CN204846461U - Automatic tectorial membrane sealing device of electron thin slice component - Google Patents
Automatic tectorial membrane sealing device of electron thin slice component Download PDFInfo
- Publication number
- CN204846461U CN204846461U CN201520534300.8U CN201520534300U CN204846461U CN 204846461 U CN204846461 U CN 204846461U CN 201520534300 U CN201520534300 U CN 201520534300U CN 204846461 U CN204846461 U CN 204846461U
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- roller
- pad pasting
- material loading
- electronic component
- counterdie
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Abstract
The utility model provides a this automatic tectorial membrane sealing device of electron thin slice component, it includes material roller, pad pasting roller, on going up the material roller there be rather than parallel its circumference surface equipartition material loading plane of edge of axis processing, material loading planar one side position design have highly be less than the electronic component thickness of treating the material loading push away the material limit, the lower part design of going up the material roller has the material loading compression roller, go up the material roller with basement membrane through there being the bar conveying in the middle of the material loading compression roller, the side position design of material loading compression roller has the rotation the pad pasting roller, the pad pasting roller is the cylinder shape, processing has the press mold plane of equipartition on the circumference face of pad pasting roller, the pad pasting compression roller with through there being the tectorial membrane between the upper portion basement membrane of pad pasting roller, the pad pasting compression roller compresses tightly the tectorial membrane with electronic component on the basement membrane. The device is a two -sided pad pasting device, can be sealed completely with the electronic component of thin slice class.
Description
Technical field
The utility model belongs to manufacturing line technical field of processing equipment, especially relates to a kind of electronics thin sheet element automatic film covering sealing arrangement.
Background technology
Usually can use in electronic component containing metal etc. get rusty easily oxidation material; therefore after production of electronic components completes; usually need to carry out antirust anti-oxidation process to the surface of electronic component; traditional processing mode is normally carried out anti-corrosion oil to the surface of electronic component and is smeared process; and usually can carry out pad pasting process at electronical elements surface for the electronic component of some sheets; traditional electronic component film sticking equipment structure is comparatively complicated; device fabrication manufacturing cost is higher; take up an area larger; operation step in production procedure is played more, and production efficiency is lower.
Summary of the invention
For the problems referred to above, the purpose of this utility model is to provide a kind of can complete overlay film to sheet electronic component, cutting, collection process automatically, and device structure is simple, and energy consumption is low, the electronics thin sheet element automatic film covering sealing arrangement that production efficiency is high.
The utility model solves the technical scheme that its technical matters adopts: this electronics thin sheet element automatic film covering sealing arrangement comprises material roller, pad pasting roller, described upper material roller is cylindrical shape, rotation is assemblied in frame, described upper material roller is connected with motor by drive mechanism, described upper material roller is processed with its axis being parallel along the uniform material loading plane of its peripheral surface, the side Position Design of institute's material loading plane has height lower than the pusher limit of electronic component thickness for the treatment of material loading, described pusher limit shape is corresponding with treating the described electronic component of material loading, described electronic component is vertically stacked at directly over described upper material roller to compression, that stacks treats that electronic component bottom described in material loading is closely attached on the material loading plane of described upper material roller, when described upper material roller is driven to rotate, described electronic component is pushed away away by pusher limit, the cavity of air-breathing is designed with in described upper material roller, air-pressure equipment is connected with in described cavity, described material loading plane is evenly equipped with the suction hole be communicated with described cavity, when the electronic component of sheet be positioned at described material loading plane follows upper material roller rotate time, can be adsorbed by described suction hole, the bottom of described upper material roller is designed with material loading pressure roller, described upper material roller and the middle counterdie by there being bar shaped to transmit of described material loading pressure roller, electronic component in described material loading pressure roller and material loading plane compresses fits, the lateral location of described material loading pressure roller is designed with the described pad pasting roller of rotation, described pad pasting roller is cylindrical shape, the circumferential surface of described pad pasting roller is processed with uniform press mold plane, the axis being parallel of described press mold plane and described pad pasting roller, the described electronic component that described counterdie carries adhesion is adjacent to from described pad pasting roller top and press mold plane and passes through, the top of described pad pasting roller and counterdie is equipped with pad pasting pressure roller, by there being overlay film between the top counterdie of described pad pasting pressure roller and described pad pasting roller, overlay film and electronic component are pressed on described counterdie by described pad pasting pressure roller.
As preferably, described upper material roller, material loading pressure roller, pad pasting roller, the synchronized operation of pad pasting pressure roller.
As preferably, described electronic component is square, and described pusher limit is straight line bar shaped.
As preferably, described upper material roller is assemblied on fixing center shaft, described center shaft is tubulose, the described upper material roller internal cavity partial fixing that is deep into of described center shaft is connected with dividing plate, be deep into material roller inside center shaft portion and described dividing plate and upper material roller internal cavity be divided into two chambers in left and right, described center shaft indoor design has two passages, and each channel connection of described center shaft inside has a chamber; A passage is connected with the inlet end of air-pressure equipment with chamber, and another passage is connected with the outlet side of air-pressure equipment with chamber; Described dividing plate and the slipper seal of upper material roller inwall are assembled.
As preferably, the equal annular in surface of described material loading pressure roller and described pad pasting pressure roller is enclosed with cavernous body.On material loading pressure roller, described electronic component is pressed on described counterdie by the compacted deformation of cavernous body, and on pad pasting pressure roller, described overlay film is pressed on described counterdie by the compacted deformation of cavernous body.
As preferably, described electronics thin sheet element automatic film covering sealing arrangement also includes blank module, rewinding case; Described blank module includes housing, and described lower housing portion is connected with the cutter of blade annular down, and the bottom of described cutter is placed with the described rewinding case of tubbiness; The top of described housing is connected with and promotes the vertically upper and lower master cylinder of housing; When described cutter are pushed down, bottom position is lower than the horizontal annular opening of described rewinding upper box part, and described rewinding upper box part opening and described cutter blade form shear constitution.
As preferably, described counterdie, pad pasting width are greater than the annular diameter of described cutter blade.
As preferably, the opening diameter of described rewinding upper box part is less than box body diameter, and described rewinding box body bottom is designed with the base plate of detachable assembling.
As preferably, described enclosure interior is fixedly equipped with vertical auxiliary cylinder, and described auxiliary cylinder telescopic head is down equipped with pushing block, and described pushing block can stretch out the bottom blade position of described cutter.
The beneficial effects of the utility model are: this electronics thin sheet element automatic film covering sealing arrangement is used for being connected with the manufacturing line of electronic component, being produced the electronic component come is attached on described counterdie by described upper material roller, then compressed by described material loading pressure roller, described electronic component continues to be brought in the press mold plane of described pad pasting roller by counterdie, then described overlay film is attached to described counterdie and electronic component top, when described overlay film, counterdie, electronic component are by described pad pasting pressure roller bottom, electronic component is compacted to be sealed in overlay film, counterdie.This completes the pad pasting sealing assembling to electronic component, this device is a kind of Double-face adhesive film device, the electronic component of sheet can be sealed completely, the simultaneously design of described material loading plane and press mold plane can prevent from described electronic component from bending being out of shape, electronic component can be adsorbed in material loading plane by the design in described material loading planar getter hole, and during guarantee electronic component material loading, position is accurate.
Accompanying drawing explanation
Fig. 1 is the structural representation of this thin sheet element automatic film covering sealing arrangement side surface direction.
Fig. 2 is the structural representation that upper material roller overlooks directional profile.
Fig. 3 treats after pad pasting completes that the electronic component of blank enters the cross-sectional view between blank module, rewinding case.
Fig. 4 be blank module, rewinding case after pad pasting to cross-sectional view during electronic component blank.
Fig. 5 be electronic component after pad pasting by the structural representation of overlay film, counterdie during blank.
Detailed description of the invention
Below in conjunction with drawings and Examples, the utility model is further illustrated:
As shown in the embodiment shown in fig, this electronics thin sheet element automatic film covering sealing arrangement, it comprises material roller 1, pad pasting roller 2; Described upper material roller 1 is cylindrical shape, rotation is assemblied in frame, described upper material roller 1 is connected with motor by drive mechanism, described upper material roller 1 is processed with its axis being parallel along the uniform material loading plane 11 of its peripheral surface, the side Position Design of institute's material loading plane 11 has height lower than the pusher limit 12 of electronic component 3 thickness for the treatment of material loading, described pusher limit 12 shape is corresponding with treating the described electronic component 3 of material loading, specifically in this embodiment, described electronic component 3 is square, and described pusher limit 12 is straight line bar shaped.
Described electronic component 3 is vertically stacked at directly over described upper material roller 1 to compression, that stacks treats that described in material loading, electronic component 3 bottom is closely attached on the material loading plane 11 of described upper material roller 1, when described upper material roller 1 is driven to rotate, described electronic component 3 is pushed away away by pusher limit 12, the cavity of air-breathing is designed with in described upper material roller 1, air-pressure equipment is connected with in described cavity, described material loading plane 11 is evenly equipped with the suction hole 13 be communicated with described cavity, when the electronic component 3 of sheet be positioned at described material loading plane 11 follows upper material roller 1 rotate time, can be adsorbed by described suction hole 13, the bottom of described upper material roller 1 is designed with material loading pressure roller 1a, described upper material roller 1 is middle by there being the surperficial counterdie 5 transmitted with the bar shaped of glue with described material loading pressure roller 1a, electronic component 3 in described material loading pressure roller 1a and material loading plane 11 compresses fits, the lateral location of described material loading pressure roller 1a is designed with the described pad pasting roller 2 of rotation, described pad pasting roller 2 is cylindrical shape, the circumferential surface of described pad pasting roller 2 is processed with uniform press mold plane 21, the axis being parallel of described press mold plane 21 and described pad pasting roller 2, the described electronic component 3 that described counterdie 5 carries adhesion is adjacent to from described pad pasting roller 2 top and press mold plane 21 and passes through, described pad pasting roller 2 is equipped with pad pasting pressure roller 2a with the top of counterdie 5, by there being overlay film 7 between the top counterdie 5 of described pad pasting pressure roller 2a and described pad pasting roller 2, overlay film 7 and electronic component 3 are pressed on described counterdie 5 by described pad pasting pressure roller 2a.
This electronics thin sheet element automatic film covering sealing arrangement is used for being connected with the manufacturing line of electronic component 3, being produced the electronic component 3 come is attached on described counterdie by described upper material roller 1, then compressed by described material loading pressure roller 1a, described electronic component 3 continues to be brought in the press mold plane 21 of described pad pasting roller 2 by counterdie 5, then described overlay film 7 is attached to described counterdie 5 and electronic component 3 top, when described overlay film 7, counterdie 5, electronic component 3 are by described pad pasting pressure roller 2a bottom, electronic component 3 is compacted to be sealed in overlay film 7, counterdie 5.This completes the pad pasting sealing assembling to electronic component 3, this device is a kind of Double-face adhesive film device, the electronic component 3 of sheet can be sealed completely, simultaneously described material loading plane 11 can prevent from described electronic component 3 from bending with the design of press mold plane 21 being out of shape, electronic component 3 can be adsorbed in material loading plane 11 by the design of described material loading plane 11 suction hole 13, make described electronic component 3 follow described on material roller 1 rotate time can not produce relative displacement, ensure electronic component 3 material loading time position accurate.
Specifically, described upper material roller 1, material loading pressure roller 1a, pad pasting roller 2, pad pasting pressure roller 2a can be designed as synchronized operation.Specifically above-mentioned four surface rotative speeds identical with the kinematic velocity of counterdie 5 and overlay film 7, such electronic component from material loading plane 11 be attached to can fall into described pad pasting roller 2 after counterdie 5 accurately press mold plane 21.Can not produce relative sliding when counterdie 5 and overlay film 7 compress with electronic component 3 simultaneously, press mold packaging effect is better.
As depicted in figs. 1 and 2, described upper material roller 1 is assemblied on fixing center shaft 8, described center shaft 8 is tubulose, the described upper material roller 1 internal cavity partial fixing that is deep into of described center shaft 8 is connected with dividing plate, be deep into material roller 1 inside center axle 8 part and described dividing plate 81 and upper material roller 1 internal cavity be divided into two chambers in left and right, the indoor design of described center shaft 8 has two passages, and each channel connection of described center shaft 8 inside has a chamber; A passage is connected with the inlet end of air-pressure equipment with chamber, and another passage is connected with the outlet side of air-pressure equipment with chamber; Described dividing plate 81 assembles with the slipper seal of upper material roller 1 inwall.Described center shaft 8 is fixedly assemblied in frame with dividing plate 81, is convenient to its gas and counts and extract out; Described upper material roller 1 is connected with engine by drive mechanism, and upper material roller 1 constantly rotates relative to described center shaft 8.The material loading plane 11 that described suction hole is connected with the inlet end of air-pressure equipment, namely in Fig. 2, the left side of upper material roller 1 is suction face, and the electronic component 3 of this side is in material loading position, just by negative-pressure adsorption; And the material loading plane 11 that described suction hole is connected with the outlet side of air-pressure equipment, namely in Fig. 2, the right flank of upper material roller 1 is for going out charge level, and described electronic component 3 is released by malleation just, is convenient to the disengaging of electronic component.
As shown in Figure 1, described material loading pressure roller 4 is enclosed with cavernous body with the equal annular in surface of described pad pasting pressure roller 2a.On material loading pressure roller 1, described electronic component 3 is pressed on described counterdie 5 by the compacted deformation of cavernous body, and on pad pasting pressure roller 2a, described overlay film 7 is pressed on described counterdie 5 by the compacted deformation of cavernous body.Described cavernous body has larger elasticity, is can not cause crimp to electronic component, makes pad pasting better effects if in work.
As shown in Figure 1, Figure 3 and Figure 4, described electronics thin sheet element automatic film covering sealing arrangement also includes blank module 4, rewinding case 6; Described blank module 4 includes housing 41, and described housing 41 bottom is connected with the cutter 42 of blade annular down, and the bottom of described cutter 42 is placed with the described rewinding case 6 of tubbiness; The top of described housing 41 is connected with and promotes the vertically upper and lower master cylinder 43 of housing 41; When described cutter 42 are pushed down, bottom position is lower than the horizontal annular opening on described rewinding case 6 top, and described rewinding case 6 upper opening and described cutter 42 blade form shear constitution.This device adopts the mode of stepping to run in use, and when the electronic component 3 encapsulated by counterdie 5 and overlay film about 7 moves to described blank module 4, counterdie 5 and overlay film 7 stop transmission; Described master cylinder 43 promotes described housing 41 and moves downward together with cutter 42, completes the cutting to described electronic component 3 and upper-lower position overlay film 7, counterdie 5, described electronic component 3 is dropped in described rewinding case 6 with the form that round sheet encapsulates.
As shown in Figure 5, when specific design, described counterdie 5, pad pasting 7 width are greater than the annular diameter of described cutter 42 blade.Be convenient to described counterdie 5, the transmission of pad pasting 7 and the curling collection for waste material after processing like this.
As shown in Figures 2 and 3, the opening diameter on described rewinding case 6 top is less than box body diameter, and described rewinding case 6 lower box is designed with the base plate 61 of detachable assembling.After being convenient to blank like this, described electronic component drops in described rewinding case 6, and the base plate 61 simultaneously can opened downwards can take out electronic component after blank easily.Described housing 41 inside is fixedly equipped with vertical auxiliary cylinder 44, and described auxiliary cylinder 44 telescopic head is down equipped with pushing block 45, and described pushing block 45 can stretch out the bottom blade position of described cutter 42.Described auxiliary cylinder 44 and the design of pushing block 45 are convenient to the electronic component 3 after cutting to head in described rewinding case 6 together with overlay film on it 7, counterdie 5.
Claims (9)
1. an electronics thin sheet element automatic film covering sealing arrangement, it comprises material roller (1), pad pasting roller (2), described upper material roller (1) is cylindrical shape, rotation is assemblied in frame, described upper material roller (1) is connected with motor by drive mechanism, it is characterized in that: described upper material roller (1) is processed with its axis being parallel along the uniform material loading plane (11) of its peripheral surface, the side Position Design of institute's material loading plane (11) has height lower than the pusher limit (12) of electronic component (3) thickness for the treatment of material loading, described electronic component (3) is vertically stacked at directly over described upper material roller (1) to compression, that stacks treats that electronic component described in material loading (3) bottom is closely attached on the material loading plane (11) of described upper material roller (1), the cavity of air-breathing is designed with in described upper material roller (1), air-pressure equipment is connected with in described cavity, described material loading plane (11) is evenly equipped with the suction hole (13) be communicated with described cavity, the bottom of described upper material roller (1) is designed with material loading pressure roller (1a), described upper material roller (1) counterdie (5) by there be bar shaped transmit middle with described material loading pressure roller (1a), described material loading pressure roller (1a) compresses with the electronic component (3) in material loading plane (11) and fits, the lateral location of described material loading pressure roller (1a) is designed with the described pad pasting roller (2) of rotation, described pad pasting roller (2) is cylindrical shape, the circumferential surface of described pad pasting roller (2) is processed with uniform press mold plane (21), the axis being parallel of described press mold plane (21) and described pad pasting roller (2), the described electronic component (3) that described counterdie (5) carries adhesion is adjacent to from described pad pasting roller (2) top and press mold plane (21) and passes through, described pad pasting roller (2) is equipped with pad pasting pressure roller (2a) with the top of counterdie (5), by there being overlay film (7) between described pad pasting pressure roller (2a) and the top counterdie (5) of described pad pasting roller (2), overlay film (7) and electronic component (3) are pressed on described counterdie (5) by described pad pasting pressure roller (2a).
2. electronics thin sheet element automatic film covering sealing arrangement according to claim 1, is characterized in that: described upper material roller (1), material loading pressure roller (1a), pad pasting roller (2), pad pasting pressure roller (2a) synchronized operation.
3. electronics thin sheet element automatic film covering sealing arrangement according to claim 1, is characterized in that: described electronic component (3) is for square, and described pusher limit (12) is straight line bar shaped.
4. electronics thin sheet element automatic film covering sealing arrangement according to claim 1, it is characterized in that: described upper material roller (1) is assemblied on fixing center shaft (8), described center shaft (8) is tubulose, described upper material roller (1) the internal cavity partial fixing that is deep into of described center shaft (8) is connected with dividing plate, be deep into material roller (1) inside center axle (8) part, with described dividing plate (81), upper material roller (1) internal cavity be divided into two chambers in left and right, described center shaft (8) indoor design has two passages, each channel connection of described center shaft (8) inside has a chamber, a passage is connected with the inlet end of air-pressure equipment with chamber, and another passage is connected with the outlet side of air-pressure equipment with chamber, described dividing plate (81) and upper material roller (1) inwall slipper seal are assembled.
5. electronics thin sheet element automatic film covering sealing arrangement according to claim 1, it is characterized in that: described material loading pressure roller (4) is enclosed with cavernous body with the equal annular in surface of described pad pasting pressure roller (2a), in the upper compacted deformation of cavernous body of material loading pressure roller (1), described electronic component (3) is pressed on described counterdie (5), in the upper compacted deformation of cavernous body of pad pasting pressure roller (2a), described overlay film (7) is pressed on described counterdie (5).
6. electronics thin sheet element automatic film covering sealing arrangement according to any one of claim 1 to 5, is characterized in that: described electronics thin sheet element automatic film covering sealing arrangement also includes blank module (4), rewinding case (6); Described blank module (4) includes housing (41), and described housing (41) bottom is connected with the cutter (42) of blade annular down, and the bottom of described cutter (42) is placed with the described rewinding case (6) of tubbiness; The top of described housing (41) is connected with and promotes the vertically upper and lower master cylinder (43) of housing (41); When described cutter (42) are pushed down, bottom position is lower than the horizontal annular opening on described rewinding case (6) top, and described rewinding case (6) upper opening and described cutter (42) blade form shear constitution.
7. electronics thin sheet element automatic film covering sealing arrangement according to claim 6, is characterized in that: described counterdie (5), pad pasting (7) width are greater than the annular diameter of described cutter (42) blade.
8. electronics thin sheet element automatic film covering sealing arrangement according to claim 6, is characterized in that: the opening diameter on described rewinding case (6) top is less than box body diameter, and described rewinding case (6) lower box is designed with the base plate (61) of detachable assembling.
9. electronics thin sheet element automatic film covering sealing arrangement according to claim 6, it is characterized in that: described housing (41) inside is fixedly equipped with vertical auxiliary cylinder (44), described auxiliary cylinder (44) telescopic head is down equipped with pushing block (45), and described pushing block (45) can stretch out the bottom blade position of described cutter (42).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520534300.8U CN204846461U (en) | 2015-07-22 | 2015-07-22 | Automatic tectorial membrane sealing device of electron thin slice component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520534300.8U CN204846461U (en) | 2015-07-22 | 2015-07-22 | Automatic tectorial membrane sealing device of electron thin slice component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204846461U true CN204846461U (en) | 2015-12-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520534300.8U Withdrawn - After Issue CN204846461U (en) | 2015-07-22 | 2015-07-22 | Automatic tectorial membrane sealing device of electron thin slice component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204846461U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104943901A (en) * | 2015-07-22 | 2015-09-30 | 苏州市万祥电器成套有限公司 | Automatic laminating and sealing device for electronic sheet components |
-
2015
- 2015-07-22 CN CN201520534300.8U patent/CN204846461U/en not_active Withdrawn - After Issue
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104943901A (en) * | 2015-07-22 | 2015-09-30 | 苏州市万祥电器成套有限公司 | Automatic laminating and sealing device for electronic sheet components |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20151209 Effective date of abandoning: 20171114 |
|
| AV01 | Patent right actively abandoned |