CN204836357U - Flat getting ready of image sensor circuit is put and system - Google Patents
Flat getting ready of image sensor circuit is put and system Download PDFInfo
- Publication number
- CN204836357U CN204836357U CN201520665867.9U CN201520665867U CN204836357U CN 204836357 U CN204836357 U CN 204836357U CN 201520665867 U CN201520665867 U CN 201520665867U CN 204836357 U CN204836357 U CN 204836357U
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- China
- Prior art keywords
- image sensor
- sensor circuit
- needle plate
- plate
- circuit plate
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- Expired - Fee Related
Links
- 238000004026 adhesive bonding Methods 0.000 claims description 44
- 239000003292 glue Substances 0.000 claims description 19
- 238000007906 compression Methods 0.000 claims description 16
- 230000006835 compression Effects 0.000 claims description 15
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 14
- 230000007246 mechanism Effects 0.000 claims description 6
- 238000003384 imaging method Methods 0.000 abstract description 18
- 239000002184 metal Substances 0.000 abstract description 5
- 230000000740 bleeding effect Effects 0.000 abstract 1
- 238000009434 installation Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 2
- 108091008695 photoreceptors Proteins 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007712 rapid solidification Methods 0.000 description 1
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The utility model discloses a flat getting ready of image sensor circuit is put and system, the device includes rubberizing base, rubberizing platform, support frame, faller, drive arrangement, the rubberizing platform sets up on the upper surface of rubberizing base, and is provided with the reference column on the upper surface of rubberizing platform, be provided with the vertical guide pillar of arranging on the support frame, the faller is installed on the guide pillar and can be reciprocated on the guide pillar, install many bleeding pressure post on the faller, drive arrangement fixes on the support frame, links to each other with the faller, can drive the faller and move on the guide pillar. The utility model discloses on can accurate with image sensor circuit board, levelly and smoothly installing a metal sheet, make image sensor circuit board keep good roughness, make the image sensor imaging surface keep high parallel with the camera lens imaging surface, have simple structure compactness, convenient to use's advantage.
Description
Technical field
The utility model relates to image sensor circuit plate field, particularly, relates to a kind of image sensor circuit plate flattening device and system.
Background technology
In the prior art, because circuit board (particularly the circuit board of installation diagram image-position sensor) is easily out of shape and warpage because of variations in temperature, evenness is lower, cause the location consistency of the image sensor devices be fixedly mounted on described circuit board poor thus, thus be difficult to realize higher image definition.
In integrated movement design, definition in how keeping image to change is a key point, this just needs to keep imageing sensor imaging surface parallel with lens imaging face, and imageing sensor imaging surface can for best in the optimal imaging distance that factory settings researched and developed by camera lens.
But in existing simple screw fixed solution, above two all can not obtain perfect solution, and use actual for a long time, the loosened screw that may occur can produce larger impact to image quality.
Utility model content
The purpose of this utility model is just to provide a kind of image sensor circuit plate flattening device and system, this image sensor circuit plate flattening device and system is utilized to be installed to by image sensor circuit plate on a metallic plate, the evenness making image sensor circuit plate keep good, makes imageing sensor imaging surface and lens imaging face keep highly parallel.
The technical scheme in the invention for solving the above technical problem is:
Image sensor circuit plate flattening device, comprises gluing pedestal, gluing table, bracing frame, needle plate, drive unit, and described gluing table is arranged on the upper surface of gluing pedestal, and the upper surface of gluing table is provided with reference column; Support frame as described above is provided with the guide pillar vertically arranged, described needle plate to be arranged on guide pillar and can to move up and down on guide pillar; Described needle plate is provided with many compression legs, and needle plate is positioned at directly over gluing table; Described driving dress is fixed on bracing frame, is connected with needle plate, and needle plate can be driven to move on guide pillar.
As further improvement of the utility model, the upper surface of described gluing table is also provided with projection or groove.
Further, described drive unit comprises cylinder, the connecting rod be connected on cylinder piston, and this connecting rod lower end is connected with needle plate.
Further, described needle plate is provided with 6 compression legs.
Further, the compression leg axial symmetry on described needle plate is arranged.
Further, the both sides of described needle plate are also respectively provided with one group of mounting panel.
Further, often organize mounting panel and be made up of two parallel flat boards, on two sides that dull and stereotyped lower end is fixed on needle plate or on the both sides of the upper surface of needle plate.
Image sensor circuit plate planarization system, comprise circuit board flattening mechanism, glue flow speed controller, gum outlet, ultraviolet curing instrument, ultraviolet curing instrument controller, described circuit board flattening mechanism is the image sensor circuit plate flattening device described in above-mentioned arbitrary technical scheme, described glue flow speed controller is connected with gum outlet, described ultraviolet curing instrument is connected with ultraviolet curing instrument controller, and described ultraviolet curing instrument is fixing on a mounting board.
Further, the quantity of described ultraviolet curing instrument is two, and described needle plate both sides respectively arrange one.
To sum up, the beneficial effects of the utility model are:
Image sensor circuit plate can accurately, entirely be installed on a metallic plate by the utility model, and the evenness making image sensor circuit plate keep good makes imageing sensor imaging surface and lens imaging face keep highly parallel;
The utility model is provided with drive unit control needle plate and compresses image sensor circuit plate, has carried out further guarantee to the Pingdu that image sensor circuit plate is installed on a metal plate;
The utility model is simple and compact for structure, easy to use.
Accompanying drawing explanation
Fig. 1 is the structural representation of a specific embodiment of the present utility model;
Fig. 2 is the structural representation of a specific embodiment of needle plate;
Fig. 3 is the structural representation of the metallic plate for installation diagram image-position sensor;
Fig. 4 is the structural representation of image sensor circuit plate;
Fig. 5 is the end view of image sensor circuit plate;
Fig. 6 is the structural representation of a specific embodiment of gluing table.
Mark and corresponding parts title in accompanying drawing: 1-glue flow speed controller; 2-gum outlet; 3-ultraviolet curing instrument; 4-gluing table; 41-reference column; 42-is protruding; 5-gluing pedestal; 6-ultraviolet curing instrument controller; 7-drive unit; 8-needle plate; 81-flat part; 82-installation portion; 83-through hole; 9-bracing frame; 10-guide pillar; 11-compression leg; 12-is dull and stereotyped; 21-strip slot; 22-first location hole; 31-second location hole; 32-pin hole.
Embodiment
When utilizing the smooth image sensor circuit plate of the utility model, mainly image sensor circuit plate is installed on a metallic plate, makes the imageing sensor imaging surface on image sensor circuit plate and lens imaging face keep highly parallel and make imageing sensor imaging surface be in optimal imaging apart from upper.Below in conjunction with embodiment and accompanying drawing, to the detailed description further of the utility model do, but execution mode of the present utility model is not limited thereto.
In description of the present utility model; it will be appreciated that; term "front", "rear", "left", "right", " on ", D score, " vertically ", " level ", " height ", " low " " interior ", the orientation of the instruction such as " outward " or position relationship be based on orientation shown in the drawings or position relationship; only the present invention for convenience of description and simplified characterization; instead of instruction or hint indication device or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as the restriction to the utility model protection range.
Embodiment 1:
As shown in Figure 1, image sensor circuit plate flattening device, comprises gluing pedestal 5, gluing table 4, bracing frame 9, needle plate 8, drive unit 7.
Described gluing table 4 is arranged on the upper surface center of gluing pedestal 5, for placing metallic plate, is put on a metal plate by image sensor circuit plate during installation diagram image-position sensor circuit board again.
The structure of metallic plate as shown in Figure 3, is provided with the first location hole 22, its upper surface is provided with the strip slot 21 placing glue, and metallic plate center has the photoreceptor through hole passed for the photoreceptor on sensor circuit board;
The structure of image sensor circuit plate as shown in Figure 4 and Figure 5, image sensor circuit plate is provided with the second location hole 31 and pin hole 32.
The upper surface of gluing table 4 is provided with reference column 41, when placing image sensor circuit plate and metallic plate, this reference column 41 stretches into the second location hole 31 of image sensor circuit plate and the first location hole 22 of metallic plate.
Support frame as described above 9 is arranged on the upper surface of gluing pedestal 5, be positioned at gluing table 4 rear, bracing frame 9 is provided with the guide pillar 10 vertically arranged, described needle plate 8 to be arranged on guide pillar 10 and can to move up and down on guide pillar 10, and needle plate 8 is positioned at directly over gluing table 4;
As shown in Figure 6, described needle plate 8 is provided with 6 compression legs 11, and all compression legs 11 axial symmetry is arranged; Compression leg 11 is perpendicular to needle plate 8 place plane and the lower end of compression leg 11 passes needle plate 8, thus needle plate 8 presses down when being pressed onto on image sensor circuit plate, and compression leg 11 lower end is stretched in the pin hole 32 on image sensor circuit plate.In the present embodiment 6 compression legs 11 on needle plate 8 symmetrical, front and back are symmetrical, make imageing sensor in the horizontal plane uniform force to reach best formation state, should also be noted that avoid being arranged on the components and parts on image sensor circuit plate when arranging compression leg 11.
Described drive unit 7 is fixed on bracing frame 9, is connected with needle plate 8, and needle plate 8 can be driven to move on guide pillar 10.
In practical application, the position of gluing table 4, bracing frame 9 can adjust according to use needs, and gluing table 4 is not necessarily positioned at the center of gluing pedestal 5, as long as be positioned at immediately below needle plate 8 on gluing pedestal 5; Bracing frame 9 can also be arranged on gluing pedestal 5 side or other positions, and ensure that needle plate 8 is positioned at directly over gluing table 4, in addition, the upper end of the compression leg 11 on needle plate 8 also can pass needle plate 8.
Adopt the method for the image sensor circuit plate flattening device smooth image sensor circuit plate in the present embodiment as follows: to be first fixed on gluing pedestal 5 by gluing table 4; The positioning cylinder 41 again the first location hole 22 of metallic plate being aimed at gluing table 4 is pressed into and lies on the table top of gluing table 4, then in the strip slot 21 of metallic plate, inserts appropriate glue; Then the positioning cylinder 41 the second location hole 31 of image sensor circuit plate being aimed at gluing table 4 is pressed into and is overlapped on metallic plate; Top needle plate 8 pressure is finally made to carry out the operations such as subsequent cure.
Image sensor circuit plate can accurately, entirely be installed on a metallic plate by the image sensor circuit plate flattening device in the present embodiment, the evenness making image sensor circuit plate keep good, makes imageing sensor imaging surface and lens imaging face keep highly parallel; Drive unit 7 controls needle plate 8 pairs of image sensor circuit plates and compresses operations such as carrying out follow-up solidification, image sensor circuit plate can be made more entirely to fix on a metal plate, ensure evenness.
Embodiment 2:
On the basis of embodiment, also gluing table 4 is further improved in the present embodiment:
As shown in Figure 6, the upper surface of described gluing table 4 is also provided with protruding 42, in practical application, also a groove can also can be replaced to for this projection, structure, optimal imaging distance etc. according to imageing sensor determine to use protruding or the height of groove and projection, the degree of depth of groove, concrete how to select and design height, depth parameter are the common technology means of this area, in the present embodiment, do not repeating its method.Like this, image information can be received in optimal imaging distance after imageing sensor can being made to install.
Embodiment 3:
On the basis of embodiment 1 or embodiment 2, in the present embodiment, needle plate 8 and drive unit 7 are further improved:
Described drive unit 7 comprises cylinder, the connecting rod be connected on cylinder piston, and this connecting rod lower end is connected with needle plate 8.
As shown in Figure 6, needle plate 8 comprises the flat part 81 installing compression leg 11, the installation portion 82 be connected with connecting rod, and described installation portion 82 both sides are provided with the through hole 83 passed for guide pillar 10.Like this, needle plate 8 installation portion 82 is connected with connecting rod lower end, and guide pillar 10 is located in the through hole 83 of installation portion, during cylinder operation, piston driving connecting rod moves up and down along guide pillar 10, thus makes needle plate 8 to move or moves down, and compresses or unclamp image sensor circuit plate.Described gluing pedestal 5 can also be arranged a switch and carry out control cylinder work.Flat part 81 is preferably a square plate, and installation portion 82 is preferably a rectangular flat board, and the two ends, left and right of this rectangular flat board can be the arc shown in Fig. 1, also can square for shown in Fig. 6.
Embodiment 4:
On above-mentioned any embodiment basis, also improve as follows in the present embodiment:
The both sides of described needle plate 8 are also respectively provided with one group of mounting panel, often organize mounting panel and are made up of two parallel flat boards 12, on two sides that dull and stereotyped 12 lower ends are fixed on needle plate 8 or on the both sides of the upper surface of needle plate 8.The effect of mounting panel is for installing ultraviolet curing instrument, ultraviolet curing instrument is fixed between two flat boards 12, lower end reaches below needle plate 8, like this can glue when needle plate 8 jam sensor circuit board between cure sensor circuit board and metallic plate, make sensor circuit board more fixing on a metal plate.
Embodiment 5:
Image sensor circuit plate planarization system, comprises circuit board flattening mechanism, glue flow speed controller 1, gum outlet 2, two ultraviolet curing instrument 3, ultraviolet curing instrument controller 6, two ultraviolet curing instrument 3 is separately fixed on the mounting panel of needle plate 8 both sides.
Described circuit board flattening mechanism is the image sensor circuit plate flattening device in embodiment 4; Described glue flow speed controller 1 is connected with gum outlet 2 by a glue conduit, makes glue flow into gum outlet 2 from glue flow speed controller 1 and flow out from gum outlet 3; Described ultraviolet curing instrument 3 is electrically connected by wire with ultraviolet curing instrument controller 6, controls ultraviolet curing instrument 3 pairs of glues be cured and stop solidification by ultraviolet curing instrument controller 6.In the present embodiment, glue adopts UV glue, is ultraviolet cured adhesive again, and the ultraviolet light irradiation sent by ultraviolet curing instrument 3 just can rapid solidification.
Adopt the flow process of image sensor circuit plate planarization system installation diagram image-position sensor of the present invention as follows:
(1) first gluing table 4 is screwed on gluing pedestal 5;
(2) positioning cylinder 41 the first location hole 22 of metallic plate being aimed at gluing table 4 is pressed into and lies on the table top of gluing table 4, then opens glue flow speed controller 1 and in the strip slot 21 of metallic plate, inserts appropriate glue by gum outlet 2;
(3) positioning cylinder 41 the second location hole 31 of image sensor circuit plate being aimed at gluing table 4 is pressed into and is overlapped on metallic plate;
(4) top needle plate 8 is made to depress;
(5) the glue solidification 1min in the strip slot 21 of ultraviolet curing instrument 3 pairs of metallic plates is opened by ultraviolet curing instrument controller 6, after solidification terminates, needle plate 8 is lifted, take out the combination of image sensor circuit plate and metallic plate, last batch is put into roaster and is heated.
Finally can also add four screws for the combination of image sensor circuit plate and metallic plate, ensure the stability of image sensor circuit plate in Long-Time Service.
Below be only preferred implementation of the present utility model, protection range of the present utility model be not only confined to above-described embodiment, all technical schemes belonged under the utility model thinking all belong to protection range of the present utility model.It should be pointed out that for those skilled in the art, not departing from the some improvements and modifications under the utility model principle prerequisite, protection range of the present utility model should be considered as.
Claims (9)
1. image sensor circuit plate flattening device, is characterized in that, comprises gluing pedestal (5), gluing table (4), bracing frame (9), needle plate (8), drive unit (7),
Described gluing table (4) is arranged on the upper surface of gluing pedestal (5), and the upper surface of gluing table (4) is provided with reference column (41);
Support frame as described above (9) is provided with the guide pillar (10) vertically arranged, described needle plate (8) is arranged on guide pillar (10) and goes up and can move up and down on guide pillar (10); Described needle plate (8) is provided with many compression legs (11) and needle plate (8) is positioned at directly over gluing table (4);
Described drive unit (7) is fixed on bracing frame (9), is connected with needle plate (8), and needle plate (8) can be driven upper mobile at guide pillar (10).
2. image sensor circuit plate flattening device according to claim 1, is characterized in that, the upper surface of described gluing table (4) is also provided with projection (42) or groove.
3. image sensor circuit plate flattening device according to claim 1, is characterized in that, described drive unit (7) comprises cylinder, the connecting rod be connected on cylinder piston, and this connecting rod lower end is connected with needle plate (8).
4. image sensor circuit plate flattening device according to claim 1, is characterized in that, described needle plate (8) is provided with 6 compression legs (11).
5. image sensor circuit plate flattening device according to claim 1, is characterized in that, compression leg (11) axial symmetry on described needle plate (8) is arranged.
6., according to the arbitrary described image sensor circuit plate flattening device of claim 1 to 5, it is characterized in that, the both sides of described needle plate (8) are also respectively provided with one group of mounting panel.
7. image sensor circuit plate flattening device according to claim 6, it is characterized in that, often organize mounting panel to be made up of two parallel flat boards (12), on two sides that flat board (12) lower end is fixed on needle plate (8) or on the both sides of the upper surface of needle plate (8).
8. image sensor circuit plate planarization system, it is characterized in that, comprise circuit board flattening mechanism, glue flow speed controller (1), gum outlet (2), ultraviolet curing instrument (3), ultraviolet curing instrument controller (6), described circuit board flattening mechanism is the image sensor circuit plate flattening device described in claim 6, described glue flow speed controller (1) is connected with gum outlet (2), described ultraviolet curing instrument (3) is connected with ultraviolet curing instrument controller (6), and described ultraviolet curing instrument (3) is fixing on a mounting board.
9. image sensor circuit plate planarization system according to claim 8, is characterized in that, the quantity of described ultraviolet curing instrument (3) is two, and described needle plate (8) both sides respectively arrange one.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201520665867.9U CN204836357U (en) | 2015-08-31 | 2015-08-31 | Flat getting ready of image sensor circuit is put and system |
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Application Number | Priority Date | Filing Date | Title |
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CN201520665867.9U CN204836357U (en) | 2015-08-31 | 2015-08-31 | Flat getting ready of image sensor circuit is put and system |
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CN201520665867.9U Expired - Fee Related CN204836357U (en) | 2015-08-31 | 2015-08-31 | Flat getting ready of image sensor circuit is put and system |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110039298A (en) * | 2018-01-15 | 2019-07-23 | 浙江宇视科技有限公司 | Evenness adjusting methods and system |
CN110521200A (en) * | 2017-04-27 | 2019-11-29 | 联合视觉技术有限责任公司 | Equipment for detection data |
-
2015
- 2015-08-31 CN CN201520665867.9U patent/CN204836357U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110521200A (en) * | 2017-04-27 | 2019-11-29 | 联合视觉技术有限责任公司 | Equipment for detection data |
CN110039298A (en) * | 2018-01-15 | 2019-07-23 | 浙江宇视科技有限公司 | Evenness adjusting methods and system |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151202 Termination date: 20170831 |