CN204911618U - Mill roller - Google Patents

Mill roller Download PDF

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Publication number
CN204911618U
CN204911618U CN201520424749.9U CN201520424749U CN204911618U CN 204911618 U CN204911618 U CN 204911618U CN 201520424749 U CN201520424749 U CN 201520424749U CN 204911618 U CN204911618 U CN 204911618U
Authority
CN
China
Prior art keywords
heat
roll shaft
roller
semiconductor
grinding roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520424749.9U
Other languages
Chinese (zh)
Inventor
赵瑞芬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhangjiagang Pufeite Building Material Co Ltd
Original Assignee
Zhangjiagang Pufeite Building Material Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhangjiagang Pufeite Building Material Co Ltd filed Critical Zhangjiagang Pufeite Building Material Co Ltd
Priority to CN201520424749.9U priority Critical patent/CN204911618U/en
Application granted granted Critical
Publication of CN204911618U publication Critical patent/CN204911618U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model provides a mill roller, including this somatic part and the heat dissipation roller that sets up along this somatic part axial, being provided with the accommodation space between this somatic part and the heat dissipation roller, be provided with at least one semiconductor radiating block in the accommodation space, the cold junction and the heat conduction of this somatic part of semiconductor radiating block are connected, and the hot junction and the heat conduction of heat dissipation roller of semiconductor radiating block are connected. So, mill roller is at the during operation, through the refrigeration effect of semiconductor radiating block cold junction, the heat that produces when the function of this somatic part of neutralization effectively, and dispel the heat through the heat dissipation roller in the hot junction of semiconductor radiating block, be equivalent to indirect heat conduction with this somatic part of mill roller to the roller that dispels the heat on, its radiating effect is good, simple structure, the heat influence of avoiding mill roller to produce at the during operation mill efficiency and material quality.

Description

Grinding roller
Technical field
The utility model belongs to Machining Technology field, particularly relates to a kind of grinding roller.
Background technology
The operation principle of grinding roller is by arranging the cylindrical grinding roller relatively rotated horizontally, at a high speed for a pair, applying the load such as extruding, shearing, friction, thus reach the object of pulverizing to the material entering working region between two rollers.For the milling system of some high speed, between the grinding roller run up and material, a large amount of heats can be produced, form air-flow, thus cause the at random of fine material, affect grinding efficiency.In addition, the too high meeting of roll temperature causes materials quality proterties to change.
Be badly in need of a kind of new grinding roller, to solve the problem.
Utility model content
The purpose of this utility model is to provide a kind of grinding roller, and the heat operationally produced for solving grinding roller in prior art can affect the problem of grinding efficiency and materials quality.
For realizing above-mentioned utility model object, the utility model provides a kind of grinding roller, comprising:
Body and the heat radiation roll shaft axially arranged along described body, accommodation space is provided with between described body and described heat radiation roll shaft, at least one semiconductor heat-dissipating block is provided with in described accommodation space, the cold junction of described semiconductor heat-dissipating block is connected with described body heat conduction, and the hot junction of described semiconductor heat-dissipating block is connected with the heat conduction of described heat radiation roll shaft.
As further improvement of the utility model, in described heat radiation roll shaft, be provided with carbon nano-particle.
As further improvement of the utility model, the quantity of described semiconductor heat-dissipating block is set to two.
As further improvement of the utility model, described two semiconductor heat-dissipating blocks are divided into the both sides of described roll shaft.
As further improvement of the utility model, the diameter of described heat radiation roll shaft equals 1/3rd of described body diameter.
Compared with prior art, the beneficial effects of the utility model are: the grinding roller that the utility model provides, by the heat radiation roll shaft arranging body and axially arrange along body, accommodation space is provided with between body and heat radiation roll shaft, at least one semiconductor heat-dissipating block is provided with in accommodation space, the cold junction of this semiconductor heat-dissipating block is connected with body heat conduction, hot junction is connected with the heat conduction of heat radiation roll shaft, so, grinding roller operationally, by the refrigeration of semiconductor heat-dissipating block cold junction, can effectively in and body operate time produce heat, and dispelled the heat by heat radiation roll shaft in the hot junction of semiconductor heat-dissipating block, be equivalent to indirectly by the heat conduction of grinding roller body extremely heat radiation roll shaft, its good heat dissipation effect, structure is simple, the heat effects grinding efficiency avoiding grinding roller operationally to produce and materials quality.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model grinding roller one detailed description of the invention.
Detailed description of the invention
Below in conjunction with each embodiment shown in the drawings, the utility model is described in detail; but should be noted that; these embodiments are not limitation of the utility model; those of ordinary skill in the art are according to these embodiment institute work energy, method or structural equivalent transformations or substitute, and all belong within protection domain of the present utility model.
Ginseng Fig. 1, introduces a detailed description of the invention of the utility model grinding roller 100.In the present embodiment, this grinding roller 100 comprises body 11, heat radiation roll shaft 12 and semiconductor heat-dissipating block 14.
Heat radiation roll shaft 12 is axially arranged along body 11.In the present embodiment, be provided with accommodation space 13 between this body 11 and heat radiation roll shaft 12, semiconductor heat-dissipating block 14 is arranged in this accommodation space 13.
Semiconductor heat-dissipating block 14 is one application of semiconductor refrigerating technology.Semiconductor refrigerating is also known as electronic cooling, or thermoelectric cooling, of growing up from the fifties between the subject at Refrigeration Technique and semiconductor technology edge, the P-N junction that it utilizes extraordinary semi-conducting material to form, form thermocouple pair, produce Peltier effect, namely by a kind of New Refrigerating method that direct current freezes, be called the large refrigeration modes in the world three with compression-type refrigeration and absorption refrigeration.
In the present embodiment, the cold junction 141 of semiconductor heat-dissipating block 14 is connected with body 11 heat conduction, and the hot junction 142 of semiconductor heat-dissipating block 14 is connected with the heat conduction of heat radiation roll shaft 12.So, grinding roller 100 operationally, by the refrigeration of semiconductor heat-dissipating block 14 cold junction 141, can effectively in and body 11 operate time produce heat, and dispelled the heat by heat radiation roll shaft 12 in the hot junction 142 of semiconductor heat-dissipating block 14, be equivalent to indirectly by the heat conduction of grinding roller 100 body 11 extremely heat radiation roll shaft 12.
One preferred embodiment in, be provided with carbon nano-particle in heat radiation roll shaft 12, for strengthening the radiating effect of roll shaft 12 of dispelling the heat.
One preferred embodiment in, the quantity of semiconductor heat-dissipating block 14 is set to two, and these two semiconductor heat-dissipating blocks 14 are divided into the both sides of roll shaft.Certainly, be understandable that, in the embodiment replaced, the quantity of semiconductor heat-dissipating block 14 can also be set to more.
One preferred embodiment in, heat radiation roll shaft 12 diameter equal 1/3rd of body 11 diameter.
The grinding roller that the utility model provides, by the heat radiation roll shaft arranging body and axially arrange along body, accommodation space is provided with between body and heat radiation roll shaft, at least one semiconductor heat-dissipating block is provided with in accommodation space, the cold junction of this semiconductor heat-dissipating block is connected with body heat conduction, hot junction is connected with the heat conduction of heat radiation roll shaft, so, grinding roller operationally, by the refrigeration of semiconductor heat-dissipating block cold junction, can effectively in and body operate time produce heat, and dispelled the heat by heat radiation roll shaft in the hot junction of semiconductor heat-dissipating block, be equivalent to indirectly by the heat conduction of grinding roller body extremely heat radiation roll shaft, its good heat dissipation effect, structure is simple, the heat effects grinding efficiency avoiding grinding roller operationally to produce and materials quality.
To those skilled in the art, obvious the utility model is not limited to the details of above-mentioned one exemplary embodiment, and when not deviating from spirit of the present utility model or essential characteristic, can realize the utility model in other specific forms.Therefore, no matter from which point, all should embodiment be regarded as exemplary, and be nonrestrictive, scope of the present utility model is limited by claims instead of above-mentioned explanation, and all changes be therefore intended in the implication of the equivalency by dropping on claim and scope are included in the utility model.Any Reference numeral in claim should be considered as the claim involved by limiting.
In addition, be to be understood that, although this description is described according to embodiment, but not each embodiment only comprises an independently technical scheme, this narrating mode of description is only for clarity sake, those skilled in the art should by description integrally, and the technical scheme in each embodiment also through appropriately combined, can form other embodiments that it will be appreciated by those skilled in the art that.

Claims (5)

1. a grinding roller, it is characterized in that, the heat radiation roll shaft comprising body and axially arrange along described body, accommodation space is provided with between described body and described heat radiation roll shaft, at least one semiconductor heat-dissipating block is provided with in described accommodation space, the cold junction of described semiconductor heat-dissipating block is connected with described body heat conduction, and the hot junction of described semiconductor heat-dissipating block is connected with the heat conduction of described heat radiation roll shaft.
2. grinding roller according to claim 1, is characterized in that, is provided with carbon nano-particle in described heat radiation roll shaft.
3. grinding roller according to claim 1, is characterized in that, the quantity of described semiconductor heat-dissipating block is set to two.
4. grinding roller according to claim 3, is characterized in that, described two semiconductor heat-dissipating blocks are divided into the both sides of described roll shaft.
5. grinding roller according to claim 1, is characterized in that, the diameter of described heat radiation roll shaft equals 1/3rd of described body diameter.
CN201520424749.9U 2015-06-18 2015-06-18 Mill roller Expired - Fee Related CN204911618U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520424749.9U CN204911618U (en) 2015-06-18 2015-06-18 Mill roller

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520424749.9U CN204911618U (en) 2015-06-18 2015-06-18 Mill roller

Publications (1)

Publication Number Publication Date
CN204911618U true CN204911618U (en) 2015-12-30

Family

ID=54960803

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520424749.9U Expired - Fee Related CN204911618U (en) 2015-06-18 2015-06-18 Mill roller

Country Status (1)

Country Link
CN (1) CN204911618U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105583064A (en) * 2016-03-02 2016-05-18 李娟� Temperature control device of mineral crushing equipment
CN107187165A (en) * 2017-06-29 2017-09-22 苏州亨达尔工业材料有限公司 Plastic plate laminating machine

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105583064A (en) * 2016-03-02 2016-05-18 李娟� Temperature control device of mineral crushing equipment
CN105583064B (en) * 2016-03-02 2018-09-07 灵武市伟畅机械科技有限公司 Temperature control equipment in mineral break process equipment
CN107187165A (en) * 2017-06-29 2017-09-22 苏州亨达尔工业材料有限公司 Plastic plate laminating machine

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151230

Termination date: 20160618