CN204988347U - Miniaturized vibration temperature integral type sensor - Google Patents
Miniaturized vibration temperature integral type sensor Download PDFInfo
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- CN204988347U CN204988347U CN201520546561.1U CN201520546561U CN204988347U CN 204988347 U CN204988347 U CN 204988347U CN 201520546561 U CN201520546561 U CN 201520546561U CN 204988347 U CN204988347 U CN 204988347U
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Abstract
The utility model discloses a miniaturized vibration temperature integral type sensor, including vibration sensing chip and temperature sensing chip, still include stainless steel shell and printed circuit board, printed circuit board sets up inside the stainless steel shell, and vibration sensing chip and temperature sensing chip are arranged on printed circuit board, the last signal transmission line that still is connected with of printed circuit board, it has epoxy still to fill in the stainless steel shell. The utility model discloses it has following advantage to compare prior art: the utility model discloses mainly used device temperature and vibration parameter measurement can realize installing sensor two parameters of measure the temperature and vibration simultaneously, should miniaturization temperature vibration integral type sensor have compact structure, dependable performance, installation advantage such as convenient, solved effectively that temperature and vibration sensor integrated level are not high, the scene install loaded down with trivial details, measure inaccurate scheduling problem.
Description
Technical field
The utility model relates to sensor field, in particular a kind of miniaturization vibration temperature integral sensor.
Background technology
The vibration utilizing sensor to record and temperature signal are diagnosed machine performance, are the most frequently used in mechanical fault diagnosis, most effective methods.The information such as the vibration that plant equipment produces in operational process, temperature, sound are the main signals of reflection plant equipment running status, wherein temperature and vibration are two most important parameters, all need to measure this two parameters when most of slewing carries out status monitoring.Obtaining these Dynamic Signals by various vibration transducer, temperature sensing chip, is the main path carrying out mechanical equipment state monitoring and fault diagnosis.There is many deficiencies in links such as installation, fixing, Signal transmissions in the temperature sensing chip of traditional discrete and vibration transducer, installation workload is large, line arrangement is mixed and disorderly, accuracy of measurement is low.The temperature of, miniaturization high by integrated design degree and vibration integral sensor effectively can improve installation convenience and the accuracy of measurement of temperature and vibration transducer, for carrying out equipment condition monitoring and fault diagnosis.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, provides a kind of miniaturization vibration temperature integral sensor.
The utility model is achieved through the following technical solutions: a kind of miniaturization vibration temperature integral sensor, involving vibrations sensing chip and temperature sensing chip, it is characterized in that: miniaturization vibration temperature integral sensor also comprises stainless steel casing and printed circuit board (PCB), printed circuit board (PCB) is arranged on stainless steel casing inside, vibrating sensing chip and temperature sensing chip layout are on a printed circuit, printed circuit board (PCB) is also connected with signal transmssion line, epoxy resin is also filled with for by vibrating sensing chip in stainless steel casing, temperature sensing chip and printed circuit board (PCB) carrying out firm packaging are in stainless steel casing.
As further improvement of these options, temperature sensing chip is arranged on bottom printed circuit board (PCB), and temperature sensing chip bottom arranges inductive probe, and inductive probe stretches out downwards, and inductive probe stretches out 6mm bottom printed circuit board (PCB).
As further improvement of these options, bottom stainless steel casing, arrange blind hole, during installation, inductive probe just in time stretches in blind hole, and blind hole diameter is 5mm, and blind hole depth is 5mm, and stainless steel casing is 1mm at the wall thickness of blind via bottom.
As further improvement of these options, stainless steel casing top is provided with upper end cover, upper end cover and stainless steel casing are threaded connection, and signal transmssion line is passed by upper end cover center of top, also arrange cable fastening in upper end cover center of top.
As further improvement of these options, the height of stainless steel casing is 50mm, external diameter 25mm, intracavity diameter 18mm, cavity heights 44mm.
As further improvement of these options, the epoxy height be filled in stainless steel casing exceedes printed circuit board (PCB) upper edge 10mm.
The utility model has the following advantages compared to existing technology: the utility model to provide a kind of novel miniaturization vibration temperature integral sensor, be mainly used in device temperature and vibration parameters measurement, installation sensor measuring tempeature and vibration two parameters simultaneously can be realized, this miniaturization temperature disturbance integral sensor has the advantages such as compact conformation, dependable performance, installation be convenient, efficiently solves temperature and vibration transducer integrated level is not high, in-site installation is loaded down with trivial details, measure the problems such as inaccurate.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Embodiment
Below embodiment of the present utility model is elaborated; the present embodiment is implemented under premised on technical solutions of the utility model; give detailed embodiment and concrete operating process, but protection domain of the present utility model is not limited to following embodiment.
Embodiment
A kind of miniaturization vibration temperature integral sensor, involving vibrations sensing chip 7 and temperature sensing chip 8, it is characterized in that: miniaturization vibration temperature integral sensor also comprises stainless steel casing 5 and printed circuit board (PCB) 6, it is inner that printed circuit board (PCB) 6 is arranged on stainless steel casing 5, vibrating sensing chip 7 and temperature sensing chip 8 are arranged on printed circuit board (PCB) 6, printed circuit board (PCB) 6 is also connected with signal transmssion line 1, epoxy resin 4 is also filled with for by vibrating sensing chip 7 in stainless steel casing 5, temperature sensing chip 8 and printed circuit board (PCB) 6 carrying out firm packaging are in stainless steel casing 5.The height of stainless steel casing 5 is 50mm, external diameter 25mm, intracavity diameter 18mm, cavity heights 44mm, and the epoxy resin 4 be filled in stainless steel casing 5 highly exceedes printed circuit board (PCB) 6 upper edge 10mm.Vibrating sensing chip and temperature sensing chip 8 are arranged in a printed circuit board 6, make this miniaturization vibration temperature integral sensor compact in size, facilitate installation and maintenance; Use epoxy resin 4 cast that vibrating sensing chip and temperature sensing chip 8 are installed firmly not loosen, improve the accuracy of temperature and vibration measurement; The epoxy resin 4 of filling highly exceedes on printed circuit board (PCB) 6 along height; the effect of carrying out firm packaging can not only be played like this; simultaneously can also available protecting signal transmssion line 1 and the joint area of printed circuit board (PCB) 6, ensure the degree of reliability of whole miniaturization vibration temperature integral sensor.
Temperature sensing chip 8 is arranged on bottom printed circuit board (PCB) 6, arranges inductive probe 81 bottom temperature sensing chip 8, and inductive probe 81 stretches out downwards, and inductive probe 81 stretches out 6mm bottom printed circuit board (PCB) 6.The requirement of measurement to sensitivity of temperature is higher, so temperature sensing chip 8 is arranged the bottommost with printed circuit board (PCB) 6 by this programme, inductive probe 81 is stretched out downwards simultaneously and make it as far as possible bottom stainless steel casing 5, like this can measuring tempeature more accurately.
Bottom stainless steel casing 5, arrange blind hole 9, during installation, inductive probe 81 just in time stretches in blind hole 9, and blind hole 9 diameter is 5mm, and blind hole 9 degree of depth is 5mm, and the wall thickness of stainless steel casing 5 bottom blind hole 9 is 1mm.Design blind hole 9 while providing sealed environment, can reduce the effective thickness of measuring point as far as possible, inductive probe 81 is close to blind hole 9 floor design, near equipment under test surface, measuring tempeature accuracy is improved.
Stainless steel casing 5 top is provided with upper end cover 3, and upper end cover 3 and stainless steel casing 5 are threaded connection, and signal transmssion line 1 is passed by upper end cover 3 center of top, also arranges cable fastening 2 in upper end cover 3 center of top.
These are only preferred embodiment of the present utility model, not in order to limit the utility model, all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection domain of the present utility model.
Claims (6)
1. a miniaturization vibration temperature integral sensor, involving vibrations sensing chip and temperature sensing chip, it is characterized in that: described miniaturization vibration temperature integral sensor also comprises stainless steel casing and printed circuit board (PCB), described printed circuit board (PCB) is arranged on stainless steel casing inside, described vibrating sensing chip and temperature sensing chip layout are on a printed circuit, described printed circuit board (PCB) is also connected with signal transmssion line, epoxy resin is also filled with for by vibrating sensing chip in described stainless steel casing, temperature sensing chip and printed circuit board (PCB) carrying out firm packaging are in stainless steel casing.
2. a kind of miniaturization vibration temperature integral sensor as claimed in claim 1, it is characterized in that: described temperature sensing chip is arranged on bottom printed circuit board (PCB), temperature sensing chip bottom arranges inductive probe, and described inductive probe stretches out downwards, and inductive probe stretches out 6mm bottom printed circuit board (PCB).
3. a kind of miniaturization vibration temperature integral sensor as claimed in claim 2, it is characterized in that: bottom stainless steel casing, blind hole is set, during installation, described inductive probe just in time stretches in blind hole, described blind hole diameter is 5mm, blind hole depth is 5mm, and described stainless steel casing is 1mm at the wall thickness of blind via bottom.
4. a kind of miniaturization vibration temperature integral sensor as claimed in claim 1, it is characterized in that: stainless steel casing top is provided with upper end cover, described upper end cover and stainless steel casing are threaded connection, described signal transmssion line is passed by upper end cover center of top, also arranges cable fastening in upper end cover center of top.
5. a kind of miniaturization vibration temperature integral sensor as claimed in claim 1, is characterized in that: the height of described stainless steel casing is 50mm, external diameter 25mm, intracavity diameter 18mm, cavity heights 44mm.
6. a kind of miniaturization vibration temperature integral sensor as claimed in claim 1, is characterized in that: the epoxy height be filled in stainless steel casing exceedes printed circuit board (PCB) upper edge 10mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520546561.1U CN204988347U (en) | 2015-07-27 | 2015-07-27 | Miniaturized vibration temperature integral type sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520546561.1U CN204988347U (en) | 2015-07-27 | 2015-07-27 | Miniaturized vibration temperature integral type sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204988347U true CN204988347U (en) | 2016-01-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520546561.1U Active CN204988347U (en) | 2015-07-27 | 2015-07-27 | Miniaturized vibration temperature integral type sensor |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105953838A (en) * | 2016-06-17 | 2016-09-21 | 中国铁道科学研究院金属及化学研究所 | Anti-high-electromagnetic interference temperature vibration composite sensor for locomotive traction motor bearing online monitoring |
| CN109341879A (en) * | 2018-11-12 | 2019-02-15 | 安徽容知日新科技股份有限公司 | Sensing equipment and the method for installing sensing equipment |
| CN110514247A (en) * | 2019-09-23 | 2019-11-29 | 安徽容知日新科技股份有限公司 | Sensing equipment |
-
2015
- 2015-07-27 CN CN201520546561.1U patent/CN204988347U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105953838A (en) * | 2016-06-17 | 2016-09-21 | 中国铁道科学研究院金属及化学研究所 | Anti-high-electromagnetic interference temperature vibration composite sensor for locomotive traction motor bearing online monitoring |
| CN105953838B (en) * | 2016-06-17 | 2019-04-05 | 中国铁道科学研究院金属及化学研究所 | Locomotive traction motor bearing on-line monitoring temperature disturbance compound sensor |
| CN109341879A (en) * | 2018-11-12 | 2019-02-15 | 安徽容知日新科技股份有限公司 | Sensing equipment and the method for installing sensing equipment |
| CN110514247A (en) * | 2019-09-23 | 2019-11-29 | 安徽容知日新科技股份有限公司 | Sensing equipment |
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