CN205017694U - A printing ink that can superpose solidification frame for placing flexible printed circuit, FPC - Google Patents
A printing ink that can superpose solidification frame for placing flexible printed circuit, FPC Download PDFInfo
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- CN205017694U CN205017694U CN201520721675.5U CN201520721675U CN205017694U CN 205017694 U CN205017694 U CN 205017694U CN 201520721675 U CN201520721675 U CN 201520721675U CN 205017694 U CN205017694 U CN 205017694U
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- rod
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- printed circuit
- flexible printed
- rectangular frame
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Abstract
The utility model discloses a printing ink that can superpose solidification frame for placing flexible printed circuit, FPC, including four pillars that are parallel to each other, the top of pillar is fixed with a rectangular frame, the bottom mounting of pillar has the 2nd rectangular frame, a rectangular frame is including the first body of rod of the first connection in proper order, the second body of rod, the third body of rod and the fourth body of rod, the 2nd rectangular frame is including the 5th body of rod of the first connection in proper order, the 6th body of rod, the 7th body of rod and the 8th body of rod, be equipped with a plurality of first vertical bodies of rod that are parallel to each other between the first body of rod and the 5th body of rod, be equipped with the vertical body of rod of a plurality of seconds that are parallel to each other between the third body of rod and the 7th body of rod. The utility model discloses can solidify the printing ink of two faces of flexible printed circuit, FPC simultaneously, practice thrift the activity duration, improve production efficiency, quantity exclusive use or the stack combination that can solidify the flexible printed circuit, FPC of printing ink are as required used, improve the availability factor that toasts the case.
Description
Technical field
The utility model relates to a kind of stackable ink solidification framework for placing Flexible Printed Circuit.
Background technology
In the production process of Flexible Printed Circuit, need to the positive back face printing ink of Flexible Printed Circuit product, existing technique is generally first at the first surface printing-ink of product, the prebake of product process of passing through tunnel stove, then place it on stacked mobile baking rack, send baking box cured printing ink, after product first surface ink solidification, take out cooling OK, can the ink printing of operation product second, again cross continuous tunnel furnace prebake after printing, then place it on stacked mobile baking rack, send baking box cured printing ink, after taking out cooling OK, terminate printing-ink flow process.
This processing mode is due to the ink on successively cured article two sides at twice, the baking time of a product wherein ink is greater than the baking time of another side ink, the ink on product two sides is easily caused to produce aberration, if toasted printing-ink while of product two sides simultaneously, the one side that product contact layer stacked moves baking rack easily occurs that ink is adhered the situation of stacked mobile baking rack, in addition, when product is more, because of the overall structure that stacked mobile baking rack is one up and down, can not break between levels, causing can not batch job, cause baking box service efficiency low, cause the stacked mobile baking rack heat radiation time longer simultaneously, affect it to recycle.
Therefore, be necessary to provide a kind of new baking rack to solve the problems referred to above.
Utility model content
The purpose of this utility model is to provide one to superpose use, and can solidify the stackable ink solidification framework for placing Flexible Printed Circuit of the ink in Flexible Printed Circuit two faces simultaneously.
To achieve these goals, the technical scheme that adopts of the utility model is as follows:
A kind of stackable ink solidification framework for placing Flexible Printed Circuit, comprise four described pillars be parallel to each other, four described pillars be centrally located on four summits of same rectangle, described in each, the cross section of pillar is rectangle, the top of described pillar is fixed with the first rectangular frame, four angles of described first rectangular frame are fixedly connected with the top of a described pillar respectively, the bottom of described pillar is fixed with the second rectangular frame, four angles of described second rectangular frame are fixedly connected with the bottom of a described pillar respectively, described first rectangular frame comprises the first first body of rod connected successively, second body of rod, 3rd body of rod and the 4th body of rod, described second rectangular frame comprises the first the 5th body of rod connected successively, 6th body of rod, 7th body of rod and the 8th body of rod, some first vertical bodies of rod be parallel to each other are provided with between described first body of rod and described 5th body of rod, distance often between adjacent two described first vertical bodies of rod is equal, some second vertical bodies of rod be parallel to each other are provided with between described 3rd body of rod and described 7th body of rod, distance often between adjacent two described second vertical bodies of rod is equal, and often the distance of adjacent two described second vertical bodies of rod is equal with the distance often between adjacent two described first vertical bodies of rod.
Preferably, described first body of rod, the 3rd body of rod, the 5th body of rod and the 7th body of rod are parallel to each other, and described second body of rod, the 4th body of rod, the 6th body of rod and the 8th body of rod are parallel to each other.
Preferably, some horizontal type bodies of rod be parallel to each other are provided with between described 5th body of rod and described 7th body of rod, the first end of the described horizontal type body of rod is fixedly connected with the bottom of the described first vertical body of rod, and the second end of the described horizontal type body of rod is fixedly connected with the bottom of the described second vertical body of rod.
Preferably, the parallel described second vertical body of rod of the described first vertical body of rod, the vertical described horizontal type body of rod of the described first vertical body of rod.
Preferably, the top of described pillar is square, be designated as the first square, described first square comprises Article 1 limit that head and the tail successively connect, Article 2 limit, Article 3 limit and Article 4 limit, the mid point on described Article 1 limit and the mid point on described Article 2 limit to described stackable ink solidification framework center between distance equal, be designated as the first distance, the mid point on described Article 3 limit and the mid point on described Article 4 limit to described stackable ink solidification framework center between distance equal, be designated as second distance, described first distance is greater than described second distance.
Preferably, the tip edge of described pillar is fixed with block, described block comprises integrated Part I and Part II, the Part II of the vertical described block of Part I of described block, the plane at the place, Part I vertical described pillar top of described block and being fixedly connected with described Article 1 limit, the plane at the place, Part II vertical described pillar top of described block and being fixedly connected with described Article 2 limit.
Preferably, the height of the Part I of described block is equal with the height of the Part II of described block.
Preferably, when the framework superimposed placement of at least two described stackable ink solidifications, described second rectangular frame on a upper described stackable ink solidification framework is positioned on described first rectangular frame on next described stackable ink solidification framework just, and the inwall of described block on the outer wall at the position, place, four angles of described second rectangular frame on a upper described stackable ink solidification framework and the described stackable ink solidification framework of the next one is fitted.
Compared with prior art, the utility model is for the beneficial effect of the stackable ink solidification framework placing Flexible Printed Circuit: the utility model can solidify the ink in Flexible Printed Circuit two faces simultaneously, saves the activity duration, enhances productivity; The quantity of the Flexible Printed Circuit of cured printing ink as required can be used alone or stack combinations uses, to improve the service efficiency of baking box.
Accompanying drawing explanation
Fig. 1 is the structural representation of the stackable ink solidification framework for placing Flexible Printed Circuit.
In figure, each mark is as follows: 1, pillar; 2, first body of rod; 3, second body of rod; 4, the 3rd body of rod; 5, the 4th body of rod; 6, the 5th body of rod; 7, the 6th body of rod; 8, the 7th body of rod; 9, the 8th body of rod; 10, the first vertical body of rod; 11, the second vertical body of rod; 12, the horizontal type body of rod; 13, block.
Embodiment
Below in conjunction with specific embodiment, the utility model is described further.
Refer to shown in Fig. 1, the utility model comprises four described pillars 1 be parallel to each other for the stackable ink solidification framework placing Flexible Printed Circuit, four described pillars 1 be centrally located on four summits of same rectangle, described in each, the cross section of pillar 1 is rectangle, the top of described pillar 1 is fixed with the first rectangular frame, the top of four angles of described first rectangular frame pillar 1 described with is respectively fixedly connected with, the bottom of described pillar 1 is fixed with the second rectangular frame, the bottom of four angles of described second rectangular frame pillar 1 described with is respectively fixedly connected with, described first rectangular frame comprises the first first body of rod 2 connected successively, second body of rod 3, 3rd body of rod 4 and the 4th body of rod 5, described second rectangular frame comprises the first the 5th body of rod 6 connected successively, 6th body of rod 7, 7th body of rod 8 and the 8th body of rod 9, some first vertical bodies of rod 10 be parallel to each other are provided with between described first body of rod 2 and described 5th body of rod 6, distance often between adjacent two described first vertical bodies of rod 10 is equal, some second vertical bodies of rod 11 be parallel to each other are provided with between described 3rd body of rod 4 and described 7th body of rod 8, distance often between adjacent two described second vertical bodies of rod 11 is equal, and often the distance of adjacent two described second vertical bodies of rod 11 is equal with the distance often between adjacent two described first vertical bodies of rod 10.
Wherein, described first body of rod 2, the 3rd body of rod 4, the 5th body of rod 6 and the 7th body of rod 8 are parallel to each other, and described second body of rod 3, the 4th body of rod 5, the 6th body of rod 7 and the 8th body of rod 9 are parallel to each other.Some horizontal type bodies of rod 12 be parallel to each other are provided with between described 5th body of rod 6 and described 7th body of rod 8, the first end of the described horizontal type body of rod 12 is fixedly connected with the bottom of the described first vertical body of rod 10, and the second end of the described horizontal type body of rod 12 is fixedly connected with the bottom of the described second vertical body of rod 11.The parallel described second vertical body of rod 11 of the described first vertical body of rod 10, the vertical described horizontal type body of rod 12 of the described first vertical body of rod 10.
In the present embodiment, the top of described pillar 1 is square, be designated as the first square, described first square comprises the Article 1 limit that head and the tail successively connect, Article 2 limit, Article 3 limit and Article 4 limit, the mid point on described Article 1 limit and the mid point on described Article 2 limit to described stackable ink solidification framework center between distance equal, be designated as the first distance, the mid point on described Article 3 limit and the mid point on described Article 4 limit to described stackable ink solidification framework center between distance equal, be designated as second distance, described first distance is greater than described second distance.
The tip edge of described pillar 1 is fixed with block 13, described block 13 comprises integrated Part I and Part II, the Part II of the vertical described block 13 of Part I of described block 13, the plane at the place, Part I vertical described pillar 1 top of described block 13 and being fixedly connected with described Article 1 limit, the plane at the place, Part II vertical described pillar 1 top of described block 13 and being fixedly connected with described Article 2 limit.The height of the Part I of described block 13 is equal with the height of the Part II of described block 13.
When the framework superimposed placement of at least two described stackable ink solidifications, described second rectangular frame on a upper described stackable ink solidification framework is positioned on described first rectangular frame on next described stackable ink solidification framework just, and the inwall of described block 13 on the outer wall at the position, place, four angles of described second rectangular frame on a upper described stackable ink solidification framework and the described stackable ink solidification framework of the next one is fitted.
During use, by Flexible Printed Circuit first surface printing-ink, after the prebake of process of passing through tunnel stove, by Flexible Printed Circuit second printing-ink, again by the prebake of Flexible Printed Circuit process of passing through tunnel stove, then Flexible Printed Circuit is placed on the stackable ink solidification framework of the utility model, in the gap between adjacent two described first vertical bodies of rod 10, one end of Flexible Printed Circuit, in the other end of the Flexible Printed Circuit gap between adjacent two described second vertical bodies of rod 11, finally stackable ink solidification framework is sent into baking box baking-curing ink.This processing mode can solidify the ink in Flexible Printed Circuit two faces simultaneously, saves the activity duration, enhances productivity.Because Flexible Printed Circuit is vertical placement on stackable ink solidification framework, thus can prevent from the situation that ink is adhered stackable ink solidification framework occurs in the process of cured printing ink.
When needing the Flexible Printed Circuit quantity of cured printing ink more, the framework superimposed use of multiple stackable ink solidifications can be used, improving the service efficiency of baking box; When needing the Flexible Printed Circuit negligible amounts of cured printing ink, only can use a stackable ink solidification framework, the stackable ink solidification framework of taking-up after ink solidification completes, is convenient to the cooling of stackable ink solidification framework quick heat radiating, is convenient to it and recycles rapidly.
Schematically above be described the utility model and execution mode thereof, this description does not have restricted, and also just one of the execution mode of the present utility model shown in accompanying drawing, actual structure is not limited thereto.So, if those of ordinary skill in the art enlightens by it, when not departing from the utility model and creating aim, design the frame mode similar to this technical scheme and embodiment without creationary, protection range of the present utility model all should be belonged to.
Claims (8)
1. one kind for placing the stackable ink solidification framework of Flexible Printed Circuit, comprise four pillars be parallel to each other, four described pillars be centrally located on four summits of same rectangle, it is characterized in that: described in each, the cross section of pillar is rectangle, the top of described pillar is fixed with the first rectangular frame, four angles of described first rectangular frame are fixedly connected with the top of a described pillar respectively, the bottom of described pillar is fixed with the second rectangular frame, four angles of described second rectangular frame are fixedly connected with the bottom of a described pillar respectively, described first rectangular frame comprises the first first body of rod connected successively, second body of rod, 3rd body of rod and the 4th body of rod, described second rectangular frame comprises the first the 5th body of rod connected successively, 6th body of rod, 7th body of rod and the 8th body of rod, some first vertical bodies of rod be parallel to each other are provided with between described first body of rod and described 5th body of rod, distance often between adjacent two described first vertical bodies of rod is equal, some second vertical bodies of rod be parallel to each other are provided with between described 3rd body of rod and described 7th body of rod, distance often between adjacent two described second vertical bodies of rod is equal, and often the distance of adjacent two described second vertical bodies of rod is equal with the distance often between adjacent two described first vertical bodies of rod.
2. as claimed in claim 1 for placing the stackable ink solidification framework of Flexible Printed Circuit, it is characterized in that: described first body of rod, the 3rd body of rod, the 5th body of rod and the 7th body of rod are parallel to each other, described second body of rod, the 4th body of rod, the 6th body of rod and the 8th body of rod are parallel to each other.
3. as claimed in claim 1 for placing the stackable ink solidification framework of Flexible Printed Circuit, it is characterized in that: between described 5th body of rod and described 7th body of rod, be provided with some horizontal type bodies of rod be parallel to each other, the first end of the described horizontal type body of rod is fixedly connected with the bottom of the described first vertical body of rod, and the second end of the described horizontal type body of rod is fixedly connected with the bottom of the described second vertical body of rod.
4. as claimed in claim 3 for placing the stackable ink solidification framework of Flexible Printed Circuit, it is characterized in that: the parallel described second vertical body of rod of the described first vertical body of rod, the vertical described horizontal type body of rod of the described first vertical body of rod.
5. as claimed in claim 1 for placing the stackable ink solidification framework of Flexible Printed Circuit, it is characterized in that: the top of described pillar is square, be designated as the first square, described first square comprises the Article 1 limit that head and the tail successively connect, Article 2 limit, Article 3 limit and Article 4 limit, the mid point on described Article 1 limit and the mid point on described Article 2 limit to described stackable ink solidification framework center between distance equal, be designated as the first distance, the mid point on described Article 3 limit and the mid point on described Article 4 limit to described stackable ink solidification framework center between distance equal, be designated as second distance, described first distance is greater than described second distance.
6. as claimed in claim 5 for placing the stackable ink solidification framework of Flexible Printed Circuit, it is characterized in that: the tip edge of described pillar is fixed with block, described block comprises integrated Part I and Part II, the Part II of the vertical described block of Part I of described block, the plane at the place, Part I vertical described pillar top of described block and being fixedly connected with described Article 1 limit, the plane at the place, Part II vertical described pillar top of described block and being fixedly connected with described Article 2 limit.
7. as claimed in claim 6 for placing the stackable ink solidification framework of Flexible Printed Circuit, it is characterized in that: the height of the Part I of described block is equal with the height of the Part II of described block.
8. as claimed in claim 7 for placing the stackable ink solidification framework of Flexible Printed Circuit, it is characterized in that: when the framework superimposed placement of at least two described stackable ink solidifications, described second rectangular frame on a upper described stackable ink solidification framework is positioned on described first rectangular frame on next described stackable ink solidification framework just, and the inwall of described block on the outer wall at the position, place, four angles of described second rectangular frame on a upper described stackable ink solidification framework and the described stackable ink solidification framework of the next one is fitted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520721675.5U CN205017694U (en) | 2015-09-17 | 2015-09-17 | A printing ink that can superpose solidification frame for placing flexible printed circuit, FPC |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520721675.5U CN205017694U (en) | 2015-09-17 | 2015-09-17 | A printing ink that can superpose solidification frame for placing flexible printed circuit, FPC |
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| CN205017694U true CN205017694U (en) | 2016-02-03 |
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| CN201520721675.5U Active CN205017694U (en) | 2015-09-17 | 2015-09-17 | A printing ink that can superpose solidification frame for placing flexible printed circuit, FPC |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115551205A (en) * | 2022-09-16 | 2022-12-30 | 广东成德电子科技股份有限公司 | Printed circuit board processing method |
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- 2015-09-17 CN CN201520721675.5U patent/CN205017694U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115551205A (en) * | 2022-09-16 | 2022-12-30 | 广东成德电子科技股份有限公司 | Printed circuit board processing method |
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