CN204914599U - Semiconductor refrigeration formula three -dimensional inkjet printer's base structure - Google Patents

Abstract

Semiconductor refrigeration formula three -dimensional inkjet printer's base structure, including semiconductor cooler and Y axle frame, Y axle frame rear side is equipped with Y axis stepper motor, and Y axle frame is improved level and is equipped with Y spindle guide rail, and it is equipped with the processing platform to slide on the Y spindle guide rail, and Y axis stepper motor passes through Y axle synchronous belt drive mechanism and is connected processing platform left and right sides fixedly connected with Z axle frame with processing platform bottom transmission, semiconductor cooler is fixed to be established at Z axle frame lateral part. The utility model relates to a novelty, compact structure, transmission stability are high, in time cool off the hot -melt material who extrudes, and warping can not appear in the product that prints, and the printing precision improves greatly.

Description

The understructure of semiconductor refrigeration type three-dimensional printer

Technical field

The utility model belongs to three-dimensionally shaped technical field, particularly relates to a kind of understructure of semiconductor refrigeration type three-dimensional printer.

Background technology

Three-dimensional printing technology, design a model as source with Computerized three-dimensional, discrete and the numerical control molding system by software hierarchy, utilize the mode such as laser beam, hot melt nozzle successively to be piled up by the special materials such as metal dust, ceramic powders, plastics, cell tissue to cohere, final superposition is shaping, produces entity products.3D solid is become several two dimensional surfaces by 3 D-printing, producing, greatly reducing the complexity of manufacture by also successively superposing material processed.This Digitized manufacturing pattern directly just can generate the part of any shape from computer graphics data.Fusion sediment moulding (FDM) technology is a mainstream technology in three-dimensional printing technology, and FDM technology is that cad model is divided into cross section very thin from level to level, generates the two-dimensional geometry information controlling 3 D-printing machine nozzle motion track.The heating head of three-dimensional printer is heated to critical condition heat-fusible materials (ABS resin, nylon, wax etc.), present quasi-fluid properties, under the control of the computer, along the two-dimensional geometry information movement track that CAD determines, the material of half flow regime squeezes out by extruder head, solidifies the thin layer forming contour shape.After one deck, fallen by vertical lift system and newly form layer, be cured.Pile up bonding so layer by layer, form the 3D solid of this model from bottom to top.

One of key issue of the three-dimensional printer of application FDM technology is formed precision problem, affects a lot of because have of formed precision, the problem etc. comprising frame strength, transmission stability and cool heat-fusible materials.Frame strength deficiency can cause printer to occur the change of fitted position in the course of the work, impacts formed precision; Intensity deficiency also can cause transmission stability not high, and vibrations appear in printhead walking process mid frame, and printing precision is reduced; Heat-fusible materials cools too slow after extruder head is extruded, and there will be heat-fusible materials and is naturally elongated by gravity, causes the model printed to occur the problem of being out of shape.So, for improving printing precision, needing badly and existing three-dimensional printer is improved.

Utility model content

The utility model, in order to solve weak point of the prior art, provides that a kind of compact conformation, intensity are high, transmission stability good, shortening heat melt material cool time, promotes the understructure of the semiconductor refrigeration type three-dimensional printer of printing precision.

For solving the problems of the technologies described above, the utility model adopts following technical scheme: the understructure of semiconductor refrigeration type three-dimensional printer, it is characterized in that: comprise semiconductor cooler and Y-axis framework, y-axis stepper motor is provided with on rear side of Y-axis framework, on Y-axis framework, level is provided with Y-axis guide rail, Y-axis slide on rails is provided with processing platform, y-axis stepper motor is connected with processing platform bottom driving by Y-axis synchronous belt drive mechanism, the processing platform left and right sides is fixedly connected with Z axis framework, and semiconductor cooler is fixedly located at Z axis framework lower end sidepiece;

Semiconductor cooler comprises turbofan, housing and semiconductor chilling plate, housing is fixedly connected with Z axis framework, semiconductor chilling plate is located in housing, the chill surface of semiconductor chilling plate is connected with the fin being positioned at housing, the face that heats of semiconductor chilling plate is connected with the outer fin stretching out housing, the radiator fan that external fin carries out dispelling the heat is provided with outside housing, the side of housing is connected with the air outlet of turbofan, the opposite side of housing is connected with wind scooper, and the outlet of wind scooper is connected with cooling jet by cool air hose.

Adopt technique scheme, semiconductor refrigeration type three-dimensional printer also comprises following technical characteristic: Z axis base of frame is provided with Z axis stepper motor, Z axis framework is provided with Z axis guide rail, Z axis slide on rails is provided with X-axis framework, Z axis stepper motor is in transmission connection by ball screw assembly, and X-axis framework, X-axis framework one end is provided with X-axis stepper motor, X-axis framework is provided with X-axis guide rail, X-axis slide on rails is provided with three-dimensional material and extrudes assembly, and X-axis stepper motor is extruded assembly by X-axis synchronous belt drive mechanism and three-dimensional material and is in transmission connection;

Three-dimensional material is extruded assembly and is comprised the slide block sliding and be located on X-axis guide rail, and slide block is provided with extruder, and the discharging opening of extruder lower end is connected with extruding pipe, and extruding pipe is provided with heater, and extruding pipe lower end is connected with extruder head; Cooling jet in the utility model is located at slider bottom by connecting plate, and the air outlet of cooling jet is towards the outlet of extruder head.

All be slidably connected by sliding bearing between processing platform and Y-axis guide rail, between X-axis framework and Z axis guide rail, between slide block and X-axis guide rail.

The above technical scheme of semiconductor refrigeration type three-dimensional printer has following beneficial effect:

1, X axis, Y-axis and Z-axis direction all adopt driving stepper motor, and adopt ball screw assembly, or synchronous belt drive mechanism as transmission mechanism, and accurate sliding bearing is all adopted at the place of being slidably connected, steadily mobile, mobile accuracy is high, thus raising three-dimensional material extrudes the stability of assembly and the precision of movement.

2, the cold air that the chill surface of semiconductor chilling plate produces is spread by interior fin, brushing through turbofan, cold air sprays to the exit of extruder head successively by wind scooper, cool air hose and cooling jet, the material of half flow regime squeezes out by extruder head, brute force through cold wind cools, and quick solidification forms the thin layer of contour shape.So just avoid cool time long, the situation causing heat molten type material to produce distortion due to self gravitation effect occurs.The heat that the face that heats of semiconductor chilling plate produces is through the heat radiation of outer fin and brushing through radiator fan, and radiating effect strengthens greatly.

In sum, semiconductor refrigeration type three-dimensional printer modern design, compact conformation, transmission stability are high, cool in time the heat-fusible materials extruded, and the product printed there will not be distortion, and printing precision improves greatly.

Accompanying drawing explanation

Fig. 1 is the perspective view of semiconductor refrigeration type three-dimensional printer;

Fig. 2 is the enlarged drawing of semiconductor cooler in Fig. 1;

Fig. 3 is the enlarged drawing that in Fig. 1, three-dimensional material extrudes assembly place.

Detailed description of the invention

As shown in Figure 1-Figure 3, semiconductor refrigeration type three-dimensional printer, comprise semiconductor cooler 1 and Y-axis framework 2, y-axis stepper motor 3 is provided with on rear side of Y-axis framework 2, on Y-axis framework 2, level is provided with Y-axis guide rail 4, Y-axis guide rail 4 slides and is provided with processing platform 5, y-axis stepper motor 3 is connected with processing platform 5 bottom driving by Y-axis synchronous belt drive mechanism 6, processing platform 5 left and right sides is fixedly connected with Z axis framework 7, Z axis stepper motor 8 is provided with bottom Z axis framework 7, Z axis framework 7 is provided with Z axis guide rail 9, Z axis guide rail 9 slides and is provided with X-axis framework 10, Z axis stepper motor 8 is in transmission connection by ball screw assembly, 11 and X-axis framework 10, X-axis framework 10 one end is provided with X-axis stepper motor 12, X-axis framework 10 is provided with X-axis guide rail 13, on X-axis guide rail 13, slip is provided with three-dimensional material and extrudes assembly 14, X-axis stepper motor 12 is extruded assembly 14 by X-axis synchronous belt drive mechanism 15 and three-dimensional material and is in transmission connection, semiconductor cooler 1 is fixedly located at Z axis framework 7 lower end sidepiece.

Three-dimensional material is extruded assembly 14 and is comprised the slide block 16 sliding and be located on X-axis guide rail 13, and slide block 16 is provided with extruder 17, and the discharging opening of extruder 17 lower end is connected with extruding pipe 18, and extruding pipe 18 is provided with heater 19, and extruding pipe 18 lower end is connected with extruder head 30.

Semiconductor cooler 1 comprises turbofan 20, housing 21 and semiconductor chilling plate 22, semiconductor chilling plate 22 is located in housing 21, the chill surface of semiconductor chilling plate 22 is connected with the fin 23 being positioned at housing 21, the face that heats of semiconductor chilling plate 22 is connected with the outer fin 24 stretching out housing 21, the radiator fan 25 that external fin 24 carries out dispelling the heat is provided with outside housing 21, the side of housing 21 is connected with the air outlet of turbofan 20, the opposite side of housing 21 is connected with wind scooper 26, the outlet of wind scooper 26 is connected with cooling jet 27 by cool air hose 31, cooling jet 27 is located at bottom slide block 16 by connecting plate 28, the air outlet of cooling jet 27 is towards the outlet of extruder head 30.

All be slidably connected by sliding bearing 29 between processing platform 5 and Y-axis guide rail 4, between X-axis framework 10 and Z axis guide rail 9, between slide block 16 and X-axis guide rail 13.

X axis, Y-axis and Z-axis direction all adopt driving stepper motor, and adopt ball screw assembly, 11 or synchronous belt drive mechanism as transmission mechanism, and accurate sliding bearing 29 is all adopted at the place of being slidably connected, steadily mobile, mobile accuracy is high, thus raising three-dimensional material extrudes the stability of assembly 14 and the precision of movement.

The cold air that the chill surface of semiconductor chilling plate 22 produces is spread by interior fin 23, through brushing of turbofan 20, cold air sprays to the exit of extruder head 30 successively by wind scooper 26, cool air hose 31 and cooling jet 27, the material of half flow regime squeezes out by extruder head 30, brute force through cold wind cools, and quick solidification forms the thin layer of contour shape.So just avoid cool time long, the situation causing heat molten type material to produce distortion due to self gravitation effect occurs.The heat that the face that heats of semiconductor chilling plate 22 produces is through the heat radiation of outer fin 24 and brushing through radiator fan 25, and radiating effect strengthens greatly.

The present embodiment not does any pro forma restriction to shape of the present utility model, material, structure etc.; every above embodiment is done according to technical spirit of the present utility model any simple modification, equivalent variations and modification, all belong to the protection domain of technical solutions of the utility model.

Claims (1)

1. the understructure of semiconductor refrigeration type three-dimensional printer, it is characterized in that: comprise semiconductor cooler and Y-axis framework, y-axis stepper motor is provided with on rear side of Y-axis framework, on Y-axis framework, level is provided with Y-axis guide rail, Y-axis slide on rails is provided with processing platform, y-axis stepper motor is connected with processing platform bottom driving by Y-axis synchronous belt drive mechanism, and the processing platform left and right sides is fixedly connected with Z axis framework; Semiconductor cooler is fixedly located at Z axis framework lower end sidepiece;

Semiconductor cooler comprises turbofan, housing and semiconductor chilling plate, housing is fixedly connected with Z axis framework, semiconductor chilling plate is located in housing, the chill surface of semiconductor chilling plate is connected with the fin being positioned at housing, the face that heats of semiconductor chilling plate is connected with the outer fin stretching out housing, the radiator fan that external fin carries out dispelling the heat is provided with outside housing, the side of housing is connected with the air outlet of turbofan, the opposite side of housing is connected with wind scooper, and the outlet of wind scooper is connected with cooling jet by cool air hose.