CN204993837U - Loudspeaker module - Google Patents
Loudspeaker module Download PDFInfo
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- CN204993837U CN204993837U CN201520772716.3U CN201520772716U CN204993837U CN 204993837 U CN204993837 U CN 204993837U CN 201520772716 U CN201520772716 U CN 201520772716U CN 204993837 U CN204993837 U CN 204993837U
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- loud speaker
- microwell array
- speaker module
- lower casing
- circuit assembly
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Abstract
The utility model relates to a loudspeaker module, include: a housing, the casing includes epitheca and inferior valve, cavity configuration in the casing prescribes a limit to one is provided with the micropore array at least on one of epitheca or inferior valve, and the speaker monomer, including magnetic circuit assembly and vibration subassembly, the vibration subassembly will interior cavity configuration is separated for ante -chamber and back cavity, the last magnetic gap that is provided with predetermined pattern of magnetic circuit assembly, magnetic circuit assembly is close to the inferior valve setting. The utility model discloses the heat dissipation problem that the technical problem that will solve is loudspeaker module.
Description
Technical field
The utility model relates to electroacoustic techniques field, and more specifically, the utility model relates to a kind of loud speaker.
Background technology
Along with the development of modern technologies, the requirement of people to electronic equipment is more and more higher.Loud speaker is as a part indispensable in mobile device, and people it is also proposed higher requirement to its quality.And while raising loudspeaker sound quality and volume, the operating power of loud speaker also continues to increase.Vibrating diaphragm assembly in loud speaker module can be subject to the obstruction of the air in chamber, front and back when vibration, therefore can produce a large amount of heats when vibration, along with the continuous increase of operating power, the heat produced in its course of work also constantly increases.Loud speaker is as a kind of high-grade, precision and advanced electronic component, and it constructs exquisiteness, complex structure, often the heat of generation cannot be got rid of timely and effectively, and too much heat can to vibrating diaphragm assembly, and magnetic circuit assembly impacts.
In the prior art, in view of loud speaker module is comparatively small, research staff does not adopt the method improving its structure to strengthen radiating effect usually, but adopts the intrinsic phonate hole of loud speaker and damping hole to dispel the heat.But inventor finds that said method is because damping hole is generally away from magnetic circuit, and phonate hole is also comparatively far away apart from vibration component, and therefore adopt the mode of phonate hole and damping hole heat radiation to be shed by heat efficiently and effectively, radiating efficiency is low.And the percent opening of damping hole and phonate hole is little, affects radiating effect.Therefore inventor provide a kind of under the prerequisite of acoustic characteristic not affecting loud speaker, the loud speaker module that loud speaker heat effectively can be distributed.
Utility model content
An object of the present utility model is the radiating effect strengthening loud speaker module under the prerequisite not affecting acoustical behavior.
According to an aspect of the present utility model, a kind of loud speaker module is provided, comprises:
Housing, described housing comprises upper casing and lower casing, and described housing limits an inner-cavity structure, at least on one of upper casing or lower casing, is provided with microwell array; And
Loudspeaker monomer, comprises magnetic circuit assembly and vibration component, and described inner-cavity structure is divided into ante-chamber and back cavity by described vibration component, described magnetic circuit assembly is provided with the magnetic gap of predetermined pattern, and described magnetic circuit assembly is arranged near lower casing.
Preferably, only on the position corresponding with described front cavity region of described upper casing, microwell array is provided with.
Preferably, only on described lower casing, the microwell array corresponding with described magnetic gap pattern is provided with.
Preferably, the position that described lower casing is corresponding with magnetic circuit assembly is set to magnetic conductive board, and described microwell array is arranged on magnetic conductive board.
Preferably, on the position corresponding with described front cavity region of described upper casing and on described lower casing and the corresponding position of magnetic gap pattern, microwell array is provided with.
Preferably, the position that described lower casing is corresponding with magnetic circuit assembly is set to magnetic conductive board, and described microwell array is arranged on magnetic conductive board.
Preferably, the aperture of described microwell array is not more than 0.05mm.
Preferably, the corresponding described loudspeaker monomer of described housing is provided with injection molding steel disc, and described microwell array is arranged on corresponding injection molding steel disc.
Preferably, described housing also comprises mesochite, and described upper casing, mesochite and lower casing limit an inner-cavity structure jointly.
A technique effect of the present utility model is, utilizes the microwell array at least offered on upper casing or lower casing to strengthen the radiating effect of loud speaker module.The microwell array that the utility model is offered on upper casing or lower casing is compared with phonate hole of the prior art and damping hole, and distance thermal source is comparatively near, and percent opening is higher, therefore substantially increases the radiating efficiency of loud speaker module.
By referring to the detailed description of accompanying drawing to exemplary embodiment of the present utility model, further feature of the present utility model and advantage thereof will become clear.
Accompanying drawing explanation
What form a part for specification drawings describes embodiment of the present utility model, and together with the description for explaining principle of the present utility model.
Fig. 1 is the schematic diagram of loud speaker module.
Fig. 2 is the schematic diagram of loud speaker module.
Fig. 3 is the cutaway view at c and the c in Fig. 2 ' place.
Fig. 4 is the enlarged drawing at A place in Fig. 3.
Embodiment
Various exemplary embodiment of the present utility model is described in detail now with reference to accompanying drawing.It should be noted that: unless specifically stated otherwise, otherwise positioned opposite, the numerical expression of the parts of setting forth in these embodiments and step and numerical value do not limit scope of the present utility model.
Illustrative to the description only actually of at least one exemplary embodiment below, never as any restriction to the utility model and application or use.
The technology and equipment known for person of ordinary skill in the relevant may not discuss in detail, but in the appropriate case, described technology and equipment should be regarded as a part for specification.
In all examples with discussing shown here, any occurrence should be construed as merely exemplary, instead of as restriction.Therefore, other example of exemplary embodiment can have different values.
It should be noted that: represent similar terms in similar label and letter accompanying drawing below, therefore, once be defined in an a certain Xiang Yi accompanying drawing, then do not need to be further discussed it in accompanying drawing subsequently.
According to the first specific embodiment of the present utility model, provide a kind of loud speaker module, this loud speaker comprises housing and loudspeaker unit.Its middle shell is divided into upper casing 3, mesochite 2 and lower casing 1, and upper casing 3, mesochite 2 define an inner-cavity structure with lower casing 1.Wherein loudspeaker monomer comprises magnetic circuit assembly 5 and vibration component, and inner-cavity structure is divided into ante-chamber and back cavity by vibration component, comprises voice coil loudspeaker voice coil 7 in vibration component.Magnetic circuit assembly 5 is provided with the magnetic gap of predetermined pattern, described magnetic circuit assembly is arranged near lower casing.
Only on the position corresponding with front cavity region of upper casing 3, be provided with microwell array 6 in the present embodiment, microwell array here refer to and adopt the microwell array offered of laser, the technology such as etching also can be adopted in actual applications to offer microwell array.In the present embodiment, the pore size control of microwell array is in 0.05mm, ensures that sound does not shed from micropore.The material that position corresponding with microwell array 6 on upper casing 3 in the present embodiment adopts is injection molding steel disc.But; those skilled in the art should understand; this is the most preferred mode of the present embodiment; and concrete restriction should do not carried out to the material of upper casing 3; those skilled in the art can carry out being out of shape and expanding according to actual conditions, but these distortion and expansion all should belong to protection range of the present utility model.
Because the present embodiment offers microwell array 6 on the upper casing 3 corresponding with front cavity region, because inner chamber has been separated into ante-chamber and back cavity by the vibrating diaphragm in vibration component, therefore alternatively set in the present embodiment microwell array 6 is corresponding with vibrating diaphragm.Loud speaker module, in the process of carrying out work, can produce a large amount of heats during diaphragm oscillations.This kind utilizes the heat dissipating method arranging micropore in the position that upper casing is corresponding with front cavity region, changes by the mode that intrinsic phonate hole dispels the heat indirectly in prior art, directly utilizes conduction to be got rid of by heat.The heat at vibrating diaphragm place, due to the direct corresponding thermal source of position of opening, can be discharged to loud speaker module outside by this kind of method timely and effectively, prevents the distortion that vibrating diaphragm causes because of high temperature.Inventor considers the acoustic characteristic of loud speaker module, so carried out requirement to aperture.When inventor's repetition test, find that aperture need control in 0.05mm, this ensure that sound can not shed from micropore, namely while the acoustic characteristic that ensure that loud speaker module, also there is splendid radiating effect.
According to the second specific embodiment of the present utility model, provide a kind of loud speaker module, this loud speaker comprises housing and loudspeaker unit.Its middle shell is divided into upper casing 3, mesochite 2 and lower casing 1, and upper casing 3, mesochite 2 define an inner-cavity structure with lower casing 1.Wherein loudspeaker monomer comprises magnetic circuit assembly 5 and vibration component, and inner-cavity structure is divided into ante-chamber and back cavity by vibration component, comprises voice coil loudspeaker voice coil 7 in vibration component.Magnetic circuit assembly 5 is provided with the magnetic gap of predetermined pattern, and magnetic circuit assembly 5 is arranged near lower casing.
Only on lower casing 1, the microwell array corresponding with magnetic gap pattern is provided with in the present embodiment.Here microwell array refer to and adopt the microwell array offered of laser, the technology such as etching also can be adopted in actual applications to offer microwell array.In the present embodiment, the pore size control of micropore is in 0.05mm, ensures that sound does not shed from micropore.
Because the present embodiment is only provided with the microwell array 4 corresponding with magnetic gap pattern on lower casing 1, because set microwell array is corresponding with magnetic gap, this kind of method, change by the mode that intrinsic damping hole dispels the heat indirectly in prior art, directly utilize microwell array to conduct and heat is discharged.The heat at magnetic gap place, due to the direct corresponding thermal source of position of opening, can be discharged to loud speaker module outside by this kind of method timely and effectively, prevents the generation of high temperature demagnetization phenomenon.Inventor considers the acoustic characteristic of loud speaker module, so carried out requirement to aperture.When inventor's repetition test, find that aperture need control in 0.05mm, this ensure that sound can not shed from micropore, both ensure that the acoustic characteristic of loud speaker module, also there is splendid radiating effect simultaneously.
According to the 3rd specific embodiment of the present utility model, provide a kind of loud speaker module, this loud speaker comprises housing and loudspeaker unit.Its middle shell is divided into upper casing 3, mesochite 2 and lower casing 1, and upper casing 3, mesochite 2 define an inner-cavity structure with lower casing 1.Wherein loudspeaker monomer comprises magnetic circuit assembly 5 and vibration component, and inner-cavity structure is divided into ante-chamber and back cavity by vibration component, comprises voice coil loudspeaker voice coil 7 in vibration component.Magnetic circuit assembly 5 is provided with the magnetic gap of predetermined pattern, and magnetic circuit assembly is arranged near lower casing.
The position that in the present embodiment, lower casing 1 is corresponding with magnetic circuit assembly is provided with magnetic conductive board 8, in the present embodiment, only on magnetic conductive board 8, is provided with the microwell array corresponding with magnetic gap.Here microwell array refer to and adopt the microwell array of laser open, the technology such as etching also can be adopted in actual applications to offer microwell array to magnetic conductive board.In the present embodiment, the pore size control of micropore is in 0.05mm, ensures that sound does not shed from micropore.
Because the present embodiment is provided with the microwell array 4 corresponding with magnetic gap on only magnetic conductive board 8, because set microwell array 4 is corresponding with magnetic gap, this kind of method, change by the mode that intrinsic damping hole dispels the heat indirectly in prior art, directly utilize microwell array to conduct and heat is discharged.The heat at magnetic gap place, due to the direct corresponding thermal source of position of opening, can be discharged to loud speaker module outside by this kind of method timely and effectively, prevents the generation of high temperature demagnetization phenomenon, also can prevent the too high distortion of vibrating diaphragm Yin Wendu.Inventor considers the acoustic characteristic of loud speaker module, so carried out requirement to aperture.When inventor's repetition test, find that aperture need control in 0.05mm, this ensure that sound can not shed from micropore, both ensure that the acoustic characteristic of loud speaker module, also there is splendid radiating effect simultaneously.
According to the 4th specific embodiment of the present utility model, provide a kind of loud speaker module, this loud speaker comprises housing and loudspeaker unit.Its middle shell is divided into upper casing 3, mesochite 2 and lower casing 1, and upper casing 3, mesochite 2 define an inner-cavity structure with lower casing 1.Wherein loudspeaker monomer comprises magnetic circuit assembly 5 and vibration component, and inner-cavity structure is divided into ante-chamber and back cavity by vibration component, comprises voice coil loudspeaker voice coil 7 in vibration component.Magnetic circuit assembly 5 is provided with the magnetic gap of predetermined pattern, and magnetic circuit assembly is arranged near lower casing.
The present embodiment is provided with microwell array on the position corresponding with front cavity region of upper casing 3 and on the position corresponding with magnetic gap of lower casing 1, here microwell array refer to and adopt the microwell array offered of laser, the technology such as etching also can be adopted in actual applications to offer microwell array.In the present embodiment, the pore size control of microwell array is in 0.05mm, ensures that sound does not shed from micropore.The material that position corresponding with microwell array 6 on upper casing 3 in the present embodiment adopts is injection molding steel disc.But; those skilled in the art should understand; this is the most preferred mode of the present embodiment; and concrete restriction should do not carried out to the material of upper casing 3; those skilled in the art can carry out being out of shape and expanding according to actual conditions, but these distortion and expansion all should belong to protection range of the present utility model.
Because the present embodiment is on the position corresponding with front cavity region of upper casing 3 and the microwell array corresponding with the magnetic gap in magnetic circuit assembly of lower casing 1, because microwell array 6 set on upper casing 3 is corresponding with vibrating diaphragm, microwell array 4 set on lower casing 1 is corresponding with magnetic gap, this kind of method, directly utilizes the microwell array at this two place to conduct and is discharged by heat.This kind of method is due to the direct corresponding thermal source vibrating diaphragm of position of opening and magnetic gap two place thermal source, therefore directly the heat at vibrating diaphragm and magnetic gap place can be discharged to loud speaker module outside timely and effectively, while the generation preventing high temperature demagnetization phenomenon, also the too high distortion of vibrating diaphragm Yin Wendu can be prevented, and, when this kind of method to set up effectively can improve vibration, cavity internal gas pressure environment, reduces resistance during diaphragm oscillations, can effectively reduce voice coil loudspeaker voice coil heat production.Inventor contemplates the acoustic characteristic of loud speaker module while considering the heat radiation of maximum validity, so propose requirement to aperture.When inventor's repetition test, find that aperture need control in 0.05mm, this ensure that sound can not shed from micropore, both ensure that the acoustic characteristic of loud speaker module, also there is best radiating effect simultaneously.
According to the 5th specific embodiment of the present utility model, provide a kind of loud speaker module, this loud speaker comprises housing and loudspeaker unit, and concrete structure as shown in Figure 1.Its middle shell is divided into upper casing 3, mesochite 2 and lower casing 1, and upper casing 3, mesochite 2 define an inner-cavity structure with lower casing 1.In the present embodiment, lower casing also comprises the magnetic conductive board that corresponding magnetic circuit assembly is arranged.Wherein loudspeaker monomer comprises magnetic circuit assembly 5 and vibration component, and inner-cavity structure is divided into ante-chamber and back cavity by vibration component, comprises voice coil loudspeaker voice coil 7 in vibration component.Magnetic circuit assembly 5 is provided with the magnetic gap of predetermined pattern, and magnetic circuit assembly is arranged near lower casing.
The present embodiment is provided with microwell array 6 on the position corresponding with front cavity region of upper casing 3, and simultaneously on the magnetic conductive board 8 of lower casing 1 position corresponding with magnetic gap be provided with microwell array 4, as shown in Figures 2 to 4.Here microwell array refer to and adopt the microwell array offered of laser technology, the technology such as etching also can be adopted in actual applications to offer micropore.In the present embodiment, the pore size control of micropore is in 0.05mm, ensures that sound does not shed from micropore.The material that position corresponding with microwell array 6 on upper casing 3 in the present embodiment adopts is injection molding steel disc.But; those skilled in the art should understand; this is the most preferred mode of the present embodiment; and concrete restriction should do not carried out to the material of housing; those skilled in the art can carry out being out of shape and expanding according to actual conditions, and these distortion and expansion all should belong to protection range of the present utility model.
Because the present embodiment is provided with microwell array 6 on the position corresponding with front cavity region of upper casing 3, and simultaneously on the magnetic conductive board 8 of lower casing the position corresponding with magnetic gap be provided with microwell array 4, because the position of microwell array set on upper casing is corresponding with vibrating diaphragm, the position of microwell array set on the magnetic conductive board 8 of lower casing is corresponding with magnetic gap, this kind of method, directly utilizes the microwell array at this two place to conduct and is discharged by heat.This kind of method is due to the direct corresponding thermal source vibrating diaphragm of position of opening and magnetic gap two place thermal source, directly the heat at vibrating diaphragm and magnetic gap place can be discharged to loud speaker module outside timely and effectively, while the generation preventing high temperature demagnetization phenomenon, also the too high distortion of vibrating diaphragm Yin Wendu can be prevented, and, when this kind of method to set up effectively can improve vibration, cavity internal gas pressure environment, reduces resistance during diaphragm oscillations, can effectively reduce voice coil loudspeaker voice coil heat production.Therefore the present embodiment is optimum embodiment, and namely the radiating efficiency of the present embodiment is maximum.Inventor contemplates the acoustic characteristic of loud speaker module while considering the heat radiation of maximum validity, so carried out requirement to aperture.When inventor's repetition test, find that aperture need control in 0.05mm, this ensure that sound can not shed from micropore, both ensure that the acoustic characteristic of loud speaker module, also there is best radiating effect simultaneously.
Although be described in detail specific embodiments more of the present utility model by example, it should be appreciated by those skilled in the art, above example is only to be described, instead of in order to limit scope of the present utility model.It should be appreciated by those skilled in the art, when not departing from scope and spirit of the present utility model, above embodiment can be modified.Scope of the present utility model is limited by claims.
Claims (9)
1. a loud speaker module, is characterized in that, comprising:
Housing, described housing comprises upper casing (3) and lower casing (1), and described housing limits an inner-cavity structure, at least on one of upper casing (3) or lower casing (1), is provided with microwell array; And
Loudspeaker monomer, comprise magnetic circuit assembly (5) and vibration component, described inner-cavity structure is divided into ante-chamber and back cavity by described vibration component, described magnetic circuit assembly (5) is provided with the magnetic gap of predetermined pattern, and described magnetic circuit assembly is arranged near lower casing (1).
2. loud speaker module according to claim 1, is characterized in that, only on the position corresponding with described front cavity region of described upper casing (3), is provided with microwell array (6).
3. loud speaker module according to claim 1, is characterized in that, only on described lower casing (1), is provided with the microwell array corresponding with described magnetic gap pattern.
4. loud speaker module according to claim 3, it is characterized in that, the position that described lower casing (1) is corresponding with magnetic circuit assembly is set to magnetic conductive board (8), and described microwell array (4) is arranged on magnetic conductive board (8).
5. loud speaker module according to claim 1, is characterized in that, on the position corresponding with described front cavity region of described upper casing and on described lower casing and the corresponding position of magnetic gap pattern, be provided with microwell array.
6. loud speaker module according to claim 5, it is characterized in that, the position that described lower casing (1) is corresponding with magnetic circuit assembly is set to magnetic conductive board (8), and described microwell array (4) is arranged on magnetic conductive board (8).
7. loud speaker module according to claim 1, is characterized in that, the aperture of described microwell array is not more than 0.05mm.
8. loud speaker module according to claim 1, is characterized in that, the corresponding described loudspeaker monomer of described housing is provided with injection molding steel disc, and described microwell array is arranged on corresponding injection molding steel disc.
9. loud speaker module according to claim 1, is characterized in that, described housing also comprises mesochite (2), and described upper casing (3), mesochite (2) and lower casing (1) limit an inner-cavity structure jointly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520772716.3U CN204993837U (en) | 2015-09-30 | 2015-09-30 | Loudspeaker module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520772716.3U CN204993837U (en) | 2015-09-30 | 2015-09-30 | Loudspeaker module |
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| Publication Number | Publication Date |
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| CN204993837U true CN204993837U (en) | 2016-01-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520772716.3U Active CN204993837U (en) | 2015-09-30 | 2015-09-30 | Loudspeaker module |
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| CN (1) | CN204993837U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105188003A (en) * | 2015-09-30 | 2015-12-23 | 歌尔声学股份有限公司 | Loudspeaker module |
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2015
- 2015-09-30 CN CN201520772716.3U patent/CN204993837U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105188003A (en) * | 2015-09-30 | 2015-12-23 | 歌尔声学股份有限公司 | Loudspeaker module |
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| GR01 | Patent grant | ||
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Address after: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |