CN204885663U - Electric connector and clamping device - Google Patents

Abstract

The utility model discloses an electric connector and clamping device, wherein electric connector is used for electric connection chip module, and it is regional outside all around in the contact that chip module's bottom surface is equipped with the regional and marginal zone bit in a contact, and regional range the in contact has a plurality of contacts, include: an insulator, a plurality of terminals are acceptd in insulator for with contact electric connection, a clamping device for taking and carrying chip module a to insulator, clamping device is equipped with a plurality of trips, forms an at least arch from terminal extension of each trip, and the trip is held in the fringe region with protruding the knot, gap extending between regional two the adjacent contacts of outlying in bellied length orientation contact, and bellied width is lighter than the width in clearance. The utility model discloses electric connector and clamping device can make chip module firmly be positioned clamping device and not harm chip module again.

Description

Electric connector and clamping device

Technical field

The utility model relates to a kind of electric connector and clamping device, refers in particular to a kind ofly to be electrically connected the electric connector of chip module and the clamping device for fixed chip module.

Background technology

Along with the development of chip module high performance, requirement for chip module transmission rate and processing speed aspect is more and more higher, therefore the number of contacts on chip module bottom surface is in continuous increase, therefore the area that contact region accounts for chip module bottom surface is increasing, make the white space of chip module bottom surface outside contact region surrounding more and more less.

Application number is disclose a kind of electric connector in the Chinese patent of 201220137219.2, it is for being electrically connected chip module, comprise insulating body, the terminal be housed in insulating body, cover the lid that is located at above insulating body and to be assembled on lid and holding unit between lid and insulating body, wherein said holding unit comprises framework, the middle opening surrounded by framework and from the extended jaw of framework downwards, is fixed in holding unit by chip module by making jaw be held on the bottom surface of chip module.

In order to prevent jaw scratch contact, keep that there is between jaw and contact certain distance, therefore jaw is held on the described white space of the bottom surface of chip module usually, because described white space is very little, therefore the area that jaw is held on chip module bottom surface is very little, thus causing chucking power not enough, chip module easily comes off.

Therefore, be necessary to design a kind of new electric connector, to overcome the problems referred to above.

Summary of the invention

Creation object of the present utility model is to provide a kind of chip module can be made to be securely in place electric connector and clamping device that clamping device does not damage again chip module.

In order to achieve the above object, the utility model adopts following technical scheme:

The utility model provides a kind of electric connector, for being electrically connected chip module, the bottom surface of described chip module is provided with a contact region and a fringe region is positioned at outside described contact region surrounding, and described contact region is arranged with multiple contact, comprising: an insulating body; Multiple terminal, is contained in described insulating body, for being electrically connected with described contact; One clamping device, for carrying described chip module to described insulating body, described clamping device is provided with multiple snap fit, at least one projection is extended to form from snap fit end described in each, described snap fit and described projection are held in described fringe region, the length of described projection towards described contact region outermost adjacent two described contacts between gap extend, the width of described projection is less than the width in described gap.

Further, the width of described snap fit is greater than the width of described projection, and extends the described projection at multiple interval from described snap fit.

Further, the dual-side that the adjacent dual-side of adjacent two described contacts is corresponding with described projection is corresponding parallel.

Further, described chip module comprises the substrate being provided with described contact and the wafer module upwards protruded out from substrate, described clamping device comprises the framework being positioned at described surface, described framework is provided with the opening passed for described wafer module, extend to form two relative ribs downwards from described framework bottom surface, extend downward few two described snap fits from rib described in each.

Further, described rib side abuts with the side of described chip module.

Further, described rib bottom supporting is on described insulating body.

Further, described insulating body has four sidewalls upwards extended and the host cavity surrounded by four described sidewalls accommodates described chip module, described sidewall is provided with the barricade upwards protruded out and is positioned at outside chip module and higher than the bottom surface of described chip module, for block chip module, described clamping device to be provided with from framework to the position point of downward-extension in the outside of described sidewall so that described clamping device is positioned described insulating body, described clamping device is provided with resigning hole and steps down described barricade, and described resigning hole is surrounded by described framework and described location division.

Further, described sidewall is convexly equipped with fool proof post, and described chip module is provided with the fool proof breach coordinated with described fool proof post, and described framework is provided with the through hole be communicated with described resigning hole, and described fool proof breach is revealed in described through hole.

Further, a corner of described substrate is provided with a fool proof mark for chip module and insulating body are carried out contraposition, described framework is provided with the groove be communicated with described resigning hole, described groove and described separated by openings, and described fool proof mark is revealed in described groove.

Further, comprise the pressing plate for suppressing chip module further, pressing plate is rotatable relative to insulating body to be covered on above described insulating body, and clamping device end face is provided with slot to make way and steps down pressing plate.

The utility model provides a kind of clamping device, for fixing a chip module, the bottom surface of described chip module is provided with a contact region and a fringe region is positioned at outside described contact region surrounding, described contact region is arranged with multiple contact, it is characterized in that, comprise: described clamping device is provided with holding part, described holding part is held in described fringe region, the head of described holding part facing to described contact region outermost adjacent two described contacts between gap.

Further, the projection that described holding part comprises snap fit and extends to form from snap fit end, the width of described projection is less than the width of described snap fit, and described projection is the head of described holding part, and described snap fit and described projection are held in described fringe region.

Further, the width of described snap fit is greater than the width of described projection, and extends the described projection at multiple interval from described snap fit.

Further, the dual-side that the adjacent dual-side of adjacent two described contacts is corresponding with described projection is corresponding parallel.

Further, described chip module comprises the substrate being provided with described contact and the wafer module upwards protruded out from substrate, described clamping device comprises the framework being positioned at described surface, described framework is provided with the opening passed for described wafer module, extend to form two relative ribs downwards from described framework bottom surface, extend downward few two described holding parts from rib described in each.

Further, described rib side abuts with the side of described chip module.

Compared with prior art, the utility model extends to form projection from snap fit end, snap fit and the protruding fringe region being held in chip module, the clasp power of clamping device to chip module can be strengthened, due to projection length towards contact region outermost adjacent two contacts between gap extend, protruding width is less than the width in described gap, makes can keep certain spacing between projection and contact, prevents scratch contact.

[accompanying drawing explanation]

Fig. 1 is the stereogram before the utility model electric connector chip module is assembled to clamping device;

Fig. 2 is the stereogram of other direction before the utility model electric connector chip module is assembled to clamping device;

Fig. 3 is the stereogram after the utility model electric connector chip module is assembled to clamping device;

Fig. 4 is the stereogram before the utility model electric connector clamping device is assembled to insulating body;

Fig. 5 is the stereogram after the utility model electric connector clamping device is assembled to insulating body;

Fig. 6 is the schematic diagram of bottom surface after the utility model electric connector chip module is assembled to clamping device;

Fig. 7 is the cutaway view of the utility model electric connector pressing plate when closing.

The drawing reference numeral of embodiment illustrates:

Chip module	1	Substrate	11	Wafer module	12	Contact	13
								Contact region	14	Fringe region	15	Fool proof breach	16	Fool proof marks	17
Insulating body	2	Terminal	7	Diapire	22	Sidewall	23
								Host cavity	24	Barricade	25	Fool proof post	26	Back-up block	27
Clamping device	3	Framework	31	Opening	32	Rib	311
								Holding part	312	Snap fit	313	Protruding	314	Projection	315
Block	316	Location division	33	Groove	331	Flat part	34
								Breach	341	Resigning hole	35	Through hole	36	Groove	37
Slot to make way	38	Fixture	4	Pressing plate	5	Rocking bar	6

[embodiment]

For ease of better understanding the purpose of this utility model, structure, feature and effect etc., existing the utility model is described in further detail with embodiment by reference to the accompanying drawings.

As Fig. 5, electric connector of the present utility model, for a chip module 1 is electrically connected to a circuit board (not shown), mainly comprises an insulating body 2, the terminal 7 be contained in insulating body 2, the fixture 4 being positioned at insulating body 2 rear, the rocking bar 6 be articulated on fixture 4, being articulated in the pressing plate 5 on rocking bar 6 and the clamping device 3 for carrying chip module 1 to insulating body 2.

As shown in Figure 1, Figure 2, Fig. 3, the wafer module 12 that described chip module 1 comprises a substrate 11 and upwards protrudes out from substrate 11, the bottom surface of substrate 11 is provided with a contact region 14 and a fringe region 15 is positioned at outside described contact region 14 surrounding, described contact region 14 close-packed arrays has multiple contact 13, the side that two of substrate 11 are relative is respectively equipped with fool proof breach 16, and one of them corner of substrate 11 is provided with leg-of-mutton fool proof mark 17.

As Fig. 4, described insulating body 2 is roughly rectangular, the sidewall 23 comprising diapire 22 and upwards extend from diapire 22.Diapire 22 and sidewall 23 enclose the host cavity 24 of formation one collecting chip module 1 jointly.Diapire 22 contains multiple terminal 7 for being electrically connected with described contact 13.The corner of described sidewall 23 is provided with the barricade 25 upwards protruded out, and described barricade 25 to be positioned at outside chip module 1 and higher than the bottom surface of described chip module 1, for block chip module 1.Described sidewall 23 is convexly equipped with fool proof post 26 towards host cavity 24, and described fool proof post 26 coordinates with described fool proof breach 16, for being correctly assembled in described host cavity 24 by chip module 1.The back-up block 27 that is connected with sidewall 23 is upwards protruded out for supporting described clamping device 3 from described diapire 22.

As Fig. 5, described fixture 4 is become by sheet metal punching, and it is positioned at the rear of described insulating body 2, and is screwed on circuit board (not shown).Described fixture 4 is articulated with a rocking bar 6, described pressing plate 5 is articulated on described rocking bar 6, and described pressing plate 5 is rotatable is covered on the top of described insulating body 2 for suppressing chip module 1.

As shown in Figure 1, Figure 2, Fig. 6, described clamping device 3 comprises the framework 31 be positioned at above described substrate 11, described framework 31 central authorities are provided with the opening 32 passed for described wafer module 12, extend to form a rib 311 downwards from the both sides that described framework 31 bottom surface is relative are each, the side of described rib 311 abuts with the side of described chip module 1.From rib described in each 311 to downward-extension two holding parts 312, described holding part 312 comprise snap fit 313 and extend to form from snap fit 313 end multiple protruding 314, the width of described snap fit 313 is greater than the described width of protruding 314 (certainly, in other embodiments, also one described protruding 314 can only be extended to form from described snap fit 313, described snap fit 313 is identical with described protruding 314 width), described snap fit 313 is held in described fringe region 15 with described protruding 314, the described length of protruding 314 towards described contact region 14 outermost adjacent two described contacts 13 between gap extend, the described width of protruding 314 is less than the width in described gap.The adjacent dual-side of adjacent two described contacts 13 is corresponding parallel with described protruding 314 corresponding dual-sides.Described rib 311 is provided with the projection 315 to downward-extension, and described projection 315 to be supported on described back-up block 27 thus to prevent clamping device 3 from excessively pressing down.From the other both sides of described framework 31 bottom surface each protrude out downwards a block 316 can block in the outside of described substrate 11, prevent described chip module 1 from rocking.

Described clamping device 3 is provided with the location division 33 from framework 31 surrounding to downward-extension, and described location division 33 is positioned at the outside of described sidewall 23 so that described clamping device 3 is positioned described insulating body 2.The location division 33 being positioned at insulating body 2 front and the left and right sides is respectively equipped with a groove 331 handled easily person and captures described clamping device 3, the rear of insulating body 2 has two and is separated the location division 33 arranged.From the bottom of described location division 33, horizontal-extending is provided with flat part 34 laterally, and when deviation appears in assembling contraposition, flat part 34 is connected to barricade 25 end face, can guarantee that location division 33 not easily enters host cavity 24, plays the effect of protection terminal 7.The flat part 34 being wherein positioned at insulating body 2 front is provided with the breach 341 of an arc, steps down to the finger of operator, handled easily.

Described clamping device 3 is provided with resigning hole 35 and steps down described barricade 25, and described resigning hole 35 is surrounded with described location division 33 by described framework 31.Described framework 31 is provided with the through hole 36 be communicated with described resigning hole 35, and described fool proof breach 16 is revealed in described through hole 36.Described framework 31 is provided with the groove 37 be communicated with described resigning hole 35, and described groove 37 separates with described opening 32, and described fool proof mark 17 is revealed in described groove 37.The left and right sides that the end face of described clamping device 3 is positioned at front is provided with slot to make way 38 for described pressing plate 5 of stepping down when pressing plate 5 is rotating closed.

Chip module 1 in use, is assembled in clamping device 3 by the utility model electric connector, is fixed on clamping device 3 by chip module 1 by the clasp of snap fit 313 and protruding 314 pairs of chip modules 1.Now, the fool proof breach 16 of chip module 1 and fool proof mark 17 correspondences and are revealed in the through hole 36 of clamping device 3 with groove 37.

Then, operator can catch the groove 331 of clamping device 3 with hand, the direction adjusting clamping device 3 is coordinated by what observe fool proof mark 17 and fool proof breach 16 and fool proof post 26, outside the sidewall 23 again location division 33 being aimed at insulating body 2, straight down clamping device 3 is assembled to insulating body 2, the contact 13 of chip module 1 contacts with terminal 7.Now, the framework 31 of clamping device 3 is positioned at above host cavity 24, and 33, location division correspondence is positioned at outside insulating body 2.

Then, pressing plate 5 swivelling cover is bonded on chip module 1, finally, rocking bar 6 corresponding rotation is suppressed on pressing plate 5.

Certainly, the utility model clamping device 3 is not limited to the present embodiment, in other embodiments, the grip unit that described clamping device 3 can also be separated by two forms, each grip unit is provided with described snap fit 313 and protruding 314 for chip module 1 is fixed on grip unit, be held on chip module 1 respectively by two grip unit relatively both sides and chip module 1 being carried to insulating body 2 to contact with terminal 7 to make chip module 1, after chip module 1 is assembled in insulating body 2, described grip unit also can be removed.In addition, described clamping device 3 may also be and only do not carry chip module 1 to insulating body 2 for fixed chip module 1.

Compared with prior art, the utility model has following beneficial effect:

1. owing to extending to form protruding 314 from snap fit 313 end, snap fit 313 is held in the fringe region 15 of chip module 1 with protruding 314, the clasp power of clamping device 3 pairs of chip modules 1 can be strengthened, length due to protruding 314 towards contact region 14 outermost adjacent two contacts 13 between gap extend, the width of protruding 314 is less than the width in described gap, make can keep certain spacing between protruding 314 and contact 13, prevent scratch contact 13.

2., owing to extending to form two relative ribs 311 downwards from framework 31 bottom surface, extend downward few two snap fits 313 from each rib 311, the intensity of snap fit 313 can be strengthened.

3., because rib 311 bottom supporting is on insulating body 2, can preventing clamping device 3 clamping device 3 when being assembled in insulating body 2 from excessively pressing down, avoiding terminal 7 or contact 13 to damage.

4., because clamping device 3 is provided with the outside being positioned at insulating body 2 from framework 31 to a location division 33 of downward-extension, clamping device 3 can be made to be positioned insulating body 2, prevent it from rocking, location division 33 is provided with groove 331, and handled easily person captures clamping device 3.

5. make fool proof breach 16 and fool proof mark 17 with groove 37 to reveal because clamping device 3 is provided with through hole 36, can observe when holding piece being assembled in insulating body 2 and adjust the direction of clamping device 3, thus clamping device 3 is correctly assembled in insulating body 2.

More than describe the explanation being only the preferred embodiment of the utility model in detail, non-the scope of the claims therefore limiting to the utility model, so all this creation of utilization specifications and the equivalence techniques change for it of diagramatic content institute, be all contained in the scope of the claims of this creation.

Claims (16)

1. an electric connector, for being electrically connected chip module, the bottom surface of described chip module is provided with a contact region and a fringe region is positioned at outside described contact region surrounding, and described contact region is arranged with multiple contact, it is characterized in that, comprising:

One insulating body;

Multiple terminal, is contained in described insulating body, for being electrically connected with described contact;

One clamping device, for carrying described chip module to described insulating body, described clamping device is provided with multiple snap fit, at least one projection is extended to form from snap fit end described in each, described snap fit and described projection are held in described fringe region, the length of described projection towards described contact region outermost adjacent two described contacts between gap extend, the width of described projection is less than the width in described gap.

2. electric connector as claimed in claim 1, is characterized in that: the width of described snap fit is greater than the width of described projection, and extends the described projection at multiple interval from described snap fit.

3. electric connector as claimed in claim 1, is characterized in that: the dual-side that the adjacent dual-side of adjacent two described contacts is corresponding with described projection is corresponding parallel.

4. electric connector as claimed in claim 1, it is characterized in that: described chip module comprises the substrate being provided with described contact and the wafer module upwards protruded out from substrate, described clamping device comprises the framework being positioned at described surface, described framework is provided with the opening passed for described wafer module, extend to form two relative ribs downwards from described framework bottom surface, extend downward few two described snap fits from rib described in each.

5. electric connector as claimed in claim 4, is characterized in that: described rib side abuts with the side of described chip module.

6. electric connector as claimed in claim 4, is characterized in that: described rib bottom supporting is on described insulating body.

7. electric connector as claimed in claim 4, it is characterized in that: described insulating body has four sidewalls upwards extended and the host cavity surrounded by four described sidewalls accommodates described chip module, described sidewall is provided with the barricade upwards protruded out and is positioned at outside chip module and higher than the bottom surface of described chip module, for block chip module, described clamping device to be provided with from framework to the position point of downward-extension in the outside of described sidewall so that described clamping device is positioned described insulating body, described clamping device is provided with resigning hole and steps down described barricade, described resigning hole is surrounded by described framework and described location division.

8. electric connector as claimed in claim 7, it is characterized in that: described sidewall is convexly equipped with fool proof post, described chip module is provided with the fool proof breach coordinated with described fool proof post, and described framework is provided with the through hole be communicated with described resigning hole, and described fool proof breach is revealed in described through hole.

9. electric connector as claimed in claim 7, it is characterized in that: a corner of described substrate is provided with a leg-of-mutton fool proof mark for chip module and insulating body are carried out contraposition, described framework is provided with the groove be communicated with described resigning hole, described groove and described separated by openings, described fool proof mark is revealed in described groove.

10. electric connector as claimed in claim 1, it is characterized in that: comprise the pressing plate for suppressing chip module further, pressing plate is rotatable relative to insulating body to be covered on above described insulating body, and clamping device end face is provided with slot to make way and steps down pressing plate.

11. 1 kinds of clamping devices, for fixing a chip module, the bottom surface of described chip module is provided with a contact region and a fringe region is positioned at outside described contact region surrounding, described contact region is arranged with multiple contact, it is characterized in that, comprise: described clamping device is provided with holding part, described holding part is held in described fringe region, the head of described holding part facing to described contact region outermost adjacent two described contacts between gap.

12. clamping devices as claimed in claim 11, it is characterized in that: the projection that described holding part comprises snap fit and extends to form from snap fit end, the width of described projection is less than the width of described snap fit, described projection is the head of described holding part, and described snap fit and described projection are held in described fringe region.

13. clamping devices as claimed in claim 12, is characterized in that: the width of described snap fit is greater than the width of described projection, and extend the described projection at multiple interval from described snap fit.

14. clamping devices as claimed in claim 12, is characterized in that: the dual-side that the adjacent dual-side of adjacent two described contacts is corresponding with described projection is corresponding parallel.

15. clamping devices as claimed in claim 11, it is characterized in that: described chip module comprises the substrate being provided with described contact and the wafer module upwards protruded out from substrate, described clamping device comprises the framework being positioned at described surface, described framework is provided with the opening passed for described wafer module, extend to form two relative ribs downwards from described framework bottom surface, extend downward few two described holding parts from rib described in each.

16. clamping devices as claimed in claim 15, is characterized in that: described rib side abuts with the side of described chip module.