CN204906864U

CN204906864U - Pcb coil

Info

Publication number: CN204906864U
Application number: CN201520706729.0U
Authority: CN
Inventors: 马抗震; 刘欣轮; 哈鸣; 顾中山
Original assignee: Union Electronics (china) Co Ltd
Current assignee: Union Electronics (china) Co Ltd
Priority date: 2015-09-11
Filing date: 2015-09-11
Publication date: 2015-12-23
Anticipated expiration: 2025-09-11

Abstract

The utility model provides a PCB coil, PCB coil is superimposed PCB board and the insulating layer of centre gripping between two -layer adjacent PCB board in at least two -layer vertical orientation, the upper and lower surface of PCB board all is formed with and is circular -arc ARC segments, all be provided with on each layer PCB board and the insulating layer one run through about the surface the conductive through hole so that ARC segments homogeneous phase lap on every layer of PCB board connect and form current path, and the conductive through hole staggers in vertical orientation each other. This PCB coil compares common coil, and every layer of equal etching of electrically conductive ARC segments forms, and the reliability is higher to the accessible heavy current is not burnt out or is punctured.

Description

PCB coil

Technical field

The utility model provides a kind of PCB coil, particularly a kind of PCB coil by big current.

Background technology

Traditional coil be generally enamelled wire is wound on the iron core of rigidity, non magnetic skeleton or flexibility flexible pipe on form.General when coiling, can by being repeatedly wound around multilayer enamelled wire back and forth to increase the number of turn of coil on skeleton.

But this coil is difficult to by big current, when by big current, easily breakdown or damage.

Therefore a kind of PCB coil by big current must be designed.

Utility model content

The utility model, for prior art Problems existing, its object is to provide a kind of PCB coil by big current.

For achieving the above object, the utility model provides a kind of PCB coil, and described PCB coil comprises the pcb board that at least two-layer vertical direction superposes and the insulating barrier be held between two-layer adjacent pcb board; The upper and lower surface of described pcb board is all formed with the arc in arc-shaped, every one deck pcb board and insulating barrier are provided with a conductive through hole running through upper and lower surface and overlap formation current path mutually to make the arc on every layer of pcb board, and described conductive through hole in the vertical direction staggers mutually.

As further improvement of the utility model, described arc is provided with the first end of electric current inflow and the second end of outflow of bus current, in the arc of adjacent two layers, the second end being positioned at the arc on upper strata all overlaps to make described PCB coil form the path conducted electricity by conductive through hole with the first end of the arc being positioned at lower floor mutually.

As further improvement of the utility model, shape and the size of the described arc on every layer of pcb board are all consistent.

As further improvement of the utility model, described PCB coil also comprises the upper substrate of the insulation being arranged at the superiors' pcb board upper end and is arranged at the infrabasal plate of insulation of orlop pcb board lower end.

As further improvement of the utility model, described upper substrate is fixedly installed the first sheet metal, described first sheet metal is arranged through the upper and lower surface of described upper substrate, and described first sheet metal overlaps mutually with the first end of adjacent described arc.

As further improvement of the utility model, described upper substrate is fixedly installed the second sheet metal, described second sheet metal is arranged through the upper and lower surface of described upper substrate.

As further improvement of the utility model, described PCB coil is provided with a wire vertically extended, one end of described wire overlaps mutually with the second end of undermost described arc, and the other end of described wire extends to upper substrate and mutually overlaps with described second sheet metal.

As further improvement of the utility model, the inner surface of described conductive through hole is coated with metal conducting layer.

As further improvement of the utility model, described arc is the ellipse being provided with a fracture.

As further improvement of the utility model, at least one deck pcb board or insulating barrier are provided with the spatial accommodation running through upper and lower surface.

The beneficial effects of the utility model: this PCB coil compares common coil, the arc of every layer of conduction all etches formation, and reliability is higher, and is not burned by big current or punctures.The two-sided of pcb board is provided with arc in addition, and the utilance of pcb board is higher.Finally, conductive through hole in the vertical direction staggers mutually, technique is more prone to realize.

Accompanying drawing explanation

Fig. 1 is the perspective view of the utility model PCB coil;

Fig. 2 is the perspective view of the utility model PCB coil part-structure;

Fig. 3 is the cross-sectional view along A-A` line in Fig. 1.

Embodiment

Below with reference to each execution mode shown in the drawings, the utility model is described in detail.But these execution modes do not limit the utility model, the structure that those of ordinary skill in the art makes according to these execution modes or conversion functionally are all included in protection range of the present utility model.

The utility model provides a kind of PCB coil 100, and described PCB coil 100 is for fields such as Set Top Box, notebook computer, smart mobile phone, automobiles.

Described PCB coil 100 comprise at least two-layer vertical direction superposes pcb board 1, be held on insulating barrier 2 between two-layer adjacent pcb board 1, be arranged at the upper substrate 3 of the superiors' pcb board 1 upper end, be arranged at the infrabasal plate 4 of orlop pcb board 1 lower end and vertically extend the wire 5 connecting upper substrate 3 and infrabasal plate 4.Described upper substrate 3, infrabasal plate 4 are insulator.

Described pcb board 1 upper and lower surface is all coated with metal level, and in the present embodiment, described pcb board 1 upper and lower surface is all coated with copper film, certainly, according to the demand of different conductivity, can be coated with other metal levels on pcb board 1.Then, cover dry film in the upper and lower surface of pcb board 1, make the lines in arc-shaped by the flow process of exposure, development, then by etching liquid, etch away pcb board 1 there is no the excess metal in the part of lines.Like this, the upper and lower surface of described pcb board 1 is all formed with the arc 11 of conduction.

Described arc 11 is provided with the first end 111 of electric current inflow and the second end 112 of outflow of bus current.The shape of the arc 11 on every one deck pcb board 1 and size are all consistent, but the first end 111 of every one deck arc 11 and the position of the second end 112 all not identical.In the present embodiment, described arc 11 all in the ellipticity with a fracture, certainly, if described arc 11 also can reach the purpose of this utility model in other shapes.

Described pcb board 1 and insulating barrier 2 are provided with a conductive through hole 12 running through upper and lower surface mutually overlap to make the arc 11 of every layer of pcb board about 1.Described conductive through hole 12 is formed by laser, and plates metal conducting layer at the inner surface of conductive through hole 12, so far, can make pcb board 1 and the conducting of insulating barrier 2 upper and lower surface.In the arc 11 of adjacent two layers, the second end 112 being positioned at the arc 11 on upper strata is all positioned at same straight line with first end 111 in the vertical direction of the arc 11 being positioned at lower floor, and mutually overlapped by conductive through hole 12 between the two, with the path making described PCB coil 100 form conduction.Described conductive through hole 12 in the vertical direction staggers mutually, not on same vertical straight line.

Therefore, the second end 112 of the arc 11 of described pcb board 1 upper surface, by the conductive through hole 12 on pcb board 1, is connected with the first end 111 of the arc 11 of pcb board 1 lower surface; Accordingly, the second end 112 of the arc 11 of this pcb board 1 lower surface, again by the conductive through hole 12 on the insulating barrier 2 on the downside of this pcb board 1, is connected with the first end 111 of the arc 11 of the upper surface of the pcb board 1 on the downside of this insulating barrier 2.Therefore, by the stacked in multi-layers of pcb board 1 and insulating barrier 2, the PCB coil 100 by electric current is formed.

In addition, at least pcb board 1 described in one deck or insulating barrier 2 are provided with the spatial accommodation 13 running through upper and lower surface.Described spatial accommodation 13 is formed at removing on described pcb board 1 or insulating barrier 2 and is provided with the part of arc 11, namely, pcb board 1 described in every one deck is formed with arc 11, and, at least on one deck pcb board 1 or insulating barrier 2, in the corresponding part being provided with arc 11 of removing, be formed with spatial accommodation 13.Due to, in the present embodiment, every one deck arc 11 all in the vertical direction is corresponding, and therefore, the spatial accommodation 13 on every one deck pcb board 1 or insulating barrier 2 is also through mutually.In the present embodiment, because described arc 11 is in ellipticity, therefore, described spatial accommodation 13 is formed at described elliptoid inside and space outerpace.

Described spatial accommodation 13 can in order to hold various different magnetic material, thus described PCB coil can form the components and parts product of difference in functionality, as filter etc.

Described upper substrate 3 and infrabasal plate 4 are in order to by pcb board 1 described above and insulating barrier 2 pressing.Described upper substrate 3 is fixedly installed the first sheet metal 31 and the second sheet metal 32, described first sheet metal 31 and the second sheet metal 32 are all arranged through the upper and lower surface of described upper substrate 3.Described first sheet metal 31 overlaps with first end 111 phase of the arc 11 of described pcb board 1 upper surface of the superiors.One end of described wire 5 overlaps with described second sheet metal 32 phase, and the other end of described wire 5 overlaps with the second end 112 phase of the arc 11 of undermost pcb board 1 lower surface.Therefore, the current entry of whole PCB coil 100 is the first sheet metal 31, and the electricity outlet of whole PCB coil 100 is the second sheet metal 32.Further, described first sheet metal 31, second sheet metal 32 and wire 5 are not all connected with other arc 11, prevent short circuit.

The production method of this PCB coil 100 is as follows: first, and the position of the shape and first end 111, second end 112 and conductive through hole 12 that design arc 11 on every one deck pcb board 1 also has the position of conductive through hole 12 on insulating barrier 2; Then, the upper and lower surface of pcb board 1 is etched arc 11; Then, the relevant position laser on pcb board 1 and insulating barrier 2 is got through and is formed conductive through hole 12, and builds in conductive through hole 12 inside and plate metal conducting layer; Then, the levels of pcb board 1 and insulating barrier 2 is run through formation spatial accommodation 13; Finally, wire 5 is connected, and by upper substrate 3 and infrabasal plate 4 pressing, form this PCB coil 100.In this PCB coil 100, the diameter of the thickness size of pcb board 1, the size of coil and conductive through hole 12, all can adjust according to the needs of user.

Therefore, this PCB coil 100 compares common coil, and the arc 11 of every layer of conduction all etches formation, and reliability is higher, and is not burned by big current or punctures.The two-sided of pcb board 1 is provided with arc 11 in addition, and the utilance of pcb board 1 is higher.Finally, conductive through hole 12 in the vertical direction staggers mutually, technique is more prone to realize.

Be to be understood that, although this specification is described according to execution mode, but not each execution mode only comprises an independently technical scheme, this narrating mode of specification is only for clarity sake, those skilled in the art should by specification integrally, technical scheme in each execution mode also through appropriately combined, can form other execution modes that it will be appreciated by those skilled in the art that.

A series of detailed description listed is above only illustrating for feasibility execution mode of the present utility model; they are also not used to limit protection range of the present utility model, all do not depart from the utility model skill equivalent implementations of doing of spirit or change all should be included within protection range of the present utility model.

Claims

1. a PCB coil, is characterized in that: described PCB coil comprises the pcb board that at least two-layer vertical direction superposes and the insulating barrier be held between two-layer adjacent pcb board; The upper and lower surface of described pcb board is all formed with the arc in arc-shaped, every one deck pcb board and insulating barrier are provided with a conductive through hole running through upper and lower surface and overlap formation current path mutually to make the arc on every layer of pcb board, and described conductive through hole in the vertical direction staggers mutually.

2. PCB coil according to claim 1, it is characterized in that: described arc is provided with the first end of electric current inflow and the second end of outflow of bus current, in the arc of adjacent two layers, the second end being positioned at the arc on upper strata all overlaps to make described PCB coil form the path conducted electricity by conductive through hole with the first end of the arc being positioned at lower floor mutually.

3. PCB coil according to claim 1, is characterized in that: shape and the size of the described arc on every layer of pcb board are all consistent.

4. PCB coil according to claim 2, is characterized in that: described PCB coil also comprises the upper substrate of the insulation being arranged at the superiors' pcb board upper end and is arranged at the infrabasal plate of insulation of orlop pcb board lower end.

5. PCB coil according to claim 4, it is characterized in that: described upper substrate is fixedly installed the first sheet metal, described first sheet metal is arranged through the upper and lower surface of described upper substrate, and described first sheet metal overlaps mutually with the first end of adjacent described arc.

6. PCB coil according to claim 5, is characterized in that: described upper substrate is fixedly installed the second sheet metal, and described second sheet metal is arranged through the upper and lower surface of described upper substrate.

7. PCB coil according to claim 6, it is characterized in that: described PCB coil is provided with a wire vertically extended, one end of described wire overlaps mutually with the second end of undermost described arc, and the other end of described wire extends to upper substrate and mutually overlaps with described second sheet metal.

8. PCB coil according to claim 1, is characterized in that: the inner surface of described conductive through hole is coated with metal conducting layer.

9. PCB coil according to claim 3, is characterized in that: described arc is the ellipse being provided with a fracture.

10. PCB coil according to claim 1, is characterized in that: at least one deck pcb board or insulating barrier are provided with the spatial accommodation running through upper and lower surface.