CN204966507U - Semiconductor diode - Google Patents

Semiconductor diode Download PDF

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Publication number
CN204966507U
CN204966507U CN201520678677.0U CN201520678677U CN204966507U CN 204966507 U CN204966507 U CN 204966507U CN 201520678677 U CN201520678677 U CN 201520678677U CN 204966507 U CN204966507 U CN 204966507U
Authority
CN
China
Prior art keywords
pin
chip
chute
diode
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520678677.0U
Other languages
Chinese (zh)
Inventor
叶惠东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou High-New District Huacheng Electronic Co Ltd
Original Assignee
Suzhou High-New District Huacheng Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou High-New District Huacheng Electronic Co Ltd filed Critical Suzhou High-New District Huacheng Electronic Co Ltd
Priority to CN201520678677.0U priority Critical patent/CN204966507U/en
Application granted granted Critical
Publication of CN204966507U publication Critical patent/CN204966507U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a semiconductor diode, its technical scheme main points are: including chip and the shell of cladding in the chip outside, the shell both ends all are equipped with the spout, the spout diapire is equipped with the stationary contact that links to each other with the chip, the spout internal slipping is connected with the pin, the pin can with the stationary contact butt, be equipped with the positioning element of location pin in the spout, bending the pin welding after on the circuit board, chip in the diode takes place after the damage, only need relieve positioning element's locking, can be along the spout, with casing and pin separation, realize the dismantlement of casing, it can to install new chip more afterwards, can realize the fixed of pin and casing through positioning element, need not dismantle the change that yet can realize the chip with the pin, very convenient realization the change of the diode that damages.

Description

Semiconductor diode
Technical field
The utility model relates to a kind of electronic devices and components, and more particularly, it relates to a kind of semiconductor diode.
Background technology
In current electronic devices and components, semiconductor diode is as the most frequently used accessory of electronic devices and components, because semiconductor diode has rectification function, therefore, be widely used on various electronic devices and components, current existing diode kind is a lot, current existing diode, mainly comprises chip and is coated on the shell of chip exterior, be provided with PN junction in chip, shell is injection molded by modified epoxy, is provided with the pin be connected with chip at the two ends of shell.
When diode is installed on circuit board, first the pin of diode is needed to carry out bending according to installation, subsequently again by corresponding welding hole on the pin of diode insertion circuit board, finally by welding wire, the pin of diode is welded and fixed on circuit boards, because pin is welded and fixed setting on circuit boards, after diode is damaged, because pin and diode are wholely set, therefore want to pull down diode, pin will be pulled up from circuit board, because pin is welded on circuit boards, therefore, pin is wanted to disassemble just very inconvenient from circuit board, in addition, the chip that what diode was damaged is mostly in housing, pin scarcely can be damaged, therefore, pin also need not be disassembled and change.
Utility model content
For the deficiency that prior art exists, the purpose of this utility model is to provide a kind of semiconductor diode, can realize the replacing of the semiconductor diode damaged very easily.
For achieving the above object, the utility model provides following technical scheme: a kind of semiconductor diode, comprise chip and be coated on the shell of chip exterior, described shell two ends are equipped with chute, described chute diapire is provided with the fixed contact be connected with chip, in described chute, slippage is connected with pin, and described pin can abut with fixed contact, is provided with the positioning element of positioning pins in described chute.
Preferably, in chute, slippage is connected with slide block, and described pin is fixedly installed on slide block, and described positioning element comprises the shell fragment tilting to be fixedly installed on chute wall.
Preferably, described pin adopts with slide block and is threaded.
Preferably, described chute wall is provided with guide rail along track length direction, described slide block is provided with the groove coordinated with guide rail.
Preferably, described rail end is provided with chamfering structure.
By adopting technique scheme, after by pin bending welding on circuit boards, after the chip in diode is damaged, only need the locking removing positioning element, can along chute, housing is separated with pin, realize the dismounting of housing, install new chip more subsequently, the fixing of pin and housing can be realized by positioning element, do not need pin to be disassembled the replacing that yet can realize chip, achieve the replacing of the diode of damage very easily.
Accompanying drawing explanation
Fig. 1 is that the assembling of the utility model semiconductor diode embodiment is attempted;
A portion enlarged drawing in Fig. 2 bitmap 1
Fig. 3 is the assembling explosive view of the utility model semiconductor diode embodiment.
In figure: 1, housing; 11, chute; 12, fixed contact; 2, pin; 3, guide rail; 31, chamfering; 4, slide block; 41, groove; 42, tapped through hole; 5, screw rod; 6, shell fragment.
Embodiment
Referring to figs. 1 through Fig. 3, the utility model semiconductor diode embodiment is described further.
A kind of semiconductor diode, comprise chip and be coated on the shell of chip exterior, PN junction is provided with in chip, shell is by injection molded, chute 11 is equipped with at shell two ends, chute 11 diapire is provided with the fixed contact 12 be connected with chip, in chute 11, slippage is connected with pin 2, pin 2 has iron wire to support, when mounted, pin 2 welds on circuit boards, after pin 2 is installed, pin 2 can abut with fixed contact 12, now diode chip can with external circuit conducting, realize the normal function of diode, the positioning element of positioning pins 2 is provided with in chute 11, after by pin 2 bending welding on circuit boards, after the chip in diode is damaged, only need the locking removing positioning element, can along chute 11, housing 1 is separated with pin 2, realize the dismounting of housing 1, install new chip more subsequently, the fixing of pin 2 and housing 1 can be realized by positioning element, pin 2 is not needed to disassemble the replacing that yet can realize chip, achieve the replacing of the diode of damage very easily.
In chute 11, slippage is connected with slide block 4, pin 2 is fixedly installed on slide block 4, chute 11 sidewall is provided with guide rail 3 along chute 11 length direction, slide block 4 is provided with the groove 41 coordinated with guide rail 3, coordinated with groove 41 by guide rail 3, slide block 4 can be realized be connected with the slippage of chute 11, avoid slide block 4 to come off from chute 11, by arranging slide block 4, can be more stable realize the fixing of pin 2, positioning element comprises the shell fragment 6 tilting to be fixedly installed on chute 11 sidewall, shell fragment 6 one end is fixedly installed on chute 11 sidewall, the other end is obliquely installed, the one end tilted is towards fixed contact 12, when pin 2 abuts with fixed contact 12, shell fragment 6 end abuts with slide block 4, realize slide block 4 fixing in chute 11, in the present embodiment, in order to more stable realizes the fixing of slide block 4, shell fragment 6 is two, pile be arranged on chute 11 sidewall on, two shell fragments 6 are set, all position-limiting action can be played to the two ends up and down of slide block 4, when disassembly is desired, push shrapnel 6, when shell fragment 6 tilt one end also with chute 11 sidewall connect time, slide block 4 can be skidded off, realize the dismounting of pin 2, pin 2 and housing 1 are arranged to dismountable, when transporting, pin 2 and housing 1 can be disassembled, reduce the space that diode takies, realize the transport of diode very easily.
Owing to wearing and tearing in pin 2 end, to remain with fixed contact 12 to make pin 2 and abut, pin 2 adopts with slide block 4 and is threaded, be integrally formed with screw rod 5 in the end of pin 2, slide block 4 is provided with the tapped through hole 42 coordinated with screw rod 5, after wearing and tearing in pin 2 end, rotate pin 2, suitably stretched out by pin 2, pin 2 can be made to remain with fixed contact 12 and abut, the phenomenon avoiding loose contact occurs.
Conveniently slide block 4 slips in chute 11, is provided with chamfering 31 structure in guide rail 3 end.
Below be only preferred implementation of the present utility model, protection range of the present utility model be not only confined to above-described embodiment, all technical schemes belonged under the utility model thinking all belong to protection range of the present utility model.It should be pointed out that for those skilled in the art, do not departing from the some improvements and modifications under the utility model principle prerequisite, these improvements and modifications also should be considered as protection range of the present utility model.

Claims (5)

1. a semiconductor diode, comprise chip and be coated on the shell of chip exterior, it is characterized in that: described shell two ends are equipped with chute, described chute diapire is provided with the fixed contact be connected with chip, in described chute, slippage is connected with pin, described pin can abut with fixed contact, is provided with the positioning element of positioning pins in described chute.
2. semiconductor diode according to claim 1, is characterized in that: in chute, slippage is connected with slide block, and described pin is fixedly installed on slide block, and described positioning element comprises the shell fragment tilting to be fixedly installed on chute wall.
3. semiconductor diode according to claim 2, is characterized in that: described pin adopts with slide block and is threaded.
4. the semiconductor diode according to Claims 2 or 3, is characterized in that: described chute wall is provided with guide rail along track length direction, and described slide block is provided with the groove coordinated with guide rail.
5. semiconductor diode according to claim 4, is characterized in that: described rail end is provided with chamfering structure.
CN201520678677.0U 2015-09-03 2015-09-03 Semiconductor diode Expired - Fee Related CN204966507U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520678677.0U CN204966507U (en) 2015-09-03 2015-09-03 Semiconductor diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520678677.0U CN204966507U (en) 2015-09-03 2015-09-03 Semiconductor diode

Publications (1)

Publication Number Publication Date
CN204966507U true CN204966507U (en) 2016-01-13

Family

ID=55061551

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520678677.0U Expired - Fee Related CN204966507U (en) 2015-09-03 2015-09-03 Semiconductor diode

Country Status (1)

Country Link
CN (1) CN204966507U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105552056A (en) * 2016-02-03 2016-05-04 泰州优宾晶圆科技有限公司 Silver-faced high-voltage planar MOS schottky diode

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105552056A (en) * 2016-02-03 2016-05-04 泰州优宾晶圆科技有限公司 Silver-faced high-voltage planar MOS schottky diode

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Legal Events

Date Code Title Description
GR01 Patent grant
C14 Grant of patent or utility model
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160113

Termination date: 20200903

CF01 Termination of patent right due to non-payment of annual fee