CN204885132U - IC encapsulation subassembly improvement structure - Google Patents
IC encapsulation subassembly improvement structure Download PDFInfo
- Publication number
- CN204885132U CN204885132U CN201520484292.0U CN201520484292U CN204885132U CN 204885132 U CN204885132 U CN 204885132U CN 201520484292 U CN201520484292 U CN 201520484292U CN 204885132 U CN204885132 U CN 204885132U
- Authority
- CN
- China
- Prior art keywords
- assembly
- package assembling
- package
- utility
- subassembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a IC encapsulation subassembly improvement structure is equipped with at the buckling parts that encapsulates the subassembly to put the lock face to one side, and the outer end nadir that should put the lock face to one side is that the driving fit links up global exposing of corresponding IC subassembly to according to so that encapsulation subassembly and IC subassembly form the integrative form of seamless joint each other, reach and improve encapsulation of IC subassembly and electron device use feel effect.
Description
Technical field
The utility model is relevant a kind of IC package assembling, espespecially one arranges succinctly, package assembling and IC assembly can be made mutually to form a volume morphing of seamless combination, reach and improve IC component package and electronic installation use texture effect, and pole accords with the IC package assembling improvement of actual applicability, desirability and progressive.
Background technology
The mode that encapsulation implemented by IC assembly is various, mainly see the occasion that IC assembly uses and different, wherein, after IC assembly is combined in support plate, directly with package assembling, encapsulation is implemented to IC component integration or periphery, the IC component package mode of protection or raising texture effect is provided, as: to the IC component package of fingerprint sensor, roughly as shown in Figures 1 to 4, mainly be provided with package assembling 30 at the support plate 20 providing IC assembly 10 to settle, this package assembling 30 can establish encapsulation to the periphery cover of IC assembly 10, and set firmly and be combined in support plate 20, there is provided protection to IC assembly 10 according to this and promote texture effect.
Above-mentioned, this package assembling 30 is provided with corresponding running-on 301 according to the configuration of IC assembly 10, and this running-on 301 is outer rims that suit is located at IC assembly 10, package assembling 30 periphery and be provided with at least three alignment pins 302; This support plate 20 installed for IC assembly 10, is drilled with location hole 201 with alignment pin 302 equivalent of package assembling 30 and corresponding; According to it, after package assembling 30 pairs of sheathed encapsulation of IC assembly 10, can insert corresponding support plate location hole 201 by all alignment pins 302 of package assembling 30, and with the millet cake gluing that contacts of support plate 20 at package assembling 30, this package assembling 30 just can reach and set firmly stability.
Above-mentioned, running-on 301 periphery of this package assembling 30 and be provided with " " " buckling parts 303 of shape; this buckling parts 303 all alignment pins 302 of package assembling 30 plant be positioned at the corresponding location hole 201 of support plate 20 time; be just located at the periphery of IC assembly 10; after package assembling 30 combines with support plate 20 and sets firmly, the periphery of this IC assembly 10 is without exposing phenomenon.
Above-mentioned, please coordinate shown in Fig. 4, this package assembling 30 " " " shape buckling parts 303 upper end and be provided with predetermined thickness T; and after package assembling 30 pairs of IC assemblies 10 complete encapsulation; according to production operation flow process; generally can spray the side face of package assembling 30 and IC assembly 10, by sprayed coating B, the texture of electronic installation can be improved.
Undeniable, the setting of above-mentioned package assembling 30, can provide packaging effect needed for expection to IC assembly 10 really, but the use when long, dealer also realizes the defect still having a little blemish in an otherwise perfect thing.Namely, because this buckling parts 303 upper end has certain thickness T, cause after package assembling 30 completes encapsulation action, between the periphery of this IC assembly 10 and the buckling parts 303 of package assembling 30 can the section of being formed difference h, although can spraying be bestowed at the side face of package assembling 30 and IC assembly 10, but the thickness (being generally 0.03mm) of this sprayed coating B cannot fill and lead up this section of difference h completely, and it is poor that the combination of IC assembly 10 and package assembling 30 can be caused to produce obvious section, and then IC assembly 10 is caused to encapsulate and the texture of electronic installation use is relatedly affected and produces discount shortcoming.
Because above-mentioned existing IC component package, the utility model people is based on being engaged in the practical experience and professional knowledge that this type of product design manufacture enriches for many years, and coordinate the utilization of scientific principle, actively in addition research and innovation, to founding a kind of IC package assembling structure-improved of new structure, general existing IC component package can be improved, make it have more practicality.Through constantly research, design, and through repeatedly studying sample and after improving, finally creating the utility model had practical value.
Summary of the invention
The utility model provides a kind of IC package assembling structure-improved, and its technical problem solved is the volume morphing making the encapsulation of package assembling and IC assembly form seamless combination, reaches and significantly promotes IC component package and electronic installation use texture effect.
The utility model solves its technical problem and realizes by the following technical solutions.
A kind of IC package assembling structure-improved, include IC assembly, for the support plate of IC component placement and the package assembling to IC component package, wherein, it is sheathed that package assembling is provided with corresponding IC assembly of trapping a suspect into admitting his guilt, and is provided with buckling parts is located at IC assembly periphery at running-on periphery; It is characterized by: the buckling parts of the running-on periphery of package assembling is provided with tilting buckling surface, the outer end low spot of this tilting buckling surface be the closely sealed IC of being engaged on assembly expose side face.
The utility model compared with prior art has obvious advantage and beneficial effect.By technique scheme, the utility model IC package assembling structure-improved can reach suitable technological progress and practicality, and has the extensive value in industry, and it at least has following advantages:
1, arrange succinctly, tool economy.
2, package assembling can be made to form a volume morphing of seamless combination to the encapsulation of IC assembly, reach and improve IC component package and electronic installation use texture effect.
Above-mentioned explanation is only the general introduction of technical solutions of the utility model, in order to technological means of the present utility model can be better understood, and can be implemented according to the content of specification, and can become apparent to allow above and other object of the present utility model, feature and advantage, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, be described in detail as follows.
Accompanying drawing explanation
Fig. 1 is that existing known package assembling is to the schematic perspective view of IC component package;
Fig. 2 is the decomposition chart of Fig. 1;
Fig. 3 is Fig. 1 generalized section;
Fig. 4 is the close-up schematic view of Fig. 3;
Fig. 5 is the schematic perspective view of the utility model package assembling to IC component package embodiment;
Fig. 6 is the decomposition chart of Fig. 5;
Fig. 7 is the generalized section of Fig. 5;
Fig. 8 is the close-up schematic view of Fig. 7.
[primary clustering symbol description]
B: sprayed coating T: thickness
H: section difference 10:IC assembly
20: support plate 201: location hole
30: package assembling 301: running-on
302: alignment pin 303: buckling parts
3031: tilting buckling surface 3032: outer end low spot
Embodiment
For further setting forth the utility model for the technological means reaching predetermined utility model object and take and effect, below in conjunction with accompanying drawing and preferred embodiment, to according to its embodiment of IC package assembling structure-improved, structure, feature and the effect thereof that the utility model proposes, be described in detail as follows.
Refer to shown in Fig. 5 to Fig. 8, a kind of IC package assembling of the utility model structure-improved, refer on the support plate 20 providing IC assembly 10 to settle in conjunction with package assembling 30, this package assembling 30 pairs of IC assemblies 10 encapsulate, wherein, it is sheathed for corresponding IC assembly 10 that this package assembling 30 is provided with running-on 301, be provided with buckling parts 303 at running-on 301 periphery and be located at IC assembly 10 periphery, this buckling parts 303 is provided with tilting buckling surface 3031, the outer end low spot 3032 of this tilting buckling surface 3031 be the closely sealed IC of being engaged on assembly 10 expose side face.
Utilize above-mentioned formed the utility model, when package assembling 30 by running-on 301 aim at be inserted in the IC assembly 10 being placed in support plate 20 implement encapsulation work time, the buckling parts 303 of running-on 301 periphery of this package assembling 30 is located at IC assembly 10 periphery, and be provided with tilting buckling surface 3031 with the buckling parts 303 of this package assembling 30, and the outer end low spot 3032 of this tilting buckling surface 3031 again closely sealed be engaged on corresponding IC assembly 10 expose side face, then shape is closed without section differential with the side face that exposes of IC assembly 10 by the buckling parts 303 of this package assembling 30; Spraying can be bestowed by the side face of IC assembly 10 and package assembling 30 simultaneously, mutual side face is made to have predetermined thickness sprayed coating B, then this is originally between IC assembly 10 side face closed without section differential and the tilting buckling surface 3031 of package assembling 30, more will can form seamless integrating with according to this, one volume morphing of the related formation seamless combination of encapsulation of package assembling 30 pairs of IC assemblies 10, and then reach the effect improving the encapsulation of IC assembly 10 and electronic installation use texture.
The above, it is only preferred embodiment of the present utility model, not any pro forma restriction is done to the utility model, although the utility model discloses as above with preferred embodiment, but and be not used to limit the utility model, any those skilled in the art, do not departing within the scope of technical solutions of the utility model, make a little change when the technology contents of above-mentioned announcement can be utilized or be modified to the Equivalent embodiments of equivalent variations, in every case be the content not departing from technical solutions of the utility model, according to technical spirit of the present utility model to any simple modification made for any of the above embodiments, equivalent variations and modification, all still belong in the scope of technical solutions of the utility model.
Claims (1)
1. an IC package assembling structure-improved, include IC assembly, for the support plate of IC component placement and the package assembling to IC component package, wherein, it is sheathed that package assembling is provided with corresponding IC assembly of trapping a suspect into admitting his guilt, and is provided with buckling parts is located at IC assembly periphery at running-on periphery; It is characterized by: the buckling parts of the running-on periphery of package assembling is provided with tilting buckling surface, the outer end low spot of this tilting buckling surface be the closely sealed IC of being engaged on assembly expose side face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520484292.0U CN204885132U (en) | 2015-07-07 | 2015-07-07 | IC encapsulation subassembly improvement structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520484292.0U CN204885132U (en) | 2015-07-07 | 2015-07-07 | IC encapsulation subassembly improvement structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204885132U true CN204885132U (en) | 2015-12-16 |
Family
ID=54829478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520484292.0U Expired - Fee Related CN204885132U (en) | 2015-07-07 | 2015-07-07 | IC encapsulation subassembly improvement structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204885132U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106098647A (en) * | 2016-06-20 | 2016-11-09 | 东莞市联洲知识产权运营管理有限公司 | A kind of multi-chip stacks formula integrated antenna package |
-
2015
- 2015-07-07 CN CN201520484292.0U patent/CN204885132U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106098647A (en) * | 2016-06-20 | 2016-11-09 | 东莞市联洲知识产权运营管理有限公司 | A kind of multi-chip stacks formula integrated antenna package |
| CN106098647B (en) * | 2016-06-20 | 2018-12-14 | 绍兴杭铭饰品有限公司 | A kind of multi-chip stacks formula integrated antenna package |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103249270B (en) | Components with mechanically-bonded plastic and methods for forming such components | |
| CN204885132U (en) | IC encapsulation subassembly improvement structure | |
| CN205428623U (en) | Chip inductor structure | |
| CN205595595U (en) | Rapid Assembly device of radio frequency terminal | |
| CN204622978U (en) | A kind of two-sided erosion line multiple layer metal texture intertexture decorative panel | |
| CN205644047U (en) | Noble metal wrist -watch | |
| CN204774335U (en) | Two -sided line multilayer metal texture decorative board that interweaves that loses | |
| CN205686139U (en) | A kind of vehicle-mounted perfume base | |
| CN207521238U (en) | A kind of mobile terminal and glue-dropping tool | |
| CN205172162U (en) | Handle lock handle | |
| CN105332552A (en) | Handling door lock lever and manufacturing technology thereof | |
| CN202572374U (en) | Tool box capable of being assembled fast | |
| CN205093070U (en) | Memory body circuit board assembly block structure | |
| CN206287751U (en) | A kind of new automobile Song Xin core wheel lids | |
| CN203020631U (en) | Gold stamped paper bag | |
| CN204975206U (en) | Turbocharged bead cover shell mold | |
| CN206140948U (en) | Product Assembly frock is sealed in bypass | |
| CN205183865U (en) | Dust remover spray pipe precision frock of drilling | |
| CN204173254U (en) | A kind of electronic product wrapping machine Connection Block | |
| CN204032538U (en) | A kind of colorful structure of silica gel product | |
| CN203257814U (en) | Output shaft mechanism for automobile starter motor | |
| CN203472720U (en) | Automobile door trim component | |
| CN205686017U (en) | A kind of front cover location structure of the disk cementing machine workbench manufacturing this equipment | |
| CN202790513U (en) | Oil chamber plug cap | |
| CN202448640U (en) | Novel decorative painting |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151216 Termination date: 20170707 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |