CN204925877U - Cloud computer motherboard with heat dissipation function - Google Patents

Cloud computer motherboard with heat dissipation function Download PDF

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Publication number
CN204925877U
CN204925877U CN201520514037.6U CN201520514037U CN204925877U CN 204925877 U CN204925877 U CN 204925877U CN 201520514037 U CN201520514037 U CN 201520514037U CN 204925877 U CN204925877 U CN 204925877U
Authority
CN
China
Prior art keywords
radiating fin
cloud computer
cooling coil
low temperature
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520514037.6U
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Chinese (zh)
Inventor
柴恩杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tianjin Shubiao Technology Co Ltd
Original Assignee
Tianjin Shubiao Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tianjin Shubiao Technology Co Ltd filed Critical Tianjin Shubiao Technology Co Ltd
Priority to CN201520514037.6U priority Critical patent/CN204925877U/en
Application granted granted Critical
Publication of CN204925877U publication Critical patent/CN204925877U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a cloud computer motherboard with heat dissipation function, including cloud computer motherboard, radiating fin frame, radiating fin, cooling coil and low temperature water circle device, cloud computer motherboard below is provided with the radiating fin frame, is provided with radiating fin on the radiating fin frame, and the last winding of radiating fin has cooling coil, and cooling coil links to each other with the outside low temperature water circle device of cloud computer, and the intaking of low temperature water circle device's delivery port and cooling coil is held continuously, has a radiating fin 4 through the support mounting between the two adjacent radiating fin, cloud computer motherboard lower extreme is equipped with a plurality of temperature sensor, still includes a controller, the input of controller links to each other with temperature sensor, the output of controller links to each other with radiator fan and low temperature water circle device. The utility model discloses simple structure can dispel the heat fast, and can select different radiating modes according to the temperature, and is with strong points.

Description

There is the cloud computer mainboard of heat sinking function
Technical field
The utility model relates to cloud computer technical field, is specifically related to the cloud computer mainboard with heat sinking function.
Background technology
Traditional cloud computer mainboard is all dispelled the heat by radiating module, general is all dispelled the heat by fan, then by heat pipe, heat is derived, ensure the heat dispersion that computer is good, but this heat energy generally all wastes, can not be used, therefore need to improve existing cooling system.
Utility model content
For solving the problem, the utility model provides a kind of cloud computer mainboard with heat sinking function, and structure is simple, and can dispel the heat rapidly and heat energy can be made full use of, practicality is very strong.
For achieving the above object, the technical scheme that the utility model is taked is: the cloud computer mainboard with heat sinking function, comprise cloud computer mainboard, radiating fin horse, radiating fin, cooling coil and water at low temperature circulating device, radiating fin horse is provided with below cloud computer mainboard, radiating fin horse is provided with radiating fin, radiating fin is wound with cooling coil, cooling coil is connected with the water at low temperature circulating device of cloud computer outside, the water delivering orifice of water at low temperature circulating device is connected with the water inlet end of cooling coil, radiator fan is had by support installing between adjacent two radiating fins, described cloud computer mainboard lower end is provided with some temperature sensors, also comprise a controller, the input end of described controller is connected with temperature sensor, the output terminal of described controller is connected with water at low temperature circulating device with radiator fan.
As preferably, described controller is single-chip microcomputer.
As preferably, described temperature sensor is SMD sensor.
The utility model has following beneficial effect: structure is simple, can dispel the heat rapidly, and radiating mode that can be different according to thermal creep stress, with strong points.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Embodiment
In order to make the purpose of this utility model and advantage clearly understand, below in conjunction with embodiment, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
As shown in Figure 1, the utility model embodiment provides a kind of cloud computer mainboard with heat sinking function, comprise cloud computer mainboard 1, radiating fin horse 2, radiating fin 3, cooling coil 4 and water at low temperature circulating device 5, radiating fin horse 2 is provided with below cloud computer mainboard 1, radiating fin horse 2 is provided with radiating fin 3, radiating fin 3 is wound with cooling coil 4, cooling coil 4 is connected with the water at low temperature circulating device 5 of cloud computer outside, the water delivering orifice of water at low temperature circulating device 5 is connected with the water inlet end of cooling coil 4, radiator fan 6 is had by support installing between adjacent two radiating fins 3, described cloud computer mainboard 1 lower end is provided with some temperature sensors, also comprise a controller, the input end of described controller is connected with temperature sensor, the output terminal of described controller is connected with water at low temperature circulating device 5 with radiator fan 6.
Described controller is single-chip microcomputer.
Described temperature sensor is SMD sensor.
This concrete enforcement structure is simple, can dispel the heat rapidly, and radiating mode that can be different according to thermal creep stress, with strong points.
The above is only preferred implementation of the present utility model; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection domain of the present utility model.

Claims (3)

1. there is the cloud computer mainboard of heat sinking function, it is characterized in that, comprise cloud computer mainboard (1), radiating fin horse (2), radiating fin (3), cooling coil (4) and water at low temperature circulating device (5), cloud computer mainboard (1) below is provided with radiating fin horse (2), radiating fin horse (2) is provided with radiating fin (3), radiating fin (3) is wound with cooling coil (4), cooling coil (4) is connected with the water at low temperature circulating device (5) of cloud computer outside, the water delivering orifice of water at low temperature circulating device (5) is connected with the water inlet end of cooling coil (4), radiator fan (6) is had by support installing between adjacent two radiating fins (3), described cloud computer mainboard (1) lower end is provided with some temperature sensors, also comprise a controller, the input end of described controller is connected with temperature sensor, the output terminal of described controller is connected with water at low temperature circulating device (5) with radiator fan (6).
2. the cloud computer mainboard with heat sinking function according to claim 1, is characterized in that, described controller is single-chip microcomputer.
3. the cloud computer mainboard with heat sinking function according to claim 1, is characterized in that, described temperature sensor is SMD sensor.
CN201520514037.6U 2015-07-15 2015-07-15 Cloud computer motherboard with heat dissipation function Expired - Fee Related CN204925877U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520514037.6U CN204925877U (en) 2015-07-15 2015-07-15 Cloud computer motherboard with heat dissipation function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520514037.6U CN204925877U (en) 2015-07-15 2015-07-15 Cloud computer motherboard with heat dissipation function

Publications (1)

Publication Number Publication Date
CN204925877U true CN204925877U (en) 2015-12-30

Family

ID=54974987

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520514037.6U Expired - Fee Related CN204925877U (en) 2015-07-15 2015-07-15 Cloud computer motherboard with heat dissipation function

Country Status (1)

Country Link
CN (1) CN204925877U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106200838A (en) * 2016-06-26 2016-12-07 宋传东 A kind of computer control system based on Internet of Things
CN108008793A (en) * 2017-12-03 2018-05-08 长沙瑞晓知识产权服务有限公司 Cloud computer mainboard with heat sinking function

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106200838A (en) * 2016-06-26 2016-12-07 宋传东 A kind of computer control system based on Internet of Things
CN108008793A (en) * 2017-12-03 2018-05-08 长沙瑞晓知识产权服务有限公司 Cloud computer mainboard with heat sinking function

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151230

Termination date: 20160715

CF01 Termination of patent right due to non-payment of annual fee