CN204962934U - Novel far infrared board that generates heat - Google Patents
Novel far infrared board that generates heat Download PDFInfo
- Publication number
- CN204962934U CN204962934U CN201520721393.5U CN201520721393U CN204962934U CN 204962934 U CN204962934 U CN 204962934U CN 201520721393 U CN201520721393 U CN 201520721393U CN 204962934 U CN204962934 U CN 204962934U
- Authority
- CN
- China
- Prior art keywords
- far infrared
- copper sheet
- impregnated paper
- top layer
- stamen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
Abstract
The utility model relates to a board generates heat, especially, relate to a novel far infrared board that generates heat, it includes the top layer, intermediate level and bottom, top layer and bottom are the flooding ply, the intermediate level includes far infrared carbon fiber generate heat stamen lamella and the two poles of the earth copper sheet conducting layer, be equipped with conductive copper sheet in the copper sheet conducting layer of the two poles of the earth, the last electric wire that is equipped with of conductive copper sheet, the top layer, intermediate level and bottom stack the assembly through the high temperature high pressure synthetic type far infrared board that generates heat that once bonds according to the order, the far infrared is generated heat the board and is passed through the connection of electric lines power, the top layer is the flooding ply of the impregnated paper component of 1-100 quantity, it is through boning on the far infrared carbon fiber generates heat the stamen lamella after the high temperature high pressure dissolves, the bottom is the flooding ply of the impregnated paper component of 1-200 quantity, it bonds after the high temperature high pressure dissolves in the two poles of the earth copper sheet conducting layer and the far infrared carbon fiber stamen lamella that generates heat, the pump body has the advantages of simple structure, pracality, and the device is safe, it is beautifully durable, and it is water -fast resistant xeothermic, it is high temperature resistant withstand voltage, and energy is saved, the low carbon environmental protection.
Description
Technical field
The utility model relates to a kind of plate, particularly relates to a kind of new far infrared heating board.
Background technology
At present, people for ground heating floor research widely.In general, be that electric heating material is arranged in plate, by reaching the object of heating to this electric heating material energising in plate, thus plate generated heat with heating.Conductivity of heat due to plate itself is not fine, so be also provided with Heat Conduction Material in some plate in the prior art, further by electric heating material the heat transfer sent out to the various piece of plate, thus the space uniform heat supply residing for whole plate, but the Heat Conduction Material used is generally metal material, as aluminium alloy etc., except raw material and processing cost height, also there is larger potential safety hazard, and poor effect; Be difficult to meet people's diversification, higher heating requirement.
Summary of the invention
For the deficiencies in the prior art, the purpose of this utility model is to provide a kind of new far infrared heating board, and not only structure is simple for it, practical, and safety is attractive in appearance durable, and water-fast dry heat resistance, high temperature resistant withstand voltage, economize energy, low-carbon environment-friendly.
For achieving the above object, the utility model is achieved by the following technical programs:
A kind of new far infrared heating board, comprise top layer, intermediate layer and bottom, described top layer and described bottom are impregnated paper, described intermediate layer comprises Far infrared carbon fiber heating stamen lamella and the two poles of the earth copper sheet conductive layer, conductive copper sheet is provided with in the copper sheet conductive layer of described the two poles of the earth, described conductive copper sheet is provided with electric wire, described top layer, described intermediate layer and described bottom stack assembly in order and once to bond synthesis type Far-infrared heating panel through HTHP, and described Far-infrared heating panel connects power supply by electric wire.
Further, described top layer is the impregnated paper of the impregnated paper composition of quantity 1 ~ 100, and it is bonded on described Far infrared carbon fiber heating stamen lamella after HTHP dissolves.
Further, described bottom is the impregnated paper of the impregnated paper composition of quantity 1 ~ 200, and it is bonded in described the two poles of the earth copper sheet conductive layer and described Far infrared carbon fiber heating stamen lamella after HTHP dissolves.
Further, described impregnated paper is for containing Lauxite or melmac or hybrid resin or phenolic resins ply of paper.
Further, described HTHP to be temperature be 90 DEG C ~ 200 DEG C, pressure is at 10 ~ 22MPa.
Further, the thickness of described Far-infrared heating panel is 0.2 ~ 75mm.
In sum, the utility model has the advantages that: a kind of new far infrared heating board, comprise top layer, intermediate layer and bottom, top layer and bottom are impregnated paper, intermediate layer comprises Far infrared carbon fiber heating stamen lamella and the two poles of the earth copper sheet conductive layer, conductive copper sheet is provided with in the copper sheet conductive layer of the two poles of the earth, conductive copper sheet is provided with electric wire, top layer, intermediate layer and bottom stack assembly in order and once to bond synthesis type Far-infrared heating panel through HTHP, Far-infrared heating panel connects power supply by electric wire, top layer is the impregnated paper of the impregnated paper composition of quantity 1 ~ 100, it is bonded on Far infrared carbon fiber heating stamen lamella after HTHP dissolves, bottom is the impregnated paper of the impregnated paper composition of quantity 1 ~ 200, it is bonded in the two poles of the earth copper sheet conductive layer and Far infrared carbon fiber heating stamen lamella after HTHP dissolves, not only structure is simple for it, practical, safety, attractive in appearance durable, and water-fast dry heat resistance, high temperature resistant withstand voltage, economize energy, low-carbon environment-friendly.
Accompanying drawing explanation
Fig. 1 is the utility model structural representation;
In figure, 1, top layer, 2, intermediate layer, 201, Far infrared carbon fiber heating stamen lamella, 202, the two poles of the earth copper sheet conductive layer, 3, bottom, 4, Far-infrared heating panel, 5, electric wire, 6, conductive copper sheet.
Detailed description of the invention
Below in conjunction with accompanying drawing and detailed description of the invention, the utility model is further described:
As shown in Figure 1, a kind of new far infrared heating board, comprise top layer 1, intermediate layer 2 and bottom 3, described top layer 1 and described bottom 3 are impregnated paper, described intermediate layer 2 comprises Far infrared carbon fiber heating stamen lamella 201 and the two poles of the earth copper sheet conductive layer 202, conductive copper sheet 6 is provided with in described the two poles of the earth copper sheet conductive layer 202, described conductive copper sheet 6 is provided with electric wire 5, described top layer 1, described intermediate layer 2 and described bottom 3 stack assembly in order and once to bond synthesis type Far-infrared heating panel 4 through HTHP, and described Far-infrared heating panel 4 connects power supply by electric wire 5.
Described top layer 1 is the impregnated paper of the impregnated paper composition of quantity 1 ~ 100, and it is bonded on described Far infrared carbon fiber heating stamen lamella 201 after HTHP dissolves.
Described bottom 3 is the impregnated paper of the impregnated paper composition of quantity 1 ~ 200, and it is bonded in described the two poles of the earth copper sheet conductive layer 202 and described Far infrared carbon fiber heating stamen lamella 201 after HTHP dissolves.
Described impregnated paper is for containing Lauxite or melmac or hybrid resin or phenolic resins.
Described HTHP to be temperature be 90 DEG C ~ 200 DEG C, pressure is at 10 ~ 22MPa.
The thickness of described Far-infrared heating panel 4 is 0.2 ~ 75mm.
As can be seen here, not only structure is simple for it, practical, and safety is attractive in appearance durable, and water-fast dry heat resistance, high temperature resistant withstand voltage, economize energy, low-carbon environment-friendly.
For a person skilled in the art, according to above technical scheme and design, other various corresponding change and distortion can be made, and all these change and distortion all should belong within the protection domain of the utility model claim.
Claims (6)
1. a new far infrared heating board, comprise top layer (1), intermediate layer (2) and bottom (3), it is characterized in that: described top layer (1) and described bottom (3) are impregnated paper, described intermediate layer (2) comprises Far infrared carbon fiber heating stamen lamella (201) and the two poles of the earth copper sheet conductive layer (202), conductive copper sheet (6) is provided with in described the two poles of the earth copper sheet conductive layer (202), described conductive copper sheet (6) is provided with electric wire (5), described top layer (1), described intermediate layer (2) and described bottom (3) stack assembly in order and once to bond synthesis type Far-infrared heating panel (4) through HTHP, described Far-infrared heating panel (4) connects power supply by electric wire (5).
2. a kind of new far infrared heating board according to claim 1, it is characterized in that: the impregnated paper that the impregnated paper that described top layer (1) is quantity 1 ~ 100 forms, it is bonded on described Far infrared carbon fiber heating stamen lamella (201) after HTHP dissolves.
3. a kind of new far infrared heating board according to claim 1, it is characterized in that: the impregnated paper that the impregnated paper that described bottom (3) is quantity 1 ~ 200 forms, it is bonded in described the two poles of the earth copper sheet conductive layer (202) and described Far infrared carbon fiber heating stamen lamella (201) after HTHP dissolves.
4. a kind of new far infrared heating board according to Claims 2 or 3, is characterized in that: described impregnated paper is for containing Lauxite or melmac or hybrid resin or phenolic resins.
5. a kind of new far infrared heating board according to Claims 2 or 3, is characterized in that: described HTHP to be temperature be 90 DEG C ~ 200 DEG C, pressure is at 10 ~ 22MPa.
6. a kind of new far infrared heating board according to claim 5, is characterized in that: the thickness of described Far-infrared heating panel (4) is 0.2 ~ 75mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520721393.5U CN204962934U (en) | 2015-09-17 | 2015-09-17 | Novel far infrared board that generates heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520721393.5U CN204962934U (en) | 2015-09-17 | 2015-09-17 | Novel far infrared board that generates heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204962934U true CN204962934U (en) | 2016-01-13 |
Family
ID=55057997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520721393.5U Expired - Fee Related CN204962934U (en) | 2015-09-17 | 2015-09-17 | Novel far infrared board that generates heat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204962934U (en) |
-
2015
- 2015-09-17 CN CN201520721393.5U patent/CN204962934U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160113 Termination date: 20170917 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |