CN204939579U - A kind of esr wide plate billet crystallizer realizing uniform decrease in temperature - Google Patents
A kind of esr wide plate billet crystallizer realizing uniform decrease in temperature Download PDFInfo
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- CN204939579U CN204939579U CN201520683880.7U CN201520683880U CN204939579U CN 204939579 U CN204939579 U CN 204939579U CN 201520683880 U CN201520683880 U CN 201520683880U CN 204939579 U CN204939579 U CN 204939579U
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- flow deflector
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Abstract
The utility model discloses a kind of esr wide plate billet crystallizer realizing uniform decrease in temperature, comprise four single-bit modules be bolted, each single-bit module includes by top board, base plate, work copper coin, water tank panel and side frame plate are by the casing that is welded to form and the flow deflector be all arranged in casing and water tank baffle, the diversed plate of whole casing and water tank baffle are divided into a interlayer, b interlayer and c interlayer, backwater narrow slit is formed between flow deflector and top board, formed into water narrow slit between flow deflector and base plate, a interlayer and c interlayer pass through to be communicated with into water narrow slit, b interlayer is communicated with by backwater narrow slit with c interlayer, the work copper coin cooling of this wide plate billet crystallizer evenly, cooling intensity is enough large, work copper coin modification and premature breakdown can be effectively prevent.
Description
Technical field
The utility model relates to a kind of metallurgy industry esr wide plate billet crystallizer, particularly relates to a kind of esr wide plate billet crystallizer realizing uniform decrease in temperature.
Background technology
The electroslag remelting plate blank crystallizer work copper coin type of cooling of domestic and international current use has two kinds: one is holed in work copper coin inside machining, water flowing cooling work copper coin in hole, another kind is with clad steel plate again after machining fluting in the one side of work copper coin, water flowing cooling work copper coin in Copper steel cladding pit, this is the Major Cooling Methods of copper coin of working in current esr plate plate crystallizer.
This type of cooling belongs to Local cooling, and discharge is little, and cooling intensity is little, and the processing and manufacturing difficulty of these crystallizer stencils is large, and require high to quality of cooling water, maintenance capacity is large; What is more important, if hole or slot too little, can limit the flow of water coolant, makes the cooling intensity of copper coin not enough and causes work copper coin modification or damage; If boring or fluting are too large, just must increase copper plate thickness, cause plate slab crystallizer manufacturing cost significantly to increase.
Utility model content
The utility model makes improvement for above-mentioned Problems existing, namely the technical problems to be solved in the utility model is to provide a kind of esr wide plate billet crystallizer realizing uniform decrease in temperature, the work copper coin cooling of this wide plate billet crystallizer evenly, cooling intensity is enough large, can effectively prevent work copper coin modification and premature breakdown.
In order to solve the problems of the technologies described above, the utility model proposes a kind of like this esr wide plate billet crystallizer realizing uniform decrease in temperature, comprise four single-bit modules be bolted, each described single-bit module includes by top board, base plate, work copper coin, water tank panel and side frame plate by the casing that is welded to form and the flow deflector be all arranged in described casing and water tank baffle, described flow deflector, described water tank panel, described water tank baffle, described base plate and described side frame plate form a interlayer, described flow deflector, described water tank panel, described water tank baffle, described top board and described side frame plate form b interlayer, described flow deflector, described work copper coin, described top board, described base plate and described side frame plate form c interlayer, backwater narrow slit is formed between described flow deflector and described top board, formed between described flow deflector and described base plate into water narrow slit, described a interlayer and described c interlayer pass through to be communicated with into water narrow slit, described b interlayer is communicated with by backwater narrow slit with described c interlayer, described water tank panel is provided with water inlet pipe and rising pipe, the side of described side frame plate is provided with connection deckle board, and described connection deckle board is provided with bolt hole.
Further, the arranged outside of described connection deckle board has reinforcement gusset.
Further, described flow deflector is mutually vertical with described water tank baffle.
Further, described flow deflector and described work copper coin are parallel to each other.
The beneficial effects of the utility model:
The first, this electroslag remelting plate blank crystallizer work copper coin uniform fluid flow that this practicality provides, the water yield is sufficient, and heat load is large, and the current actual measurement temperature difference is less than 3 degree, improves the ability of copper coin high temperature resistance modification, extends the work-ing life of plate slab crystallizer;
Second, manufacture simple, not need on copper coin drilling deep hole water flowing or slot on copper coin to carry out complicated Copper steel cladding technique again, just can produce wide cut electroslag remelting plate blank crystallizer by simple weldprocedure, low cost of manufacture, the manufacture specification of plate slab crystallizer also can significantly extend;
3rd, easy to use, industrial tap water can be used to cool, need not soft water cooling be used.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Fig. 1 is the utility model single-bit module front view;
Fig. 2 is the utility model single-bit module vertical view;
Fig. 3 is the utility model single-bit module left view;
In figure: 1, work copper coin; 2, water tank panel; 3, flow deflector; 4, water tank baffle; 5, top board; 6, base plate; 7, side frame plate; 8, water inlet pipe; 9, rising pipe; 10, deckle board is connected; 11, gusset is strengthened; 12, bolt hole; 13, a interlayer; 14, b interlayer; 15, c interlayer; 16, water narrow slit is entered; 17, backwater narrow slit.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
As shown in FIG. 1 to 3, for a kind of embodiment partial schematic diagram of the present utility model, comprise four single-bit modules be bolted, each described single-bit module includes by top board 5, base plate 6, work copper coin 1, water tank panel 2 and side frame plate 7 are by the casing that is welded to form and be all arranged on orthogonal flow deflector 3 and water tank baffle 4 in described casing, described flow deflector 3 is parallel to each other with described work copper coin 1, described flow deflector 3, described water tank panel 2, described water tank baffle 4, described base plate 6 and described side frame plate 7 form a interlayer 13, described flow deflector 3, described water tank panel 2, described water tank baffle 4, described top board 5 and described side frame plate 7 form b interlayer 14, described flow deflector 3, described work copper coin 1, described top board 5, described base plate 6 and described side frame plate 7 form c interlayer 15, backwater narrow slit 17 is formed between described flow deflector 3 and described top board 5, formed between described flow deflector 3 and described base plate 6 into water narrow slit 16, described a interlayer 13 and described c interlayer 15 pass through to be communicated with into water narrow slit 16, described b interlayer 14 is communicated with by backwater narrow slit 17 with described c interlayer 15, described water tank panel 2 is provided with water inlet pipe 8 and rising pipe 9, the side of described side frame plate 7 is provided with and connects deckle board 10, described connection deckle board is provided with bolt hole 12.
During use, after water coolant enters a interlayer 13 by water inlet pipe 8, c interlayer 15 is flowed into by entering water narrow slit 16, the cavity of a interlayer 13 is enough large relative to water seam section, entering water narrow slit 16 is current limliting water seams, make the water flow in a interlayer 13 slow, pressure drop can be ignored, the hydraulic pressure of a interlayer 13 is even, the water coolant flow through into water narrow slit 16 evenly flows into c interlayer 15, enter the water coolant of c interlayer 15 along work copper coin 1 Uniform Flow from bottom to top, c interlayer 15 can be enough thin, and then increase the flow velocity of water, quickening work copper coin 1 dispels the heat, water coolant flows into b interlayer 14 through backwater narrow slit 17 after arriving c interlayer 15 top, finally flowed out by rising pipe 9, backwater narrow slit 17 plays metering function equally, this type of cooling can be taken away high-temperature molten steel in electroslag working process fast and be delivered to the heat of work copper coin, greatly improve the heat transfer boundary condition of work copper coin, copper coin modification is effectively controlled.
Further, the arranged outside of described connection deckle board 10 has reinforcement gusset 11.
Reinforcement gusset is set, the steadiness of crystallizer can be promoted, after effective prevention work copper coin 1 is heated, deformation occurs.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection domain of the present utility model.
Claims (4)
1. can realize an esr wide plate billet crystallizer for uniform decrease in temperature, it is characterized in that: comprise four single-bit modules be bolted, each described single-bit module includes by top board, base plate, work copper coin, water tank panel and side frame plate by the casing that is welded to form and the flow deflector be all arranged in described casing and water tank baffle, described flow deflector, described water tank panel, described water tank baffle, described base plate and described side frame plate form a interlayer, described flow deflector, described water tank panel, described water tank baffle, described top board and described side frame plate form b interlayer, described flow deflector, described work copper coin, described top board, described base plate and described side frame plate form c interlayer, backwater narrow slit is formed between described flow deflector and described top board, formed between described flow deflector and described base plate into water narrow slit, described a interlayer and described c interlayer pass through to be communicated with into water narrow slit, described b interlayer is communicated with by backwater narrow slit with described c interlayer, described water tank panel is provided with water inlet pipe and rising pipe, the side of described side frame plate is provided with connection deckle board, and described connection deckle board is provided with bolt hole.
2. a kind of esr wide plate billet crystallizer realizing uniform decrease in temperature according to claim 1, is characterized in that: the arranged outside of described connection deckle board has reinforcement gusset.
3. a kind of esr wide plate billet crystallizer realizing uniform decrease in temperature according to claim 1, is characterized in that: described flow deflector is mutually vertical with described water tank baffle.
4. a kind of esr wide plate billet crystallizer realizing uniform decrease in temperature according to claim 1, is characterized in that: described flow deflector and described work copper coin are parallel to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520683880.7U CN204939579U (en) | 2015-09-06 | 2015-09-06 | A kind of esr wide plate billet crystallizer realizing uniform decrease in temperature |
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| CN201520683880.7U CN204939579U (en) | 2015-09-06 | 2015-09-06 | A kind of esr wide plate billet crystallizer realizing uniform decrease in temperature |
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| CN204939579U true CN204939579U (en) | 2016-01-06 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105039734A (en) * | 2015-09-06 | 2015-11-11 | 江油市重鑫特种金属材料有限公司 | Electro-slag remelting wide slab crystallizer capable of achieving uniform cooling |
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2015
- 2015-09-06 CN CN201520683880.7U patent/CN204939579U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105039734A (en) * | 2015-09-06 | 2015-11-11 | 江油市重鑫特种金属材料有限公司 | Electro-slag remelting wide slab crystallizer capable of achieving uniform cooling |
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