surface combines the far infrared radiation layer, and the length direction of opposite side has the base plate mount pad, the mechanism of generating heat, install on the base plate mount pad characteristics: it includes the base plate to generate heat the mechanism, the electric heating lead, first and second insulating heat transfer layer, base plate and the cooperation of base plate mount pad, the first insulation heat -conducting layer combines at the base plate towards a side surface of infrared emission board and generate heat the board subsides with the infrared ray and touch or keep having the microgap, the 2nd insulating heat transfer layer combines at the side surface of base plate back to the infrared emission board, the electric heating lead combines the surface at the 2nd insulating heat transfer layer, and cover by adding to insulating heat transfer layer, it combines to add to insulating heat transfer layer and the 2nd insulating heat transfer layer. The volume can be reduced, promote the adaptability of installation site, can be suitable for special occasion uses like grain depot and drying tobacco, long service lifetime. Heating efficiency is effectual with the heating, save material, saving electric energy.
Description
Technical field
The utility model belongs to indoor electric heating device technique field, is specifically related to a kind of Far infrared radiation heating device.
Background technology
The radiant type infrared warmer belonging to indoor electric heating device category in prior art mostly directly adopts heating wire or adopts the electric heating tube of in-built electrical heated filament as pyrotoxin, " efficient multifunctional infrared radiator " that the typical example of this structural system is recommended as application for a patent for invention publication No. CN102062437A, known by the reading of the 0027th section, the specification to this patent application, what heater adopted is electric heating tube, more precisely, be using heating wire as pyrotoxin.Because temperature during electrothermal wire heating is higher, thus need to carry out multilayer insulation and insulation, selecting with it is also proposed higher heatproof and fire resistant requirements simultaneously to related elements.
Although above-mentioned patent application scheme can embody the technique effect of the aspects that the 0016 to 0021 section, its specification is concluded to a certain extent, but objectively there is following shortcoming: one, owing to have employed heating wire and needing to carry out multilayer insulation and insulation, thus volume is relatively large and damage sight; Its two, owing to being subject to bulky restriction, the installation thus for small space has fastidious property; Its three, easily cause naked light due to heating wire and even cause fire, thus for such as silo (grain depot), drying tobacco and so on fire-protection rating require relatively harsh occasion and be not suitable for use; Its four, because when electric heating tube works, temperature is higher, thus heating wire oxidizable generation fracture, both affected useful life, caused again maintenance trouble; They are five years old, because the plane of structure area of electric heating tube is relatively little, again owing to the diameter of electric heating tube can not be amplified without limit (otherwise the further increase of the volume of whole multifunctional infrared radiator can be caused), also because electric heating tube does not have dull and stereotyped such with infrared emitting plate (i.e. infrared radiation panel, as follows) between the large strong point of contact-making surface, thus under equal-wattage, the efficiency of heating surface of infrared emitting plate and heating effect are all affected accordingly, particularly when the width of infrared ray expelling plate is relatively wide, this phenomenon is more outstanding.Certainly, if the quantity reasonably increasing electric heating tube with space state at the Width corresponding to infrared emitting plate can make up this shortcoming, but certainly can increase cost and make structure more complicated and manufacture and assembly difficulty are increased, being unfavorable in addition in use saving power consumption; They are six years old, due in order to ensure between electric heating tube and infrared emitting plate in conjunction with effect, thus the electric heating tube mount pad being enough to the length direction of electric heating tube is tending towards comprehensive envelope must be formed on infrared emitting plate, so not only increase the material making infrared emitting plate, improve the difficulty (infrared emitting plate is usually by aluminium extruded mould extrusion forming) of mould, and make infrared emitting plate seem too heavy.
For above-mentioned prior art, be necessary to be improved, the applicant has done useful exploration and design for this reason, finally defines technical scheme described below.
Summary of the invention
Task of the present utility model is to provide one to contribute to abandoning multiple heat-insulation and heat-preservation measure and using remarkable reduced volume, being conducive to promoting using the adaptability of installation site avoids the installation by small space to limit, have and be convenient to stop produce naked light and the use used under the environment being adapted at such as grain depot and drying tobacco and so on, be of value to and avoid heater element to be oxidized and use and ensure lasting useful life, there is the contact area being good at significantly improving heater and infrared radiation panel and use and embody the excellent efficiency of heating surface and heating effect and contribute to simplifying the structure of infrared emitting plate and use the Far infrared radiation heating device facilitating manufacture and installation and good energy-saving effect can be embodied.
Task of the present utility model has been come like this, a kind of Far infrared radiation heating device, comprise an infrared emitting plate, this infrared emitting plate there is far infrared radiation layer at the surface conjunction of using state side toward the outside, and towards the length direction of interior side, there is substrate mount pad under infrared emitting plate uses, one heating mechanism, this heating mechanism is arranged on described substrate mount pad, be characterised in that: described heating mechanism comprises a substrate, one electric heating lead, one first thermal insulation layer and one second thermal insulation layer, substrate matches with described substrate mount pad, first thermal insulation layer be combined in substrate towards a side surface of described infrared emitting plate and and infrared heating plate paste touch or and infrared emitting plate between maintain microgap, second thermal insulation layer is combined in the side surface of substrate back to infrared emitting plate, electric heating lead is combined in the surface of the second thermal insulation layer, and covered by additional thermal insulation layer, and this additional thermal insulation layer and described second thermal insulation layer are combined as a whole.
In a specific embodiment of the present utility model, described substrate mount pad comprises one first pin and one second pin, this first, second pin is to keep parallel state to be formed in described infrared emitting plate in a state of use towards interior side at length direction each other, and the second slot of the first slot of the first pin and the second pin is corresponding in opposite directions; A group substrate first anti-deformation flange is configured with towards the side of the length direction of the first pin with space state at described substrate, and be configured with a group substrate second anti-deformation flange with space state at substrate equally towards the side of the length direction of substrate second pin, one group substrate first anti-deformation flange matches with the first described slot, and a group substrate second anti-deformation flange matches with the second described slot.
In another specific embodiment of the present utility model, be configured with heat insulating board first pin and heat insulating board second pin towards interior side under described infrared emitting plate using state, described first, second pin is positioned at heat insulating board first, between second pin, the length direction of heat insulating board first pin is configured with warming plate first caulking groove, and the length direction of heat insulating board second pin is configured with warming plate second caulking groove, warming plate first, second caulking groove is corresponding in opposite directions and at this warming plate first, interleaving of second caulking groove is embedded with a heat insulating board.
In another specific embodiment of the present utility model, first, second described insulated conductive layer and additional thermal insulation layer are glaze layer.
In another specific embodiment of the present utility model, described substrate is the trade mark is 430 stainless irons, and the thickness of substrate is 1-1.5 ㎜.
Also have in a specific embodiment of the present utility model, described electric heating lead is made up of through hot setting the silver-colored palladium electrocondution slurry printed, and this electric heating lead is incorporated into the surface of the second described thermal insulation layer with case of bending, the two ends of this electric heating lead are connected with external power source circuit electrical.
More of the present utility model and in a specific embodiment, described be bent into U-bend song, S shape bend, square shape bend or formed a plurality of trend towards three-back-shaped bending.
In an of the present utility model and then specific embodiment, described microgap is for being less than 1.5 ㎜.
Of the present utility model again more and in a specific embodiment, the position of a described group substrate first anti-deformation flange and a group substrate second anti-deformation flange be correspond to each other or mutually stagger, and the spacing between each two adjacent substrate first anti-deformation flanges in a group substrate first anti-deformation flange is 20-30 ㎜, the spacing between each two adjacent substrate second anti-deformation flanges in a group substrate second anti-deformation flange is similarly 20-30 ㎜.
In a specific embodiment of the present utility model, described heat insulating board is micarex.
The technical scheme that the utility model provides compared with the prior art compared with one of technique effect, owing to have employed heating mechanism rational in infrastructure, thus can abandon multiple heat-insulation and heat-preservation measure, contribute to reduced volume; Two, due to heating, mechanism is configured to flat platy structure by substrate, electric heating lead, first, second thermal insulation layer, thus can promote the adaptability of installation site, avoids the restriction by spatial altitude; Three, because electric heating lead is made up of through hot setting the silver-colored palladium electrocondution slurry printed, and covered by additional thermal insulation layer, thus in use naked light can not occur, special occasions such as grain depot and drying tobacco can be suitable for and use; Four, due to the reliable closed state in electric heating lead place as heater element, thus can not be oxidized and be ensured lasting useful life; Five, because heating mechanism is bluff body structure, thus can increase the corresponding area with infrared emitting plate, embody the excellent efficiency of heating surface and heating effect; Six, owing to not only simplifying the structure of substrate mount pad but also reduce volume, thus not only can facilitate manufacture and installation, and material can also be saved, alleviate the weight of infrared emitting plate, the effect of saves energy can also be embodied in addition; Seven, because first, second anti-deformation flange of substrate can avoid substrate to be at high temperature out of shape, thus can guarantee to conduct electricity useful life of long-term stability of hot line.
Accompanying drawing explanation
Fig. 1 is the first embodiment schematic diagram of the present utility model.
Fig. 2 is the schematic diagram that Fig. 1 overturns after 180 °.
Fig. 3 is the cross sectional representation of Fig. 1 and Fig. 2.
Fig. 4 is the second embodiment schematic diagram of the present utility model.
Embodiment
In order to enable the auditor of Patent Office especially the public clearly understand technical spirit of the present utility model and beneficial effect, applicant will elaborate below by way of example, but not all the restriction to the utility model scheme to the description of embodiment, any according to being only pro forma but not substantial equivalent transformation and all should being considered as the technical solution of the utility model category done by the utility model design.
Embodiment 1:
Refer to Fig. 1, give an infrared emitting plate 1 preferably adopting extruded aluminium to extrude, this infrared emitting plate 1 there is far infrared radiation layer 11 at the surface conjunction of using state side toward the outside (Fig. 2 state is side toward the outside), and towards the length direction of interior side (state shown in Fig. 2 towards under side), there is substrate mount pad 12 under infrared emitting plate 1 uses; Give a heating mechanism 2, this heating mechanism 2 is arranged on described substrate mount pad 12.Aforesaid far infrared radiation layer 11 is with spraying or be coated on infrared emitting substrate 1 with other similar fashion, and in addition, infrared emitting substrate 11 can be referred to as infrared radiation substrate (as follows).
Technical essential as the technical scheme that the utility model provides: aforesaid heating mechanism 2 comprises a substrate 21, one electric heating lead 22, one first thermal insulation layer 23 and one second thermal insulation layer 24, substrate 21 matches with described substrate mount pad 12, first thermal insulation layer 23 be combined in substrate 21 towards a side surface of described infrared emitting plate 1 and and infrared heating plate 1 paste touch or and infrared emitting plate 1 between maintain microgap (the present embodiment selects the former), second thermal insulation layer 24 is combined in the side surface of substrate 21 back to infrared emitting plate 1, electric heating lead 22 is combined in the surface of the second thermal insulation layer 24, and covered by additional thermal insulation layer 25, and this additional thermal insulation layer 25 is combined as a whole with aforementioned second thermal insulation layer 24, that is conduction hot line 22 is covered and protect between the second thermal insulation layer 24 and additional thermal insulation layer 25.
As shown in Figure 1, aforesaid substrate mount pad 12 comprises one first pin 121 and one second pin 122, this first, second pin 121,122 is to keep parallel state to be formed in aforementioned infrared emitting plate 1 in a state of use towards interior side at length direction each other, and the second slot 1221 of the first slot 1211 of the first pin 121 and the second pin 122 is corresponding in opposite directions; A group substrate first anti-deformation flange 211 is configured with towards the side of the length direction of the first pin 121 with space state at aforesaid substrate 21, and be configured with a group substrate second anti-deformation flange 212 with space state at substrate 21 equally towards the side of the length direction of substrate second pin 122, one group substrate first anti-deformation flange 211 matches with the first described slot 1211, and a group substrate second anti-deformation flange 212 matches with the second described slot 1221.If there is no first, second anti-deformation flange 211,212 of a group substrate, so substrate 21 at high temperature as there will be obvious distortion about 800 DEG C time, and make first, second thermal insulation layer 23,24 and additional thermal insulation layer 25 occur being out of shape by substrate 21 cracking trend caused, even undermine electric heating lead 22, therefore arranging first, second anti-deformation flange 211,212 of substrate is that the test that the applicant have passed through non-limited number of times draws.
Continue to see Fig. 1, as preferred scheme, be configured with heat insulating board first pin 13 and heat insulating board second pin 14 towards interior side under aforementioned infrared line expelling plate 1 using state, described first, second pin 121, 122 are positioned at heat insulating board first, second pin 13, between 14, the length direction of heat insulating board first pin 13 is configured with warming plate first caulking groove 131, and the length direction of heat insulating board second pin 14 is configured with warming plate second caulking groove 141, warming plate first, second caulking groove 131, 141 is corresponding in opposite directions and at this warming plate first, second caulking groove 131, 141 interleave is embedded with a heat insulating board filled the post of by micarex 15.
Preferably, first, second insulated conductive layer 23,24 aforesaid and additional thermal insulation layer 25 are glaze layer.According to professional general knowledge, to the both sides of substrate 21 respectively glazing namely apply first, second thermal insulation layer 23,24 and carry out high temperature sintering, add thermal insulation layer 25 with example.
In the present embodiment, aforesaid substrate 21 for the trade mark be 430 stainless irons, and the thickness of substrate 21 is 1-1.5 ㎜, and be 1.1-1.3 ㎜ preferably, be preferably 1.2 ㎜, the present embodiment selects 1.2 ㎜.Aforesaid electric heating lead 22 is made up of through hot setting printing (by silk screen printing) silver-colored palladium electrocondution slurry, and this electric heating lead 22 is incorporated into the surface of the second described thermal insulation layer 24 with U-shaped case of bending, and the two ends of this electric heating lead are connected with external power source circuit electrical.As preferred scheme, also rare earth can be added in silver-colored palladium slurry.
Applicant it should be noted that: electric heating lead 22 except aforesaid U-bend song (U and n replaces), can also be that S shape bends, square shape bends or formed a plurality of trend towards three-back-shaped bending.
In the present embodiment, stagger mutually in the position of an aforesaid group substrate first anti-deformation flange 211 and a group substrate second anti-deformation flange 212, but if they are corresponding, then still should be considered as technical connotation category disclosed in the utility model.
Preferably, spacing in an aforesaid group substrate first anti-deformation flange 211 between each two adjacent substrate first anti-deformation flanges is 20-30 ㎜, be comparatively one's mother's sister 22-28 ㎜, be preferably 25 ㎜ (the present embodiment is 25 ㎜), a group substrate second anti-deformation flange 212 is with example.
Refer to Fig. 2, Fig. 2 is the state diagram that Fig. 1 overturns after 180 °, and why infrared emitting plate 1 is not shown as the state shown in Fig. 2 by applicant in FIG, is because the detailed construction in order to clearly reveal heating mechanism 2.
Ask for an interview Fig. 3, Fig. 3 illustrates the situation after Fig. 1 assembling, and the installation caulking groove 16 being positioned at infrared emitting plate 1 both sides illustrated in the drawings is for fixing infrared emitting plate 16 and framework.
Because aforesaid electric heating lead 22 is connected with external power source circuit electrical, thus after connection external power source circuit, this electric heating lead 22 with electricresistance effect generates heat, transfer heat to the second thermal insulation layer 24, substrate 21 is passed to by the second thermal insulation layer 24, infrared emitting plate 1 is passed to through the first thermal insulation layer 23 by substrate 21, the infrared waves that a large amount of wavelength is 4-12 μm are inspired by far infrared radiation layer 11, due to the radiation of infrared waves energy, the surface temperature of infrared ray heat-conducting plate 1 can be made lower than about 280 DEG C, play the effect of security heating.
Embodiment 2:
Refer to Fig. 4, two substrate mount pads 12 are formed towards interior side under aforementioned infrared emitting plate 1 using state, one heating mechanism 2 is respectively set in two substrate mount pads 12, forms the complicated structure that one piece of infrared emitting plate 1 is equipped with two mechanisms 2 of generating heat.All the other are all with the description to embodiment 1.
Embodiment 3:
Namely substrate 21 slightly, is only formed with the microgap of preferably 0.2-1.5 ㎜ by figure between the surface of the first thermal insulation layer 23 of substrate 21 and infrared emitting plate 1, and microgap is 0.3-0.6 ㎜ preferably certainly, is preferably 0.5 ㎜ (the present embodiment selects 0.5 ㎜).All the other are all with the description to embodiment 1.
In sum, the technical scheme that the utility model provides overcomes the deficiency in prior art, successfully completes invention task, has cashed record in applicant's superincumbent technique effect hurdle all objectively and has stroked effect.
Claims (10)
1. a Far infrared radiation heating device, comprise an infrared emitting plate (1), go up at this infrared emitting plate (1) and have far infrared radiation layer (11) at the surface conjunction of using state side toward the outside, and towards the length direction of interior side, there is substrate mount pad (12) under infrared emitting plate (1) uses; one heating mechanism (2), this heating mechanism (2) is arranged on described substrate mount pad (12), it is characterized in that: described heating mechanism (2) comprises a substrate (21), one electric heating lead (22), one first thermal insulation layer (23) and one second thermal insulation layer (24), substrate (21) matches with described substrate mount pad (12), first thermal insulation layer (23) be combined in substrate (21) towards a side surface of described infrared emitting plate (1) and and infrared heating plate (1) paste touch or and infrared emitting plate (1) between maintain microgap, second thermal insulation layer (24) is combined in the side surface of substrate (21) back to infrared emitting plate (1), electric heating lead (22) is combined in the surface of the second thermal insulation layer (24), and covered by additional thermal insulation layer (25), and this additional thermal insulation layer (25) and described second thermal insulation layer (24) are combined as a whole.
2. Far infrared radiation heating device according to claim 1, it is characterized in that described substrate mount pad (12) comprises one first pin (121) and one second pin (122), this first, second pin (121,122) is to keep parallel state to be formed in described infrared emitting plate (1) in a state of use towards interior side at length direction each other, and second slot (1221) of first slot (1211) of the first pin (121) and the second pin (122) is corresponding in opposite directions; Group substrate first anti-deformation flange (211) is configured with towards the side of the length direction of the first pin (121) with space state at described substrate (21), and be configured with group substrate second anti-deformation flange (212) with space state at substrate (21) equally towards the side of the length direction of substrate second pin (122), one group substrate first anti-deformation flange (211) matches with described the first slot (1211), and group substrate second anti-deformation flange (212) matches with described the second slot (1221).
3. Far infrared radiation heating device according to claim 2, it is characterized in that being configured with heat insulating board first pin (13) and heat insulating board second pin (14) towards interior side under described infrared emitting plate (1) using state, described first, second pin (121, 122) heat insulating board first is positioned at, second pin (13, 14) between, the length direction of heat insulating board first pin (13) is configured with warming plate first caulking groove (131), and the length direction of heat insulating board second pin (14) is configured with warming plate second caulking groove (141), warming plate first, second caulking groove (131, 141) corresponding in opposite directions and at this warming plate first, second caulking groove (131, 141) interleave is embedded with a heat insulating board (15).
4. Far infrared radiation heating device according to claim 1, is characterized in that described first, second insulated conductive layer (23,24) and additional thermal insulation layer (25) are glaze layer.
5. Far infrared radiation heating device according to claim 1, it is characterized in that described substrate (21) for the trade mark be 430 stainless irons, and the thickness of substrate (21) is 1-1.5 ㎜.
6. Far infrared radiation heating device according to claim 1, it is characterized in that described electric heating lead (22) is made up of through hot setting the silver-colored palladium electrocondution slurry printed, and this electric heating lead (22) is incorporated into the surface of described the second thermal insulation layer (24) with case of bending, and the two ends of this electric heating lead are connected with external power source circuit electrical.
7. Far infrared radiation heating device according to claim 6, it is characterized in that described being bent into U-bend song, S shape bend, square shape bend or formed a plurality of trend towards three-back-shaped bending.
8. Far infrared radiation heating device according to claim 1, is characterized in that described microgap is for being less than 1.5 ㎜.
9. Far infrared radiation heating device according to claim 2, it is characterized in that the position of described group substrate first anti-deformation flange (211) and group substrate second anti-deformation flange (212) be correspond to each other or mutually stagger, and the spacing between each two adjacent substrate first anti-deformation flanges in group substrate first anti-deformation flange (211) is 20-30 ㎜, the spacing between each two adjacent substrate second anti-deformation flanges in group substrate second anti-deformation flange (212) is similarly 20-30 ㎜.
10. Far infrared radiation heating device according to claim 3, is characterized in that described heat insulating board (15) is micarex.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520739109.7U CN205040045U (en) | 2015-09-22 | 2015-09-22 | Far infrared radiation heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520739109.7U CN205040045U (en) | 2015-09-22 | 2015-09-22 | Far infrared radiation heating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205040045U true CN205040045U (en) | 2016-02-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520739109.7U Expired - Fee Related CN205040045U (en) | 2015-09-22 | 2015-09-22 | Far infrared radiation heating device |
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| Country | Link |
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| CN (1) | CN205040045U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105142249A (en) * | 2015-09-22 | 2015-12-09 | 黄兴菊 | Infrared radiation heating device |
-
2015
- 2015-09-22 CN CN201520739109.7U patent/CN205040045U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105142249A (en) * | 2015-09-22 | 2015-12-09 | 黄兴菊 | Infrared radiation heating device |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160217 Termination date: 20190922 |