CN205026468U - LED photovoltaic module subassembly - Google Patents
LED photovoltaic module subassembly Download PDFInfo
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- CN205026468U CN205026468U CN201520599279.XU CN201520599279U CN205026468U CN 205026468 U CN205026468 U CN 205026468U CN 201520599279 U CN201520599279 U CN 201520599279U CN 205026468 U CN205026468 U CN 205026468U
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Abstract
The utility model discloses a LED photovoltaic module subassembly. This LED photovoltaic module subassembly includes: a N detachable photovoltaic module (N > 1, and be the integer), its 2N concentric circles cyclic group board that includes the variation in size, each ring base plate surface distribution has a plurality of LED lamps, and wherein, the 1st photovoltaic module includes the 1st a ring base plate and a N+1 ring base plate, connects through first linkage unit, the 2nd photovoltaic module includes the 2nd a ring base plate and a N+2 ring base plate, connects through the second linkage unit, a N photovoltaic module includes a N ring base plate and a 2N ring base plate, connects through the N linkage unit. This first linkage unit, this second linkage unit... Be equipped with the LED drive circuit who corresponds each photovoltaic module on this N linkage unit respectively. The utility model discloses a LED photovoltaic module subassembly not only practices thrift the base plate, photovoltaic module simple structure, and the heat dissipation is good moreover, low cost.
Description
Technical field
The utility model relates to lighting technical field, particularly relates to a kind of LED photovoltaic die set.
Background technology
LED light source because having the high and volume lampet advantage of environmental protection, long service life, energy-conservation, stable performance, light efficiency, at present extensive use to various lighting field, as room lighting, automobile, consumption electronic products.
At present, along with developing rapidly of LED technology, LED light source has been widely applied on high-power illumination equipment.In high-power LED lighting apparatus, recent a kind of LED photovoltaic module is widely used, this LED photovoltaic module comprises substrate in the form of annular discs and on disc wafer, arranges LED drive circuit and LED, because the circuit set on LED photovoltaic module needed for LED illumination comprises LED drive chip and LED, only need be installed on the base of LED illumination device, assemble with lampshade etc., without the need to the circuit design etc. of too much consideration LED, production and assembly are convenient.But, there is following problem in the LED photovoltaic module of this disc wafer: in high-power LED (light emitting diode) lighting equipment, LED needs tens of to thousands of, the LED of so many quantity is arranged on one piece of disc wafer, the heat radiation of LED just must must be considered, therefore the spacing between LED needs the enough large of setting, this just makes the amount ratio of baseplate material larger, simultaneously due to high power, also need more LED drive chip to drive, complicated at disc wafer upward wiring, this just makes the LED photovoltaic modular structure with disc wafer complicated, and production cost is high.
Therefore, be necessary to propose a kind of new scheme, solve the problem.
Utility model content
The utility model, just based on above one or more problem, provides a kind of LED photovoltaic die set, in order to solve prior art photoelectricity module in waste baseplate material, complex structure, poor heat radiation and the high problem of production cost.
A kind of LED photovoltaic die set, wherein, described LED photovoltaic die set comprises: N number of dismountable photoelectricity module (N > 1, and be integer), described N number of described photoelectricity module comprises 2N the donut substrate varied in size, described in each, annulus substrate surface is distributed with some LED lamp, described 2N donut substrate carries out number consecutively along the direction increased gradually apart from the center of circle of described annulus substrate, be followed successively by the 1st, 2nd ... is N number of, N+1 ... 2N annulus substrate, 1st photoelectricity module comprises the 1st annulus substrate and N+1 annulus substrate, described 2nd photoelectricity module comprises the 2nd annulus substrate and N+2 annulus substrate, N number of photoelectricity module comprises N number of annulus substrate and 2N annulus substrate.Described 1st annulus substrate is also had to be connected by the first linkage unit with described N+1 annulus substrate, described 2nd annulus substrate is connected by the second linkage unit with N+2 annulus substrate, described N number of annulus substrate is connected by N linkage unit with 2N annulus substrate, described first linkage unit, described second linkage unit ... on described N linkage unit, correspondence is provided with the LED drive circuit of described 1st photoelectricity module, the LED drive circuit of described 2nd photoelectricity module respectively ... the LED drive circuit of described N number of photoelectricity module.
Preferably, described first linkage unit, described second linkage unit ... described N linkage unit is arranged side by side successively.
Preferably, described first linkage unit be the 2nd annulus substrate between described 1st annulus substrate and described N+1 annulus substrate to N number of annulus substrate from the direction deviating from the described center of circle successively divided go out a part form; Described second linkage unit be the 3rd annulus substrate between described 2nd annulus substrate and described N+2 annulus substrate to N+1 annulus substrate from the direction deviating from the described center of circle successively divided go out a part form ... described N linkage unit be the described the N+1 annulus substrate between N number of annulus substrate and described 2N annulus substrate to 2N-1 annulus substrate from the direction deviating from the described center of circle successively divided go out a part form, wherein, described first linkage unit, described second linkage unit ... described N linkage unit is bar shaped.
Preferably, described N=3.
Preferably, the driving chip quantity of the LED drive circuit of described 1st photoelectricity module is less than the driving chip quantity of the LED drive circuit of described N number of photoelectricity module.
Preferably, in described 2N donut substrate, be provided with connector between two described annulus substrates of arbitrary neighborhood, described connector is thermal sheet.
Preferably, described N number of dismountable photoelectricity module comprises 8N described connector, and described 8N described connector arranges along orthogonal two diameters on described 2N donut substrate.
Preferably, described N number of dismountable photoelectricity module comprises 8N fixing hole, annulus substrate described in each comprises 4 fixing holes, and described 2N donut substrate is divided into 4 regions by described 8N described fixing hole, in each area, the LED quantity of N+1 annulus substrate surface of the 1st photoelectricity module is the twice of the LED quantity of the 1st annulus substrate surface, the LED quantity of N+2 annulus substrate surface of described 2nd photoelectricity module is the twice of the LED quantity of the 2nd annulus substrate surface, the LED quantity of 2N annulus substrate surface of N number of photoelectricity module is the twice of the LED quantity of N number of annulus substrate surface.
Preferably, have in a described 8N fixing hole 4N described fixing hole distribute described 2N donut substrate one diametrically, have 2N described fixing hole to be distributed on the Radius of described 2N the donut substrate vertical with described diameter, between remaining 2N described fixing hole, curved section of line is distributed in the opposite side of described radius.
Preferably, described N number of dismountable photoelectricity module is applied in Down lamp, lamp affixed to the ceiling and bulb lamp.
LED photovoltaic die set of the present utility model, by arranging 2N the donut substrate varied in size to N number of dismountable photoelectricity module, coupled together by linkage unit between two annulus substrates of same photoelectricity module, and LED drive circuit is set on linkage unit, not only there is saving substrate, the simple beneficial effect of photoelectricity modular structure, and heat radiation is good, with low cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED photovoltaic die set of the utility model preferred embodiment.
Fig. 2 is the first circuit module distribution schematic diagram of the LED drive circuit 11 in Fig. 1.
Fig. 3 is the second circuit module distribution schematic diagram of the LED drive circuit 12 in Fig. 1.
Fig. 4 is the third circuit module distribution schematic diagram of the LED drive circuit 13 in Fig. 1.
Detailed description of the invention
Below in conjunction with drawings and Examples, the utility model is described in detail.It should be noted that, if do not conflicted, each feature in the utility model embodiment and embodiment can be combined with each other, all within protection domain of the present utility model.
LED photovoltaic die set of the present utility model, comprise: N number of dismountable photoelectricity module (N > 1, and be integer), described N number of described photoelectricity module comprises 2N the donut substrate varied in size, described in each, annulus substrate surface is distributed with some LED lamp 15a, 15b, 15c, described 2N donut substrate 11a, 11b, 12a, 12b, 13a, 13b carries out number consecutively along the direction increased gradually apart from the center of circle O of described annulus substrate, be followed successively by the 1st annulus substrate, 2nd annulus substrate ... is N number of, N+1 ... 2N annulus substrate, wherein, 1st photoelectricity module comprises the 1st annulus substrate and N+1 annulus substrate, described 2nd photoelectricity module comprises the 2nd annulus substrate and N+2 annulus substrate, N number of photoelectricity module comprises N number of annulus substrate and 2N annulus substrate, wherein, described 1st annulus substrate is connected by the first linkage unit with described N+1 annulus substrate, described 2nd annulus substrate is connected by the second linkage unit with N+2 annulus substrate, described N number of annulus substrate is connected by N linkage unit with 2N annulus substrate, described first linkage unit, described second linkage unit ... on described N linkage unit, correspondence is provided with the LED drive circuit of described 1st photoelectricity module respectively, the LED drive circuit of described 2nd photoelectricity module ... the LED drive circuit of described N number of photoelectricity module.In addition, it should be noted that, because the spacing (i.e. thickness) of upper surface of base plate and lower surface is less, usually this thickness is between 0.1 millimeter to 5 millimeters, and do not relate to this thickness at the utility model, mainly to the shape between the LED drive circuit on circular substrate and LED, the features such as structure are described, so relate in description substrate be disk or circular time geometrical aspects time directly look at flat circle or annulus and carry out relevant description, such as directly can use the center of circle of disc wafer, actually refer to the central point that disc wafer is provided with the surface of LED drive circuit and LED.
Refer to Fig. 1, Fig. 1 is the structural representation of the LED photovoltaic die set of the utility model preferred embodiment.As shown in Figure 1, the concrete condition that it is the photoelectricity module quantity of LED photovoltaic die set of the present utility model when being N=3, the LED photovoltaic die set of the utility model preferred embodiment comprises: 3 dismountable photoelectricity modules, these 3 dismountable photoelectricity modules comprise 6 donut substrates 11a, 11b, 12a, 12b, 13a, 13b varying in size, be through hole 16 at the core of these 6 donut substrates 11a, 11b, 12a, 12b, 13a, 13b, this through hole 16 can be used as the hole that power line passes.Described in each, annulus substrate surface is distributed with some LED lamp 15a, 15b, 15c, described 6 donut substrate 11a, 11b, 12a, 12b, 13a, 13b carries out number consecutively along the direction increased gradually apart from the center of circle O of described annulus substrate, be followed successively by the 1st annulus substrate 11a, 2nd annulus substrate 12a, 3rd annulus substrate 13a, 4th annulus substrate 11b, 5th annulus substrate 12b, 6th annulus substrate 13b, wherein, 1st photoelectricity module comprises the 1st annulus substrate 11a and a 4th annulus substrate 11b, described 2nd photoelectricity module comprises the 2nd annulus substrate 12a and a 5th annulus substrate 12b, 3rd photoelectricity module comprises the 3rd annulus substrate 13a and a 6th annulus substrate 13b, wherein, described 1st annulus substrate 11a is connected by the first linkage unit 17a with described 4th annulus substrate 11b, described 2nd annulus substrate 12a is connected by the second linkage unit 17b with the 5th annulus substrate 12b, described 3rd annulus substrate 13a is connected by the 3rd linkage unit 17c with the 6th annulus substrate 13b, described first linkage unit 17a, on described second linkage unit 17b and described 3rd linkage unit 17c, correspondence is provided with the LED drive circuit 11 of described 1st photoelectricity module respectively, the LED drive circuit 12 of described 2nd photoelectricity module, and the LED drive circuit 13 (LED drive circuit 11 of described 3rd photoelectricity module, 12, the circuit module distribution of 13 is please respectively see Fig. 2, Fig. 3, Fig. 4).It should be noted that, above-mentioned LED drive circuit 11,12,13 can adopt common LED drive circuit, because LED photovoltaic die set of the present utility model does not relate to the improvement of LED drive circuit, does not make associated description at this to the concrete principle of LED drive circuit.
In a specific embodiment, described first linkage unit 17a, described second linkage unit 17b and described 3rd linkage unit 17c are arranged side by side successively.
In a specific embodiment, described first linkage unit 17a be the 2nd annulus substrate 12a and the 3rd annulus substrate 13a between the 1st annulus substrate 11a and a 4th annulus substrate 11b from the direction deviating from described center of circle O successively divided go out a part form, described second linkage unit 17b be the 3rd annulus substrate 13a and the 4th annulus substrate 11b between described 2nd annulus substrate 12a and a 5th annulus substrate 12b from the direction deviating from described center of circle O successively divided go out a part form, described 3rd linkage unit be the 4th annulus substrate 11b and the 5th annulus substrate 12b between described 3rd annulus substrate 13a and described 6th annulus substrate 13b from the direction deviating from described center of circle O successively divided go out a part form, wherein, described first linkage unit 17a, described second linkage unit 17b and described 3rd linkage unit 17c is bar shaped.
Further, the driving chip quantity of the LED drive circuit of described 1st photoelectricity module is less than the driving chip quantity of the LED drive circuit of described 3rd photoelectricity module.
Preferably, in described 6 donut substrates, be provided with connector between two described annulus substrates of arbitrary neighborhood, described connector is thermal sheet.
Preferably, 3 dismountable photoelectricity modules comprise 24 described connector 18a, 18b, each photoelectricity module comprises 4 described connectors, and described 24 described connector 18a, 18b arrange along orthogonal two diameters on described 6 donut substrates.
Preferably, 3 dismountable photoelectricity modules comprise 24 fixing hole 14a, 14b, 14c, 14d, annulus substrate described in each comprises 4 fixing holes, and these 24 fixing hole 14a, 14b, 14c, described 6 donut substrates are divided into 4 regions by 14d, in each area, the LED quantity of the 4th annulus substrate surface of the 1st photoelectricity module is the twice of the LED quantity of the 1st annulus substrate surface, the LED quantity of the 5th annulus substrate surface of described 2nd photoelectricity module is the twice of the LED quantity of the 2nd annulus substrate surface, the LED quantity of the 6th annulus substrate surface of the 3rd photoelectricity module is the twice of the LED quantity of the 3rd annulus substrate surface.Further, have on a diameter AB of 12 described 6 donut substrates of fixing hole distribution in these 24 fixing holes, have 6 described fixing holes to be distributed on the Radius NO of described 6 donut substrates vertical with described diameter AB, between remaining 6 described fixing holes, curved section of line is distributed in the opposite side of described radius NO.Wherein the line of the fixing hole at curved section two ends is through center of circle O, is namely positioned on radius MO.Other fixing hole of curved section is distributed in the same side of radius MO.
Preferably, described 3 dismountable photoelectricity modules are applied in Down lamp, lamp affixed to the ceiling and bulb lamp.Such as, first photoelectricity module, the second photoelectricity module and the 3rd photoelectricity module all can be applied in Down lamp, lamp affixed to the ceiling and bulb lamp respectively, can also be the first photoelectricity module, combination of two is applied in Down lamp, lamp affixed to the ceiling and bulb lamp in the second photoelectricity module and the 3rd photoelectricity module, can be again the first photoelectricity module, the second photoelectricity module and the 3rd photoelectricity module be combined into one and be applied integrally in Down lamp, lamp affixed to the ceiling and bulb lamp.
Certainly, just illustrate for N=3 here, 2 got for N, 4,5 or other larger situation be also the same, these are all in protection domain of the present utility model.
Refer to Fig. 2, Fig. 2 is the first circuit module distribution schematic diagram of the LED drive circuit 11 in Fig. 1.As shown in Figure 2, first circuit module of LED drive circuit 11 is bent distribution, comprise: power access end 113, rectification unit 112, discharge cell 114 and LED drive chip 111, wherein, power access end 113 and rectification unit 112 are positioned on annulus substrate surface, are inclined to set, and discharge cell 114 and LED drive chip 111 are distributed in the first linkage unit 17a surface.This bent has a bending angle α, and this bending angle α gets obtuse angle, the best 135 ° time.
Refer to Fig. 3, Fig. 3 is the second circuit module distribution schematic diagram of the LED drive circuit 12 in Fig. 1.As shown in Figure 3, the second circuit module of LED drive circuit 12 comprises: power access end 124, rectification unit 123, discharge cell 125, first LED drive chip 121 and the second LED drive chip 122.Wherein power access end 124, rectification unit 123, discharge cell 125, second LED drive chip 122 are distributed in the second linkage unit 17b on the surface, and the first LED drive chip 121 is distributed in circular substrate on the surface.
Refer to Fig. 4, Fig. 4 is the third circuit module distribution schematic diagram of the LED drive circuit 13 in Fig. 1.As shown in Figure 4, the tertiary circuit module of LED drive circuit 13 comprises: power access end 134, rectification unit 133, discharge cell 135, the 3rd LED drive chip 131, the 4th LED drive chip 132, be distributed on the 3rd linkage unit 17c.
Preferably, described multiple dismountable LED photovoltaic module is applied to LED lamp, and these LED lamp comprise Down lamp, bulb lamp and lamp affixed to the ceiling.
The foregoing is only embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every utilize the utility model description and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present utility model.
Claims (10)
1. a LED photovoltaic die set, it is characterized in that, described LED photovoltaic die set comprises: N number of dismountable photoelectricity module, N > 1, and be integer, described N number of described photoelectricity module comprises 2N the donut substrate varied in size, described in each, annulus substrate surface is distributed with some LED lamp, described 2N donut substrate carries out number consecutively along the direction increased gradually apart from the center of circle of described annulus substrate, be followed successively by the 1st, 2nd ... is N number of, N+1 ... 2N annulus substrate, 1st photoelectricity module comprises the 1st annulus substrate and N+1 annulus substrate, described 2nd photoelectricity module comprises the 2nd annulus substrate and N+2 annulus substrate, N number of photoelectricity module comprises N number of annulus substrate and 2N annulus substrate, wherein, described 1st annulus substrate is connected by the first linkage unit with described N+1 annulus substrate, described 2nd annulus substrate is connected by the second linkage unit with N+2 annulus substrate, described N number of annulus substrate is connected by N linkage unit with 2N annulus substrate, described first linkage unit, described second linkage unit ... on described N linkage unit, correspondence is provided with the LED drive circuit of described 1st photoelectricity module respectively, the LED drive circuit of described 2nd photoelectricity module ... the LED drive circuit of described N number of photoelectricity module.
2. LED photovoltaic die set as claimed in claim 1, is characterized in that: described first linkage unit, described second linkage unit ... described N linkage unit is arranged side by side successively.
3. LED photovoltaic die set as claimed in claim 2, is characterized in that: described first linkage unit be the 2nd annulus substrate between described 1st annulus substrate and described N+1 the annulus substrate direction that oneself deviates from the described center of circle to N number of annulus substrate successively divided go out a part form; Described second linkage unit be the 3rd annulus substrate between described 2nd annulus substrate and described N+2 annulus substrate to N+1 annulus substrate from the direction deviating from the described center of circle successively divided go out a part form ... described N linkage unit be the described the N+1 annulus substrate between N number of annulus substrate and described 2N annulus substrate to 2N-1 annulus substrate from the direction deviating from the described center of circle successively divided go out a part form, wherein, described first linkage unit, described second linkage unit ... described N linkage unit is bar shaped.
4. LED photovoltaic die set as claimed in claim 1, is characterized in that: described N=3.
5. LED photovoltaic die set as claimed in claim 1, is characterized in that: the driving chip quantity of the LED drive circuit of described 1st photoelectricity module is less than the driving chip quantity of the LED drive circuit of described N number of photoelectricity module.
6. LED photovoltaic die set as claimed in claim 1, it is characterized in that: in described 2N donut substrate, be provided with connector between two described annulus substrates of arbitrary neighborhood, described connector is thermal sheet.
7. LED photovoltaic die set as claimed in claim 6, is characterized in that: described N number of dismountable photoelectricity module comprises 8N described connector, and described 8N described connector arranges along orthogonal two diameters on described 2N donut substrate.
8. LED photovoltaic die set as claimed in claim 1, it is characterized in that: described N number of dismountable photoelectricity module comprises 8N fixing hole, annulus substrate described in each comprises 4 fixing holes, and described 2N donut substrate is divided into 4 regions by described 8N described fixing hole, in each area, the LED quantity of N+1 annulus substrate surface of the 1st photoelectricity module is the twice of the LED quantity of the 1st annulus substrate surface, the LED quantity of N+2 annulus substrate surface of described 2nd photoelectricity module is the twice of the LED quantity of the 2nd annulus substrate surface, the LED quantity of 2N annulus substrate surface of N number of photoelectricity module is the twice of the LED quantity of N number of annulus substrate surface.
9. LED photovoltaic die set as claimed in claim 8, it is characterized in that: have in a described 8N fixing hole 4N described fixing hole distribute described 2N donut substrate one diametrically, have 2N described fixing hole to be distributed on the Radius of described 2N the donut substrate vertical with described diameter, between remaining 2N described fixing hole, curved section of line is distributed in the opposite side of described radius.
10. the LED photovoltaic die set as described in any one of claim 1 to 9, is characterized in that: described N number of dismountable photoelectricity module is applied in Down lamp, lamp affixed to the ceiling and bulb lamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520599279.XU CN205026468U (en) | 2015-08-11 | 2015-08-11 | LED photovoltaic module subassembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520599279.XU CN205026468U (en) | 2015-08-11 | 2015-08-11 | LED photovoltaic module subassembly |
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| Publication Number | Publication Date |
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| CN205026468U true CN205026468U (en) | 2016-02-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520599279.XU Active CN205026468U (en) | 2015-08-11 | 2015-08-11 | LED photovoltaic module subassembly |
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| CN (1) | CN205026468U (en) |
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Effective date of registration: 20161222 Address after: 518000 Guangdong City, Nanshan District province high tech in the middle of the two road, No. 2 Shenzhen International Software Park, room 201-205, room, 4 (only office) (222-226) Patentee after: Shenzhen CYT Optoelectronic Technology Co.,Ltd. Address before: 518000 Guangdong, Shenzhen, Nanshan District science and technology in the road, Shenzhen, 4 Software Park, building 2, building two Patentee before: Gu Daoxiong |
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| CP01 | Change in the name or title of a patent holder |
Address after: 518000 Guangdong City, Nanshan District province high tech in the middle of the two road, No. 2 Shenzhen International Software Park, room 201-205, room, 4 (only office) (222-226) Patentee after: Shenzhen mayor express Semiconductor Technology Co., Ltd. Address before: 518000 Guangdong City, Nanshan District province high tech in the middle of the two road, No. 2 Shenzhen International Software Park, room 201-205, room, 4 (only office) (222-226) Patentee before: Shenzhen CYT Optoelectronic Technology Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |