CN204968339U - Shielding device - Google Patents

Abstract

The utility model relates to a shielding device, this shielding device including electrically conductive foam frame and can attach connect to the lid or the cover of frame. The example embodiment who is used for the electrically conductive foam frame of shielding device or subassembly is disclosed in addition.

Description

Shielding device

Technical field

The disclosure relates in general to the electromagnetic interference shield equipment or assembly that comprise conductive foam.

Background technology

This section provides the background information of the present disclosure relating to not necessarily prior art.

The FAQs of operating electronic devices produces electromagnetic radiation in the electronic circuit of equipment.Such radiation can cause electromagnetic interference (EMI) or radio frequency interference (RFI), and this may disturb the operation of other electronic installation in certain degree of closeness.If do not have enough shieldings, then EMI/RFI interference can cause the deterioration of signal of interest or lose completely, thus causes electronic equipment inefficiency maybe can not work.

The common solution improving the impact of EMI/RFI uses the shielding that can absorb and/or reflect and/or redirect EMI energy.EMI/RFI is positioned in its source by these shieldings of usual employing, and other device in the contiguous EMI/RFI source of isolation.

Term used herein " EMI " should be generally considered to comprise and refer to EMI to be launched and RFI transmitting, and term " electromagnetism " should be generally considered and comprises and refer to from external source and endogenous electromagnetism and radio frequency.Therefore, the shielding of (as used in this article) term broadly comprises and refers to as by absorbing, reflecting, intercept and/or redirect energy or (or limit) EMI and/or RFI is alleviated in their some combinations, makes it no longer to disturb the compliance of such as government and/or the internal functionality of electronic unit system.

Utility model content

This section provides overall utility model content of the present disclosure, but does not disclose its four corner or its all features comprehensively.

According to various aspect, illustrative embodiments discloses shielding device or assembly, it lid or cover of comprising conductive foam framework and can being attached to described framework.Disclose the illustrative embodiments of the conductive foam framework for shielding device or assembly in addition.

According to first aspect, shielding device comprises: framework, and described framework comprises conductive foam; And lid, described lid can be attached to described framework; Wherein, when the one or more parts on substrate are positioned at the inside jointly limited with the described lid being attached to described framework by described framework, described shielding device operatively shields described one or more parts.

According to second aspect, in the shielding device according to first aspect, described framework comprises the one or more sidewalls limited by described conductive foam, makes described framework have open-top; And described cover is attached to described framework, the described open-top of described framework is covered by described lid.

According to the third aspect, in the shielding device according to second aspect, described sidewall is limited integratedly by the described conductive foam of single-piece.

According to fourth aspect, in the shielding device according to the third aspect, described sidewall has single-piece or monolithic construction, and described framework is not comprised at any gap described in adjacent a pair between sidewall and/or the joint that is connected to each other by each sidewall.

According to the 5th aspect, in the shielding device according to the third aspect, the described conductive foam of described single-piece is the shape of described framework by conductive foam sheet material cross cutting.

According to the 6th aspect, in the shielding device according to first aspect, described framework comprises the conductive foam bar of the shape being bent into described framework.

According to the 7th aspect, in the shielding device according to first aspect, described framework comprises the one or more inwall and one or more lateral wall that are limited by described conductive foam, the lateral wall of described lid and described framework and inwall is made jointly to limit multiple independently electromagnetic interference shield compartment, wherein when described framework is installed up to substrate, the parts of described substrate can be positioned in different compartments, and the described parts of described substrate are provided electromagnetic interference shield because of described electromagnetic interference shield compartment, thus suppress electromagnetic interference to pass in and out each electromagnetic interference shield compartment.

According to eighth aspect, in the shielding device according to first aspect, described cover is attached to the first surface of described framework; And described shielding device comprises electrically conductive pressure sensitive adhesives further, described electrically conductive pressure sensitive adhesives is attached to second of described framework, and this second opposed with for the described first surface being attached described lid.

According to the 9th aspect, in the shielding device according to first aspect, described conductive foam comprises polyurethane foam, and the main body of described polyurethane foam is covered with metal; And/or described conductive foam comprises such foam: this foam comprises the internal voids with interior surface, described interior surface due to be arranged in described interior surface at least one conduction metal or non-metallic layer but conduction.

According to the tenth aspect, in the shielding device according to first aspect, described lid comprises at least one in conductive sheet, conductive fabric, metalized film, conductive foam and/or metal forming.

According to the 11 aspect, in the shielding device according to the either side in aforementioned, described framework is only made up of described conductive foam.

According to the 12 aspect, shielding device comprises conductive foam sidewall, described conductive foam sidewall is configured to roughly be installed up to described substrate around the one or more parts on substrate, thinks that the described one or more parts on described substrate provide electromagnetic interference shield.

According to the 13 aspect, in the shielding device described according to the 12, described conductive foam sidewall is limited integratedly by the conductive foam of single-piece, makes described conductive foam sidewall have single-piece or monolithic construction.

According to fourteenth aspect, in the shielding device described according to the 13, the conductive foam of described single-piece is the shape of the framework comprising described conductive foam sidewall by conductive foam sheet material cross cutting, or is bent into the shape of described framework.

According to the 15 aspect, in shielding device described according to the 12, described shielding device comprises one or more conductive foam inwall further, makes described conductive foam sidewall and described one or more conductive foam inwall jointly limit by the separate multiple regions of one or more described conductive foam inwall; And/or wherein said conductive foam sidewall comprises the polyurethane foam being covered with metal, and/or described conductive foam sidewall comprises such foam, this foam comprises the internal voids with interior surface, described interior surface due to be arranged in described interior surface at least one conduction metal or non-metallic layer but conduction.

According to the 16 aspect, in the shielding device described according to the ten two to ten five, described shielding device is combined shielding equipment, and this combined shielding equipment comprises: framework, and this framework comprises the described conductive foam sidewall limiting open-top; And lid, described lid is attached to described framework in the described open-top of described framework, wherein, when the one or more parts on substrate are positioned at the inside jointly limited by described framework and described lid, the described one or more parts of described combined shielding equipment operating ground shielding.

Other application becomes obvious by according to the description provided herein.Description and the concrete example of the utility model content are only intended to illustrative object, and not intended to be limiting the scope of the present disclosure.

Accompanying drawing explanation

Accompanying drawing described herein is only for selected execution mode but not the exemplary object of all possible enforcement, and not intended to be limiting the scope of the present disclosure.

Fig. 1 is the stereogram of the shielding device comprising lid and conductive foam framework according to illustrative embodiments;

Fig. 2 is the stereogram of the shielding device shown in Fig. 1, and exemplified with lid and the outside of conductive foam framework;

Fig. 3 is the plane graph of the shielding device shown in Fig. 1;

Fig. 4 A and Fig. 4 B is the chart illustrated according to the shielding device of illustrative embodiments or each layer of assembly;

Fig. 5 shows the exemplary method being manufactured the conductive foam framework for shielding device or assembly according to illustrative embodiments by cross cutting conductive foam sheet material;

Fig. 6 A is the stereogram of the conductive foam framework for shielding device or assembly according to illustrative embodiments;

Fig. 6 B is the stereogram of the conductive foam framework shown in Fig. 6 A, and exemplified with according to the material layer (such as, liner, etc.) of illustrative embodiments along the first surface of framework or bottom surface;

Fig. 6 C is the stereogram of the conductive foam framework shown in Fig. 6 B and liner, also exemplified with according to the material layer (such as, hyaline membrane, etc.) of illustrative embodiments along second of framework or end face;

Fig. 7 to Figure 10 shows the exemplary method according to illustrative embodiments, each material layer being assembled into the conductive foam framework shown in Fig. 6 A, Fig. 6 B and Fig. 6 C;

Figure 11 A, Figure 11 B, Figure 12 and Figure 13 show according to illustrative embodiments manufacture another exemplary method for the conductive foam framework of shielding device or assembly;

Figure 14 is the stereogram comprising conductive foam framework, lid and the shielding device along the thermal interfacial material of lid according to illustrative embodiments; And

Figure 15 is the viewgraph of cross-section of the shielding device shown in Figure 14.

Embodiment

Referring now to accompanying drawing, each example embodiment is described more fully.

Plate cascade screen (BLS) can be used in the electronic installation of such as smart mobile phone, panel computer etc.The metal BLS assembly of frequent use routine, but they need or require flatness.Such as, in default of bending and adapting to the flexibility of the tolerance of uneven surface, the conventional BLS assembly based on metal only can be installed on a flat surface.Conventional metal BLS assembly is also difficult to have 1 millimeter or following height.Conventional metal BLS assembly also cannot apply or be used in flexible PCB or wearable application.

Another approach replaces metal BLS with fabric foam (fabricoverfoam, FOF) pad.FOF pad can be arranged as the wall of BLS assembly, then uses the contact adhesive (PSA) with conductive textile layer to be laminated to the top layers of BLS assembly.The bottom of BLS assembly will via conduction PSA contact print circuit board (PCB).But its inventor has realized that this FOF pad approach only can be applied in rectangular shape, this is because it is very difficult to adapt to non-rectangular shape, and electromagnetic interference (EMI) leakage may be produced at corner joint place.

In this article in disclosed illustrative embodiments, there is the BLS combined shielding equipment or the assembly that comprise conductive foam framework, this conductive foam framework can be applied to uneven surface, on-plane surface and/or various shape or pattern (such as, non-rectangular shape, curved shape, round-shaped, rectangular shape, complex pattern, etc.) in.Illustrative embodiments disclosed herein can have the height dimension being less than 1 millimeter, and/or can have enough flexibilities to be applied among flexible PCB and wearable application etc.In addition, illustrative embodiments disclosed herein can comprise framework, without any joint or gap, EMI leakage is reduced.

In the exemplary embodiment, composite type (such as, two-piece type, etc.) shielding device or assembly roughly comprise framework and can be attached to lid or the cover of framework.Framework comprises conductive foam.Lid or cover can comprise EMI shielding material, surface, sheet material or layer (such as, conductive fabric, metalized film, metal forming, other shielding material, etc.).Lid can have such circumference or track: its size and shape mates or corresponds to the circumference of framework or the size and shape of track.Lid can be attached along the upper surface of framework or be attached to the upper surface of framework, with the open-top of cover framework.When one or more parts on substrate are positioned at the inside jointly limited by framework and the lid that is attached to framework, the described one or more parts of combined shielding equipment operating ground shielding.

Framework can comprise one or more sidewall, and this sidewall is limited by conductive foam, makes framework have open-top.Lid can be attached to framework, and the open-top tegmentum of framework is covered.Sidewall can be limited integratedly by the conductive foam of single-piece, makes sidewall have single-piece or monolithic construction.In this case, framework does not comprise the gap of any permission EMI leakage between adjacent pair of sidewalls.Because the sidewall of framework will be integrally joined to each other, framework also will not comprise any joint be connected to each other by each sidewall.The conductive foam of single-piece can be the shape of framework by conductive foam sheet material cross cutting.Or framework can comprise the conductive foam bar of the shape being bent into framework.

In some illustrative embodiments, framework can comprise one or more lateral wall and one or more inwall, separator or partition.Sidewall and inwall can all be limited by conductive foam.The sidewall of cover and frame frame and inwall jointly can limit multiple independently EMI and shield compartment.When framework is installed (such as, adhere to, be welded to weld pad, etc.) to substrate (such as, printed circuit board (PCB), etc.) time, parts on substrate can be positioned in different compartments, make these parts because EMI shields compartment and are provided EMI shielding, thus suppress EMI to pass in and out each EMI shielding compartment.In other illustrative embodiments, framework can not comprise maybe can not have inwall, separator or partition, makes the sidewall of framework roughly limit single inner space or compartment.Shielding device can comprise two-piece type assembly, and this two-piece type assembly comprises the single-piece lid that can be attached to one-piece frame.

Conductive foam can be any suitable conductive porous material, such as polyurethane open celled foam, plating foam, etc.The main body that conductive foam can be included in polyurethane foam is covered with the polyurethane foam of metal.Conductive foam can comprise such foam, that is, it comprises the internal voids with interior surface, described interior surface due to be arranged in these interior surface at least one conduction metal or conduction non-metallic layer but conduction.In some embodiments, cover or lid are also made up of conductive foam, and this conductive foam can be identical or different with the conductive foam for framework.

By means of only the mode of citing, conductive foam can be the EcoFoam conductive foam (such as, CF-400 series, CF-500 is serial, etc.) purchased from LairdTechnologies.Conductive foam can provide X-axis, Y-axis and Z axis conductivity, and can strengthen the screening effectiveness required by the microprocessor speed in order to improve computer, communication, other electronic equipment etc.Foam can comprise the conduction PSA band be positioned on one or more side, or foam can not comprise adhesive.In addition, by means of only the mode of citing, conduction PSA band can be with purchased from the conduction PSA of LairdTechnologies, such as LT-301PSA band, its thickness is about 0.09 millimeter, and stainless peel strength is greater than every 25 millimeter of 1.3 kilogram, and Z axis resistance is less than 0.05 ohm.

Foam can be cut, punches, slot etc., and may to apply non-common shapings that may be difficult to shield profile pad be useful.Foam can be used for low cycle applications, and such as I/O (I/O) shielding, other non-shear standard connect, etc.

Conductive foam can meet harmful substance restriction (RoHS).By International Electrotechnical Commission (IEC) international standard IEC61249-2-21 (in November, 2003 first edition the 15th page), conductive foam can be Halogen." Halogen " (or not halogen-containing) of the electric and electronic equipment contained under European Union's harmful substance restriction (RoHS) instruction is defined as no more than maximum 900 parts of every 1,000,000 chlorine, every 1,000,000 bromines no more than maximum 900 parts and no more than maximum 1500 parts of every 1,000,000 total halogens by international standard IEC61249-2-21.Phrase " Halogen ", " not halogen-containing " etc. are applicable equally in this article.

Conductive foam can have excellent Z axis conductivity and shield and ground connection to provide effective EMI, and the comparatively light material for low compression force etc. can be allowed to use.Conductive foam can be used in any suitable application, comprises server, cabinet application, network and Communication Equipment, LCD and plasm TV, medical equipment, desktop computer, printer, kneetop computer, panel computer, smart mobile phone, etc.Conductive foam can be metallic foams (such as, the whole main body of polyurethane foam is covered with the polyurethane foam of metal, etc.), and any suitable thickness can be had, comprise about 0.5 millimeter of (mm), about 1mm, about 1.5mm, about 2mm, about 2.5mm, about 3mm, about 4mm, etc.The screening effectiveness of conductive foam is about 87 decibels (dB) between 30 megahertzes (MHz) and 300MHz, is about 108dB, and is about 90dB between 300MHz and 3 gigahertzs (GHz) between 3GHz and 18GHz.Conductive foam can have the compression set that every ASTMD3574 is less than 25%.

Lid can comprise EMI shielding material, surface, sheet material or layer (such as, conductive fabric, metalized film, metal forming, other conduction or shielding material, etc.).Lid can have such circumference or track, and its size and shape mates or corresponds to the circumference of framework or the size and shape of track.Lid can comprise any suitable material, comprises conductive fabric (such as, band, etc.), metalized film, metal forming, etc.Such as, electric conducting material can comprise the nickel/copper polyester electric conduction webbing (such as, 86785 nickel/copper webbing, etc.) purchased from LairdTechnologies.Conductive fabric band can comprise metallization (such as, nickel, copper, etc.) based on the fabric of polyester and electrically conductive pressure sensitive adhesives.Tissue layer can provide EMI/RFI to shield and conductivity, and adhesive phase can be assisted conductive fabric band is applied to metal, plastics etc. surface.Conductive fabric band can be produced on roller, can be cut, punch, etc.

The electric conducting material of lid can meet RoHS, is Halogen, and has low surface resistivity by IEC-61249-2-21 standard, such as, is about less than 0.1 ohm-sq or provides other enough low surface resistivity of excellent electric conductivity.The electric conducting material of lid can have the screening effectiveness being greater than about 75dB (such as, being 75 decibels under 100MHz, is 80dB at 1 GHz, etc.) in wider frequency spectrum.Lid can comprise conductive layer (such as, metallized fabrics, etc.), adhesive phase (such as, acrylic acid series electrically conductive pressure sensitive adhesives, etc.) and off-style paper layer.

Lid or cover can use adhesive to be applied to framework.Lid or cover can have the shape substantially identical with framework, make to cover or cover substantially all circumferences or open-top that will cover and be limited by framework.Such as, lid can be applied to the first surface of conductive foam framework, with the open-top forming cover framework and the surface of inside limited by framework.The inside limited by framework can be basic hollow, and can be covered by lid, and framework and Gai Ke are provided jointly to being received in by framework and the shielding of covering the parts in the common inside limited.

In some embodiments, conductive foam framework can by conductive foam sheet material cross cutting.This bight can produced between two adjacent walls does not comprise the conductive foam framework in any joint or gap.Utilize conventional BLS framework, can there is joint or gap in the bight place be incorporated into together at two sidewalls be separated, make EMI may leak joint or gap.Die cutting method also can produce the conductive foam framework with more complex pattern (such as, non-rectangular pattern, etc.).

In some embodiments, conductive foam can be cut into inch strips, and is then bent into pattern or the shape of framework.Such as, bar is flexible is the outer perimeter of framework, and one or more other can be added to inwall, partition or separator.Compare with FOF pad, this approach also can reduce EMI leakage.Foam can (such as, perpendicular cuts in a thickness direction), to form framework.

Lid can be attached to the first surface of framework.Electrically conductive pressure sensitive adhesives can apply or be attached to opposed with the first surface of attachment of cover second of framework.Electrically conductive pressure sensitive adhesives can be used for framework to be installed up to circuit board, and the one or more parts making shield assembly be circuit board provide plate cascade screen.In other illustrative embodiments, frame being weldable to (such as, along or above weld pad, etc.) substrate.

Shielding device or assembly can have two-dimensional shapes or 3D shape.Shielding device or assembly can be flexible, and one or more parts that can be configured to around circuit board coordinate flexibly, think that one or more parts provide EMI to shield.Such as, conductive foam framework can be enough flexible to be applied to the circuit board with not plane surface, irregular surface, curved surface etc.Shielding device or assembly can have the general thickness that is less than about 1 millimeter or height (such as, about 0.75mm, etc.).

In the exemplary embodiment, shielding device or assembly at least partially (such as, cover or lid, etc.) also can heat conduction, to help to set up or limit from thermal source (such as, the heat-generating electronic part that the plate of electronic installation is installed, etc.) to heat radiation and/or structure of reducing phlegm and internal heat thermally conductive pathways at least partially, heat radiation and/or all radiators in this way of structure of reducing phlegm and internal heat, electronic installation (such as, cell phone, smart phone, panel computer, notebook computer, personal computer, etc.) shell or housing, heat diffuser, heat pipe, etc.

Such as, illustrative embodiments comprises combined shielding equipment or assembly, its lid or cover of roughly comprising framework and can being attached to framework.Lid or cover are conduction and heat conduction.Such as, lid can comprise conduction and the foam of heat conduction, and this foam can be identical or different with the foam for framework.One or more thermal interfacial material can be arranged along the inner surface covered or cover and/or outer surface.Such as, thermal interfacial material (such as, compliance (compliant) or conformal (conformable) hot interface pad, putty or gap fillers, etc.) can arrange along the inner surface of lid or cover, thermal interfacial material is placed with to be installed up to when shielding device to contact (such as with at least one electric component time printed circuit board (PCB) (PCB) at least one electric component, direct physical contacts, etc.).By contacting at least one electric component, heat can be conducted to lid or cover away from least one electric component by thermal interfacial material.Lid or cover then can by heat conduction to heat abstractor or structures of reducing phlegm and internal heat.By means of only the mode of citing, shielding device can use the conduction PSA between framework and PCB to be with and be installed up to PCB.In addition, by means of only the mode of citing, thermal interfacial material can comprise and has the conformal of enough compressibilities, flexibility, deformability and/or flowable and/or flowable thermal interfacial material, with the size and the profile that allow thermal interfacial material relative com pact thickly to conform to a few electric component, thus remove air gap between them.Hot interface can also be form material (form-in-placematerial) on the spot, makes it to distribute on the lid of shielding device or cover to put in place.

With reference to accompanying drawing, Fig. 1 to Fig. 3 is exemplified with according to the shielding device of disclosure each side or the illustrative embodiments of assembly 100.Assembly 100 comprises framework 102 and lid or covers 104.Framework 102 comprises conductive foam.Conductive foam can be formed by single conductive foam sheet material cross cutting, forms by one or more conductive foam bar is bending, etc.Although Fig. 1 to Fig. 3 is exemplified with the framework 102 of irregular primarily two-dimensional shape, but other illustrative embodiments can comprise and has heteroid conductive foam framework, such as rectangular shape, other non-rectangular shape are (such as, circle, triangle, irregular, etc.), 3D shape, curved shape, other pattern, etc.

Lid or cover 104 comprise the shielded surfaces taking conductive fabric band forms.In other embodiments, lid 104 can comprise another shielding material, such as metalized film, metal forming, etc.In other embodiments, cover 104 and can comprise the conductive foam identical or different with the foam for framework 102.

Shielding device or assembly 100 can have any suitable thickness or height, comprise about 2.25mm, about 1mm, about 0.75mm, about 0.70mm, etc.In some embodiments, assembly 100 can comprise the conductive layer on the top being positioned at lid 104, such as conductive transparent film or be metallized, other material layer of lamination or plating etc.

In this illustrated embodiment, shielding device 100, without inwall, separator or partition, makes the sidewall 103 of framework 102 roughly limit single inner space or compartment.In other illustrative embodiments, conductive foam framework can comprise one or more inwall, separator or partition (such as, between the sidewall of framework, extend and/or be attached to the sidewall of framework, etc.), so that framework is blocked as two or more inner spaces.

Fig. 4 A and Fig. 4 B illustrate respectively each layer of exemplary shield equipment according to illustrative embodiments or assembly 200 and 300.As shown in Figure 4 A, shielding device 200 comprises conductive foam 202 (such as, framework, etc.) and shielding material 204 (such as, lid or cover, etc.).Shielding material 204 can comprise conductive fabric (such as, conductive fabric band, etc.), metalized film, metal forming, conductive foam or other shielding material, etc.Shielding material 204 can be attached to the top side of conductive foam 202.In the exemplary embodiment, conductive foam 202 is the frameworks with open-top, and shielding material 204 is attached to framework to cover lid or the cover of open-top.In such illustrative embodiments, shielding device or assembly 200 can be two-piece type shielding device thus, and wherein first is framework, and second is lid or cover.

As shown in Figure 4 B, shielding device 300 comprises conductive foam 302 (such as, framework, etc.), shielding material 304 (such as, lid or cover, etc.) and adhesive phase 306 (such as, contact adhesive, etc.).Shielding material 304 can comprise conductive fabric (such as, conductive fabric band, etc.), metalized film, metal forming, conductive foam or other shielding material, etc.Shielding material 304 can be attached to the top side of conductive foam 302.Adhesive phase 306 can be attached to the bottom side of conductive foam 302.Adhesive phase 306 can be used for shielding device 300 to install or be mounted to substrate (such as, printed circuit board (PCB), etc.).In the exemplary embodiment, conductive foam 302 is the frameworks with open-top, and shielding material 304 is attached to framework to cover lid or the cover of open-top.

Fig. 5 is exemplified with the method by conductive foam sheet material 408 cross cutting conductive foam framework 402.Although Fig. 5 shows rectangle cross cutting foam frame 402, it is difform foam frame that other execution mode can have cross cutting.Conductive foam framework 402 can be cut shape into any expectation based on the application of expection or final use.Such as, framework 402 can be cut as non-rectangular shape, irregularly shaped (such as, the frame shape shown in Fig. 1 to Fig. 3), bending pattern, etc.

The foam frame 402 of cross cutting can suppress EMI leakage, because it may not have any joint or gap at any bight 405 place of framework 402.Such as, the framework 402 shown in Fig. 5 comprises four sidewalls 403 and four bights 405.Each bight 405 is between a pair adjacent wall 403.Sidewall 403 and the bight between them 405 are limited integratedly by the single-piece conductive foam of conductive sheet 408 cross cuttings.Therefore, sidewall 403 and bight 405 have single-piece or monolithic construction.Conductive foam framework 402 does not have the gap of any permission EMI leakage thus between adjacent pair of sidewalls 403.Framework 402 does not comprise any joint be connected to each other by each sidewall yet, because the sidewall of framework 403 is integrally joined to each other at bight 405 place.

In Alternative exemplary execution mode, framework can be formed by one or more conductive foam bars of the shape being bent or otherwise being formed or be configured as framework.Among some alternate embodiments of these alternate embodiments, framework only comprises shaping (such as, bending, formed, etc.) for limiting single conductive foam bar or the conductive foam sheet of one or more sidewalls of framework.In other alternate embodiments, framework comprises one of them foam strip and is shaped (such as, bending, formation, etc.) be limit the outermost sidewall of framework and multiple conductive foam bar of the restriction of at least one other foam strip inwall, separator or partition or conductive foam sheet.

Fig. 6 A is exemplified with the conductive foam framework 502 for shielding device or assembly according to illustrative embodiments.As shown in the figure, framework 502 comprises four sidewalls 503 limiting rectangular shape.Framework 502 also comprises three inwall, separator or partitions 507, which together defines four interior zones 509 separated by inwall 507.When lid or cover are installed on the top of framework 502, framework 502 and the common restriction four of lid independently EMI shield compartments.When framework 502 is installed up to substrate, the parts on substrate can be positioned in different compartments, make these parts be provided EMI shielding because EMI shields compartment, thus suppress EMI to pass in and out each EMI shielding compartment.Conductive foam framework 502 can comprise fabric foam material.

Fig. 6 B is exemplified with the conductive foam framework 502 according to Fig. 6 A of illustrative embodiments with along the first surface of framework 502 or the material layer 511 of bottom surface.In this example, material layer 511 comprises liner (such as, conductive adhesive layer, etc.).Liner can be that all standing extends release liner, and it allows single to remove to expose adhesive along the bottom surface of framework 502.Then the adhesive exposed can be used for framework 502 to adhere to substrate.

Fig. 6 C is exemplified with the conductive foam framework 502 shown in Fig. 6 B and liner 504.Also show in Fig. 6 C according to illustrative embodiments another material layer 513 along second of framework 502 or top.In this example, on the side opposed with liner 504 of conductive foam framework 502, (such as, material layer 513 comprises hyaline membrane or layer polyester film, other polyester film, polyimides (PI) film, PEN (PEN) film, other transparent, translucent or bright film, etc.).Hyaline membrane or layer can be translucent reinforcements.Hyaline membrane or layer can comprise the low tacky adhesion by support frame 502 and liner 504.Such as, framework 502 and liner 504 can be carried by fin 515, until framework 502 is installed up to substrate.Hyaline membrane or layer also can remove or peel off framework 502 by use fin 515 before or after framework 502 being installed up to substrate.

Fig. 7 to Figure 10 is exemplified with the exemplary method according to illustrative embodiments, bottom material layer 511 and top layer of material 513 being assembled to the conductive foam framework 502 shown in Fig. 6 A, Fig. 6 B and Fig. 6 C.This exemplary method can be considered to semi-automatic process.Such as, operating personnel manually may perform one or more step, such as each several part are put into fixture or instrument.

Fig. 7 shows the exemplary figure or instrument 640 with serious hollow plate 642 and end evacuated panel 644.Fixture 640 can be used for first on conductive foam framework 502, assembling liner 511.Such as, end evacuated panel 644 can be used for placing conductive foam framework 502.Serious hollow plate 642 can be used for location and catches liner 511.

As shown in Figure 8, liner 511 and conductive foam framework 502 can manually be placed in fixture or instrument 640 by operating personnel.Then operating personnel can via handle 646 manual closing fixture or instrument 640, thus cause liner 511 to be adhered or attached to conductive foam framework 502.Liner 511 can use any suitable adhesive (such as, contact adhesive, etc.) to be applied to conductive foam framework 502.Operating personnel then can manual unlocking fixture or instrument 640 and remove conductive foam framework 502 and be attached to the liner 511 of conductive foam framework 502.By means of only the mode of citing, operating personnel can use this instrument or fixture 640 assembling per minute about.

Fig. 9 is exemplified with another exemplary figure of instrument 650 with serious hollow plate 652 and end evacuated panel 654.Fixture 650 can be used for layer 513 to be assembled on the side opposed with liner 511 of conductive foam framework 502.Such as, end evacuated panel 654 can be used for location and catches conductive foam framework 502 and liner 511.Serious hollow plate 652 can be used for location and trapping layer 513.As shown in the figure, serious hollow plate 652 comprises for locating and aiming at the alignment pin of layer 513, has the respective aperture for receiving pin.

As shown in Figure 10, layer 513 and conductive foam framework 502 and liner 511 can manually be placed in fixture or instrument 650 by operating personnel.Then operating personnel can via handle 656 manual closing fixture or instrument 650, thus cause layer 513 to adhere to the side opposed with liner 511 of conductive foam framework 502.Layer 513 can use any suitable adhesive (such as, contact adhesive, etc.) to be applied to conductive foam framework 502.Operating personnel then can manual unlocking fixture or instrument 650 and remove conductive foam framework 502 and liner 511 and be attached to the layer 513 of opposite side of conductive foam framework 502.By means of only the mode of citing, operating personnel can use instrument or fixture 650 assembling per minute about six.

Figure 11 A, Figure 11 B, Figure 12 and Figure 13 are exemplified with another exemplary method of conductive foam framework 704 being used for shielding device or assembly according to illustrative embodiments manufacture.This exemplary method can be considered to automation process.Such as, operating personnel may only need a person with the qualifications of a general, and material is manual to be placed in the machine, and machine can complete the remainder of this process automatically, without the need to requiring that operating personnel carry out any extra manual step.

Figure 11 A and Figure 11 B shows vacuum nest 770.In Figure 11 A, vacuum nest 770 is opened.In Figure 11 B, vacuum nest 770 plate is assembled (such as, have the conductive foams for framework 704, etc.).In some embodiments, vacuum nest 770 can be assembled by operating personnel's hand-operated floor board.Vacuum nest 770 can be that photocuring (SLA) prints vacuum nest.

Figure 12 shows exemplary group machine for automated production conductive foam framework 704 or system 780.Conductive foam manual loading can be positioned at above the fabric framework in the vacuum nest 770 on track 784 by operating personnel 782.Such as, machine 780 can comprise six tracks 784, makes six operating personnel 782 can use machine 780 simultaneously.Other execution mode can comprise track 784 more or less and have the operating personnel 782 more or less simultaneously worked.

Mounter 780 can comprise hyaline membrane or layer applicator 786, such as, for applying the applicator of polyester film, other polyester film, polyimides (PI) film, PEN (PEN) film, other transparent, translucent or bright film etc.Such as, applicator 786 can be suitable polyester film applicator, comprises the AveryALS-204 applicator with transducer roller, etc.Applicator 786 can be configured to translucent reinforcement to be applied to conductive foam framework.

Mounter 780 also can comprise release liner applicator 788.Release liner applicator 788 can be any suitable release liner applicator, comprises the AveryALS-204 applicator with conversion roller, etc.Release liner applicator 788 can be configured to all standing to be extended release liner and be applied to conductive foam framework.

Machine 780 also can comprise robot 790, and robot 790 can be configured to catch label.When the registration of reinforcement layer can occur in and place via (such as, robot 790, vacuum nest 770, applicator 786 etc.) alignment pin.Then the assembly that is clamminess can (such as, via release liner applicator 788, robot 790, vacuum nest 770, etc.) coordinate with all standing release liner.Tamping operation can be performed to guarantee suitably to adhere to conductive foam framework, liner and transparent film layer (such as, polyester film, other polyester film, polyimides (PI) film, PEN (PEN) film, other transparent, translucent or bright film, etc.).Then the assembly completed can pass otch 792.Although Figure 12, exemplified with six operating personnel, 782, six tracks 784 and each hyaline membrane or layer applicator 786, release liner applicator 788 and robot 790, can use operating personnel more or less and/or machine part in other embodiments.

By means of only the mode of citing, utilize six operating personnel worked on 18 second load time, mounter 780 can production per hour about 1200.This is by generation each cycle circulation timei of about three seconds, or about 0.33 per second, 20 per minute, and 1200 per hour.When 100% recovery rate and 70% uptime, machine 780 is per hour can produce 840 only.When two classes of per tour every day ten hours, machine 780 can produce 16800 every day only, and only produced 100800 weekly when sky operation Saturday.

Figure 13 is exemplified with another exemplary group machine or system 880.Machine 880 comprises eight tracks 884, and each track all has vacuum nest 870, and it can be used by operating personnel 882.Machine 880 also comprises hyaline membrane or layer applicator 886 and release liner applicator 888 and robot 890.Machine 880 can be configured to assemble conductive foam frame assembly in the mode that the machine 780 with Figure 13 is similar.Although Figure 13, exemplified with four operating personnel, 882, eight tracks 884 and each hyaline membrane or layer applicator 886, release liner applicator 888 and robot 890, can use operating personnel more or less and/or machine part in other embodiments.

By means of only the mode of citing, when four operating personnel and 18 second load time, machine 880 is per hour can produce about 800.Such as, when each cycle circulation timei of 4.5 seconds, machine 880 is per second produces 0.22,13.3 per minute, therefore 800 per hour.When 100% recovery rate and 70% uptime, per hourly can only produce 560.When one Saturday sky, one day two classes, per tour ten hours, every day can produce 11200 only, only produces 67200 weekly, monthly only produces 291000, and quarterly only produces 873000.

When 36 second load time, machine 880 is per hour can produce about 400.Such as, when each cycle circulation timei of 9 seconds, machine 880 is per second produces 0.11, production per minute 6.7, therefore production per hour 400.When 100% recovery rate and 70% uptime, per hourly can only produce 280.When one Saturday sky, every day two classes (ten hours), every day can produce 5600 only, weekly only produce 33600, monthly only produce 145600, and quarterly only produce 436800.

Figure 14 and Figure 15 is exemplified with another illustrative embodiments of the shielding device of the assembly 900 according to disclosure each side.Assembly 900 comprises framework 902 and lid or covers 904.In this illustrated example, assembly 900 also comprises the thermal interfacial material 917 that the surface along lid 904 is arranged.

Framework 902 comprises conductive foam.Conductive foam can be formed by single conductive foam sheet material cross cutting, forms by one or more conductive foam bar is bending, etc.By means of only the mode of citing, framework 902 can comprise the EcoFoam conductive foam (such as, CF400-series, CF-500 is serial, etc.) purchased from LairdTechnologies.

In this example, lid or cover 904 also comprise conductive foam, and this conductive foam can be identical or different with the conductive foam for framework 902.By means of only the mode of citing, lid 904 can comprise the EcoFoam conductive foam (such as, CF-400 series, CF-500 is serial, etc.) purchased from LairdTechnologies.In other embodiments, lid 904 can comprise another shielding material, such as metalized film, metal forming, conductive fabric band, etc.In some embodiments, assembly 900 can comprise lid 904, lid 904 comprise conductive transparent film or be metallized, other material layer of lamination or plating etc.

In this illustrated embodiment, shielding device 900, without inwall, separator or partition, makes the sidewall 903 of framework 902 roughly limit single inner space or compartment 909.In other illustrative embodiments, conductive foam framework can comprise one or more inwall, separator or partition (such as, between the sidewall of framework, extend and/or be attached to the sidewall of framework, etc.), so that framework is blocked as two or more inner spaces.

In addition in this illustrative execution mode, conduction PSA band 909 is along the bottom surface of the sidewall 903 of framework.PSA band 909 can be used for framework 902 being adhered to substrate, such as PCB, etc.By means of only the mode of citing, conduction PSA band can be with purchased from the conduction PSA of LairdTechnologies, and such as LT-301PSA is with, and thickness is about 0.09 millimeter, stainless peel strength is greater than every 25 millimeter of 1.3 kilogram, and Z axis resistance is less than 0.05 ohm.Alternate embodiments can comprise along the sidewall of framework other adhesive or there is no adhesive.

Thermal interfacial material 917 is arranged along the inner surface of lid 904.Thermal interfacial material 917 and lid 904 can help to set up or limit from thermal source (such as, the heat-generating electronic part that the plate of electronic installation is installed, etc.) to heat radiation and/or structure of reducing phlegm and internal heat thermally conductive pathways at least partially, heat radiation and/or all radiators in this way of structure of reducing phlegm and internal heat, electronic installation (such as, cell phone, smart phone, panel computer, notebook computer, personal computer, etc.) shell or housing, heat diffuser, heat pipe, etc.Thermal interfacial material 917 can adhere to lid 904, and/or frictional fit is between the sidewall 903 of framework, etc.Or such as, thermal interfacial material 917 can self-adhesive or viscosity be enough to allow thermal interfacial material 917 to arrange along lid 904, and does not require any adhesive.

Thermal interfacial material 917 can comprise compliance, conformal and/or flowable hot interface pad, putty or gap fillers, etc.Thermal interfacial material 917 can have enough compressibilities, flexibility and/or flowable, to allow thermal interfacial material 917 relative com pact thickly to fit the size of electric component and profile, thus when being installed up to the PCB on electric component when shielding device 900, remove the air gap between them.By contact electric component, heat can be conducted to lid 904 away from electric component by thermal interfacial material 917.Lid 904 then can by heat conduction to adjacent to or the heat radiation that contacts with lid 904 and/or structure of reducing phlegm and internal heat.In addition, thermal interfacial material 917 can comprise form material on the spot, thermal interfacial material 917 can be assigned with on lid 904 and put in place.

By means of only the mode of citing, framework 902 can comprise such rectangular shape: length is 50mm, and width is 20mm, and thickness or height (such as, 1.5mm, 1.75mm, 2.0mm, etc.) from 1.5mm to 2.0mm.Each frame side wall 903 can have the width of 1.0mm, makes the opening of framework or inner 909 comprise length and is 48mm and width is the rectangular shape of 18mm.Lid 904 can have and the same or similar rectangular shape of framework 902, length and width dimensions (such as, 50mmx20mm, etc.).Lid 904 can have thickness or the height of 0.5mm.Thermal interfacial material 917 can have and the opening of framework 902 or inner 909 same or similar rectangular shapes, length and width dimensions (such as, 48mmx18mm, etc.).Thermal interfacial material 917 can have thickness or the height of 1.0mm.PSA band 919 along the sidewall 903 of framework can have the thickness of about 0.09mm.In this example, any overall gross thickness that shielding device or assembly 900 can have from about 2mm to about 2.6mm (such as, 2mm, 2.09mm, 2.59mm, 2.6mm, etc.) or height.The size and dimension (this is all size and dimensions disclosed herein) provided in this section is only example.Other illustrative embodiments can have different structure, such as, has different shape (such as, non-rectangle, etc.) and/or smaller or greater, etc.

According to another illustrative embodiments, the method manufacturing plate level EMI shielding device or assembly roughly comprises: form conductive foam framework, and substantially cover the first surface of conductive foam framework with electric conducting material, to form the shielded surfaces of the circumference of the shape had corresponding to framework.The step forming conductive foam framework can comprise: by conductive foam sheet material die cut frame, or conductive foam is cut to one or more conductive foam bar, and at least one conductive foam bar is bent into framework.

Illustrative methods can comprise further: electrically conductive pressure sensitive adhesives is applied to second of framework.Electrically conductive pressure sensitive adhesives can be applied to circuit board, thus conductive foam framework and shielded surfaces are attached to circuit board, provides shielding with the one or more parts to circuit board.Conductive foam assembly can be bent, to make bending, on-plane surface and/or the irregular surface of conductive foam framework and shielded surfaces adaptive circuit plate, wearable items etc.

According to another illustrative embodiments, the method manufacturing combined shielding equipment roughly comprises: form conductive foam wall, and this conductive foam wall limits open-top and is configured to roughly be installed up to substrate around the one or more parts on substrate.The method also comprises: cover open-top with electric conducting material.When the one or more parts on substrate are positioned at the inside jointly limited by conductive foam wall and electric conducting material, conductive foam wall and the electric conducting material one or more parts operatively on shielding board.

By forming conductive foam wall by single conductive foam sheet material cross cutting conductive foam wall, conductive foam wall is made to have single-piece or monolithic construction.Or, such as, by conductive foam being cut to one or more conductive foam bar and at least one conductive foam bar being bent into conductive foam wall and forming conductive foam wall.

Electrically conductive pressure sensitive adhesives can be applied to the first surface opposed with second of conductive foam wall of conductive foam wall, and along second of conductive foam wall, electric conducting material is oriented to cover open-top.Electrically conductive pressure sensitive adhesives can be used for, around the one or more parts on circuit board, conductive foam wall is attached to circuit board, thus provides shielding for the one or more parts on circuit board.Conductive foam wall and electric conducting material can be bent into corresponding with bending, the on-plane surface of circuit board and/or irregular surface.

The method can comprise: electric conducting material is attached to the conductive foam wall in open-top by use vacuum nest or evacuated panel.The method also can comprise: form one or more conductive foam inwall, makes conductive foam wall, one or more conductive foam inwall and electric conducting material jointly limit multiple independently EMI and shields compartment.Parts on substrate can be positioned in different compartments, and are provided EMI shielding because EMI shields compartment, thus suppress EMI to pass in and out each EMI shielding compartment.

According to another illustrative embodiments, the one or more parts be related on substrate provide the method for shielding roughly to comprise: lid is attached to the framework comprising conductive foam.The method also comprises: framework is attached to substrate, and one or more parts are disposed in by framework and the common inside limited of lid.

According to another illustrative embodiments, there is a kind of framework of the combined shielding equipment for providing EMI to shield for the one or more parts on substrate.This framework comprises conductive foam sidewall, and this sidewall limits the open-top of framework.Sidewall is configured to roughly be installed up to substrate around the one or more parts on substrate.

Sidewall can be limited by single-piece conductive foam one, makes sidewall have single-piece or monolithic construction.Single-piece conductive foam can be the shape of framework by conductive foam sheet material cross cutting or be bent into the shape of framework.

Framework also can comprise one or more conductive foam inwall.The sidewall of framework and inwall can limit jointly by the separate multiple regions of one or more conductive foam inwall.

Conductive foam sidewall can comprise the polyurethane foam being covered with metal, and/or such foam, this foam comprises the internal voids with interior surface, described interior surface due to be arranged in these interior surface at least one conduction metal or non-metallic layer but conduction.

Combined shielding equipment can comprise framework and in the open-top of framework, be attached to the lid of framework.When the one or more parts on substrate are positioned at the inside jointly limited by framework and lid, the one or more parts on combined shielding equipment operating ground shielding board.

In the exemplary embodiment, the conductive foam for framework may experience fire retardant process.Such as, the interior surface of foam or porous material can be provided with the fire retardant of effective dose.Fire retardant by be arranged in the space (or hole) of interconnection surface on and disperse throughout foam.Under background of the present disclosure, " effective dose " can be considered to the amount of such fire retardant: it provides at least horizontal flame grade of UL94V-0, V-1, V-2, HB or HF-1 for foam, and retains the shielding Z axis conductivity of enough EMI or specific insulation simultaneously.Amount throughout the fire retardant of foam dispersion is about 10 ounces every square yard (opsy) or following, about 5opsy or following, about 3opsy, etc.By means of only citing mode, fire retardant process can with United States Patent (USP) 7,060,348 and/or U.S. Patent application publication 2014/0199904 in describe fire retardant coating processes similar or identical, conductive foam can be UL94V-0 and Halogen whereby.United States Patent (USP) 7,060,348 and whole disclosures of U.S. Patent application publication 2014/0199904 be incorporated herein by reference.

Comprising the execution mode of one or more thermal interfacial material (such as, shielding device 900 shown in Figure 14 and Figure 15, etc.) in, various material can be used for any one or more thermal interfacial materials (TIM) in these illustrative embodiments.Such as, one or more TIM can by better heat conductor and the material with separately higher than air thermal conductivity formed.One or more TIM can comprise thermal interfacial material (such as, the Tflex purchased from LairdTechnologies ^tMthe temperature gap filler material of 300 series, Tflex ^tMthe temperature gap filler material of 600 series, Tpcm ^tMthe phase-change material of 580 series, Tpcm ^tMthe phase-change material of 780 series, Tpli ^tMthe gap fillers of 200 series and/or Tgrease ^tMthe hot lubricating grease of 880 series, etc.).

By the mode of illustrating further, TIM can by heat conduction and conduction elastomers mold.TIM can comprise the heat conduction conforming materials or heat-conducting interface material that are formed by the ceramic particle in the matrix of rubber, gel, lubricating grease or wax, metallic particles, ferrite EMI/RFI absorbing particles, metal or glass fiber mesh etc.

Table below lists example T IM and attribute.These example TIM are that LairdTechnologies is commercially available, therefore always with LairdTechnologies trademark.These are provided only to show unrestriced object for illustrative purposes.

Table herein lists the various TIM that thermal conductivity is 1.2,3,3.1,3.8,4.7,5.4 and 6W/mK.These thermal conductivities are only examples, and other execution mode can comprise following TIM: thermal conductivity, higher than 6W/mK, is less than 1.2W/mK, or other value between 1.2 and 6W/mk.Such as, following TIM can be used: thermal conductivity is higher than the air thermal conductivity of 0.024W/mK, and such as thermal conductivity is about 0.3W/mk, is about 3.0W/mK, or a certain value between 0.3W/mk and 3.0W/mk, etc.

Representative properties	Describe	Method of testing
			Color	Ash	Vision
Structure/composition	Non-reinforcing film
			Proportion, g/cc	2.51	Helium specific gravity bottle
Minimum bond line thickness, mm (mil)	0.025(1)	Laird's method of testing
			Thermal conductivity, W/mK	4.7	Heat dish thermal constant analyzer
Thermal impedance, DEG C-cm 2/ W (DEG C-inch 2/W)	0.064(0.010)	ASTM D5470
			Available thickness, mm (mil)	0.125-0.625(5-25)	Laird's method of testing
Room temperature hardness, Shore 00	85	ASTM D2240
			Specific insulation, ohm-cm	10 15	ASTM D257

TFLEX ^tMthe Representative properties of 300

TIM can comprise compliance or conformal silicon pad, non-silicone sill (such as, non-silicone base gap filler materials, thermoplasticity and/or thermosetting polymer, elastomeric material, etc.), screen print materials, polyurethane foam or gel, deep fat ash, hot lubricating grease, heat conduction additive, etc.TIM can be configured to have enough compliances, conformability and/or flexibility, with allow TIM material be placed with contact with matching surface (comprising on-plane surface, bending or uneven matching surface) time closely close fit surface.TIM can comprise the soft thermal interfacial material of conduction formed by elastomer and at least one heat-conducting metal, boron nitride and/or ceramic fillers, also can be conformal even if make soft thermal interfacial material not experience phase transformation or reflux.Even if TIM can be do not comprise metal and do not experience phase transformation or backflow also can be conformal nonmetal, non-phase-change material.TIM can comprise hot interfacial phase change material, the T-pcm enumerated in such as showing above ^tM583.

TIM can comprise one or more conformal thermal interfacial material gap fillers pad, there is enough deformabilities, compliance, adaptability, compressibility, flowable and/or flexibility, with allow to pad be placed with when being installed up to the printed circuit board (PCB) on electronic unit when shielding device contact with electronic unit in relative com pact thickly to fit the size of electronic unit and profile.By the mode bind electronic components coordinating with relative close and encapsulate, heat can be conducted to the lid in radiated energy by conformal thermal interfacial material gap pad away from electronic unit.In addition, thermal interfacial material gap fillers pad can be non-phase-change material and/or tolerance or the gap being configured to adjust deflection.

In some illustrative embodiments, thermal interfacial material can comprise conformal non-phase transformation gap fillers, gap pad or putty without the need to fusing or experience phase transformation.Thermal interfacial material can adjust tolerance or the gap of deflection under low temperature (such as, the room temperature of 20 DEG C to 25 DEG C, etc.).Thermal interfacial material can have significantly lower than Young's modulus and the Shore hardnes figure of copper or aluminium.Thermal interfacial material also can have than copper or the larger deflection of aluminium the percentage of pressure.

In some illustrative embodiments, thermal interfacial material comprises T-flex ^tM300 fill ceramic silicone elastomer gap fillers or T-flex ^tMthe silicone elastomer gap fillers of 600 filling boron nitride, both all have the Young's modulus of about 0.000689 gigapascal.Therefore, illustrative embodiments can comprise the thermal interfacial material with the Young's modulus more much smaller than 1 gigapascal.

T-flex ^tM300 fill ceramic silicone elastomer gap fillers and T-flex ^tMthe 600 silicone elastomer gap fillers of filling boron nitride have Shore 00 hardness number (through ASTMD2240 method of testing) being about 27 and 25 respectively.In some other illustrative embodiments, thermal interfacial material can comprise the T-pli that Shore 00 hardness is about 70 or 75 ^tM200 fill the silicone elastomer of boron nitride, the gap fillers of glass fiber reinforcement.Therefore, illustrative embodiments can comprise the thermal interfacial material that Shore 00 hardness is less than 100.

In addition, some illustrative embodiments comprise wetted and be attached to the conformal hot interface of matching surface.The example of available compliance in the exemplary embodiment or conformal thermal interfacial material is set forth, together with its Young's modulus, thermal conductivity and hardness number at once below.

T-flex ^tM300 series of heat gap filler materials roughly comprise such as: 50 pound per square inches pressure and below under other attribute of illustrating by the silicone elastomer of the filling pottery of deflection more than 50%.T-flex ^tM600 series of heat gap filler materials roughly comprise: the silicone elastomer of filling boron nitride, it in low pressure (such as, 10 to 100 pound per square inches, etc.), the hardness of every ASTMD2240 is for 25 Shore 00 or 40 Shores 00 and return to its original thickness more than 90% after compression under other attribute shown in table herein.T-pli ^tM200 series of gaps fillers roughly comprise: the silicone elastomer of the filling boron nitride of enhancing, and the hardness of every ASTMD2240 is 75 Shore 00 or 70 Shores 00, and other attribute shown in showing herein.T-pcm ^tM580 serial phase-change materials are roughly non-reinforcing film, and phase transformation softening temperature is about 122 degrees Fahrenheits (50 degrees Celsius).T-grease ^tM880 series of heat lubricating grease are roughly silica-based hot lubricating grease, and viscosity is less than 1500000 centipoises.Other illustrative embodiments can comprise that hardness is less than 25 Shores 00, is greater than 75 Shores 00, TIM between 25 and 75 Shores 00 etc.

Illustrative embodiments more of the present disclosure can provide one or more (but not necessarily any or all) in following advantage.Such as, illustrative embodiments can have the general thickness being less than about 1 millimeter (such as, about 0.7mm, about 0.75mm, etc.).Illustrative embodiments can be mounted, applies or be installed up to nonplanar surface and/or can be designed or be arranged in three-dimensional surface or pattern.Illustrative embodiments can allow relatively easy operation, manufacture and reprocess and/or advantage of lower cost.Utilize illustrative embodiments, the general thickness of BLS can reduce (such as, reduce 0.07mm, 0.25mm, etc.), this will allow the thickness using BLS device to reduce again.

The illustrative embodiments provided makes the disclosure will be thoroughly, and fully will pass on scope to those skilled in the art.Many details by the example set forth as concrete parts, apparatus and method, thoroughly to understand embodiment of the present disclosure.To be apparent that those skilled in the art: do not need to adopt detail, example embodiment can be presented as many different forms, and also should not be interpreted as limiting the scope of the present disclosure.In some example embodiment, do not describe the technique known, the apparatus structure known in detail and know technology.In addition, the advantage that available one or more illustrative embodiments of the present disclosure realizes and improvement only provide for illustrative purposes, do not limit the scope of the present disclosure, illustrative embodiments disclosed herein can provide all above-mentioned advantages and improvement or nothing, and still falls in the scope of the present disclosure.

Concrete size disclosed herein, concrete material and/or concrete shape are example in essence, do not limit the scope of the present disclosure.The particular value of given parameters disclosed herein and the particular range of value do not get rid of the scope of other value and the value come in handy in one or more example disclosed herein.And, it is envisaged that, any two particular values of the design parameter stated herein can limit the end points of the scope of the value that may be applicable to given parameters (such as, the first value of disclosed given parameters and the second value can be read as and disclose: given parameters can also adopt any value between the first value and the second value).Parameter X such as, if parameter X illustrates to have value A in this article, also illustrates that there is value Z, it is envisaged that can have the scope from about A to the value of about Z.Equally, it is envisaged that the value of two or more scopes of disclosed parameter (no matter whether such scope is nested, overlapping or different) is included into all possible range combinations that may use the end points of open scope value required for protection.Such as, if parameter X illustrates the value in the scope with 1 – 10 or 2 – 9 or 3 – 8 in this article, also should imagine: parameter X can have other scope of the value comprising 1 – 9,1 – 8,1 – 3,1 – 2,2 – 10,2 – 8,2 – 3,3 – 10 and 3 – 9.

Term used herein is only for the object describing particular example execution mode, and not intended to be limiting.As used in this article, singulative " ", " one " and " should/described " be intended to also comprise plural form, unless context otherwise clearly illustrates that.Term " comprises " and " having " is pardon, therefore specify and there are stated features, entirety, step, operation, key element and/or parts, but do not get rid of existence or add one or more further feature, entirety, step, operation, key element, parts and/or their group.Method step described herein, technique and operation should not be construed as and require that they show as discussion or illustrative particular order necessarily, are showed order unless otherwise indicated.It will also be appreciated that and can adopt extra or alternative step.

When a key element or layer be referred to as " ... on ", " being engaged to ", " being connected to " or " being attached to " another key element or layer time, it can directly exist ... go up, engage, connect or be attached to intermediate elements or layer that another key element or layer maybe may exist.On the contrary, when a key element be referred to as " directly exist ... on ", " being directly engaged to ", " being connected directly to " or " being attached directly to " another key element or layer time, intermediate elements or layer may not be there is.Should understand in a similar fashion other wording for describing relation between each key element (such as, " and between " with " directly ... between ", " adjacent " and " direct neighbor ", etc.).As used in this article, term "and/or" comprises any of the item of one or more associated listed and all combinations.

Although term first, second, the 3rd etc. can be used for describing various key element, parts, region, layer and/or sections in this article, and these key elements, parts, region, layer and/or sections should not limited by these terms.These terms only can be used for key element, parts, region, layer or a sections and another region, layer or sections to distinguish.The term of such as " first ", " second " and other numerical terms used herein do not imply sequence or order, unless clearly illustrated that by context.Thus, the first element discussed below, parts, region, layer or sections can be called as the second key element, parts, region, layer or sections, and do not depart from the instruction of example embodiment.

Provide previously described execution mode for the object illustrated and describe.And not intended to be is exhaustive or the restriction disclosure.Be intended to or state that the key element of the purposes of particular implementation or the independent of feature is roughly not limited thereto particular implementation, but being interchangeable under applicable circumstances, and can be used in selected execution mode, even without illustrating especially or describing also like this.Equally also can there is multimode change perhaps.Such change should not be regarded as a departure from the disclosure, and all amendments so are all intended to be included in the scope of the present disclosure.

Claims (16)

1. a shielding device, this shielding device comprises:

Framework, described framework comprises conductive foam; And

Lid, described lid can be attached to described framework;

Wherein, when the one or more parts on substrate are positioned at the inside jointly limited with the described lid being attached to described framework by described framework, described shielding device operatively shields described one or more parts.

2. shielding device according to claim 1, wherein:

Described framework comprises the one or more sidewalls limited by described conductive foam, makes described framework have open-top; And

Described cover is attached to described framework, and the described open-top of described framework is covered by described lid.

3. shielding device according to claim 2, wherein, described sidewall is limited integratedly by the described conductive foam of single-piece.

4. shielding device according to claim 3, wherein, described sidewall has single-piece or monolithic construction, and described framework is not comprised at any gap described in adjacent a pair between sidewall and/or the joint that is connected to each other by each sidewall.

5. shielding device according to claim 3, wherein, the described conductive foam of described single-piece is the shape of described framework by conductive foam sheet material cross cutting.

6. shielding device according to claim 1, wherein, described framework comprises the conductive foam bar of the shape being bent into described framework.

7. shielding device according to claim 1, wherein, described framework comprises the one or more inwall and one or more lateral wall that are limited by described conductive foam, the lateral wall of described lid and described framework and inwall is made jointly to limit multiple independently electromagnetic interference shield compartment, wherein when described framework is installed up to substrate, the parts of described substrate can be positioned in different compartments, and the described parts of described substrate are provided electromagnetic interference shield because of described electromagnetic interference shield compartment, thus suppress electromagnetic interference to pass in and out each electromagnetic interference shield compartment.

8. shielding device according to claim 1, wherein:

Described cover is attached to the first surface of described framework; And

Described shielding device comprises electrically conductive pressure sensitive adhesives further, and described electrically conductive pressure sensitive adhesives is attached to second of described framework, and this second opposed with for the described first surface being attached described lid.

9. shielding device according to claim 1, wherein:

Described conductive foam comprises polyurethane foam, and the main body of described polyurethane foam is covered with metal; And/or

Described conductive foam comprises such foam: this foam comprises the internal voids with interior surface, described interior surface due to be arranged in described interior surface at least one conduction metal or non-metallic layer but conduction.

10. shielding device according to claim 1, wherein, described lid comprises at least one in conductive sheet, conductive fabric, metalized film, conductive foam and/or metal forming.

11. shielding devices according to any one in aforementioned claim, wherein, described framework is only made up of described conductive foam.

12. 1 kinds of shielding devices, this shielding device comprises conductive foam sidewall, described conductive foam sidewall is configured to roughly be installed up to described substrate around the one or more parts on substrate, thinks that the described one or more parts on described substrate provide electromagnetic interference shield.

13. shielding devices according to claim 12, wherein, described conductive foam sidewall is limited integratedly by the conductive foam of single-piece, makes described conductive foam sidewall have single-piece or monolithic construction.

14. shielding devices according to claim 13, wherein, the conductive foam of described single-piece is the shape of the framework comprising described conductive foam sidewall by conductive foam sheet material cross cutting, or is bent into the shape of described framework.

15. shielding devices according to claim 12, described shielding device comprises one or more conductive foam inwall further, makes described conductive foam sidewall and described one or more conductive foam inwall jointly limit by the separate multiple regions of one or more described conductive foam inwall; And/or wherein said conductive foam sidewall comprises the polyurethane foam being covered with metal, and/or described conductive foam sidewall comprises such foam, this foam comprises the internal voids with interior surface, described interior surface due to be arranged in described interior surface at least one conduction metal or non-metallic layer but conduction.

16. according to claim 12 to the shielding device described in any one in 15, and wherein, described shielding device is combined shielding equipment, and this combined shielding equipment comprises:

Framework, this framework comprises the described conductive foam sidewall limiting open-top; And

Lid, described lid is attached to described framework in the described open-top of described framework,

Wherein, when the one or more parts on substrate are positioned at the inside jointly limited by described framework and described lid, the described one or more parts of described combined shielding equipment operating ground shielding.