CN205017117U - Wireless structural health monitors node based on radio frequency energy is gathered - Google Patents
Wireless structural health monitors node based on radio frequency energy is gathered Download PDFInfo
- Publication number
- CN205017117U CN205017117U CN201520825960.1U CN201520825960U CN205017117U CN 205017117 U CN205017117 U CN 205017117U CN 201520825960 U CN201520825960 U CN 201520825960U CN 205017117 U CN205017117 U CN 205017117U
- Authority
- CN
- China
- Prior art keywords
- pin
- electric capacity
- module
- ground
- energy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Arrangements For Transmission Of Measured Signals (AREA)
Abstract
The utility model discloses a wireless structural health monitors node based on radio frequency energy is gathered, this node include energy antenna module, energy conversion module, sensor module and microprocessor module. Energy antenna module comprises the patch antenna, energy conversion module comprises RF -DC energy conversion module, energy storage module and voltage stabilizing module, sensor module includes temperature sensor module and answers dynamics sensor module, the microprocessor module includes microprocessor control module and zigBee wireless communication module. The utility model provides a radio frequency energy in the environment can independently be collected to wireless structural health monitoring node based on the radio frequency energy is collected to thereby convert the radio frequency energy into DC voltage for whole node lasts the power supply, can also send the temperature and answer force transducer information to assemble the node continually and steadily.
Description
Technical field
The utility model relates to wireless chargeable sensor network technique and structural health monitoring technology, particularly relate to a kind of based on radio-frequency (RF) energy collect can the wireless sensor node of monitoring of structures health.
Background technology
Along with the fast development of wireless sensor network technology (WSN), nowadays WSN is widely used in national defense and military, environmental monitoring, Industry Control, in the fields such as monitoring structural health conditions.In monitoring structural health conditions actual application environment, sensor node is usually deployed in inside configuration, so in the middle of traditional structural health monitoring technology, the sensor node life-span often depends on the energy entrained by node battery.
And if environmental energy collection technique is applied in the energy supply of sensor node, it is made spontaneously from the space environment at its place, to obtain outside energy, and collected energy can meet the energy requirements of whole system, this makes it possible to the difficult problem fundamentally solving node keeps energy supply.The environmental energy collection technique of current comparative maturity has: solar energy, vibrational energy, wind energy collecting etc.
But above environmental energy collection technique exists certain defect, such as, although sunlight is widely distributed, serious by effect of natural conditions, and can not direct irradiation to inside configuration.
Vibrational energy is mainly present in industrial environment, can convert electric energy to, but its application surface is very little by principles such as piezoelectricity, electromagnetism, electrostatic fields.
Wind energy collecting is the same with solar energy, be a kind of very clean energy source, and wind energy is unstable, uncertain, cannot enter inside configuration equally.
And electromagnetic wave in environment is ubiquitous, compared to other environmental energy, electromagnetic energy is collected by the impact of the natural cause such as region, weather, and is easy to penetrant structure.
Summary of the invention
In order to overcome the life cycle problem of sensor node in the middle of existing structure health monitoring technique, provide a kind of wireless structural health monitoring node gathered based on radio-frequency (RF) energy.This node adopts the radio-frequency (RF) energy collection mode of electromagnetic radiation, independently can collect the radio-frequency (RF) energy in environment, and radio-frequency (RF) energy is converted to direct voltage thus powers for whole node keeps, can also inside configuration temperature be sent sustainedly and stably to aggregation node and answer dynamics sensor information.
The purpose of this utility model is achieved through the following technical solutions: a kind of wireless structural health monitoring node gathered based on radio-frequency (RF) energy, this node comprises energy antenna module, energy conversion module, sensor assembly and microprocessor module.Energy antenna module is made up of Patch antenna; Energy conversion module is made up of RF-DC energy conversion module, energy storage module and Voltage stabilizing module; Sensor assembly comprises temperature sensor module and answers dynamics sensor assembly; Microprocessor module comprises microprocessor control module and ZigBee wireless communication module.Energy antenna module receives the electromagnetic wave in space environment, and be connected with RF-DC energy conversion module, energy storage module is connected with Voltage stabilizing module with RF-DC energy conversion module respectively, Voltage stabilizing module is connected with microprocessor module and sensor assembly respectively, temperature, answers dynamics two sensor assemblies and ZigBee communication module to be connected with microprocessor control module respectively.
Further, described Patch antenna adopts centre frequency to be 915MHz oriented antenna, RF-DC energy conversion module is primarily of power conversion chip U1, probe J2 forms, energy storage module is primarily of super capacitor C1, C2 and switch S 1 form, Voltage stabilizing module is primarily of low voltage difference voltage stabilizing chip U2, electric capacity C3 and C4, resistance R6, light-emitting diode D1 forms, temperature sensor module is by temperature sensor chip U5 and electric capacity C21, C20 forms, answer dynamics sensor assembly primarily of foil gauge U4, operational amplifier U6, resistance R5, R7 ~ R11, electric capacity C22 ~ C24 forms, wherein Patch antenna is connected with the SMA base on pcb board, and Patch aerial signal output pin is connected to the signal input pin of power conversion chip U1, puts ground pin and is directly connected with the ground wire of pcb board, 1 pin of super capacitor C2 is connected with No. 1 pin of toggle switch S1 respectively with 2 pin, the positive pin of super capacitor C1 is connected with 3 pin of toggle switch S1, the stored energy pin of power conversion chip U1 is connected with 2 pin of toggle switch S1, the ground pin of putting of power conversion chip U1 is connected to the ground respectively, and the output pin of power conversion chip U1 is connected with probe J2, the signal input pin of low voltage difference voltage stabilizing chip U2 is connected with probe J2, electric capacity C3 positive pole respectively, the signal input pin of voltage stabilizing chip U2 is connected with enable pin, the ground pin of putting of voltage stabilizing chip U2 is connected to ground, the signal output pin of voltage stabilizing chip U2 is connected with electric capacity C4, electric capacity C4 is connected with 1 pin of toggle switch S2, No. 2 pins of toggle switch S2 are connected with 1 pin of row's seat P1, and the two ends of resistance R6 are connected with light-emitting diode D1 positive pole with 2 pin of row's seat P1 respectively, the negative pole of the negative pin of super capacitor C1,3 pin of super capacitor C2 and 4 pin, electric capacity C3, the electric capacity C4 other end and the equal ground connection of light-emitting diode D1 negative pole,
First of temperature sensor chip U5 puts ground pin and is connected with electric capacity C21 two ends respectively with modulating output pin, the modulating output pin of temperature sensor chip U5 is connected with the 7th tunnels analogy input pin of microprocessor U3, the energization pins and second of temperature sensor chip U5 is put ground pin and is connected with electric capacity C20 two ends respectively, and the energization pins of temperature sensor chip U5 is connected with 2 pin of S1, first puts ground pin and second puts the equal ground connection of ground pin, 2 pin of foil gauge U4 are connected to ground, 1 pin respectively with R5, R7 is connected with the signal positive input pin of instrument amplifier U6, the other end of R5 is connected with adjustable resistance R8 intermediate ends, R9 one end is connected with adjustable resistance R8, the R9 other end is connected with the signal negative input pin of instrument amplifier U6, R10 is connected with the signal negative input pin of instrument amplifier U6, R7, R8, the other end of R10 is all connected with 2 pin of S1, the two ends of R11 are connected with the reference resistance pin of instrument amplifier U6 respectively, C22 is connected with the energization pins of instrument amplifier U6, the signal output pin of instrument amplifier U6 is connected with the 6th tunnels analogy input pin of microprocessor U3, be connected with one end of C23 and C24 simultaneously, the negative supply pin of instrument amplifier U6, the other end of reference voltage pin and electric capacity C22 ~ C24 is connected to ground,
Described microprocessor module by microcontroller and communication module integrated chip U3, paster crystal oscillator Y1 ~ Y2, electric capacity C5 ~ C19, resistance R3 ~ R4, inductance L 1 ~ L3, SMA antenna base J3, arrange seat P2 and form, microprocessor is put ground pin and is connected to the ground, Clock Signal pin, signal enable pin respectively with 6 of row seat P2, 5 pin connect, and the 7th tunnels analogy input pin is connected with the modulating output pin of temperature sensor chip U5, and the 6th tunnels analogy input pin is connected with the signal output pin of instrument amplifier U6, reset pin respectively with 7 pin arranging seat P2, electric capacity C18 and resistance R4 connects, analog power pin respectively with tantalum electric capacity C7 anode, electric capacity C6, magnetic bead L1 connects, electric capacity C6, tantalum electric capacity C7, the other end of electric capacity C18 is all connected to ground, and 1 pin and the electric capacity C8 of the first high-frequency crystal oscillator pin and crystal oscillator Y1 are connected, and 2 pin and the electric capacity C9 of the first high-frequency crystal oscillator pin and crystal oscillator Y1 are connected, electric capacity C8, the other end of C9 is all connected to ground, and RF signal is born pin and is connected with electric capacity C11, and the positive pin of RF signal is connected with electric capacity C10, the other end of electric capacity C10 respectively with inductance L 3, electric capacity C12 connects, the other end of electric capacity C11 respectively with electric capacity C13, inductance L 2 connects, electric capacity C12, the other end of inductance L 2 is connected with electric capacity C14 simultaneously, and the other end of electric capacity C14 is connected with SMA antenna base J3, and biasing resistor pin is connected with resistance R3, electric capacity C13, inductance L 3, the other end of resistance R3 is connected to ground, and is connected the while of the first low frequency crystal oscillator pin with 1 pin of crystal oscillator Y2 and electric capacity C15, is connected, electric capacity C15 while of the second low frequency crystal oscillator pin with 2 pin of crystal oscillator Y2 and electric capacity C16, the other end of electric capacity C16 is all connected to ground, clock debugging pin, debug data pin respectively with 3 of row seat P2, 4 pin connect, spi bus primary input pin, the main output pin of spi bus respectively with 9 of row seat P2, 8 pin connect, and digital power pin is connected with 2 pin of electric capacity C17 and toggle switch S2 simultaneously, resistance R4, inductance L 1, the other end of C19 is all connected with 2 pin of toggle switch S2, and 1 pin of P2 and the grounding leg of SMA base J3 are connected to ground, and digital power decoupling pin is connected with electric capacity C5, electric capacity C5, the other end of electric capacity C19 is connected to ground.
The beneficial effect that the utility model has is:
1) the utility model have employed environmental energy collection technique, enable sensor node at inside configuration active collection utilisable energy, and convert it to electric energy to power itself, constantly can obtain the utilisable energy in environment, substantially prolongs the life cycle of node.
2) the utility model have employed the radio-frequency (RF) energy collection mode based on electromagnetic radiation, electromagnetism can control the energy collected as the energy generation of carrier and the system of collection, and not by the restriction of space environment, its gathering-device settles difficulty also lower in actual use.The radiation scope of electromagnetic radiation is wider, and electromagnetic radiation is ubiquitous, and magnetic field of the earth, sunlight, mobile communication base station, Wi-Fi etc. can the different electromagnetic radiation of emissive porwer.
3) introducing of the microprocessor of super low-power consumption, wireless communication protocol, voltage stabilizing chip, the Temperature Humidity Sensor radio-frequency (RF) energy that enables wireless chargeable sensor network nodes perception fainter.
4) the health status reflecting structure that can be more accurate and visual in the monitoring of the corresponding dynamics of inside configuration and temperature.
Accompanying drawing explanation
Fig. 1 is overall structure block diagram of the present utility model;
Fig. 2 is the circuit theory diagrams of energy antenna module of the present utility model and energy conversion module;
Fig. 3 is the circuit theory diagrams of sensor assembly of the present utility model;
Fig. 4 is microprocessor module circuit theory diagrams of the present utility model.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail.
As shown in Figure 1, the overall structure of the wireless structural health monitoring node collected based on radio-frequency (RF) energy is described.This node comprises energy antenna module, energy conversion module, sensor assembly and microprocessor module.Energy antenna employing centre frequency is the Patch antenna of 915MHz, and the electromagnetic wave that energy antenna module received RF source is launched also is converted into high-frequency DC; Energy conversion module comprises RF-DC energy conversion module, energy storage module, Voltage stabilizing module three parts, carry out after impedance matching with energy antenna model calling, the high-frequency DC produced by antenna is converted to low-frequency d electricity and is stored in the middle of super capacitor; Sensor assembly is by temperature sensor and strain gauge perception and collection structure health and fitness information; Microprocessor module is the core of whole node, comprises microprocessor control module and ZigBee wireless communication module.Energy antenna module receives the electromagnetic wave in space environment, and be connected with RF-DC energy conversion module, energy storage module is connected with Voltage stabilizing module with RF-DC energy conversion module respectively, Voltage stabilizing module is connected with microprocessor module and sensor assembly respectively, temperature, answers dynamics two sensor assemblies and ZigBee communication module to be connected with microprocessor control module respectively.
As shown in Figure 2, be the circuit theory diagrams of the energized part of this sensor node, include collection of energy antenna, energy conversion module and energy storage module.Collection of energy antenna and energy conversion module carry out being connected after impedance matching, its load impedance 50 ohm, energy acceptance direction be directed level 122 °, vertical 68 °, linear gain 6.1dBi.RF-DC energy conversion module forms primarily of chip U1 and probe J2, what wherein U1 adopted is the P2110B power conversion chip of Powercast company of the U.S., energy storage module is primarily of AVXBestcap series super electric capacity C1, C2 composition, and Voltage stabilizing module is primarily of New Low Voltage difference linear voltage stabilization chip NCP698SQ30T1G, electric capacity C3 and C4, resistance R6, the patch light-emitting diode D1 composition of ON Semiconductor Corporation, wherein Patch antenna is connected with the SMA base on pcb board, Patch aerial signal output pin (No. 1 pin) is connected to the signal input pin (No. 3 pins) of power conversion chip U1, puts ground pin (2 ~ No. 5 pins) and is directly connected with the ground wire of pcb board, 1 pin of super capacitor C2 is connected with No. 1 pin of toggle switch S1 respectively with 2 pin, the positive pin of super capacitor C1 is connected with 3 pin of toggle switch S1, the stored energy pin (No. 8 pins) of power conversion chip U1 is connected with 2 pin of toggle switch S1, ground pin (2,4, No. 11 pins) of putting of power conversion chip U1 is connected to the ground respectively, and the output pin (No. 12 pins) of power conversion chip U1 is connected with probe J2, the signal input pin (No. 2 pins) of low voltage difference voltage stabilizing chip U2 respectively with probe J2, electric capacity C3 positive pole connects, the signal input pin (No. 2 pins) of voltage stabilizing chip U2 is connected with enable pin (No. 4 pins), ground pin (No. 1 pin) of putting of voltage stabilizing chip U2 is connected to ground, the signal output pin (No. 3 pins) of voltage stabilizing chip U2 is connected with electric capacity C4, electric capacity C4 is connected with 1 pin of toggle switch S2, No. 2 pins of toggle switch S2 are connected with 1 pin of row's seat P1, the two ends of resistance R6 are connected with light-emitting diode D1 positive pole with 2 pin of row's seat P1 respectively, the negative pole of the negative pin of super capacitor C1,3 pin of super capacitor C2 and 4 pin, electric capacity C3, the electric capacity C4 other end and the equal ground connection of light-emitting diode D1 negative pole.
As shown in Figure 3, the connection of sensor module circuitry schematic diagram is described.The high-precision low-power consumption temperature sensor MAX6613 that temperature sensor module is newly released by Mei Xin semiconductor company and electric capacity C21, C20 form, answer dynamics sensor assembly primarily of foil gauge U4, operational amplifier U6, resistance R5, R7 ~ R11, electric capacity C22 ~ C24 forms, wherein U4 adopts KFG series concrete foil gauge, the low power consumption high-precision general purpose instrument amplifier INA128 that U6 adopts TI company to release.First of temperature sensor chip U5 puts ground pin (No. 2 pins) and is connected with electric capacity C21 two ends respectively with modulating output pin (No. 3 pins), the modulating output pin (No. 3 pins) of temperature sensor chip U5 is connected with the 7th tunnels analogy input pin (No. 12 pins) of microprocessor U3, the energization pins (No. 4 pins) and second of temperature sensor chip U5 is put ground pin (No. 5 pins) and is connected with electric capacity C20 two ends respectively, and the energization pins (No. 4 pins) of temperature sensor chip U5 is connected with 2 pin of S1, first puts ground pin (No. 2 pins) and second puts ground pin (No. 5 pins) all ground connection, 2 pin of foil gauge U4 are connected to ground, 1 pin respectively with R5, R7 is connected with the signal positive input pin (No. 3 pins) of instrument amplifier U6, the other end of R5 is connected with adjustable resistance R8 intermediate ends, R9 one end is connected with adjustable resistance R8, the R9 other end is connected with the signal negative input pin (No. 2 pins) of instrument amplifier U6, R10 is connected with the signal negative input pin (No. 2 pins) of instrument amplifier U6, R7, R8, the other end of R10 is all connected with 2 pin of S1, the two ends of R11 respectively with the reference resistance pin (1 of instrument amplifier U6, No. 8 pins) connect, C22 is connected with the energization pins (No. 7 pins) of instrument amplifier U6, the signal output pin (No. 6 pins) of instrument amplifier U6 is connected with the 6th tunnels analogy input pin (No. 13 pins) of microprocessor U3, be connected with one end of C23 and C24 simultaneously, the negative supply pin (No. 4 pins) of instrument amplifier U6, reference voltage pin (No. 5 pins) and the other end of electric capacity C22 ~ C24 are connected to ground.
As shown in Figure 4, the circuit theory diagrams of microprocessor module are described.Microprocessor module by microcontroller and communication module integrated chip U3, paster crystal oscillator Y1 ~ Y2, electric capacity C5 ~ C19, resistance R3 ~ R4, inductance L 1 ~ L3, SMA antenna base J3, arrange seat P2 and form, what wherein U3 adopted is the CC2530 chip that TI company releases.Microprocessor is put ground pin (1 ~ No. 4 pin) and is connected to the ground, Clock Signal pin (No. 5 pins), signal enable pin (No. 6 pins) respectively with 6 of row seat P2, 5 pin connect, 7th tunnels analogy input pin (No. 12 pins) is connected with the modulating output pin (No. 3 pins) of temperature sensor chip U5, 6th tunnels analogy input pin (No. 13 pins) is connected with the signal output pin (No. 6 pins) of instrument amplifier U6, reset pin (No. 20 pins) respectively with 7 pin of row seat P2, electric capacity C18 and resistance R4 connects, analog power pin (21, 24, 27 ~ 29, No. 31 pins) respectively with tantalum electric capacity C7 anode, electric capacity C6, magnetic bead L1 connects, electric capacity C6, tantalum electric capacity C7, the other end of electric capacity C18 is all connected to ground, and 1 pin and the electric capacity C8 of the first high-frequency crystal oscillator pin (No. 22 pins) and crystal oscillator Y1 are connected, and 2 pin and the electric capacity C9 of the first high-frequency crystal oscillator pin (No. 23 pins) and crystal oscillator Y1 are connected, electric capacity C8, the other end of C9 is all connected to ground, and RF signal is born pin (No. 25 pins) and is connected with electric capacity C11, and the positive pin of RF signal (No. 26 pins) is connected with electric capacity C10, the other end of electric capacity C10 respectively with inductance L 3, electric capacity C12 connects, the other end of electric capacity C11 respectively with electric capacity C13, inductance L 2 connects, electric capacity C12, the other end of inductance L 2 is connected with electric capacity C14 simultaneously, and the other end of electric capacity C14 is connected with SMA antenna base J3, and biasing resistor pin (No. 30 pins) is connected with resistance R3, electric capacity C13, inductance L 3, the other end of resistance R3 is connected to ground, be connected with 1 pin of crystal oscillator Y2 and electric capacity C15 while of first low frequency crystal oscillator pin (No. 33 pins), be connected with 2 pin of crystal oscillator Y2 and electric capacity C16 while of second low frequency crystal oscillator pin (No. 32 pins), electric capacity C15, the other end of electric capacity C16 is all connected to ground, clock debugging pin (No. 34 pins), debug data pin (No. 35 pins) respectively with 3 of row seat P2, 4 pin connect, spi bus primary input pin (No. 37 pins), the main output pin of spi bus (No. 38 pins) respectively with 9 of row seat P2, 8 pin connect, digital power pin (No. 10 pins, No. 39 pins) be connected with 2 pin of electric capacity C17 and toggle switch S2, resistance R4 simultaneously, inductance L 1, the other end of C19 is all connected with 2 pin of toggle switch S2, and 1 pin of P2 and the grounding leg of SMA base J3 are connected to ground, and digital power decoupling pin (No. 40 pins) is connected with electric capacity C5, electric capacity C5, the other end of electric capacity C19 is connected to ground.
Claims (2)
1., based on the wireless structural health monitoring node that radio-frequency (RF) energy gathers, it is characterized in that, this node comprises energy antenna module, energy conversion module, sensor assembly and microprocessor module; Energy antenna module is made up of Patch antenna; Energy conversion module is made up of RF-DC energy conversion module, energy storage module and Voltage stabilizing module; Sensor assembly comprises temperature sensor module and answers dynamics sensor assembly; Microprocessor module comprises microprocessor control module and ZigBee wireless communication module; Energy antenna module receives the electromagnetic wave in space environment, and be connected with RF-DC energy conversion module, energy storage module is connected with Voltage stabilizing module with RF-DC energy conversion module respectively, Voltage stabilizing module is connected with microprocessor module and sensor assembly respectively, temperature, answers dynamics two sensor assemblies and ZigBee communication module to be connected with microprocessor control module respectively.
2. a kind of wireless structural health monitoring node gathered based on radio-frequency (RF) energy according to claim 1, it is characterized in that, described Patch antenna adopts centre frequency to be 915MHz oriented antenna; RF-DC energy conversion module comprises power conversion chip U1, probe J2; Energy storage module comprises super capacitor C1, C2 and switch S 1; Voltage stabilizing module comprises low voltage difference voltage stabilizing chip U2, electric capacity C3 and C4, resistance R6, light-emitting diode D1; Temperature sensor module comprises temperature sensor chip U5 and electric capacity C21, C20; The dynamics sensor assembly of answering comprises foil gauge U4, operational amplifier U6, resistance R5, R7 ~ R11, electric capacity C22 ~ C24; Wherein Patch antenna is connected with the SMA base on pcb board, and Patch aerial signal output pin is connected to the signal input pin of power conversion chip U1, puts ground pin and is directly connected with the ground wire of pcb board; 1 pin of super capacitor C2 is connected with No. 1 pin of toggle switch S1 respectively with 2 pin, the positive pin of super capacitor C1 is connected with 3 pin of toggle switch S1, the stored energy pin of power conversion chip U1 is connected with 2 pin of toggle switch S1, the ground pin of putting of power conversion chip U1 is connected to the ground respectively, and the output pin of power conversion chip U1 is connected with probe J2; The signal input pin of low voltage difference voltage stabilizing chip U2 is connected with probe J2, electric capacity C3 positive pole respectively, the signal input pin of voltage stabilizing chip U2 is connected with enable pin, the ground pin of putting of voltage stabilizing chip U2 is connected to ground, the signal output pin of voltage stabilizing chip U2 is connected with electric capacity C4, electric capacity C4 is connected with 1 pin of toggle switch S2, No. 2 pins of toggle switch S2 are connected with 1 pin of row's seat P1, and the two ends of resistance R6 are connected with light-emitting diode D1 positive pole with 2 pin of row's seat P1 respectively; The negative pole of the negative pin of super capacitor C1,3 pin of super capacitor C2 and 4 pin, electric capacity C3, the electric capacity C4 other end and the equal ground connection of light-emitting diode D1 negative pole;
First of temperature sensor chip U5 puts ground pin and is connected with electric capacity C21 two ends respectively with modulating output pin, the modulating output pin of temperature sensor chip U5 is connected with the 7th tunnels analogy input pin of microprocessor U3, the energization pins and second of temperature sensor chip U5 is put ground pin and is connected with electric capacity C20 two ends respectively, and the energization pins of temperature sensor chip U5 is connected with 2 pin of S1, first puts ground pin and second puts the equal ground connection of ground pin, 2 pin of foil gauge U4 are connected to ground, 1 pin respectively with R5, R7 is connected with the signal positive input pin of instrument amplifier U6, the other end of R5 is connected with adjustable resistance R8 intermediate ends, R9 one end is connected with adjustable resistance R8, the R9 other end is connected with the signal negative input pin of instrument amplifier U6, R10 is connected with the signal negative input pin of instrument amplifier U6, R7, R8, the other end of R10 is all connected with 2 pin of S1, the two ends of R11 are connected with the reference resistance pin of instrument amplifier U6 respectively, C22 is connected with the energization pins of instrument amplifier U6, the signal output pin of instrument amplifier U6 is connected with the 6th tunnels analogy input pin of microprocessor U3, be connected with one end of C23 and C24 simultaneously, the negative supply pin of instrument amplifier U6, the other end of reference voltage pin and electric capacity C22 ~ C24 is connected to ground,
Described microprocessor module by microcontroller and communication module integrated chip U3, paster crystal oscillator Y1 ~ Y2, electric capacity C5 ~ C19, resistance R3 ~ R4, inductance L 1 ~ L3, SMA antenna base J3, arrange seat P2 and form, microprocessor is put ground pin and is connected to the ground, Clock Signal pin, signal enable pin respectively with 6 of row seat P2, 5 pin connect, and the 7th tunnels analogy input pin is connected with the modulating output pin of temperature sensor chip U5, and the 6th tunnels analogy input pin is connected with the signal output pin of instrument amplifier U6, reset pin respectively with 7 pin arranging seat P2, electric capacity C18 and resistance R4 connects, analog power pin respectively with tantalum electric capacity C7 anode, electric capacity C6, magnetic bead L1 connects, electric capacity C6, tantalum electric capacity C7, the other end of electric capacity C18 is all connected to ground, and 1 pin and the electric capacity C8 of the first high-frequency crystal oscillator pin and crystal oscillator Y1 are connected, and 2 pin and the electric capacity C9 of the first high-frequency crystal oscillator pin and crystal oscillator Y1 are connected, electric capacity C8, the other end of C9 is all connected to ground, and RF signal is born pin and is connected with electric capacity C11, and the positive pin of RF signal is connected with electric capacity C10, the other end of electric capacity C10 respectively with inductance L 3, electric capacity C12 connects, the other end of electric capacity C11 respectively with electric capacity C13, inductance L 2 connects, electric capacity C12, the other end of inductance L 2 is connected with electric capacity C14 simultaneously, and the other end of electric capacity C14 is connected with SMA antenna base J3, and biasing resistor pin is connected with resistance R3, electric capacity C13, inductance L 3, the other end of resistance R3 is connected to ground, and is connected the while of the first low frequency crystal oscillator pin with 1 pin of crystal oscillator Y2 and electric capacity C15, is connected, electric capacity C15 while of the second low frequency crystal oscillator pin with 2 pin of crystal oscillator Y2 and electric capacity C16, the other end of electric capacity C16 is all connected to ground, clock debugging pin, debug data pin respectively with 3 of row seat P2, 4 pin connect, spi bus primary input pin, the main output pin of spi bus respectively with 9 of row seat P2, 8 pin connect, and digital power pin is connected with 2 pin of electric capacity C17 and toggle switch S2 simultaneously, resistance R4, inductance L 1, the other end of C19 is all connected with 2 pin of toggle switch S2, and 1 pin of P2 and the grounding leg of SMA base J3 are connected to ground, and digital power decoupling pin is connected with electric capacity C5, electric capacity C5, the other end of electric capacity C19 is connected to ground.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520825960.1U CN205017117U (en) | 2015-10-21 | 2015-10-21 | Wireless structural health monitors node based on radio frequency energy is gathered |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520825960.1U CN205017117U (en) | 2015-10-21 | 2015-10-21 | Wireless structural health monitors node based on radio frequency energy is gathered |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205017117U true CN205017117U (en) | 2016-02-03 |
Family
ID=55215700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520825960.1U Expired - Fee Related CN205017117U (en) | 2015-10-21 | 2015-10-21 | Wireless structural health monitors node based on radio frequency energy is gathered |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205017117U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105186719A (en) * | 2015-10-21 | 2015-12-23 | 浙江大学 | Wireless-structure health monitoring node based on radio frequency energy acquisition |
| CN107328971A (en) * | 2017-06-15 | 2017-11-07 | 国家电网公司 | A kind of intelligent electric meter system |
-
2015
- 2015-10-21 CN CN201520825960.1U patent/CN205017117U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105186719A (en) * | 2015-10-21 | 2015-12-23 | 浙江大学 | Wireless-structure health monitoring node based on radio frequency energy acquisition |
| CN105186719B (en) * | 2015-10-21 | 2018-02-09 | 浙江大学 | Wireless structural health monitoring node based on RF energy collection |
| CN107328971A (en) * | 2017-06-15 | 2017-11-07 | 国家电网公司 | A kind of intelligent electric meter system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103795136B (en) | Micro-energy collecting system of WSN node | |
| CN105186719A (en) | Wireless-structure health monitoring node based on radio frequency energy acquisition | |
| CN104217566A (en) | Intelligent meter searching method and system for type II collector | |
| CN107219441A (en) | Ultra-high-tension power transmission line fault location system based on mobile phone A PP | |
| CN205017117U (en) | Wireless structural health monitors node based on radio frequency energy is gathered | |
| CN104597352A (en) | Power quality monitoring system | |
| CN205232038U (en) | Variable frequency power supply circuit and TV set | |
| CN102932711A (en) | Wireless microphone signal transmitting circuit | |
| CN210181439U (en) | Intelligent sensor with wide temperature range, long service life and wireless communication support | |
| CN113314837B (en) | Polarization-insensitive WIFI frequency band electromagnetic energy collection surface | |
| CN208386945U (en) | A kind of wake-up circuit for acquiring RF energy for wireless sensor node | |
| Ding et al. | Research of wireless sensor network nodes based on ambient energy harvesting | |
| CN105933426A (en) | Farmland environment monitoring system and method based on solar power generation | |
| CN105048649A (en) | Environmental radio frequency energy collector based on electromagnetic metamaterial frequency selective surface | |
| CN212909121U (en) | 2.4-2.5GHz RF energy collecting device | |
| CN210225835U (en) | High-power solar lamp control circuit based on microwave human body induction | |
| CN204346484U (en) | Transmission line of electricity monitoring terminal and on-line monitoring system | |
| CN201726173U (en) | Wireless sensor device for civil engineering structure health monitoring | |
| CN201788514U (en) | Novel RFID (radio frequency identification) tag micro-energy collection control device | |
| CN204761725U (en) | A can awaken wireless sensor network node module up for illumination intensity detects | |
| CN205175564U (en) | Temperature measurement circuit and monitored control system of electric wire netting contact | |
| CN203882887U (en) | Energy-saving single-coil magnetic latching relay device with differential driving circuit | |
| CN203377648U (en) | Improved circuit sharing contact in triggering and charging | |
| CN103787261B (en) | A kind of integrated form multiple tracks collection of energy micro mechanical structure | |
| CN204065317U (en) | A kind of group-net communication type fault indication device for power distribution line |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160203 Termination date: 20181021 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |