CN205005414U - Protection printed circuit board device - Google Patents
Protection printed circuit board device Download PDFInfo
- Publication number
- CN205005414U CN205005414U CN201520613722.4U CN201520613722U CN205005414U CN 205005414 U CN205005414 U CN 205005414U CN 201520613722 U CN201520613722 U CN 201520613722U CN 205005414 U CN205005414 U CN 205005414U
- Authority
- CN
- China
- Prior art keywords
- cooling
- printed circuit
- temperature
- panel assembly
- flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 22
- 239000000110 cooling liquid Substances 0.000 claims description 17
- 239000012809 cooling fluid Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000001514 detection method Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a protection printed circuit board device, including circuit substrate, cooling base plate and flow governor, the circuit substrate is installed in cooling base plate top, flow governor installs on the cooling base plate, flow governor passes through the water -cooled tube and connects cooling cistern no. 1 and cooling cistern no. 2, inside temperature sensor, velocity of flow sensor, micro - processing chip, accumulator and the controlling element that flows of being provided with of flow governor, compared with the prior art, the utility model discloses following beneficial effect has: can the detection circuitry substrate temperature through temperature sensor, when the temperature is higher than a critical value, can dispel the heat automatically, can be immediately and conduct electronic component to loose to the heat of circuit edition of books body fast and remove.
Description
Technical field
The utility model is a kind of protection printed circuit panel assembly, belongs to electric circuit protection equipment field.
Background technology
Along with high power, the high integrated develop rapidly of electronic devices and components, the components and parts that specific volume power density is higher are applied more and more widely.In real work, the temperature of power component often increases by 10 DEG C, and its life-span will reduce half, and therefore, the radiating element supporting with high performance components is also changed at generation technique gradually.The air-cooled type of cooling of tradition cannot meet the job requirement of high-power electronic component, water-cooled just progressively replaces air-cooled, be mainly used in the cooling of high performance components, compared with ventilation panel, water-cooling base plate has the feature of the maintainability that unit volume radiating efficiency is large, reliability is high and good, is a kind of heat dissipation equipment being widely used in daily and industrial high-power electronic component.
General circuit plate is all be made up of bakelite or glass fibre, the radiating effect of circuit board itself is poor, cannot immediately and rapidly electronic component is conducted to that the heat of circuit board itself is loose to be removed, especially some are very easily produced to the electronic component of high temperature, the light-emittingdiode etc. of such as high luminous power, therefore, a kind of system with treatment circuit plate temperature that can detect is needed.
Utility model content
For the deficiency that prior art exists, the utility model object is to provide a kind of protection printed circuit panel assembly, and to solve the problem proposed in above-mentioned background technology, the utility model is easy to use, convenient operation, good stability, and reliability is high.
To achieve these goals; the utility model realizes by the following technical solutions: a kind of protection printed circuit panel assembly; comprise circuit substrate, cooling base and flow governor; described circuit substrate is arranged on above cooling base; described flow governor is arranged on cooling base; described flow governor connects cooling liquid reservoir one and cooling liquid reservoir two by water cooling tube, and described flow governor inside is provided with temperature sensor, flow sensor, miniature process chip, holder and flow control component.
Further, described cooling liquid reservoir one and cooling liquid reservoir two inside are provided with the cooling fluid of the chilling temperature lower than ambient temperature.
Further, described flow control component is a kind of whether flowing for controlled cooling model liquid or the control element of flowing velocity.
Further, described miniature process chip is connected with the temperature sensor for testing circuit substrate temperature, and described miniature process chip is also connected with the flow sensor for detecting cooling liquid speed.
Further, described miniature process chip be electrically connected for the holder storing working temperature critical value.
Further, described flow control component is electrically connected with the miniature process chip controlling its work.
The beneficial effects of the utility model: one protection printed circuit panel assembly of the present utility model; can testing circuit substrate temperature by temperature sensor; when temperature is higher than a critical value; can automatic heat radiation, can immediately and rapidly electronic component is conducted to that the heat of circuit board itself is loose to be removed.
Accompanying drawing explanation
By reading the detailed description done non-limiting example with reference to the following drawings, other features, objects and advantages of the present utility model will become more obvious:
Fig. 1 is a kind of structural representation protecting printed circuit panel assembly of the utility model;
Fig. 2 is a kind of cooling base structural representation protecting printed circuit panel assembly of the utility model;
Fig. 3 is a kind of operation principle block diagram protecting printed circuit panel assembly of the utility model;
In figure: 1-circuit substrate, 2-cooling base, 21-flow governor, 22-cool liquid reservoir one, 23-cools liquid reservoir two, 24-water cooling tube, 25-temperature sensor, 26-flow sensor, the miniature process chip of 27-, 28-holder, 29-flow control component.
Embodiment
The technological means realized for making the utility model, creation characteristic, reaching object and effect is easy to understand, below in conjunction with embodiment, setting forth the utility model further.
Refer to Fig. 1, Fig. 2 and Fig. 3; the utility model provides a kind of technical scheme: a kind of protection printed circuit panel assembly; comprise circuit substrate 1, cooling base 2 and flow governor 21; circuit substrate 1 is arranged on above cooling base 2; flow governor 21 is arranged on cooling base 2; flow governor 21 connects cooling liquid reservoir 1 and cooling liquid reservoir 2 23 by water cooling tube 24, and flow governor 21 inside is provided with temperature sensor 25, flow sensor 26, miniature process chip 27, holder 28 and flow control component 29.
Cooling liquid reservoir 1 and cooling liquid reservoir 2 23 inside are provided with the cooling fluid of the chilling temperature lower than ambient temperature, flow control component 29 is a kind of whether flowings for controlled cooling model liquid or the control element of flowing velocity, miniature process chip 27 is connected with the temperature sensor 25 for testing circuit substrate 2 temperature, miniature process chip 27 is also connected with the flow sensor 26 for detecting cooling liquid speed, miniature process chip 27 be electrically connected for the holder 28 storing working temperature critical value, flow control component 29 is electrically connected with the miniature process chip 27 controlling its work.
When reality uses, temperature sensor 25 can testing circuit substrate 2 temperature, the temperature information detected can be sent in miniature process chip 27 by temperature sensor 25, miniature process chip 27 is after further calculating and processing, by contrasting with the temperature threshold value in holder 28, if higher than this critical value, miniature process chip 27 can control flow control component, and then the cooling fluid of storage in cooling liquid reservoir 1 and cooling liquid reservoir 2 23 is flowed out, flow in water cooling tube 25, the flow rate information of cooling fluid can be sent in miniature process chip 27 by flow sensor 26, miniature process chip 27 is after further processing, by controlling flow control component 29, and then controlled cooling model flow velocity, thus the heat that immediately and rapidly electronic component can be conducted to circuit substrate 1 itself is loose removes.
More than show and describe general principle of the present utility model and principal character and advantage of the present utility model, to those skilled in the art, obvious the utility model is not limited to the details of above-mentioned one exemplary embodiment, and when not deviating from spirit of the present utility model or essential characteristic, the utility model can be realized in other specific forms.Therefore, no matter from which point, all should embodiment be regarded as exemplary, and be nonrestrictive, scope of the present utility model is limited by claims instead of above-mentioned explanation, and all changes be therefore intended in the implication of the equivalency by dropping on claim and scope are included in the utility model.Any Reference numeral in claim should be considered as the claim involved by limiting.
In addition, be to be understood that, although this specification is described according to execution mode, but not each execution mode only comprises an independently technical scheme, this narrating mode of specification is only for clarity sake, those skilled in the art should by specification integrally, and the technical scheme in each embodiment also through appropriately combined, can form other execution modes that it will be appreciated by those skilled in the art that.
Claims (6)
1. a protection printed circuit panel assembly; comprise circuit substrate, cooling base and flow governor; it is characterized in that: described circuit substrate is arranged on above cooling base; described flow governor is arranged on cooling base; described flow governor connects cooling liquid reservoir one and cooling liquid reservoir two by water cooling tube, and described flow governor inside is provided with temperature sensor, flow sensor, miniature process chip, holder and flow control component.
2. one protection printed circuit panel assembly according to claim 1, is characterized in that: described cooling liquid reservoir one and cooling liquid reservoir two inside are provided with the cooling fluid of the chilling temperature lower than ambient temperature.
3. one protection printed circuit panel assembly according to claim 1, is characterized in that: described flow control component is a kind of whether flowing for controlled cooling model liquid or the control element of flowing velocity.
4. one protection printed circuit panel assembly according to claim 1; it is characterized in that: described miniature process chip is connected with the temperature sensor for testing circuit substrate temperature, described miniature process chip is also connected with the flow sensor for detecting cooling liquid speed.
5. one protection printed circuit panel assembly according to claim 1, is characterized in that: described miniature process chip be electrically connected for the holder storing working temperature critical value.
6. the one protection printed circuit panel assembly according to claim 1 or 3, is characterized in that: described flow control component is electrically connected with the miniature process chip controlling its work.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520613722.4U CN205005414U (en) | 2015-08-16 | 2015-08-16 | Protection printed circuit board device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520613722.4U CN205005414U (en) | 2015-08-16 | 2015-08-16 | Protection printed circuit board device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205005414U true CN205005414U (en) | 2016-01-27 |
Family
ID=55162279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520613722.4U Expired - Fee Related CN205005414U (en) | 2015-08-16 | 2015-08-16 | Protection printed circuit board device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205005414U (en) |
-
2015
- 2015-08-16 CN CN201520613722.4U patent/CN205005414U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| CB03 | Change of inventor or designer information |
Inventor after: Dang Yingcai Inventor after: Jiang Huaijun Inventor before: Huang Kaogan Inventor before: Wei Yang Inventor before: Xie Yanjuan |
|
| COR | Change of bibliographic data | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160614 Address after: 528455 Guangdong province Zhongshan City, four South Road No. 50 Building No. 3 second two Patentee after: Zhongshan Heng Neng Electronic Technology Co., Ltd. Address before: 528400 Guangdong city of Zhongshan Province in Shiqi District of Liantang Road No. 8 lotus Hing Building 707 Patentee before: Huang Kaogan |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160127 Termination date: 20160816 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |